Loadable PLD Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	No. of I/O Lines
EPF10K50SFC256-2N	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.4 ns		Yes	2.625 V	CMOS		2.5		Grid Array			Mixed	2.375 V	1 mm	70 °C (158 °F)	191 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.1 mm	17 mm	No		e1					17 mm	191
EPF10K130EBI672-2	Altera	Loadable PLD	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	0.7 ns		Yes	2.7 V			2.5		Grid Array			Mixed	2.3 V		85 °C (185 °F)	4 Dedicated Inputs, 413 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672				No		e1						413
EP20K100FI400-2	Altera	Loadable PLD		Ball	400	BGA	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Grid Array			Macrocell	2.375 V			4 Dedicated Inputs	4		Tin Silver Copper	Bottom	S-PBGA-B400	3			No		e1				220 °C (428 °F)
EP20K60EBC356-2X	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	2.41 ns	2560	Yes	1.89 V	CMOS	188	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays	Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 196 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0	160 MHz	20 s	188	220 °C (428 °F)	35 mm	196
EP1K30TC144-1N	Altera	Loadable PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	0.4 ns	1728	Yes	2.625 V	CMOS	102	2.5	2.5,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	Mixed	2.375 V	.5 mm	70 °C (158 °F)	102 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	90 MHz	30 s	102	260 °C (500 °F)	20 mm	102
EPF6016QC208-2	Altera	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy		1320	Yes	5.25 V	CMOS	171	5	3.3/5,5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Macrocell	4.75 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 171 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Can Also Be Used 16000 Logic Gates	e0	153 MHz	20 s	171	220 °C (428 °F)	28 mm	171
EP1M350FC780-5	Altera	Loadable PLD	Other	Ball	780	HBGA	Square	Plastic/Epoxy			Yes	1.89 V	CMOS		1.8		Grid Array, Heat Sink/Slug			Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 486 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		3.5 mm	29 mm	No		e1					29 mm	486
EPXA4F672C2	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy			Yes	1.89 V			1.8		Grid Array			Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 426 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e0		20 s		220 °C (428 °F)	27 mm	426
EP2A40F1020C9	Altera	Loadable PLD	Other	Ball	1020	BGA	Square	Plastic/Epoxy	2.05 ns	38400	Yes	1.575 V	CMOS	723	1.5	1.5,1.5/3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays	Macrocell	1.425 V	1 mm	85 °C (185 °F)	735 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e0			723	220 °C (428 °F)	33 mm	735
EPF10K70QI240-4	Altera	Loadable PLD	Industrial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	24.2 ns		Yes	5.25 V	CMOS		5		Flatpack, Fine Pitch			Registered	4.75 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 189 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No	3744 Logic elements; Built-in JTAG boundry-scan test circuitry	e3	60.6 MHz				32 mm	189
EPF10K200SBC600-3	Altera	Loadable PLD	Commercial	Ball	600	BGA	Square	Plastic/Epoxy	0.8 ns	9984	Yes	2.625 V	CMOS	470	2.5	2.5,2.5/3.3 V	Grid Array	BGA600,35X35,50	Field Programmable Gate Arrays	Mixed	2.375 V	1.27 mm	70 °C (158 °F)	470 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B600	3	1.93 mm	45 mm	No		e0		20 s	470	220 °C (428 °F)	45 mm	470
EP20K200CQ208C7N	Altera	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	1.48 ns		Yes	1.89 V			1.8		Flatpack, Fine Pitch			Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 136 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3					28 mm	136
EPF10K50VFI484-4	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	21.1 ns		Yes	3.6 V	CMOS		3.3		Grid Array			Registered	3 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 291 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm	291
EP20K1500CF1020C-7	Altera	Loadable PLD	Other	Ball	1020	HBGA	Square	Plastic/Epoxy	1.4 ns		Yes	1.89 V			1.8		Grid Array, Heat Sink/Slug			Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 808 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e1				220 °C (428 °F)	33 mm	808
EPF81188AQC208-A-3	Altera	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	1.8 ns		Yes	3.6 V	CMOS		3.3		Flatpack, Fine Pitch			Registered	3 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 148 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No	Can also operate at 5 V supply	e3					28 mm	148
EPF10K200SBC600-2N	Altera	Loadable PLD	Commercial	Ball	600	BGA	Square	Plastic/Epoxy	0.6 ns		Yes	2.625 V	CMOS		2.5		Grid Array			Mixed	2.375 V	1.27 mm	70 °C (158 °F)	470 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B600		1.93 mm	45 mm	No		e1					45 mm	470
