Loadable PLD Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	No. of I/O Lines
EPF6016TI144-3	Altera	Loadable PLD		Gull Wing	144	LFQFP	Square	Plastic/Epoxy		1320	Yes	5.5 V	CMOS	117	5	3.3/5,5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.63SQ,20	Field Programmable Gate Arrays	Macrocell	4.5 V	.5 mm		4 Dedicated Inputs, 117 I/O	4		Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Can Also Be Used 16000 Logic Gates	e0	133 MHz	20 s	117	220 °C (428 °F)	20 mm	117
EPF8636AQI160-2	Altera	Loadable PLD	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy		504	Yes	5.5 V	CMOS	118	5	3.3/5,5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	Macrocell	4.5 V	.65 mm	85 °C (185 °F)	4 Dedicated Inputs, 118 I/O	4	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G160	3	4.07 mm	28 mm	No	504 Logic elements; 63 Labs; Configurable I/O operation with 3.3 V or 5 V	e0			114	220 °C (428 °F)	28 mm	118
EPF81188ARM208-3	Altera	Loadable PLD	Military	Gull Wing	208	HFQFP	Square	Plastic/Epoxy			Yes	5.5 V	CMOS		5		Flatpack, Heat Sink/Slug, Fine Pitch			Registered	4.5 V	.5 mm	125 °C (257 °F)	4 Dedicated Inputs	4	-55 °C (-67 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No	1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3					28 mm
EP20K200ERC240-1X	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy		8320	Yes	2.625 V	CMOS	160	2.5	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 168 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3			160	220 °C (428 °F)	32 mm	168
EPF10K50SQC208-3	Altera	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	0.5 ns	2880	Yes	2.625 V	CMOS	147	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Mixed	2.375 V	.5 mm	70 °C (158 °F)	147 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0		20 s	147	220 °C (428 °F)	28 mm	147
EP20K200QC240	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Flatpack, Fine Pitch			Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 174 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3				220 °C (428 °F)	32 mm	174
EPF10K130VBC600-2	Altera	Loadable PLD	Commercial	Ball	600	BGA	Square	Plastic/Epoxy	0.5 ns	6656	Yes	3.6 V	CMOS	470	3.3	3.3 V	Grid Array	BGA600,35X35,50	Field Programmable Gate Arrays	Registered	3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 470 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B600		1.93 mm	45 mm	No		e0			470	220 °C (428 °F)	45 mm	470
EPF10K50SFC672-1X	Altera	Loadable PLD	Commercial	Ball	672	BGA	Square	Plastic/Epoxy	8 ns		Yes	2.7 V	CMOS		2.5		Grid Array			Mixed	2.3 V	1 mm	70 °C (158 °F)	254 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1					27 mm	254
EPF8820AQI160-A-2	Altera	Loadable PLD	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy	1.7 ns		Yes	3.6 V	CMOS		3.3		Flatpack			Registered	3 V	.65 mm	85 °C (185 °F)	4 Dedicated Inputs, 120 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G160		4.07 mm	28 mm	No	Can also operate at 5 V supply	e3					28 mm	120
EPF10K30ARC240-2	Altera	Loadable PLD	Commercial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	13 ns		Yes	3.6 V	CMOS		3.3		Flatpack, Heat Sink/Slug, Fine Pitch			Registered	3 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3					32 mm	189
EPF10K130EBC484-1	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.6 ns		Yes	2.7 V			2.5		Grid Array			Mixed	2.3 V		70 °C (158 °F)	4 Dedicated Inputs, 369 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484				No		e1						369
EP20K100FC784-1	Altera	Loadable PLD	Other	Ball	784	BGA	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Grid Array			Macrocell	2.375 V		85 °C (185 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	3			No		e1				220 °C (428 °F)
EP20K100ERC208-3	Altera	Loadable PLD	Other	Gull Wing	208	HFQFP	Square	Plastic/Epoxy		4160	Yes	2.625 V	CMOS	143	2.5	1.8,1.8/3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 151 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3			143	220 °C (428 °F)	28 mm	151
EPF10K50EQC208-2	Altera	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	0.6 ns	2880	Yes	2.7 V	CMOS	147	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Mixed	2.3 V	.5 mm	70 °C (158 °F)	147 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	2880 Logic Elements	e0	140 MHz	20 s	147	220 °C (428 °F)	28 mm	147
EP20K300EBC652-3	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	3.06 ns	11520	Yes	1.89 V	CMOS	400	1.8	1.8,1.8/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays	Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 408 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B652	3	3.5 mm	45 mm	No		e0	160 MHz		400	220 °C (428 °F)	45 mm	408
