Loadable PLD Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
EPF10K200SFI672-2	Intel	Loadable PLD	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	0.6 ns	9984	Yes	2.625 V		CMOS	470	2.5	2.5,2.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	85 °C (185 °F)	470 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e0			470		27 mm		470
EPF10K20TI144-4	Intel	Loadable PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	0.6 ns	1152	Yes	5.25 V		CMOS	102	5	3.3/5,5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.63SQ,20	Field Programmable Gate Arrays		Registered	4.75 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 102 I/O	4	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	294 MHz		102		20 mm		102
EPF10K30AQC240-2	Intel	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	0.7 ns	1728	Yes	3.6 V		CMOS	246	3.3	2.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays		Registered	3 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	1728 Logic Elements; 216 Labs	e0	80 MHz		246		32 mm		189
EPF10K30EQI208-2	Intel	Loadable PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	0.4 ns	1728	Yes	2.625 V		CMOS	147	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Mixed	2.375 V	.5 mm	85 °C (185 °F)	147 I/O		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0			147		28 mm		147
EPF10K30EQI208-3	Intel	Loadable PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	12.5 ns	1728	Yes	2.7 V		CMOS	147	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Mixed	2.3 V	.5 mm	85 °C (185 °F)	147 I/O		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0			147		28 mm		147
EPF10K30RC240-3N	Intel	Loadable PLD	Commercial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	0.6 ns	1728	Yes	5.25 V		CMOS	189	5	3.3/5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	1728 Logic Elements	e3	66.67 MHz		189		32 mm		189
EPF10K30RC240-4	Intel	Loadable PLD	Commercial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	0.6 ns	1728	Yes	5.25 V		CMOS	189	5	3.3/5,5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	1728 Logic Elements	e0	62.89 MHz		189		32 mm		189
EPF10K50EQI240-2	Intel	Loadable PLD	Industrial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	0.6 ns	2880	Yes	2.7 V		CMOS	189	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays		Mixed	2.3 V	.5 mm	85 °C (185 °F)	189 I/O		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	2880 Logic Elements	e0	140 MHz		189		32 mm		189
EPF10K50SFC484-1	Intel	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.3 ns	2880	Yes	2.625 V		CMOS	254	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	70 °C (158 °F)	254 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0			254		23 mm		254
EPF10K50SQC208-3N	Intel	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	0.5 ns	2880	Yes	2.625 V		CMOS	147	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Mixed	2.375 V	.5 mm	70 °C (158 °F)	147 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3			147		28 mm		147
EPF6016AFC100-2	Intel	Loadable PLD	Other	Ball	100	LBGA	Square	Plastic/Epoxy		1320	Yes	3.6 V		CMOS	81	3.3	2.5/3.3,3.3 V	Grid Array, Low Profile	BGA100,10X10,40	Field Programmable Gate Arrays		Macrocell	3 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 81 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No		e0	153 MHz		81		11 mm		81
EPF6016ATI100-2N	Intel	Loadable PLD		Gull Wing	100	LFQFP	Square	Plastic/Epoxy			Yes	3.6 V				3.3		Flatpack, Low Profile, Fine Pitch				Macrocell	3 V	.5 mm		4 Dedicated Inputs, 81 I/O	4		Matte Tin	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No	Also Configurable with 5 V VCC	e3	153 MHz				14 mm		81
