Loadable PLD Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	No. of I/O Lines
EPF10K30ATI144-2	Altera	Loadable PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	13 ns		Yes	3.6 V	CMOS		3.3		Flatpack, Low Profile, Fine Pitch			Registered	3 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 102 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144		1.6 mm	20 mm	No		e3					20 mm	102
EPF10K100BPC240-1	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	11 ns		Yes		CMOS		2.5		Flatpack, Fine Pitch			Mixed		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3					32 mm	189
EP20K400CF672C8	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	1.78 ns	16640	Yes	1.89 V	CMOS	480	1.8	1.8,1.8/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e0			480	220 °C (428 °F)	27 mm	488
EP20K1000EBC652XES	Altera	Loadable PLD	Other	Ball	652	LBGA	Square	Plastic/Epoxy			Yes	1.89 V			1.8		Grid Array, Low Profile			Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		1.63 mm	45 mm	No		e1					45 mm	488
EP20K100EFC672-1	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy			Yes	1.89 V			1.8		Grid Array			Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e1	160 MHz			220 °C (428 °F)	27 mm	246
EP20K400FC672-2N	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	3.1 ns		Yes	2.625 V	CMOS		2.5		Grid Array			Macrocell	2.375 V	1 mm	85 °C (185 °F)	502 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e1					27 mm	502
EPF6016QC240-3	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy		1320	Yes	5.25 V	CMOS	199	5	3.3/5,5 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Macrocell	4.75 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 199 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Can Also Be Used 16000 Logic Gates	e0	133 MHz	20 s	199	220 °C (428 °F)	32 mm	199
EPF10K10BI356-4	Altera	Loadable PLD	Industrial	Ball	356	HLBGA	Square	Plastic/Epoxy	23.8 ns		Yes	5.5 V	CMOS		5		Grid Array, Heat Sink/Slug, Low Profile			Registered	4.5 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No	576 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	60.6 MHz				35 mm
EP20K60ERC208-1	Altera	Loadable PLD	Other	Gull Wing	208	HFQFP	Square	Plastic/Epoxy		2560	Yes	2.625 V	CMOS	140	2.5	1.8,1.8/3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 148 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3	160 MHz		140	220 °C (428 °F)	28 mm	148
EPF6016QI208-3	Altera	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy		1320	Yes	5.5 V	CMOS	171	5	3.3/5,5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Macrocell	4.5 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 171 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Can Also Be Used 16000 Logic Gates	e0	133 MHz	20 s	171	220 °C (428 °F)	28 mm	171
EPF10K50SQI208-1	Altera	Loadable PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	8 ns	2880	Yes	2.7 V	CMOS	147	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Mixed	2.3 V	.5 mm	85 °C (185 °F)	147 I/O		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0			147	220 °C (428 °F)	28 mm	147
EPF8820RM208-2	Altera	Loadable PLD	Military	Gull Wing	208	HFQFP	Square	Plastic/Epoxy			Yes	5.5 V	CMOS		5		Flatpack, Heat Sink/Slug, Fine Pitch			Registered	4.5 V	.5 mm	125 °C (257 °F)	4 Dedicated Inputs, 148 I/O	4	-55 °C (-67 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No	820 Flip Flops; 672 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3					28 mm	148
EPF10K40QC240-3	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	17.2 ns		Yes	5.25 V	CMOS		5		Flatpack, Fine Pitch			Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3					32 mm	189
EP20K100RI208-3X	Altera	Loadable PLD		Gull Wing	208	HFQFP	Square	Plastic/Epoxy			Yes	2.625 V	CMOS		2.5		Flatpack, Heat Sink/Slug, Fine Pitch			Macrocell	2.375 V	.5 mm		4 Dedicated Inputs, 159 I/O	4		Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3				220 °C (428 °F)	28 mm	159
EP2A70F1508C8	Altera	Loadable PLD	Other	Ball	1508	BGA	Square	Plastic/Epoxy	2.49 ns	67200	Yes	1.575 V	CMOS	1048	1.5	1.5,1.5/3.3 V	Grid Array	BGA1508,39X39,40	Field Programmable Gate Arrays	Macrocell	1.425 V	1 mm	85 °C (185 °F)	1060 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1508	3	3.5 mm	40 mm	No		e0			1048	220 °C (428 °F)	40 mm	1060
EP20K600EFC33-1X	Altera	Loadable PLD	Other	Ball	1020	BGA	Square	Plastic/Epoxy	1.57 ns	24320	Yes	1.89 V	CMOS	580	1.8	1.8,1.8/3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays	Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 588 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e0		20 s	580	220 °C (428 °F)	33 mm	588
