Loadable PLD Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	No. of I/O Lines
EP20K600EFC1020-2X	Altera	Loadable PLD	Other	Ball	1020	HBGA	Square	Plastic/Epoxy	0.4 ns	24320	Yes	2.625 V	CMOS	588	2.5	1.8,2.5,3.3 V	Grid Array, Heat Sink/Slug	BGA1020,32X32,40	Field Programmable Gate Arrays	Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 588 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e0	160 MHz		588	220 °C (428 °F)	33 mm	588
EP20K160EBI356	Altera	Loadable PLD		Ball	356	LBGA	Square	Plastic/Epoxy			Yes				1.8		Grid Array, Low Profile			Macrocell		1.27 mm		4 Dedicated Inputs, 273 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1				220 °C (428 °F)	35 mm	273
EPF8452AQI160-2	Altera	Loadable PLD	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy		336	Yes	5.5 V	CMOS	120	5	3.3/5,5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	Macrocell	4.5 V	.65 mm	85 °C (185 °F)	4 Dedicated Inputs, 120 I/O	4	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G160	3	4.07 mm	28 mm	No	336 Logic elements; 42 Labs; Configurable I/O operation with 3.3 V or 5 V	e0			116	220 °C (428 °F)	28 mm	120
EPF8636ARI208-3	Altera	Loadable PLD	Industrial	Gull Wing	208	HFQFP	Square	Plastic/Epoxy		504	Yes	5.5 V	CMOS	136	5	3.3/5,5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays	Registered	4.5 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 136 I/O	4	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G208		4.1 mm	28 mm	No	504 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	385 MHz		132	220 °C (428 °F)	28 mm	136
EP2A40B724C9N	Altera	Loadable PLD	Other	Ball	724	BGA	Square	Plastic/Epoxy	2.05 ns		Yes	1.575 V	CMOS		1.5		Grid Array			Macrocell	1.425 V	1.27 mm	85 °C (185 °F)	536 I/O		0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B724		3.5 mm	35 mm	No		e1		40 s		245 °C (473 °F)	35 mm	536
EP20K400BC652-2V	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	3.1 ns	16640	Yes	2.625 V	CMOS	496	2.5	2.5,2.5/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays	Macrocell	2.375 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 502 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		3.5 mm	45 mm	No		e1	34 MHz		496	220 °C (428 °F)	45 mm	502
EPF10K100ABC600-3	Altera	Loadable PLD	Commercial	Ball	600	BGA	Square	Plastic/Epoxy	0.8 ns	4992	Yes	3.6 V	CMOS	406	3.3	2.5/3.3,3.3 V	Grid Array	BGA600,35X35,50	Field Programmable Gate Arrays	Registered	3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 406 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B600	3	1.93 mm	45 mm	No		e0		20 s	406	220 °C (428 °F)	45 mm	406
EP20K160ERI208-1X	Altera	Loadable PLD		Gull Wing	208	HFQFP	Square	Plastic/Epoxy		6400	Yes	2.625 V	CMOS	135	2.5	1.8,1.8/3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm		4 Dedicated Inputs, 143 I/O	4		Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3			135	220 °C (428 °F)	28 mm	143
EPF10K100EFI484-2N	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	0.5 ns	4992	Yes	2.625 V	CMOS	338	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	Mixed	2.375 V	1 mm	85 °C (185 °F)	338 I/O		-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1		40 s	338	260 °C (500 °F)	23 mm	338
EPF81188ARI208-5	Altera	Loadable PLD	Industrial	Gull Wing	208	HFQFP	Square	Plastic/Epoxy			Yes	5.5 V	CMOS		5		Flatpack, Heat Sink/Slug, Fine Pitch			Registered	4.5 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No	1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3					28 mm
EP20K200CB356I-9	Altera	Loadable PLD		Ball	356	LBGA	Square	Plastic/Epoxy		8320	Yes	1.89 V	CMOS	263	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays	Macrocell	1.71 V	1.27 mm		4 Dedicated Inputs, 271 I/O	4		Tin Lead	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e0			263	220 °C (428 °F)	35 mm	271
EP20K200CB652I-7	Altera	Loadable PLD		Ball	652	LBGA	Square	Plastic/Epoxy	1.6 ns		Yes	1.89 V			1.8		Grid Array, Low Profile			Macrocell	1.71 V	1.27 mm		4 Dedicated Inputs, 376 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B652		1.63 mm	45 mm	No		e1				220 °C (428 °F)	45 mm	376
EPF8636AQC160-2	Altera	Loadable PLD	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy		504	Yes	5.25 V	CMOS	118	5	3.3/5,5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	Registered	4.75 V	.65 mm	70 °C (158 °F)	4 Dedicated Inputs, 118 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	4.07 mm	28 mm	No	504 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	417 MHz		114	220 °C (428 °F)	28 mm	118
EP20K300ERC240-2	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy		11520	Yes	2.625 V	CMOS	144	2.5	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 152 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3	160 MHz		144	220 °C (428 °F)	32 mm	152
EPF6010ATI144-3	Altera	Loadable PLD		Gull Wing	144	LFQFP	Square	Plastic/Epoxy		880	Yes	3.6 V	CMOS	102	3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.63SQ,20	Field Programmable Gate Arrays	Macrocell	3 V	.5 mm		4 Dedicated Inputs, 102 I/O	4		Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Also Configurable with 5 V VCC	e0	133 MHz		102	220 °C (428 °F)	20 mm	102