EPF6016QC208-2N	Intel	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy			Yes	5.25 V				5		Flatpack, Fine Pitch				Macrocell	4.75 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 171 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Can Also Be Used 16000 Logic Gates	e3	153 MHz				28 mm		171
EPF6016QC208-3N	Intel	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy		1320	Yes	5.25 V		CMOS	171	5	3.3/5,5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Macrocell	4.75 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 171 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Can Also Be Used 16000 Logic Gates	e3	133 MHz		171		28 mm		171
EPF6016TC144-2	Intel	Loadable PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		1320	Yes	5.25 V		CMOS	117	5	3.3/5,5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.63SQ,20	Field Programmable Gate Arrays		Macrocell	4.75 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 117 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Can Also Be Used 16000 Logic Gates	e0	153 MHz		117		20 mm		117
EPF6024ABI256-2	Altera	Loadable PLD		Ball	256	BGA	Square	Plastic/Epoxy		1960	Yes	3.6 V		CMOS	218	3.3	2.5/3.3,3.3 V	Grid Array	BGA256(UNSPEC)	Field Programmable Gate Arrays		Macrocell	3 V	1.27 mm		4 Dedicated Inputs, 218 I/O	4		Tin/Lead	Bottom	S-PBGA-B256	3	2.3 mm	27 mm	No	Also Configurable with 5 V VCC	e0	153 MHz	30 s	218	220 °C (428 °F)	27 mm		218
EPF8282ATC100-4N	Intel	Loadable PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy		208	Yes	5.25 V		CMOS	78	5	3.3,3.3/5,5 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays		Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 78 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No	208 Logic Elements	e3			78		14 mm		78
EPF8282TC100-3	Altera	Loadable PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy		208	Yes	5.25 V		CMOS	78	5	3.3/5,5 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays		Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 74 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No	282 Flip Flops; 208 Logic elements; Built-in JTAG boundry-scan test circuitry	e0			74	220 °C (428 °F)	14 mm		74
EPF8452ALI84-6	Altera	Loadable PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy			Yes	5.5 V		CMOS		5		Chip Carrier				Registered	4.5 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 64 I/O	4	-40 °C (-40 °F)		Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	452 Flip Flops; 336 Logic Elements						29.3116 mm		64
EPF8636ALC84-4	Intel	Loadable PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		504	Yes	5.25 V		CMOS	68	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		Registered	4.75 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 68 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	504 Logic Elements	e0	357 MHz		64		29.3116 mm		68
PZ3320C7XX	NXP Semiconductors	Loadable PLD	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	9 ns		Yes	3.63 V		CMOS		3.3		Flatpack				Macrocell	2.97 V		70 °C (158 °F)			0 °C (32 °F)		Quad	S-PQFP-G160				No			100 MHz
PZ3320N8YY	NXP Semiconductors	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	9.5 ns		Yes	3.63 V		CMOS		3.3		Grid Array				Macrocell	2.97 V		85 °C (185 °F)	192 I/O		-40 °C (-40 °F)		Bottom	S-PBGA-B256				No			91 MHz						192
PZ3960C7EB	NXP Semiconductors	Loadable PLD	Commercial	Ball	492	BGA	Square	Plastic/Epoxy	9 ns		Yes	3.63 V		CMOS		3.3		Grid Array				Macrocell	2.97 V	1.27 mm	70 °C (158 °F)	1 Dedicated Inputs, 384 I/O	1	0 °C (32 °F)		Bottom	S-PBGA-B492		2.54 mm	35 mm	No	960 Macrocells		100 MHz				35 mm		384