EP20K200BI356-1	Altera	Loadable PLD		Ball	356	LBGA	Square	Plastic/Epoxy		8320	Yes	2.625 V	CMOS	271	2.5	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays	Macrocell	2.375 V	1.27 mm		4 Dedicated Inputs, 277 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1			271	220 °C (428 °F)	35 mm	277
EP20K200FC672	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Grid Array			Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 382 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e1				220 °C (428 °F)	27 mm	382
EPF6016AQC208	Altera	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy			Yes	3.6 V			3.3		Flatpack, Fine Pitch				3 V	.5 mm	85 °C (185 °F)	1320 Clbs, 8000 Gates		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Can also use 16000 Gates	e0					28 mm
EPF10K100ERI240-2X	Altera	Loadable PLD	Industrial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	12 ns		Yes	2.7 V	CMOS		2.5		Flatpack, Heat Sink/Slug, Fine Pitch			Mixed	2.3 V	.5 mm	85 °C (185 °F)	189 I/O		-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3					32 mm	189
EP20K300EBC652-3N	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	3.06 ns		Yes	1.89 V	CMOS		1.8		Grid Array			Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 408 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		3.5 mm	45 mm	No		e1	160 MHz				45 mm	408
EPF10K50BM356-5	Altera	Loadable PLD	Military	Ball	356	HLBGA	Square	Plastic/Epoxy	27 ns		Yes	5.5 V	CMOS		5		Grid Array, Heat Sink/Slug, Low Profile			Registered	4.5 V	1.27 mm	125 °C (257 °F)	4 Dedicated Inputs, 310 I/O	4	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No	2880 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	53.76 MHz				35 mm	310
EP20K60EBC356-2N	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	2.41 ns		Yes	1.89 V	CMOS		1.8		Grid Array, Low Profile			Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 196 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1	160 MHz				35 mm	196
EP20K100TC144-1XN	Altera	Loadable PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	2.5 ns		Yes	2.625 V	CMOS		2.5		Flatpack, Low Profile, Fine Pitch			Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 101 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3					20 mm	101
EP1K100FC256-1N	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.4 ns	4992	Yes	2.625 V	CMOS	186	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	Mixed	2.375 V	1 mm	70 °C (158 °F)	186 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	90 MHz	30 s	186	260 °C (500 °F)	17 mm	186
EPF10K30EFC484-3X	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.6 ns		Yes	2.625 V	CMOS		2.5		Grid Array			Mixed	2.375 V	1 mm	70 °C (158 °F)	220 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm	220
EP20K400GC655-3	Altera	Loadable PLD	Other	Pin/Peg	655	PGA	Square	Ceramic, Metal-Sealed Cofired	3.6 ns	16640	No	2.625 V	CMOS	496	2.5	2.5,2.5/3.3 V	Grid Array	SPGA655,47X47	Field Programmable Gate Arrays	Macrocell	2.375 V	2.54 mm	85 °C (185 °F)	4 Dedicated Inputs, 502 I/O	4	0 °C (32 °F)	Tin Lead	Perpendicular	S-CPGA-P655	1	4.08 mm	62.484 mm	No		e0			496	220 °C (428 °F)	62.484 mm	502
EPXA4F1020C2	Altera	Loadable PLD	Other	Ball	1020	HBGA	Square	Plastic/Epoxy			Yes	1.89 V			1.8		Grid Array, Heat Sink/Slug			Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 488 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e0				220 °C (428 °F)	33 mm	488
EP2A70B724C8N	Altera	Loadable PLD	Other	Ball	724	BGA	Square	Plastic/Epoxy	2.49 ns		Yes	1.575 V	CMOS		1.5		Grid Array			Macrocell	1.425 V	1.27 mm	85 °C (185 °F)	536 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B724		3.5 mm	35 mm	No		e1					35 mm	536
EP20K300ERC240-3	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy		11520	Yes	2.625 V	CMOS	144	2.5	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 152 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3	160 MHz		144	220 °C (428 °F)	32 mm	152
EP1K50QC208-2N	Altera	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	0.4 ns	2880	Yes	2.625 V	CMOS	147	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Mixed	2.375 V	.5 mm	70 °C (158 °F)	147 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	37.5 MHz	30 s	147	245 °C (473 °F)	28 mm	147
EPF10K50SQC240-1N	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	0.3 ns	2880	Yes	2.625 V	CMOS	189	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Mixed	2.375 V	.5 mm	70 °C (158 °F)	189 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3			189		32 mm	189
