Loadable PLD Programmable Logic Devices (PLD) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

EPF6016QC240-3N

Altera

Loadable PLD

Other

Gull Wing

240

FQFP

Square

Plastic/Epoxy

Yes

5.25 V

5

Flatpack, Fine Pitch

Macrocell

4.75 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 199 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

Can Also Be Used 16000 Logic Gates

e3

133 MHz

32 mm

199

EPF8452AQI160-A-2

Altera

Loadable PLD

Industrial

Gull Wing

160

QFP

Square

Plastic/Epoxy

1.7 ns

Yes

3.6 V

CMOS

3.3

Flatpack

Registered

3 V

.65 mm

85 °C (185 °F)

4 Dedicated Inputs, 120 I/O

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G160

4.07 mm

28 mm

No

Can also operate at 5 V supply

e3

28 mm

120

EPF10K40RI208-3

Altera

Loadable PLD

Industrial

Gull Wing

208

HFQFP

Square

Plastic/Epoxy

17.2 ns

Yes

5.25 V

CMOS

5

Flatpack, Heat Sink/Slug, Fine Pitch

Registered

4.75 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 147 I/O

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

e3

28 mm

147

EP1M120FC484-7A

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.89 V

CMOS

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 303 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

2.1 mm

23 mm

No

e1

23 mm

303

EP1K100FC256-2

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.5 ns

4992

Yes

2.625 V

CMOS

186

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,50

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

186 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

37.5 MHz

20 s

186

220 °C (428 °F)

17 mm

186

EPF10K50RI240-5

Altera

Loadable PLD

Industrial

Gull Wing

240

HFQFP

Square

Plastic/Epoxy

27 ns

2880

Yes

5.5 V

CMOS

189

5

3.3/5,5 V

Flatpack, Heat Sink/Slug, Fine Pitch

HQFP240,1.37SQ,20

Field Programmable Gate Arrays

Registered

4.5 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 189 I/O

4

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G240

4.1 mm

32 mm

No

2880 Logic Elements

e0

57.8 MHz

189

220 °C (428 °F)

32 mm

189

EPF8282LM84-2

Altera

Loadable PLD

Military

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.5 V

CMOS

5

Chip Carrier

Registered

4.5 V

1.27 mm

125 °C (257 °F)

4 Dedicated Inputs, 64 I/O

4

-55 °C (-67 °F)

Quad

S-PQCC-J84

5.08 mm

29.3116 mm

No

282 Flip Flops; 208 Logic elements; Built-in JTAG boundry-scan test circuitry

29.3116 mm

64

EPF8282AVLC84-4

Altera

Loadable PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

208

Yes

3.6 V

CMOS

68

3.3

3.3 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

Registered

3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 68 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

5.08 mm

29.3116 mm

No

208 Logic Elements

e0

357 MHz

64

220 °C (428 °F)

29.3116 mm

68

EP20K60EQI208-1X

Altera

Loadable PLD

Gull Wing

208

FQFP

Square

Plastic/Epoxy

2560

Yes

2.625 V

CMOS

140

2.5

1.8,1.8/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

4 Dedicated Inputs, 148 I/O

4

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

140

220 °C (428 °F)

28 mm

148

EPF8452ATC100-3N

Altera

Loadable PLD

Commercial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

336

Yes

5.25 V

CMOS

68

5

3.3/5,5 V

Flatpack, Low Profile, Fine Pitch

TQFP100,.63SQ

Field Programmable Gate Arrays

Registered

4.75 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 78 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.27 mm

14 mm

No

336 Logic Elements

e3

385 MHz

30 s

68

260 °C (500 °F)

14 mm

78

EP20K200CF484I8

Altera

Loadable PLD

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

1.78 ns

8320

Yes

1.89 V

CMOS

368

1.8

1.8,1.8/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 376 I/O

4

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.6 mm

23 mm

No

e0

368

220 °C (428 °F)

23 mm

376

EPF6016ATC100-3

Altera

Loadable PLD

Other

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

1320

Yes

3.6 V

CMOS

81

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Field Programmable Gate Arrays

Macrocell

3 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 81 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G100

3

1.27 mm

14 mm

No

Can Also Be Used 16000 Logic Gates

e0

133 MHz

20 s

81

235 °C (455 °F)

14 mm

81

EPF10K30ABI484-3

Altera

Loadable PLD

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

2 ns

Yes

3.6 V

3.3

Grid Array

Mixed

3 V

85 °C (185 °F)

4 Dedicated Inputs, 246 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

No

e1

246

EPF8636ARC160-3

Altera

Loadable PLD

Commercial

Gull Wing

160

HQFP

Square

Plastic/Epoxy

Yes

5.25 V

CMOS

5

Flatpack, Heat Sink/Slug

Registered

4.75 V

.65 mm

70 °C (158 °F)

4 Dedicated Inputs

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G160

3.91 mm

28 mm

No

636 Flip Flops; 504 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e3

28 mm

EPF10K200EBC600-2N

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.6 ns

Yes

2.7 V

CMOS

2.5

Grid Array

Mixed

2.3 V

1.27 mm

70 °C (158 °F)

