| Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Altera |
Loadable PLD |
Commercial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
208 |
Yes |
5.25 V |
CMOS |
78 |
5 |
3.3/5,5 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
Registered |
4.75 V |
.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 74 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
282 Flip Flops; 208 Logic elements; Built-in JTAG boundry-scan test circuitry |
e0 |
74 |
220 °C (428 °F) |
14 mm |
74 |
||||||||||||
|
Altera |
Loadable PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier |
Registered |
4.5 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 64 I/O |
4 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
452 Flip Flops; 336 Logic Elements |
29.3116 mm |
64 |
||||||||||||||||||||||
|
Altera |
EE PLD |
Industrial |
Gull Wing |
44 |
LQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
32 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
1.27 mm |
10 mm |
No |
e0 |
138.9 MHz |
220 °C (428 °F) |
10 mm |
Yes |
34 |
|||||||||||
|
Altera |
UV PLD |
Commercial |
Through-Hole |
20 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
20 ns |
No |
5.25 V |
CMOS |
16 |
PAL-TYPE |
5 |
5 V |
In-Line, Window |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
160 |
2.54 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 8 I/O |
7 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
5.334 mm |
7.62 mm |
No |
Macrocells interconnected by PIA; 16 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
62.5 MHz |
8 |
220 °C (428 °F) |
24.13 mm |
8 |
||||||||||
|
Altera |
UV PLD |
Commercial |
Through-Hole |
28 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
25 ns |
No |
5.25 V |
CMOS |
24 |
PAL-TYPE |
5 |
5 V |
In-Line, Window |
DIP28,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
320 |
2.54 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 16 I/O |
7 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-GDIP-T28 |
5.08 mm |
7.62 mm |
No |
Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
62.5 MHz |
16 |
220 °C (428 °F) |
36.83 mm |
16 |
||||||||||
|
Altera |
UV PLD |
Industrial |
J Bend |
44 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
55 ns |
Yes |
5.5 V |
64 |
CMOS |
5 |
5 V |
Chip Carrier, Window |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
7 Dedicated Inputs, 28 I/O |
7 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-CQCC-J44 |
4.57 mm |
16.51 mm |
No |
Labs interconnected by PIA; 4 Labs; 64 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
40 MHz |
220 °C (428 °F) |
16.51 mm |
No |
28 |
|||||||||||
|
Altera |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
5 ns |
Yes |
5.25 V |
32 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
1 |
4.572 mm |
16.5862 mm |
No |
e0 |
250 MHz |
220 °C (428 °F) |
16.5862 mm |
Yes |
36 |
|||||||||||
|
Altera |
EE PLD |
Industrial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
96 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC68,1.0SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 52 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J68 |
3 |
5.08 mm |
24.2316 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
100 MHz |
220 °C (428 °F) |
24.2316 mm |
No |
52 |
||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
128 Macrocells; 8 Labs; Configurable I/O operation with 2.5 V or 3.3 V |
e0 |
87 MHz |
220 °C (428 °F) |
14 mm |
Yes |
84 |
||||||||||
|
Altera |
EE PLD |
Commercial |
Ball |
49 |
LFBGA |
Square |
Plastic/Epoxy |
10 ns |
Yes |
2.625 V |
128 |
CMOS |
2.5 |
1.8/3.3,2.5 V |
Grid Array, Low Profile, Fine Pitch |
BGA49,7X7,32 |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 41 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B49 |
1.55 mm |
7 mm |
No |
e0 |
94.3 MHz |
220 °C (428 °F) |
7 mm |
Yes |
41 |
||||||||||||
|
Altera |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
128 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 64 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
128 Macrocells; Shared Input/Clock |
e0 |
76.9 MHz |
220 °C (428 °F) |
29.3116 mm |
No |
64 |
|||||||||||
|
Altera |
EE PLD |
Commercial |
Pin/Peg |
160 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
12 ns |
No |
5.25 V |
192 |
CMOS |
5 |
5 V |
Grid Array |
PGA160M,15X15 |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
2.54 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 120 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P160 |
1 |
5.34 mm |
39.624 mm |
No |
192 Macrocells; Shared Input/Clock |
e0 |
90.9 MHz |
220 °C (428 °F) |
39.624 mm |
No |
120 |
||||||||||
|
Altera |
EE PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
12 ns |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 55 I/O |
0 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
320 Macrocells; 484 Flip Flops; Configurable I/O operation with 3.3 V or 5 V |
118 MHz |
29.3116 mm |
55 |
||||||||||||||||||||
|
|
Altera |
EE PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