PZ3960N8EB-S	NXP Semiconductors	Loadable PLD	Industrial	Ball	492	BGA	Square	Plastic/Epoxy	9.5 ns		Yes	3.63 V		CMOS		3.3		Grid Array				Macrocell	2.97 V	1.27 mm	85 °C (185 °F)	1 Dedicated Inputs, 384 I/O	1	-40 °C (-40 °F)		Bottom	S-PBGA-B492		2.54 mm	35 mm	No	960 Macrocells		91 MHz				35 mm		384
PZ3320N8XX	NXP Semiconductors	Loadable PLD	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy	9.5 ns		Yes	3.63 V		CMOS		3.3		Flatpack				Macrocell	2.97 V		85 °C (185 °F)			-40 °C (-40 °F)		Quad	S-PQFP-G160				No			91 MHz
PZ3960N8EB	NXP Semiconductors	Loadable PLD	Industrial	Ball	492	BGA	Square	Plastic/Epoxy	9.5 ns		Yes	3.63 V		CMOS		3.3		Grid Array				Macrocell	2.97 V	1.27 mm	85 °C (185 °F)	1 Dedicated Inputs, 384 I/O	1	-40 °C (-40 °F)		Bottom	S-PBGA-B492		2.54 mm	35 mm	No	960 Macrocells		91 MHz				35 mm		384
PZ3960C7EB-S	NXP Semiconductors	Loadable PLD	Commercial	Ball	492	BGA	Square	Plastic/Epoxy	9 ns		Yes	3.63 V		CMOS		3.3		Grid Array				Macrocell	2.97 V	1.27 mm	70 °C (158 °F)	1 Dedicated Inputs, 384 I/O	1	0 °C (32 °F)		Bottom	S-PBGA-B492		2.54 mm	35 mm	No	960 Macrocells		100 MHz				35 mm		384
PZ3320C7YY	NXP Semiconductors	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	9 ns		Yes	3.63 V		CMOS		3.3		Grid Array				Macrocell	2.97 V		70 °C (158 °F)	192 I/O		0 °C (32 °F)		Bottom	S-PBGA-B256				No			100 MHz						192
XCR3960-8BG492I	Xilinx	Loadable PLD	Industrial	Ball	492	BGA	Square	Plastic/Epoxy	8 ns		Yes	3.6 V	960	CMOS		3.3	3.3 V	Grid Array	BGA492,26X26,50	Programmable Logic Devices	No	Macrocell	3 V	1.27 mm	85 °C (185 °F)	384 I/O		-40 °C (-40 °F)		Bottom	S-PBGA-B492	1	2.55 mm	35 mm	No			91 MHz				35 mm	Yes	384
XCR3320-7TQ160C	Xilinx	Loadable PLD	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	320	CMOS		3.3	3.3 V	Flatpack	QFP160,1.0SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	70 °C (158 °F)			0 °C (32 °F)		Quad	S-PQFP-G160	1			No			111 MHz					Yes
XCR3320-7TQ144C	Xilinx	Loadable PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	320	CMOS		3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	70 °C (158 °F)	12 Dedicated Inputs, 3 I/O	12	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	111 MHz	30 s		225 °C (437 °F)	20 mm	Yes	3
XCR3320-10TQ160C	Xilinx	Loadable PLD	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	320	CMOS		3.3	3.3 V	Flatpack	QFP160,1.0SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	70 °C (158 °F)			0 °C (32 °F)		Quad	S-PQFP-G160	1			No			87 MHz					Yes
XCR3320-10TQ144C	Xilinx	Loadable PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	320	CMOS		3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	70 °C (158 °F)	12 Dedicated Inputs, 3 I/O	12	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	111 MHz	30 s		225 °C (437 °F)	20 mm	Yes	3
XCR3320-8TQ160I	Xilinx	Loadable PLD	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy	8.5 ns		Yes	3.6 V	320	CMOS		3.3	3.3 V	Flatpack	QFP160,1.0SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	85 °C (185 °F)			-40 °C (-40 °F)		Quad	S-PQFP-G160	1			No			95 MHz					Yes
XCR3320-10BG256C	Xilinx	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	320	CMOS		3.3	3.3 V	Grid Array	BGA256,20X20,50	Programmable Logic Devices	Yes	Macrocell	3 V	1.27 mm	70 °C (158 °F)	12 Dedicated Inputs, 3 I/O	12	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e0	87 MHz	30 s		225 °C (437 °F)	27 mm	Yes	3
XCR3960-7BG492C	Xilinx	Loadable PLD	Commercial	Ball	492	BGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	960	CMOS		3.3	3.3 V	Grid Array	BGA492,26X26,50	Programmable Logic Devices	No	Macrocell	3 V	1.27 mm	70 °C (158 °F)	384 I/O		0 °C (32 °F)		Bottom	S-PBGA-B492	1	2.55 mm	35 mm	No			100 MHz				35 mm	Yes	384
