Loadable PLD Programmable Logic Devices (PLD) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

EP1K50FI256-1

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

8 ns

2880

Yes

2.625 V

CMOS

186

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Registered

2.375 V

1 mm

85 °C (185 °F)

6 Dedicated Inputs, 186 I/O

6

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

90 MHz

186

220 °C (428 °F)

17 mm

186

EPF10K50VQC240-1

Altera

Loadable PLD

Commercial

Gull Wing

240

FQFP

Square

Plastic/Epoxy

0.4 ns

2880

Yes

3.6 V

CMOS

310

3.3

3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Registered

3 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 189 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e0

20 s

310

220 °C (428 °F)

32 mm

189

EPF8820ARI208-3

Altera

Loadable PLD

Industrial

Gull Wing

208

HFQFP

Square

Plastic/Epoxy

672

Yes

5.5 V

CMOS

152

5

3.3/5,5 V

Flatpack, Heat Sink/Slug, Fine Pitch

HQFP208,1.2SQ,20

Field Programmable Gate Arrays

Registered

4.5 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 152 I/O

4

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G208

4.1 mm

28 mm

No

672 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e0

385 MHz

148

220 °C (428 °F)

28 mm

152

EPF10K200EBI600-3

Altera

Loadable PLD

Industrial

Ball

600

BGA

Square

Plastic/Epoxy

16 ns

9984

Yes

2.7 V

CMOS

470

2.5

2.5,2.5/3.3 V

Grid Array

BGA600,35X35,50

Field Programmable Gate Arrays

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

470 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e0

470

220 °C (428 °F)

45 mm

470

EP20K100EBC484-2

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.8

Grid Array

Macrocell

85 °C (185 °F)

4 Dedicated Inputs, 246 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

No

e1

246

EP20K200CQI208-8X

Altera

Loadable PLD

Gull Wing

208

FQFP

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Flatpack, Fine Pitch

Macrocell

1.71 V

.5 mm

136 I/O

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

e3

28 mm

136

EP1K50FC256

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Registered

2.375 V

1 mm

70 °C (158 °F)

6 Dedicated Inputs, 186 I/O

6

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

e1

17 mm

186

EP20K1500CBC652-7X

Altera

Loadable PLD

Other

Ball

652

LBGA

Square

Plastic/Epoxy

1.4 ns

Yes

1.89 V

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

488 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B652

1.63 mm

45 mm

No

e1

45 mm

488

EPF6024AFI256-2

Altera

Loadable PLD

Ball

256

BGA

Square

Plastic/Epoxy

1960

Yes

3.6 V

CMOS

219

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Macrocell

3 V

1 mm

4 Dedicated Inputs, 219 I/O

4

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

153 MHz

219

220 °C (428 °F)

17 mm

219

EPF6016AFI100-2

Altera

Loadable PLD

Ball

100

LBGA

Square

Plastic/Epoxy

1320

Yes

3.6 V

CMOS

81

3.3

2.5/3.3,3.3 V

Grid Array, Low Profile

BGA100,10X10,40

Field Programmable Gate Arrays

Macrocell

3 V

1 mm

4 Dedicated Inputs, 81 I/O

4

Tin Lead

Bottom

S-PBGA-B100

3

1.7 mm

11 mm

No

e0

153 MHz

81

220 °C (428 °F)

11 mm

81

EP20K100EBC324-1

Altera

Loadable PLD

Other

Ball

324

BGA

Square

Plastic/Epoxy

Yes

1.8

Grid Array

Macrocell

85 °C (185 °F)

4 Dedicated Inputs, 246 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

No

e1

246

EP20K100EFI196-1

Altera

Loadable PLD

Ball

196

BGA

Square

Plastic/Epoxy

Yes

1.8

Grid Array

Macrocell

4 Dedicated Inputs, 143 I/O

4

Tin Lead

Bottom

S-PBGA-B196

3

No

e0

220 °C (428 °F)

