Loadable PLD Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	No. of I/O Lines
EP20K400FC672-1N	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	2.5 ns		Yes	2.625 V	CMOS		2.5		Grid Array			Macrocell	2.375 V	1 mm	85 °C (185 °F)	502 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e1					27 mm	502
EPF10K30EFI256-1	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	8 ns	1728	Yes	2.7 V	CMOS	176	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	Mixed	2.3 V	1 mm	85 °C (185 °F)	176 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0			176	220 °C (428 °F)	17 mm	176
EPF81500ARI240-3	Altera	Loadable PLD	Industrial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	1.8 ns	1296	Yes	5.5 V	CMOS	181	5	3.3/5,5 V	Flatpack, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	Registered	4.5 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 181 I/O	4	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	1296 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	385 MHz		177	220 °C (428 °F)	32 mm	181
EPF10K50SFI256-3X	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	12.5 ns		Yes	2.7 V	CMOS		2.5		Grid Array			Mixed	2.3 V	1 mm	85 °C (185 °F)	191 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.1 mm	17 mm	No		e1					17 mm	191
EP20K160ETC144-3X	Altera	Loadable PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	2.29 ns		Yes	1.89 V	CMOS		1.8		Flatpack, Low Profile, Fine Pitch			Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 88 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	160 MHz			220 °C (428 °F)	20 mm	88
EP20K100BC324-1	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Grid Array			Macrocell	2.375 V		85 °C (185 °F)	4 Dedicated Inputs, 252 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324				No		e1						252
EPF10K200SRC240-2	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	0.6 ns	9984	Yes	2.625 V	CMOS	182	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Mixed	2.375 V	.5 mm	70 °C (158 °F)	182 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0			182	220 °C (428 °F)	32 mm	182
EPF10K200SBC672-1	Altera	Loadable PLD	Commercial	Ball	672	BGA	Square	Plastic/Epoxy			Yes						Grid Array			Mixed			70 °C (158 °F)	4 Dedicated Inputs, 470 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672				No		e1						470
EPF10K70RC240-2	Altera	Loadable PLD	Commercial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	0.4 ns	3744	Yes	5.25 V	CMOS	358	5	3.3/5,5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0		20 s	354	220 °C (428 °F)	32 mm	189
EPF10K100BBI256-3	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	0.7 ns		Yes						Grid Array			Mixed		1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 191 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No		e1					27 mm	191
EP20K200CQ240C7	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	1.48 ns	8320	Yes	1.89 V	CMOS	160	1.8	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 168 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0			160	220 °C (428 °F)	32 mm	168
EPF10K30ARI240-3	Altera	Loadable PLD	Industrial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	17 ns		Yes	3.6 V	CMOS		3.3		Flatpack, Heat Sink/Slug, Fine Pitch			Registered	3 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 189 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3					32 mm	189
EPF10K50SBI356-2	Altera	Loadable PLD	Industrial	Ball	356	LBGA	Square	Plastic/Epoxy	9.5 ns	2880	Yes	2.7 V	CMOS	220	2.5	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays	Mixed	2.3 V	1.27 mm	85 °C (185 °F)	220 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e0			220	220 °C (428 °F)	35 mm	220
EPF8452AGC160-A-3	Altera	Loadable PLD	Commercial	Pin/Peg	160	PGA	Square	Ceramic, Metal-Sealed Cofired	1.8 ns		No	3.6 V	CMOS		3.3		Grid Array			Registered	3 V	2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 120 I/O	4	0 °C (32 °F)		Perpendicular	S-CPGA-P160		5.34 mm	39.624 mm	No	Can also operate at 5 V supply						39.624 mm	120
EP20K200CB652I-9	Altera	Loadable PLD		Ball	652	LBGA	Square	Plastic/Epoxy			Yes	1.89 V			1.8		Grid Array, Low Profile			Macrocell	1.71 V	1.27 mm		4 Dedicated Inputs, 376 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B652		1.63 mm	45 mm	No		e1				220 °C (428 °F)	45 mm	376
EP20K100TI144-3	Altera	Loadable PLD		Gull Wing	144	LFQFP	Square	Plastic/Epoxy		4160	Yes	2.625 V	CMOS	95	2.5	2.5,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm		4 Dedicated Inputs, 101 I/O	4		Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0			95	220 °C (428 °F)	20 mm	101