XCR3320-7BG256C	Xilinx	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	320	CMOS		3.3	3.3 V	Grid Array	BGA256,20X20,50	Programmable Logic Devices	Yes	Macrocell	3 V	1.27 mm	70 °C (158 °F)	12 Dedicated Inputs, 3 I/O	12	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e0	111 MHz	30 s		225 °C (437 °F)	27 mm	Yes	3
XCR3320-8TQ144I	Xilinx	Loadable PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	8.5 ns		Yes	3.6 V	320	CMOS		3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	85 °C (185 °F)	12 Dedicated Inputs, 3 I/O	12	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	95 MHz	30 s		225 °C (437 °F)	20 mm	Yes	3
XCR3320-8BG256I	Xilinx	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	8.5 ns		Yes	3.6 V	320	CMOS		3.3	3.3 V	Grid Array	BGA256,20X20,50	Programmable Logic Devices	Yes	Macrocell	3 V	1.27 mm	85 °C (185 °F)	12 Dedicated Inputs, 3 I/O	12	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e0	95 MHz	30 s		225 °C (437 °F)	27 mm	Yes	3
EP20K200RC240-2XN	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	3 ns		Yes	2.625 V		CMOS		2.5		Flatpack, Fine Pitch				Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 174 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3					32 mm		174
EP20K100EFC324-3N	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	2.2 ns	4160	Yes	1.89 V		CMOS	238	1.8	1.8,1.8/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e1	160 MHz	30 s	238	260 °C (500 °F)	19 mm		246
EPF10K100BFC256-1	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	11 ns	4992	Yes	2.7 V		CMOS	191	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Mixed	2.3 V	1 mm	70 °C (158 °F)	191 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No	4992 Logic Elements	e0	140 MHz		191	220 °C (428 °F)	17 mm		191
EP20K100EQI240-1X	Altera	Loadable PLD		Gull Wing	240	FQFP	Square	Plastic/Epoxy		4160	Yes	2.625 V		CMOS	175	2.5	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays		Macrocell	2.375 V	.5 mm		4 Dedicated Inputs, 183 I/O	4		Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3			175	220 °C (428 °F)	32 mm		183
EP20K100EBC672-3	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy			Yes					1.8		Grid Array				Macrocell			85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672				No		e1							246
EPF81500RM240-3	Altera	Loadable PLD	Military	Gull Wing	240	HFQFP	Square	Plastic/Epoxy			Yes	5.5 V		CMOS		5		Flatpack, Heat Sink/Slug, Fine Pitch				Registered	4.5 V	.5 mm	125 °C (257 °F)	4 Dedicated Inputs	4	-55 °C (-67 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No	1500 Flip Flops; 1296 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3					32 mm
EP20K1000EFI784	Altera	Loadable PLD		Ball	784	BGA	Square	Plastic/Epoxy			Yes					1.8		Grid Array				Macrocell				4 Dedicated Inputs	4		Tin Silver Copper	Bottom	S-PBGA-B784	3			No		e1				220 °C (428 °F)
EPF10K50GC403-4	Altera	Loadable PLD	Commercial	Pin/Peg	403	IPGA	Square	Ceramic, Metal-Sealed Cofired	0.6 ns	2880	No	5.25 V		CMOS	310	5	3.3/5,5 V	Grid Array, Interstitial Pitch	SPGA403M,37X37	Field Programmable Gate Arrays		Registered	4.75 V	2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 310 I/O	4	0 °C (32 °F)	Tin Lead	Perpendicular	S-CPGA-P403	1	5.026 mm	49.78 mm	No	2880 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	62.89 MHz		310	220 °C (428 °F)	49.78 mm		310
EP20K200EFI784-1	Altera	Loadable PLD		Ball	784	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V			4 Dedicated Inputs	4		Tin Silver Copper	Bottom	S-PBGA-B784	3			No		e1				220 °C (428 °F)

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.