143

EPF10K30AFC256-2N

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.7 ns

1728

Yes

3.6 V

CMOS

191

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Registered

3 V

1 mm

70 °C (158 °F)

4 Dedicated Inputs, 191 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

1728 Logic Elements; 216 Labs

e1

80 MHz

30 s

191

260 °C (500 °F)

17 mm

191

EP20K60EQC208

Altera

Loadable PLD

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Flatpack, Fine Pitch

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 151 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

e3

160 MHz

28 mm

151

EP20K1500CFI1020-8

Altera

Loadable PLD

Ball

1020

HBGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array, Heat Sink/Slug

Macrocell

1.71 V

1 mm

808 I/O

Tin Silver Copper

Bottom

S-PBGA-B1020

3.5 mm

33 mm

No

e1

33 mm

808

EP20K160ETC144-3N

Altera

Loadable PLD

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

2.29 ns

6400

Yes

1.89 V

CMOS

80

1.8

1.8,1.8/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 88 I/O

4

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

160 MHz

30 s

80

245 °C (473 °F)

20 mm

88

EP20K200EQC240-1N

Altera

Loadable PLD

Other

Gull Wing

240

FQFP

Square

Plastic/Epoxy

1.58 ns

Yes

1.89 V

CMOS

1.8

Flatpack, Fine Pitch

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 168 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e3

32 mm

168

EPF8636AGI192-5

Altera

Loadable PLD

Industrial

Pin/Peg

192

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

CMOS

5

Grid Array

Registered

4.5 V

2.54 mm

85 °C (185 °F)

4 Dedicated Inputs, 132 I/O

4

-40 °C (-40 °F)

Perpendicular

S-CPGA-P192

5.43 mm

45.15 mm

No

636 Flip Flops; 504 Logic elements; Configurable I/O operation with 3.3 V or 5 V

45.15 mm

132

EPF81188AQC208-3N

Altera

Loadable PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

Yes

5.25 V

CMOS

5

Flatpack, Fine Pitch

Registered

4.75 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 148 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e3

28 mm

148

EP20K1000CF33C7N

Altera

Loadable PLD

Other

Ball

1020

BGA

Square

Plastic/Epoxy

1.49 ns

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 708 I/O

4

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B1020

3.5 mm

33 mm

No

e1

40 s

245 °C (473 °F)

33 mm

708

EP20K600EBI652

Altera

Loadable PLD

Ball

652

LBGA

Square

Plastic/Epoxy

Yes

1.8

Grid Array, Low Profile

Macrocell

1.27 mm

4 Dedicated Inputs, 488 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B652

1.63 mm

45 mm

No

e1

220 °C (428 °F)

45 mm

488

EPF6016ATC144-1

Altera

Loadable PLD

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

1320

Yes

3.6 V

CMOS

117

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.63SQ,20

Field Programmable Gate Arrays

Macrocell

3 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 117 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Can Also Be Used 16000 Logic Gates

e0

172 MHz

20 s

117

220 °C (428 °F)

20 mm

117

EP20K400BC652-2

Altera

Loadable PLD

Other

Ball

652

BGA

Square

Plastic/Epoxy

3.1 ns

16640

Yes

2.625 V

CMOS

496

2.5

2.5,2.5/3.3 V

Grid Array

BGA652,35X35,50

Field Programmable Gate Arrays

Macrocell

2.375 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 502 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B652

3

3.5 mm

45 mm

No

e0

20 s

496

220 °C (428 °F)

45 mm

502

EP1K100FC256-2N

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.5 ns

4992

Yes

2.625 V

CMOS

186

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

186 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

37.5 MHz

30 s

186

260 °C (500 °F)

17 mm

186

EP20K100FC324-3V

Altera

Loadable PLD

Other

Ball

324

BGA

Square

Plastic/Epoxy

3.6 ns

4160

Yes

2.625 V

CMOS

246

2.5

2.5,2.5/3.3 V

Grid Array

BGA324,18X18,40

Field Programmable Gate Arrays

Macrocell

2.375 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 252 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

3.5 mm

19 mm

No

e1

246

220 °C (428 °F)