EPF10K100ABC356-1N	Altera	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	0.6 ns	4992	Yes	3.6 V	CMOS	274	3.3	2.5/3.3,3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays	Registered	3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 274 I/O	4	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e1		30 s	274	260 °C (500 °F)	35 mm	274
EP20K200RC240-3X	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	3.6 ns		Yes	2.625 V	CMOS		2.5		Flatpack, Fine Pitch			Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 174 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3				220 °C (428 °F)	32 mm	174
EPF10K200SQI240-2X	Altera	Loadable PLD	Industrial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	12 ns		Yes	2.7 V	CMOS		2.5		Flatpack, Fine Pitch			Mixed	2.3 V	.5 mm	85 °C (185 °F)	182 I/O		-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3					32 mm	182
EPF6024ABC256-1N	Altera	Loadable PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy			Yes	3.6 V			3.3		Grid Array			Macrocell	3 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 218 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No	Can Also Be Used 24000 Logic Gates	e1	172 MHz				27 mm	218
EPF10K100EFC256-2	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.5 ns	4992	Yes	2.625 V	CMOS	191	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	Mixed	2.375 V	1 mm	70 °C (158 °F)	191 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0		20 s	191	220 °C (428 °F)	17 mm	191
EP20K60ETC144-1N	Altera	Loadable PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	1.72 ns		Yes	1.89 V	CMOS		1.8		Flatpack, Low Profile, Fine Pitch			Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 92 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	160 MHz				20 mm	92
EPF10K10ATC100-1N	Altera	Loadable PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	0.5 ns		Yes	3.6 V	CMOS		3.3		Flatpack, Low Profile, Fine Pitch			Registered	3 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 66 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No	576 Logic Elements; 72 Labs	e3	80 MHz				14 mm	66
EPF81188ARC240-4	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy		1008	Yes	5.25 V	CMOS	184	5	3.3/5,5 V	Flatpack, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 184 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	357 MHz		180	220 °C (428 °F)	32 mm	184
EP20K400FI784-3	Altera	Loadable PLD		Ball	784	BGA	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Grid Array			Macrocell	2.375 V			4 Dedicated Inputs	4		Tin Silver Copper	Bottom	S-PBGA-B784	3			No		e1				220 °C (428 °F)
EP20K100EBC324-2	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy			Yes				1.8		Grid Array			Macrocell			85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324				No		e1						246
EPF10K50QC304-4	Altera	Loadable PLD	Commercial	Gull Wing	304	FQFP	Square	Plastic/Epoxy	23.8 ns		Yes	5.25 V	CMOS		5		Flatpack, Fine Pitch			Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 249 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G304		4.5 mm	40 mm	No	2880 Logic elements; Built-in JTAG boundry-scan test circuitry	e3	60.6 MHz				40 mm	249
EPF8820G5962192-3	Altera	Loadable PLD	Military	Pin/Peg	192	PGA	Square	Ceramic, Metal-Sealed Cofired			No	5.5 V	CMOS		5		Grid Array			Registered	4.5 V	2.54 mm	125 °C (257 °F)	4 Dedicated Inputs, 148 I/O	4	-55 °C (-67 °F)		Perpendicular	S-CPGA-P192		5.43 mm	45.15 mm	No	820 Flip Flops; 672 Logic elements; Configurable I/O operation with 3.3 V or 5 V						45.15 mm	148
EPF8282ATC100-3N	Altera	Loadable PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy			Yes	5.25 V	CMOS		5		Flatpack, Low Profile, Fine Pitch			Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 78 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No	208 Logic Elements	e3					14 mm	78
EPF8452QM160-3	Altera	Loadable PLD	Military	Gull Wing	160	QFP	Square	Plastic/Epoxy			Yes	5.5 V	CMOS		5		Flatpack			Registered	4.5 V	.65 mm	125 °C (257 °F)	4 Dedicated Inputs, 116 I/O	4	-55 °C (-67 °F)	Matte Tin	Quad	S-PQFP-G160		4.07 mm	28 mm	No	Labs With Fasttrack Interconnect; 452 Flip Flops; 336 Logic Elements	e3					28 mm	116
EP20K200BI484-2	Altera	Loadable PLD		Ball	484	BGA	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Grid Array			Macrocell	2.375 V			4 Dedicated Inputs, 382 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B484				No		e1						382
EPF8282ALC100-A-2	Altera	Loadable PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	0.4 ns		Yes	5.25 V	CMOS		5		Chip Carrier			Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs	4	0 °C (32 °F)		Quad	S-PQCC-J44		4.57 mm	16.5862 mm	No							16.5862 mm