EPF10K100EBI256-1	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	0.6 ns		Yes	2.7 V			2.5		Grid Array			Mixed	2.3 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 191 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No		e1					27 mm	191
EPF10K30AFC484-3N	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.9 ns		Yes	3.6 V	CMOS		3.3		Grid Array			Registered	3 V	1 mm	70 °C (158 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No	1728 Logic Elements; 216 Labs	e1	80 MHz	40 s		260 °C (500 °F)	23 mm	246
EPF8636ARI208-4	Altera	Loadable PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy			Yes	5.5 V	CMOS		5		Flatpack, Fine Pitch			Registered	4.5 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 132 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208		4.07 mm	28 mm	No	636 Flip Flops; 504 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3					28 mm	132
EPF10K50EBI256-1	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	0.6 ns		Yes	2.7 V			2.5		Grid Array			Mixed	2.3 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 191 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No		e1					27 mm	191
EP20K30ERC208-2X	Altera	Loadable PLD	Other	Gull Wing	208	HFQFP	Square	Plastic/Epoxy		1200	Yes	2.625 V	CMOS	117	2.5	1.8,1.8/3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 125 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3	160 MHz		117	220 °C (428 °F)	28 mm	125
EPF10K100EFC256-2X	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.5 ns	4992	Yes	2.625 V	CMOS	191	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	Mixed	2.375 V	1 mm	70 °C (158 °F)	191 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0		20 s	191	220 °C (428 °F)	17 mm	191
EP20K100ERI208-3X	Altera	Loadable PLD		Gull Wing	208	HFQFP	Square	Plastic/Epoxy			Yes	2.625 V	CMOS		2.5		Flatpack, Heat Sink/Slug, Fine Pitch			Macrocell	2.375 V	.5 mm		4 Dedicated Inputs, 151 I/O	4		Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3				220 °C (428 °F)	28 mm	151
EPF10K50SBC356-3X	Altera	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	0.5 ns		Yes	2.625 V	CMOS		2.5		Grid Array, Low Profile			Mixed	2.375 V	1.27 mm	70 °C (158 °F)	220 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1					35 mm	220
EPF10K100BFC256-2	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	12 ns	4992	Yes	2.7 V	CMOS	191	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	Mixed	2.3 V	1 mm	70 °C (158 °F)	191 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No	4992 Logic Elements	e0	140 MHz		191	220 °C (428 °F)	17 mm	191
EPF6016QC240-2N	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy			Yes	5.25 V			5		Flatpack, Fine Pitch			Macrocell	4.75 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 199 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Can Also Be Used 16000 Logic Gates	e3	153 MHz				32 mm	199
EPF10K30EFI672-1X	Altera	Loadable PLD	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	8 ns		Yes	2.7 V	CMOS		2.5		Grid Array			Mixed	2.3 V	1 mm	85 °C (185 °F)	220 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1					27 mm	220
EP20K200EBC356-2XN	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	1.97 ns		Yes	1.89 V	CMOS		1.8		Grid Array, Low Profile			Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 271 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1					35 mm	271
EP20K30ERC208-3X	Altera	Loadable PLD	Other	Gull Wing	208	HFQFP	Square	Plastic/Epoxy			Yes	2.625 V	CMOS		2.5		Flatpack, Heat Sink/Slug, Fine Pitch			Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 125 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3	160 MHz			220 °C (428 °F)	28 mm	125
EP20K300EFC672-2X	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	2.29 ns	11520	Yes	1.89 V	CMOS	400	1.8	1.8,1.8/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 408 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e0	160 MHz	20 s	400	220 °C (428 °F)	27 mm	408
EP20K400FC672-3	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	3.6 ns	16640	Yes	2.625 V	CMOS	496	2.5	2.5,2.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	Macrocell	2.375 V	1 mm	85 °C (185 °F)	502 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e0		20 s	496	220 °C (428 °F)	27 mm	502
EP20K200EQI240-1X	Altera	Loadable PLD		Gull Wing	240	FQFP	Square	Plastic/Epoxy		8320	Yes	2.625 V	CMOS	160	2.5	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm		4 Dedicated Inputs, 168 I/O	4		Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3			160	220 °C (428 °F)	32 mm	168
EP20K30EFC484	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes	1.89 V			1.8		Grid Array			Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 128 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1	160 MHz				23 mm	128