19 mm

252

EPF8636AGC192-5

Altera

Loadable PLD

Commercial

Pin/Peg

192

PGA

Square

Ceramic, Metal-Sealed Cofired

504

No

5.25 V

CMOS

136

5

3.3/5,5 V

Grid Array

PGA192,17X17

Field Programmable Gate Arrays

Registered

4.75 V

2.54 mm

70 °C (158 °F)

4 Dedicated Inputs, 130 I/O

4

0 °C (32 °F)

Tin Lead

Perpendicular

S-CPGA-P192

1

5.43 mm

45.15 mm

No

636 Flip Flops; 504 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e0

132

220 °C (428 °F)

45.15 mm

130

EP20K200CBI652-8X

Altera

Loadable PLD

Ball

652

LBGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

376 I/O

Tin Silver Copper

Bottom

S-PBGA-B652

1.63 mm

45 mm

No

e1

45 mm

376

EPF10K10AQC208-2N

Altera

Loadable PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

0.6 ns

Yes

3.6 V

CMOS

3.3

Flatpack, Fine Pitch

Registered

3 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 134 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

576 Logic Elements; 72 Labs

e3

80 MHz

28 mm

134

EPF10K100EPI240-2

Altera

Loadable PLD

Industrial

Gull Wing

240

FQFP

Square

Plastic/Epoxy

12 ns

Yes

2.625 V

CMOS

2.5

Flatpack, Fine Pitch

Mixed

2.375 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 189 I/O

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e3

32 mm

189

EP20K300EFI672

Altera

Loadable PLD

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.8

Grid Array

Macrocell

1 mm

4 Dedicated Inputs, 408 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e1

220 °C (428 °F)

27 mm

408

EP20K1000EBC652-1

Altera

Loadable PLD

Other

Ball

652

BGA

Square

Plastic/Epoxy

1.84 ns

38400

Yes

1.89 V

CMOS

480

1.8

1.8,1.8/3.3 V

Grid Array

BGA652,35X35,50

Field Programmable Gate Arrays

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 488 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B652

3

3.5 mm

45 mm

No

e0

160 MHz

20 s

480

220 °C (428 °F)

45 mm

488

EPF10K30EBI256-3

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

0.9 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 176 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

27 mm

176

EP20K200CB652C-8

Altera

Loadable PLD

Other

Ball

652

LBGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 376 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B652

1.63 mm

45 mm

No

e1

220 °C (428 °F)

45 mm

376

EPF10K200EBC600-1

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.4 ns

9984

Yes

2.7 V

CMOS

470

2.5

2.5,2.5/3.3 V

Grid Array

BGA600,35X35,50

Field Programmable Gate Arrays

Mixed

2.3 V

1.27 mm

70 °C (158 °F)

470 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B600

3

1.93 mm

45 mm

No

e0

20 s

470

220 °C (428 °F)

45 mm

470

EPF8282ATC100-2

Altera

Loadable PLD

Commercial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

208

Yes

5.25 V

CMOS

78

5

5 V

Flatpack, Low Profile, Fine Pitch

TQFP100,.63SQ

Field Programmable Gate Arrays

Registered

4.75 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 78 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G100

3

1.27 mm

14 mm

No

208 Logic Elements

e0

417 MHz

20 s

74

235 °C (455 °F)

14 mm

78

EP20K30EFC324-1X

Altera

Loadable PLD

Other

Ball

324

BGA

Square

Plastic/Epoxy

1.91 ns

1200

Yes

1.89 V

CMOS

120

1.8

1.8,1.8/3.3 V

Grid Array

BGA324,18X18,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 128 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

2.1 mm

19 mm

No

e1

160 MHz

120

220 °C (428 °F)

19 mm

128

EPF81188RM240-2

Altera

Loadable PLD

Military

Gull Wing

240

HFQFP

Square

Plastic/Epoxy

Yes

5.5 V

CMOS

5

Flatpack, Heat Sink/Slug, Fine Pitch

Registered

4.5 V

.5 mm

125 °C (257 °F)