470 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e1

45 mm

470

EP20K200CFC672-7X

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

1.6 ns

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

376 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.1 mm

27 mm

No

e1

27 mm

376

EP1K100QC208-2N

Altera

Loadable PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

0.5 ns

4992

Yes

2.625 V

CMOS

147

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Mixed

2.375 V

.5 mm

70 °C (158 °F)

147 I/O

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

37.5 MHz

30 s

147

245 °C (473 °F)

28 mm

147

EP20K200EQC240

Altera

Loadable PLD

Other

Gull Wing

240

FQFP

Square

Plastic/Epoxy

Yes

1.8

Flatpack, Fine Pitch

Macrocell

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 166 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e3

220 °C (428 °F)

32 mm

166

EP20K200RC208-1V

Altera

Loadable PLD

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

2.5 ns

8320

Yes

2.625 V

CMOS

138

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 144 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G208

4.1 mm

28 mm

No

e0

100 MHz

138

220 °C (428 °F)

28 mm

144

EPF10K50QI240-3

Altera

Loadable PLD

Industrial

Gull Wing

240

FQFP

Square

Plastic/Epoxy

17.2 ns

Yes

5.25 V

CMOS

5

Flatpack, Fine Pitch

Registered

4.75 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 189 I/O

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e3

32 mm

189

EP20K300EFC784

Altera

Loadable PLD

Other

Ball

784

BGA

Square

Plastic/Epoxy

Yes

1.8

Grid Array

Macrocell

85 °C (185 °F)

4 Dedicated Inputs

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B784

3

No

e1

220 °C (428 °F)

EPF10K100EQC208-1X

Altera

Loadable PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

0.4 ns

4992

Yes

2.625 V

CMOS

147

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Mixed

2.375 V

.5 mm

70 °C (158 °F)

147 I/O

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e0

147

220 °C (428 °F)

28 mm

147

EPF10K130ERC240-1X

Altera

Loadable PLD

Commercial

Gull Wing

240

HFQFP

Square

Plastic/Epoxy

9 ns

Yes

2.7 V

CMOS

2.5

Flatpack, Heat Sink/Slug, Fine Pitch

Mixed

2.3 V

.5 mm

70 °C (158 °F)

186 I/O

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e3

32 mm

186

EP20K400CB652I-9

Altera

Loadable PLD

Ball

652

LBGA

Square

Plastic/Epoxy

16640

Yes

1.89 V

CMOS

480

1.8

1.8,1.8/3.3 V

Grid Array, Low Profile

BGA652,35X35,50

Field Programmable Gate Arrays

Macrocell

1.71 V

1.27 mm

4 Dedicated Inputs, 488 I/O

4

Tin Lead

Bottom

S-PBGA-B652

1.63 mm

45 mm

No

e0

480

220 °C (428 °F)

45 mm

488

EPF10K100EPC208-2

Altera

Loadable PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

12 ns

Yes

2.625 V

CMOS

2.5

Flatpack, Fine Pitch

Mixed

2.375 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 147 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

e3

28 mm

147

EP20K200CBI652-9

Altera

Loadable PLD

Ball

652

LBGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

376 I/O

Tin Silver Copper

Bottom

S-PBGA-B652

1.63 mm

45 mm

No

e1

45 mm

376

EPF10K30AFC256-1N

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.6 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Registered

3 V

1 mm

70 °C (158 °F)

4 Dedicated Inputs, 191 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

1728 Logic Elements; 216 Labs

e1

80 MHz

17 mm

191

EP1K30FC256-2

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.4 ns

1728

Yes

2.625 V

CMOS

171

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,50

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

171 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

37.5 MHz

20 s

171

220 °C (428 °F)

17 mm

171

EP20K1500CBI652-8X

Altera

Loadable PLD

Ball

652

LBGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

488 I/O

Tin Silver Copper

Bottom

S-PBGA-B652

1.63 mm

45 mm

No

e1

45 mm

488

EP20K200RC208-2X

Altera

Loadable PLD

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

3 ns

8320

Yes

2.625 V

CMOS

138

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 144 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

e3

138

220 °C (428 °F)

28 mm

144

EP20K160EQC240-2X

Altera

Loadable PLD

Other

Gull Wing

240

FQFP

Square

Plastic/Epoxy

1.93 ns

6400

Yes

1.89 V

CMOS

167

1.8

1.8,1.8/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 175 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e0

160 MHz

20 s

167

220 °C (428 °F)

32 mm

175

EPF10K50EQC208-1

Altera

Loadable PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

0.5 ns

2880

Yes

2.7 V

CMOS

147

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Mixed

2.3 V

.5 mm

70 °C (158 °F)

147 I/O

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

2880 Logic Elements

e0

140 MHz

20 s

147

220 °C (428 °F)