EPF10K130ERI240-2	Altera	Loadable PLD	Industrial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	12 ns	6656	Yes	2.7 V	CMOS	186	2.5	2.5,2.5/3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	Mixed	2.3 V	.5 mm	85 °C (185 °F)	186 I/O		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e0			186	220 °C (428 °F)	32 mm	186
EPXA10F1020C1	Altera	Loadable PLD	Other	Ball	1020	HBGA	Square	Plastic/Epoxy			Yes	1.89 V			1.8		Grid Array, Heat Sink/Slug			Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 711 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e0				220 °C (428 °F)	33 mm	711
EP20K200CF672C-9	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy			Yes	1.89 V			1.8		Grid Array			Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 376 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e1				220 °C (428 °F)	27 mm	376
EPF10K100ABC356-1	Altera	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	0.6 ns	4992	Yes	3.6 V	CMOS	274	3.3	2.5/3.3,3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays	Registered	3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 274 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0		20 s	274	220 °C (428 °F)	35 mm	274
EPF10K100EBC356-3N	Altera	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	0.7 ns		Yes	2.625 V	CMOS		2.5		Grid Array, Low Profile			Mixed	2.375 V	1.27 mm	70 °C (158 °F)	274 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1					35 mm	274
EPF10K70RI240-3	Altera	Loadable PLD	Industrial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	19.1 ns		Yes	5.25 V	CMOS		5		Flatpack, Heat Sink/Slug, Fine Pitch			Registered	4.75 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 189 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3					32 mm	189
EP20K100FC324-2X	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	3 ns	4160	Yes	2.625 V	CMOS	246	2.5	2.5,2.5/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 252 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e0		20 s	246	220 °C (428 °F)	19 mm	252
EP1K50TC144	Altera	Loadable PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Flatpack, Low Profile, Fine Pitch			Registered	2.375 V	.5 mm	70 °C (158 °F)	6 Dedicated Inputs, 102 I/O	6	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144		1.6 mm	20 mm	No		e3					20 mm	102
EP20K160EBC356-3N	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	2.29 ns		Yes	1.89 V	CMOS		1.8		Grid Array, Low Profile			Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 271 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1	160 MHz				35 mm	271
EPF10K130EFI484-2	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	0.5 ns	6656	Yes	2.625 V	CMOS	369	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	Mixed	2.375 V	1 mm	85 °C (185 °F)	369 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0		20 s	369	220 °C (428 °F)	23 mm	369
EPF10K130EFC484-2	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.5 ns	6656	Yes	2.625 V	CMOS	369	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	Mixed	2.375 V	1 mm	70 °C (158 °F)	369 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0		20 s	369	220 °C (428 °F)	23 mm	369
EPF10K10AQC208	Altera	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy			Yes	3.6 V			3.3		Flatpack, Fine Pitch			Mixed	3 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 134 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3					28 mm	134
EP20K400CB652C9	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	2 ns	16640	Yes	1.89 V	CMOS	480	1.8	1.8,1.8/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays	Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B652	3	2 mm	45 mm	No		e0		20 s	480	220 °C (428 °F)	45 mm	488
EP20K300EQC240-3N	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	3.06 ns	11520	Yes	1.89 V	CMOS	144	1.8	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 152 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3	160 MHz	30 s	144	245 °C (473 °F)	32 mm	152
EP20K60EFC144-3N	Altera	Loadable PLD	Other	Ball	144	LBGA	Square	Plastic/Epoxy	3.56 ns		Yes	1.89 V	CMOS		1.8		Grid Array, Low Profile			Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 93 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144		1.7 mm	13 mm	No		e1	160 MHz				13 mm	93
EPF6016AFC100-1N	Altera	Loadable PLD	Other	Ball	100	LBGA	Square	Plastic/Epoxy			Yes	3.6 V			3.3		Grid Array, Low Profile			Macrocell	3 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 81 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100		1.7 mm	11 mm	No		e1	172 MHz				11 mm	81