EPF10K70BI560-5	Altera	Loadable PLD	Industrial	Ball	560	BGA	Square	Plastic/Epoxy	27 ns		Yes	5.5 V	CMOS		5		Grid Array			Registered	4.5 V		85 °C (185 °F)	4 Dedicated Inputs	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B560				No	3744 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	53.76 MHz
EPF10K50VRC240-1	Altera	Loadable PLD	Commercial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	0.4 ns	2880	Yes	3.6 V	CMOS	310	3.3	3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	Registered	3 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0		20 s	310	220 °C (428 °F)	32 mm	189
EP20K200EQC240ES	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy			Yes	1.89 V			1.8		Flatpack, Fine Pitch			Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 168 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3					32 mm	168
EP20K200RI208-3	Altera	Loadable PLD		Gull Wing	208	HFQFP	Square	Plastic/Epoxy		8320	Yes	2.625 V	CMOS	138	2.5	2.5,2.5/3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm		4 Dedicated Inputs, 144 I/O	4		Tin Lead	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e0			138	220 °C (428 °F)	28 mm	144
EPF10K200EBC672-1	Altera	Loadable PLD	Commercial	Ball	672	BGA	Square	Plastic/Epoxy	0.4 ns		Yes	2.7 V			2.5		Grid Array			Mixed	2.3 V		70 °C (158 °F)	4 Dedicated Inputs, 470 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672				No		e1						470
EPF10K100ABC600-2N	Altera	Loadable PLD	Commercial	Ball	600	BGA	Square	Plastic/Epoxy	0.7 ns		Yes	3.6 V	CMOS		3.3		Grid Array			Registered	3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 406 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B600	3	1.93 mm	45 mm	No		e1					45 mm	406
EP20K200CF484C-9N	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy	2 ns		Yes	2.625 V			2.5		Grid Array			Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 376 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1				245 °C (473 °F)	23 mm	376
EPF10K130EFC672-3N	Altera	Loadable PLD	Commercial	Ball	672	BGA	Square	Plastic/Epoxy	0.6 ns		Yes	2.625 V	CMOS		2.5		Grid Array			Mixed	2.375 V	1 mm	70 °C (158 °F)	413 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1					27 mm	413
EPF10K50SPC240-1	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	8 ns		Yes	2.625 V	CMOS		2.5		Flatpack, Fine Pitch			Mixed	2.375 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3					32 mm	189
EP20K30EQC208-1	Altera	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	1.91 ns	1200	Yes	1.89 V	CMOS	117	1.8	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 125 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0	160 MHz		117	220 °C (428 °F)	28 mm	125
EP20K1500CF1020I-7	Altera	Loadable PLD		Ball	1020	HBGA	Square	Plastic/Epoxy	1.4 ns		Yes	1.89 V			1.8		Grid Array, Heat Sink/Slug			Macrocell	1.71 V	1 mm		4 Dedicated Inputs, 808 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e1				220 °C (428 °F)	33 mm	808
EPF10K130ERI240-1	Altera	Loadable PLD	Industrial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	9 ns	6656	Yes	2.7 V	CMOS	186	2.5	2.5,2.5/3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	Mixed	2.3 V	.5 mm	85 °C (185 °F)	186 I/O		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e0			186	220 °C (428 °F)	32 mm	186
EPF10K30ABC356-1	Altera	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	0.6 ns	1728	Yes	3.6 V	CMOS	246	3.3	2.5/3.3,3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays	Registered	3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No	1728 Logic Elements; 216 Labs	e0	80 MHz	20 s	246	220 °C (428 °F)	35 mm	246
EPF8452AQC160-4	Altera	Loadable PLD	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy		336	Yes	5.25 V	CMOS	120	5	3.3/5,5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	Registered	4.75 V	.65 mm	70 °C (158 °F)	4 Dedicated Inputs, 120 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	4.07 mm	28 mm	No	336 Logic Elements	e0	357 MHz	20 s	116	220 °C (428 °F)	28 mm	120
EP20K160ETI144-1X	Altera	Loadable PLD		Gull Wing	144	LFQFP	Square	Plastic/Epoxy		6400	Yes	2.625 V	CMOS	80	2.5	1.8,1.8/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm		4 Dedicated Inputs, 88 I/O	4		Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3			80	220 °C (428 °F)	20 mm	88
EP20K1000EFC33-1X	Altera	Loadable PLD	Other	Ball	1020	BGA	Square	Plastic/Epoxy	1.84 ns	38400	Yes	1.89 V	CMOS	700	1.8	1.8,1.8/3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays	Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 708 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e0		20 s	700	220 °C (428 °F)	33 mm	708

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.