EPF10K130EBI356-3	Altera	Loadable PLD	Industrial	Ball	356	LBGA	Square	Plastic/Epoxy	16 ns	6656	Yes	2.7 V	CMOS	274	2.5	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays	Mixed	2.3 V	1.27 mm	85 °C (185 °F)	274 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e0			274	220 °C (428 °F)	35 mm	274
EP1M350FI780-6	Altera	Loadable PLD		Ball	780	HBGA	Square	Plastic/Epoxy			Yes	1.89 V	CMOS		1.8		Grid Array, Heat Sink/Slug			Macrocell	1.71 V	1 mm		0 Dedicated Inputs, 486 I/O	0		Tin Silver Copper	Bottom	S-PBGA-B780		3.5 mm	29 mm	No		e1					29 mm	486
EPF10K200EBC672-2	Altera	Loadable PLD	Commercial	Ball	672	BGA	Square	Plastic/Epoxy	0.5 ns		Yes	2.7 V			2.5		Grid Array			Mixed	2.3 V		70 °C (158 °F)	4 Dedicated Inputs, 470 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672				No		e1						470
EPF10K200SQI240-3	Altera	Loadable PLD	Industrial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	16 ns	9984	Yes	2.7 V	CMOS	182	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Mixed	2.3 V	.5 mm	85 °C (185 °F)	182 I/O		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0			182	220 °C (428 °F)	32 mm	182
EP1K50FI484-2	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	0.4 ns	2880	Yes	2.625 V	CMOS	249	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	Mixed	2.375 V	1 mm	85 °C (185 °F)	249 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0	37.5 MHz		249	220 °C (428 °F)	23 mm	249
EP20K100EFI324-2X	Altera	Loadable PLD		Ball	324	BGA	Square	Plastic/Epoxy	2.02 ns	4160	Yes	1.89 V	CMOS	238	1.8	1.8,1.8/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	Macrocell	1.71 V	1 mm		4 Dedicated Inputs, 246 I/O	4		Tin Lead	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e0		20 s	238	220 °C (428 °F)	19 mm	246
EP20K600EFC672-3	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	2.92 ns	24320	Yes	1.89 V	CMOS	500	1.8	1.8,1.8/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 508 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e0	160 MHz	20 s	500	220 °C (428 °F)	27 mm	508
EPF6016AQC208-3	Altera	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy		1320	Yes	3.6 V	CMOS	171	3.3	2.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Macrocell	3 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 171 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Can Also Be Used 16000 Logic Gates	e0	133 MHz	20 s	171	220 °C (428 °F)	28 mm	171
EPF10K10QC240-4	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	23.8 ns		Yes	5.25 V	CMOS		5		Flatpack, Fine Pitch			Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No	576 Logic elements; Built-in JTAG boundry-scan test circuitry	e3	60.6 MHz				32 mm
EPF10K30QC240-3	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	17.2 ns		Yes	5.25 V	CMOS		5		Flatpack, Fine Pitch			Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3					32 mm	189
EP20K200CBC652-9	Altera	Loadable PLD	Other	Ball	652	LBGA	Square	Plastic/Epoxy			Yes	1.89 V			1.8		Grid Array, Low Profile			Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	376 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		1.63 mm	45 mm	No		e1					45 mm	376
EPF10K30EQC208-2	Altera	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	0.4 ns	1728	Yes	2.625 V	CMOS	147	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Mixed	2.375 V	.5 mm	70 °C (158 °F)	147 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0		20 s	147	220 °C (428 °F)	28 mm	147
EPF10K30ETI144-3X	Altera	Loadable PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	12.5 ns		Yes	2.7 V	CMOS		2.5		Flatpack, Low Profile, Fine Pitch			Mixed	2.3 V	.5 mm	85 °C (185 °F)	102 I/O		-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144		1.6 mm	20 mm	No		e3					20 mm	102
EPF10K130EBI356-2	Altera	Loadable PLD	Industrial	Ball	356	LBGA	Square	Plastic/Epoxy	0.5 ns	6656	Yes	2.625 V	CMOS	274	2.5	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays	Mixed	2.375 V	1.27 mm	85 °C (185 °F)	274 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0		20 s	274	220 °C (428 °F)	35 mm	274
EP1K10TC100-1N	Altera	Loadable PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	0.4 ns	576	Yes	2.625 V	CMOS	66	2.5	2.5,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	Mixed	2.375 V	.5 mm	70 °C (158 °F)	66 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No		e3	90 MHz	30 s	66	260 °C (500 °F)	14 mm	66
EPF10K200SBI600-3	Altera	Loadable PLD	Industrial	Ball	600	BGA	Square	Plastic/Epoxy	16 ns	9984	Yes	2.7 V	CMOS	470	2.5	2.5,2.5/3.3 V	Grid Array	BGA600,35X35,50	Field Programmable Gate Arrays	Mixed	2.3 V	1.27 mm	85 °C (185 °F)	470 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B600		1.93 mm	45 mm	No		e0			470	220 °C (428 °F)	45 mm	470

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.