EP20K160ERI208-2	Altera	Loadable PLD		Gull Wing	208	HFQFP	Square	Plastic/Epoxy		6400	Yes	2.625 V	CMOS	135	2.5	1.8,1.8/3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm		4 Dedicated Inputs, 143 I/O	4		Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3			135	220 °C (428 °F)	28 mm	143
EP20K160ETC144-2XN	Altera	Loadable PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	1.93 ns		Yes	1.89 V	CMOS		1.8		Flatpack, Low Profile, Fine Pitch			Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 88 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	160 MHz				20 mm	88
EPF10K200SRC240-3X	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	0.8 ns		Yes	2.625 V	CMOS		2.5		Flatpack, Fine Pitch			Mixed	2.375 V	.5 mm	70 °C (158 °F)	182 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3					32 mm	182
EPF10K100BI560-5	Altera	Loadable PLD	Industrial	Ball	560	BGA	Square	Plastic/Epoxy	27 ns		Yes	5.5 V	CMOS		5		Grid Array			Registered	4.5 V		85 °C (185 °F)	4 Dedicated Inputs	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B560				No	4992 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	53.76 MHz
EP20K200CBC652-7X	Altera	Loadable PLD	Other	Ball	652	LBGA	Square	Plastic/Epoxy	1.6 ns		Yes	1.89 V			1.8		Grid Array, Low Profile			Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	376 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		1.63 mm	45 mm	No		e1					45 mm	376
EPF10K50SFI484-1	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	8 ns	2880	Yes	2.7 V	CMOS	254	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	Mixed	2.3 V	1 mm	85 °C (185 °F)	254 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0			254	220 °C (428 °F)	23 mm	254
EP20K200CBC356-7X	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	1.6 ns		Yes	1.89 V			1.8		Grid Array, Low Profile			Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	271 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1					35 mm	271
EPF8820AQC208-A-2	Altera	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	1.7 ns		Yes	3.6 V	CMOS		3.3		Flatpack, Fine Pitch			Registered	3 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 152 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No	Can also operate at 5 V supply	e3					28 mm	152
EP20K400EBC672-1	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy			Yes				1.8		Grid Array			Macrocell			85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672				No		e0						488
EPF10K10QC240-5	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	27 ns		Yes	5.25 V	CMOS		5		Flatpack, Fine Pitch			Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No	576 Logic elements; Built-in JTAG boundry-scan test circuitry	e3	53.76 MHz				32 mm
EP20K400EFC784-2	Altera	Loadable PLD	Other	Ball	784	BGA	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Grid Array			Macrocell	2.375 V		85 °C (185 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B784	3			No		e0				220 °C (428 °F)
EP1K50FI256-3	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	12.5 ns	2880	Yes	2.625 V	CMOS	186	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	Registered	2.375 V	1 mm	85 °C (185 °F)	6 Dedicated Inputs, 186 I/O	6	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0			186	220 °C (428 °F)	17 mm	186
EPF6016ABC256-2	Altera	Loadable PLD		Ball	256	BGA		Plastic/Epoxy			Yes		CMOS	204		3.3,3.3/5 V	Grid Array	BGA256(UNSPEC)	Field Programmable Gate Arrays								Tin Lead	Bottom					No		e0			204	220 °C (428 °F)
EP20K200EBC356-2X	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	1.97 ns	8320	Yes	1.89 V	CMOS	263	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays	Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 271 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0		20 s	263	220 °C (428 °F)	35 mm	271
EPF10K50EFC484-2N	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.6 ns		Yes	2.7 V	CMOS		2.5		Grid Array			Mixed	2.3 V	1 mm	70 °C (158 °F)	254 I/O		0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No	2880 Logic Elements	e1	140 MHz	40 s		260 °C (500 °F)	23 mm	254
EPF10K50EQC208-2N	Altera	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	0.6 ns		Yes	2.7 V	CMOS		2.5		Flatpack, Fine Pitch			Mixed	2.3 V	.5 mm	70 °C (158 °F)	147 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	2880 Logic Elements	e3	140 MHz				28 mm	147

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.