EP20K200RC240	Altera	Loadable PLD	Other	Gull Wing	240	HFQFP	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Flatpack, Heat Sink/Slug, Fine Pitch			Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 174 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3				220 °C (428 °F)	32 mm	174
EPF10K200SFI484-2	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	12 ns	9984	Yes	2.7 V	CMOS	369	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	Mixed	2.3 V	1 mm	85 °C (185 °F)	369 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0			369	220 °C (428 °F)	23 mm	369
EPF6024AFC256-2N	Altera	Loadable PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy			Yes	3.6 V			3.3		Grid Array			Macrocell	3 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 219 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.1 mm	17 mm	No		e1	153 MHz				17 mm	219
EPF8282AVTC100-A-3	Altera	Loadable PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	1.9 ns		Yes	3.6 V	CMOS		3.3		Flatpack, Low Profile, Fine Pitch			Registered	3 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 78 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100		1.27 mm	14 mm	No	Can also operate at 5 V supply	e3					14 mm	78
EPF10K50STI144-3	Altera	Loadable PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	12.5 ns	2880	Yes	2.7 V	CMOS	102	2.5	2.5,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.63SQ,20	Field Programmable Gate Arrays	Mixed	2.3 V	.5 mm	85 °C (185 °F)	102 I/O		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0			102	220 °C (428 °F)	20 mm	102
EPF10K50SFI256-2X	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	9.5 ns		Yes	2.7 V	CMOS		2.5		Grid Array			Mixed	2.3 V	1 mm	85 °C (185 °F)	191 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.1 mm	17 mm	No		e1					17 mm	191
EPF81500GM280-2	Altera	Loadable PLD	Military	Pin/Peg	280	PGA	Square	Ceramic, Metal-Sealed Cofired			No	5.5 V	CMOS		5		Grid Array			Registered	4.5 V	2.54 mm	125 °C (257 °F)	4 Dedicated Inputs, 204 I/O	4	-55 °C (-67 °F)		Perpendicular	S-CPGA-P280		5.081 mm	49.78 mm	No	1500 Flip Flops; 1296 Logic elements; Configurable I/O operation with 3.3 V or 5 V						49.78 mm	204
EPF6016ABC256-3	Altera	Loadable PLD		Ball	256	BGA		Plastic/Epoxy			Yes		CMOS	204		3.3,3.3/5 V	Grid Array	BGA256(UNSPEC)	Field Programmable Gate Arrays								Tin Lead	Bottom					No		e0			204	220 °C (428 °F)
EPF10K20QI208-5	Altera	Loadable PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	27 ns		Yes	5.5 V	CMOS		5		Flatpack, Fine Pitch			Registered	4.5 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No	1152 Logic elements Configurable I/O operation with 3.3 V or 5 V	e3	53.76 MHz				28 mm
EP20K200EBC356-3X	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	2.33 ns		Yes	1.89 V	CMOS		1.8		Grid Array, Low Profile			Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 271 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1				220 °C (428 °F)	35 mm	271
EPF10K40RC208-4	Altera	Loadable PLD	Commercial	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	0.6 ns	2304	Yes	5.25 V	CMOS	147	5	3.3/5,5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays	Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 147 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	2304 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	62.89 MHz	20 s	147	220 °C (428 °F)	28 mm	147
EPF81188ARI208-3	Altera	Loadable PLD	Industrial	Gull Wing	208	HFQFP	Square	Plastic/Epoxy			Yes	5.5 V	CMOS		5		Flatpack, Heat Sink/Slug, Fine Pitch			Registered	4.5 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No	1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3					28 mm
EPF8820ATI144-4	Altera	Loadable PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		672	Yes	5.5 V	CMOS	112	5	3.3/5,5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	Macrocell	4.5 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 112 I/O	4	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	672 Logic elements; 84 Labs; Configurable I/O operation with 3.3 V or 5 V	e0			108	220 °C (428 °F)	20 mm	112
EPF6024ATI144-2	Altera	Loadable PLD		Gull Wing	144	LFQFP	Square	Plastic/Epoxy		1960	Yes	3.6 V	CMOS	117	3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.63SQ,20	Field Programmable Gate Arrays	Macrocell	3 V	.5 mm		4 Dedicated Inputs, 117 I/O	4		Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Also Configurable with 5 V VCC	e0	153 MHz		117	220 °C (428 °F)	20 mm	117
EPF10K130EFI672-1X	Altera	Loadable PLD	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	9 ns		Yes	2.7 V	CMOS		2.5		Grid Array			Mixed	2.3 V	1 mm	85 °C (185 °F)	413 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1					27 mm	413