EP20K1000CF1020I-8	Altera	Loadable PLD		Ball	1020	HBGA	Square	Plastic/Epoxy		38400	Yes	1.89 V	CMOS	700	1.8	1.8,1.8/3.3 V	Grid Array, Heat Sink/Slug	BGA1020,32X32,40	Field Programmable Gate Arrays	Macrocell	1.71 V	1 mm		4 Dedicated Inputs, 708 I/O	4		Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e0			700	220 °C (428 °F)	33 mm	708
EPF10K10BM356-4	Altera	Loadable PLD	Military	Ball	356	HLBGA	Square	Plastic/Epoxy	23.8 ns		Yes	5.5 V	CMOS		5		Grid Array, Heat Sink/Slug, Low Profile			Registered	4.5 V	1.27 mm	125 °C (257 °F)	4 Dedicated Inputs	4	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No	576 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	60.6 MHz				35 mm
EPF10K10ABI256-1	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	0.5 ns		Yes	3.6 V			3.3		Grid Array			Mixed	3 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 150 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No		e1					27 mm	150
EP2A25F672C9N	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	2.23 ns		Yes	1.575 V	CMOS		1.5		Grid Array			Macrocell	1.425 V	1 mm	85 °C (185 °F)	492 I/O		0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1		40 s		245 °C (473 °F)	27 mm	492
EPF10K10AFI484-1	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	0.5 ns		Yes	3.6 V			3.3		Grid Array			Mixed	3 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 150 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		1.86 mm	23 mm	No		e1					23 mm	150
EPF10K30EFI256-3	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	12.5 ns	1728	Yes	2.7 V	CMOS	176	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	Mixed	2.3 V	1 mm	85 °C (185 °F)	176 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0			176	220 °C (428 °F)	17 mm	176
EPF81188AQC208-2A	Altera	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy			Yes	5.25 V	CMOS		5		Flatpack, Fine Pitch			Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 148 I/O	4	0 °C (32 °F)		Quad	S-PQFP-G208	3	4.1 mm	28 mm	No						220 °C (428 °F)	28 mm	148
EPF10K130EBI600-1	Altera	Loadable PLD	Industrial	Ball	600	BGA	Square	Plastic/Epoxy	9 ns	6656	Yes	2.7 V	CMOS	424	2.5	2.5,2.5/3.3 V	Grid Array	BGA600,35X35,50	Field Programmable Gate Arrays	Mixed	2.3 V	1.27 mm	85 °C (185 °F)	424 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B600		1.93 mm	45 mm	No		e0			424	220 °C (428 °F)	45 mm	424
EPF8452LM84-2	Altera	Loadable PLD	Military	J Bend	84	QCCJ	Square	Plastic/Epoxy			Yes	5.5 V	CMOS		5		Chip Carrier			Registered	4.5 V	1.27 mm	125 °C (257 °F)	4 Dedicated Inputs, 64 I/O	4	-55 °C (-67 °F)		Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	Labs With Fasttrack Interconnect; 452 Flip Flops; 336 Logic Elements						29.3116 mm	64
EPF10K100EBI484-3	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	0.9 ns		Yes	2.7 V			2.5		Grid Array			Mixed	2.3 V		85 °C (185 °F)	4 Dedicated Inputs, 338 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484				No		e1						338
EP2A40F672C9	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	2.05 ns	38400	Yes	1.575 V	CMOS	480	1.5	1.5,1.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	Macrocell	1.425 V	1 mm	85 °C (185 °F)	492 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e0			480	220 °C (428 °F)	27 mm	492
EP20K200EFC484-1	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy	1.58 ns	8320	Yes	1.89 V	CMOS	368	1.8	1.8,1.8/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 376 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0	160 MHz	20 s	368	220 °C (428 °F)	23 mm	376
EP20K200RI208-2	Altera	Loadable PLD		Gull Wing	208	HFQFP	Square	Plastic/Epoxy		8320	Yes	2.625 V	CMOS	138	2.5	2.5,2.5/3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm		4 Dedicated Inputs, 144 I/O	4		Tin Lead	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e0			138	220 °C (428 °F)	28 mm	144
EPF8452QI160-2	Altera	Loadable PLD	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy			Yes	5.5 V	CMOS		5		Flatpack			Registered	4.5 V	.65 mm	85 °C (185 °F)	4 Dedicated Inputs, 116 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G160		4.07 mm	28 mm	No	Labs With Fasttrack Interconnect; 452 Flip Flops; 336 Logic Elements	e3					28 mm	116
EPF6016AFC256-3	Altera	Loadable PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy		1320	Yes	3.6 V	CMOS	171	3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	Macrocell	3 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 171 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	133 MHz	20 s	171	220 °C (428 °F)	17 mm	171
EPF8452AQC160-A-3	Altera	Loadable PLD	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	1.8 ns		Yes	3.6 V	CMOS		3.3		Flatpack			Registered	3 V	.65 mm	70 °C (158 °F)	4 Dedicated Inputs, 120 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G160		4.07 mm	28 mm	No	Can also operate at 5 V supply	e3					28 mm	120
EPF10K200EBI672-3	Altera	Loadable PLD	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	0.6 ns		Yes	2.7 V			2.5		Grid Array			Mixed	2.3 V		85 °C (185 °F)	4 Dedicated Inputs, 470 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672				No		e1						470

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.