4 Dedicated Inputs, 180 I/O

4

-55 °C (-67 °F)

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e3

32 mm

180

EPF10K50SQC208-2N

Altera

Loadable PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

0.4 ns

Yes

2.625 V

CMOS

2.5

Flatpack, Fine Pitch

Mixed

2.375 V

.5 mm

70 °C (158 °F)

147 I/O

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

28 mm

147

EPF10K20RC208-4

Altera

Loadable PLD

Commercial

Gull Wing

208

HFQFP

Square

Plastic/Epoxy

0.6 ns

1152

Yes

5.25 V

CMOS

147

5

3.3/5,5 V

Flatpack, Heat Sink/Slug, Fine Pitch

HQFP208,1.2SQ,20

Field Programmable Gate Arrays

Registered

4.75 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 147 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

1152 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e0

67.11 MHz

20 s

147

220 °C (428 °F)

28 mm

147

EPF10K30EFC672-3

Altera

Loadable PLD

Commercial

Ball

672

BGA

Square

Plastic/Epoxy

12.5 ns

1728

Yes

2.7 V

CMOS

220

2.5

2.5,2.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

70 °C (158 °F)

220 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e0

220

220 °C (428 °F)

27 mm

220

EP20K200EBI356-1X

Altera

Loadable PLD

Ball

356

LBGA

Square

Plastic/Epoxy

8320

Yes

2.625 V

CMOS

263

2.5

1.8,1.8/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Macrocell

2.375 V

1.27 mm

4 Dedicated Inputs, 271 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

263

220 °C (428 °F)

35 mm

271

EP20K100TC144-2

Altera

Loadable PLD

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

3 ns

4160

Yes

2.625 V

CMOS

95

2.5

2.5,2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

101 I/O

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e0

95

220 °C (428 °F)

20 mm

101

EP20K200EBC652-1X

Altera

Loadable PLD

Other

Ball

652

BGA

Square

Plastic/Epoxy

1.58 ns

8320

Yes

1.89 V

CMOS

368

1.8

1.8,1.8/3.3 V

Grid Array

BGA652,35X35,50

Field Programmable Gate Arrays

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 376 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B652

3

3.5 mm

45 mm

No

e0

368

220 °C (428 °F)

45 mm

376

EPF10K30ETI144-3

Altera

Loadable PLD

Industrial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

12.5 ns

1728

Yes

2.7 V

CMOS

102

2.5

2.5,2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.63SQ,20

Field Programmable Gate Arrays

Mixed

2.3 V

.5 mm

85 °C (185 °F)

102 I/O

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e0

102

220 °C (428 °F)

20 mm

102

EPF10K50EPC240-1

Altera

Loadable PLD

Commercial

Gull Wing

240

FQFP

Square

Plastic/Epoxy

8.5 ns

Yes

2.7 V

CMOS

2.5

Flatpack, Fine Pitch

Mixed

2.3 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 189 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e3

32 mm

189

EPF8820ABI225-4

Altera

Loadable PLD

Industrial

Ball

225

BGA

Square

Plastic/Epoxy

672

Yes

5.5 V

CMOS

152

5

3.3/5,5 V

Grid Array

BGA225,15X15

Field Programmable Gate Arrays

Registered

4.5 V

1.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 148 I/O

4

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B225

2.3 mm

27 mm

No

820 Flip Flops; 672 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e0

148

220 °C (428 °F)

27 mm

148

EP20K200CF484I-8N

Altera

Loadable PLD

Ball

484

BGA

Square

Plastic/Epoxy

1.78 ns

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

1 mm

4 Dedicated Inputs, 376 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e1

245 °C (473 °F)

23 mm

376

EPF10K50EBC356-2

Altera

Loadable PLD

Commercial

Ball

356

LBGA

Square

Plastic/Epoxy

10 ns

2880

Yes

2.7 V

CMOS

220

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Mixed

2.3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 220 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e0

220

220 °C (428 °F)

35 mm

220

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.