EPF10K100BQI208-1	Altera	Loadable PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	11 ns	4992	Yes	2.7 V	CMOS	147	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Mixed	2.3 V	.5 mm	85 °C (185 °F)	147 I/O		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0			147	220 °C (428 °F)	28 mm	147
EP20K100EBC356	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy			Yes				1.8		Grid Array, Low Profile			Macrocell		1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1					35 mm	246
EPF10K250EBI600-1	Altera	Loadable PLD	Industrial	Ball	600	HBGA	Square	Plastic/Epoxy		12160	Yes	2.7 V	CMOS	470	2.5	2.5,2.5/3.3 V	Grid Array, Heat Sink/Slug	BGA600,35X35,50	Field Programmable Gate Arrays	Mixed	2.3 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 470 I/O	4	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B600		1.93 mm	45 mm	No		e0			470	220 °C (428 °F)	45 mm	470
EPF81500GI280-3	Altera	Loadable PLD	Industrial	Pin/Peg	280	PGA	Square	Ceramic, Metal-Sealed Cofired			No	5.5 V	CMOS		5		Grid Array			Registered	4.5 V	2.54 mm	85 °C (185 °F)	4 Dedicated Inputs, 204 I/O	4	-40 °C (-40 °F)		Perpendicular	S-CPGA-P280		5.081 mm	49.78 mm	No	1500 Flip Flops; 1296 Logic elements; Configurable I/O operation with 3.3 V or 5 V						49.78 mm	204
EPF10K50QC240-3	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	17.2 ns		Yes	5.25 V	CMOS		5		Flatpack, Fine Pitch			Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3					32 mm	189
EP20K100BC356-1	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	2.5 ns	4160	Yes	2.625 V	CMOS	246	2.5	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays	Macrocell	2.375 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 252 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0		20 s	246	220 °C (428 °F)	35 mm	252
EP20K600CB652C7N	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	1.48 ns		Yes	1.89 V			1.8		Grid Array			Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		2 mm	45 mm	No		e1					45 mm	488
EPF81188ARC240-5	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy		1008	Yes	5.25 V	CMOS	184	5	3.3/5,5 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 180 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240		4.2 mm	32 mm	No	1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0			180	220 °C (428 °F)	32 mm	180
EP20K200CBI652-7X	Altera	Loadable PLD		Ball	652	LBGA	Square	Plastic/Epoxy	1.6 ns		Yes	1.89 V			1.8		Grid Array, Low Profile			Macrocell	1.71 V	1.27 mm		376 I/O			Tin Silver Copper	Bottom	S-PBGA-B652		1.63 mm	45 mm	No		e1					45 mm	376
EP20K200FC672-3V	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	0.5 ns		Yes	2.625 V			2.5		Grid Array			Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 382 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1					27 mm	382
EP2A15F672C8	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	1.94 ns	16640	Yes	1.575 V	CMOS	480	1.5	1.5,1.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	Macrocell	1.425 V	1 mm	85 °C (185 °F)	492 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e0			480	220 °C (428 °F)	27 mm	492
EP20K400BC672-1	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Grid Array			Macrocell	2.375 V		85 °C (185 °F)	4 Dedicated Inputs, 502 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672				No		e1						502
EP20K100ETI144	Altera	Loadable PLD		Gull Wing	144	LFQFP	Square	Plastic/Epoxy			Yes				1.8		Flatpack, Low Profile, Fine Pitch			Macrocell		.5 mm		4 Dedicated Inputs, 92 I/O	4		Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3				220 °C (428 °F)	20 mm	92
EPF10K10ARC208-1	Altera	Loadable PLD	Commercial	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	CMOS		3.3		Flatpack, Heat Sink/Slug, Fine Pitch			Registered	3 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 134 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3					28 mm	134
EP1K50FC484-2N	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.4 ns	2880	Yes	2.625 V	CMOS	249	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	Mixed	2.375 V	1 mm	70 °C (158 °F)	249 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1	37.5 MHz	30 s	249	260 °C (500 °F)	23 mm	249
EP20K1500EBC652-2N	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	2.13 ns		Yes	1.89 V	CMOS		1.8		Grid Array			Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		3.5 mm	45 mm	No		e1	160 MHz				45 mm	488
EP20K200EQC208-1	Altera	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	1.58 ns	8320	Yes	1.89 V	CMOS	128	1.8	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 136 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0		20 s	128	220 °C (428 °F)	28 mm	136

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.