28 mm

147

EP20K200CFI484-8X

Altera

Loadable PLD

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

376 I/O

Tin Silver Copper

Bottom

S-PBGA-B484

2.1 mm

23 mm

No

e1

23 mm

376

EP20K100EQC208-2

Altera

Loadable PLD

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

2.02 ns

4160

Yes

1.89 V

CMOS

143

1.8

1.8,1.8/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 151 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e0

20 s

143

220 °C (428 °F)

28 mm

151

EP20K200ERI208-2X

Altera

Loadable PLD

Gull Wing

208

HFQFP

Square

Plastic/Epoxy

8320

Yes

2.625 V

CMOS

128

2.5

1.8,1.8/3.3 V

Flatpack, Heat Sink/Slug, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

4 Dedicated Inputs, 136 I/O

4

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

e3

128

220 °C (428 °F)

28 mm

136

EP20K200EQI208

Altera

Loadable PLD

Gull Wing

208

FQFP

Square

Plastic/Epoxy

Yes

1.8

Flatpack, Fine Pitch

Macrocell

.5 mm

4 Dedicated Inputs, 134 I/O

4

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

220 °C (428 °F)

28 mm

134

EP20K100QC240-2X

Altera

Loadable PLD

Other

Gull Wing

240

FQFP

Square

Plastic/Epoxy

3 ns

4160

Yes

2.625 V

CMOS

183

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 189 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e3

183

220 °C (428 °F)

32 mm

189

EPF10K200EFC672-1

Altera

Loadable PLD

Commercial

Ball

672

BGA

Square

Plastic/Epoxy

0.4 ns

9984

Yes

2.7 V

CMOS

470

2.5

2.5,2.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

70 °C (158 °F)

470 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

9984 Logic Elements

e0

140 MHz

20 s

470

220 °C (428 °F)

27 mm

470

EPF10K70QI304-5

Altera

Loadable PLD

Industrial

Gull Wing

304

FQFP

Square

Plastic/Epoxy

27 ns

Yes

5.5 V

CMOS

5

Flatpack, Fine Pitch

Registered

4.5 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G304

4.5 mm

40 mm

No

3744 Logic elements; Built-in JTAG boundry-scan test circuitry

e3

53.76 MHz

40 mm

EPF10K50VBI356-1

Altera

Loadable PLD

Industrial

Ball

356

LBGA

Square

Plastic/Epoxy

11.2 ns

Yes

3.6 V

CMOS

3.3

Grid Array, Low Profile

Registered

3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 274 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

274

EP20K200QC208-1X

Altera

Loadable PLD

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

8320

Yes

2.625 V

CMOS

138

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 144 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

138

220 °C (428 °F)

28 mm

144

EP20K60EQC208-2X

Altera

Loadable PLD

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

2.41 ns

2560

Yes

1.89 V

CMOS

140

1.8

1.8,1.8/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 148 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e0

160 MHz

20 s

140

220 °C (428 °F)

28 mm

148

EP20K600EFC672-3N

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

2.92 ns

24320

Yes

1.89 V

CMOS

500

1.8

1.8,1.8/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 508 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

4

3.5 mm

27 mm

No

e1

160 MHz

30 s

500

245 °C (473 °F)

27 mm

508

EP20K60ERC208-1X

Altera

Loadable PLD

Other

Gull Wing

208

HFQFP

Square

Plastic/Epoxy

2560

Yes

2.625 V

CMOS

140

2.5

1.8,1.8/3.3 V

Flatpack, Heat Sink/Slug, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 148 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

e3

160 MHz

140

220 °C (428 °F)

28 mm

148

EP20K60EQC208-3N

Altera

Loadable PLD

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

3.56 ns

2560

Yes

1.89 V

CMOS

140

1.8

1.8,1.8/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 148 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

160 MHz

30 s

140

245 °C (473 °F)

28 mm

148

EPF10K50VBI356-4

Altera

Loadable PLD

Industrial

Ball

356

LBGA

Square

Plastic/Epoxy

0.6 ns

2880

Yes

3.6 V

CMOS

274

3.3

3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Registered

3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 274 I/O

4

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e0

20 s

274

220 °C (428 °F)

35 mm

274

EPF10K130VGC599-2

Altera

Loadable PLD

Commercial

Pin/Peg

599

IPGA

Square

Ceramic, Metal-Sealed Cofired

0.5 ns

832

No

3.6 V

CMOS

470

3.3

3.3 V

Grid Array, Interstitial Pitch

SPGA599,47X47

Field Programmable Gate Arrays

Registered

3 V

2.54 mm

70 °C (158 °F)

4 Dedicated Inputs, 470 I/O

4

0 °C (32 °F)

Tin Lead

Perpendicular

S-CPGA-P599

1

5.08 mm

62.484 mm

No

e0

466

220 °C (428 °F)

62.484 mm

470

EPF10K30ARC240-3

Altera

Loadable PLD

Commercial

Gull Wing

240

HFQFP

Square

Plastic/Epoxy

17 ns

Yes

3.6 V

CMOS

3.3

Flatpack, Heat Sink/Slug, Fine Pitch

Registered

3 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 189 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e3

32 mm

189

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.