512 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.63SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 120 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
512 Macrocells; 32 Labs; Configurable I/O operation with 2.5 V or 3.3 V |
e3 |
116.3 MHz |
30 s |
260 °C (500 °F) |
20 mm |
Yes |
120 |
||||||||
|
Altera |
Loadable PLD |
Industrial |
Ball |
600 |
BGA |
Square |
Plastic/Epoxy |
16 ns |
6656 |
Yes |
2.7 V |
CMOS |
424 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA600,35X35,50 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
1.27 mm |
85 °C (185 °F) |
424 I/O |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B600 |
1.93 mm |
45 mm |
No |
e0 |
424 |
220 °C (428 °F) |
45 mm |
424 |
||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
0.4 ns |
1728 |
Yes |
2.625 V |
CMOS |
102 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
.5 mm |
85 °C (185 °F) |
102 I/O |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
37.5 MHz |
20 s |
102 |
220 °C (428 °F) |
20 mm |
102 |
|||||||||||
|
Altera |
EE PLD |
Industrial |
Gull Wing |
44 |
LQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.5 V |
64 |
CMOS |
5 |
5 V |
Flatpack, Low Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
1.27 mm |
10 mm |
No |
64 Macrocells |
e0 |
166.7 MHz |
220 °C (428 °F) |
10 mm |
No |
36 |
||||||||||
|
|
Altera |
Flash PLD |
Ball |
100 |
BGA |
Square |
Plastic/Epoxy |
5.4 ns |
Yes |
1.89 V |
440 |
CMOS |
1.8 |
1.5/3.3,1.8 V |
Grid Array |
BGA100,11X11,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
.5 mm |
0 Dedicated Inputs, 76 I/O |
0 |
Tin Silver Copper |
Bottom |
S-PBGA-B100 |
No |
It can also operate at 3.3 V |
e1 |
Yes |
76 |
||||||||||||||||||
|
Altera |
EE PLD |
Ball |
169 |
FBGA |
Square |
Plastic/Epoxy |
5 ns |
Yes |
512 |
CMOS |
1.8/3.3,2.5 V |
Grid Array, Fine Pitch |
BGA169,13X13,32 |
Programmable Logic Devices |
Yes |
.8 mm |
Tin Lead |
Bottom |
S-PBGA-B169 |
No |
e0 |
220 °C (428 °F) |
Yes |
||||||||||||||||||||||||||
|
Altera |
EE PLD |
Industrial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
128 |
CMOS |
5 |
3.3/5,5 V |
Flatpack |
QFP160,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.65 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 100 I/O |
0 |
-40 °C (-40 °F) |
Tin/Lead |
Quad |
S-PQFP-G160 |
3 |
4.07 mm |
28 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
125 MHz |
20 s |
220 °C (428 °F) |
28 mm |
Yes |
100 |
|||||||||
|
Altera |
Loadable PLD |
Other |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
2.5 ns |
4160 |
Yes |
2.625 V |
CMOS |
183 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 189 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e0 |
20 s |
183 |
220 °C (428 °F) |
32 mm |
189 |
|||||||||||
|
Altera |
OT PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier |
Registered |
4.5 V |
1.27 mm |
85 °C (185 °F) |
8 Dedicated Inputs, 0 I/O |
8 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
4.572 mm |
11.5062 mm |
No |
Stand-Alone Microsequencer |
e0 |
20 MHz |
220 °C (428 °F) |
11.5062 mm |
0 |
||||||||||||||||||
|
Altera |
EE PLD |
Commercial |
Ball |
100 |
TBGA |
Square |
Plastic/Epoxy |
6 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Grid Array, Thin Profile |
BGA100,10X10,40 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B100 |
3 |
1.1 mm |
11 mm |
No |
e0 |
166.7 MHz |
220 °C (428 °F) |
11 mm |
Yes |
84 |
|||||||||||
|
|
Altera |
Flash PLD |
Other |
Ball |
100 |
TFBGA |
Square |
Plastic/Epoxy |
7.9 ns |
Yes |
1.89 V |
192 |
CMOS |
1.8 |
1.8,1.2/3.3 V |
Grid Array, Thin Profile, Fine Pitch |
BGA100,11X11,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
79 I/O |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B100 |
1.2 mm |
6 mm |
No |
e1 |
184.1 MHz |
6 mm |
Yes |
79 |
|||||||||||||
|
Altera |
Loadable PLD |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
1200 |
Yes |
2.625 V |
CMOS |
117 |
2.5 |
1.8,1.8/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
4 Dedicated Inputs, 125 I/O |
4 |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
117 |
220 °C (428 °F) |
28 mm |
125 |
||||||||||||||||
|
Altera |
EE PLD |
Industrial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
160 |
CMOS |
5 |
3.3/5,5 V |
Flatpack |
QFP160,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
.65 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 104 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G160 |
3 |
4.07 mm |
28 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
100 MHz |
220 °C (428 °F) |
28 mm |
No |
104 |
||||||||||
|
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
HFQFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Registered |
4.5 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 180 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e3 |
32 mm |
180 |
||||||||||||||||||||
|
Altera |
UV PLD |
Commercial |
Through-Hole |
24 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
27 ns |
No |
5.25 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
In-Line, Window |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
160 |
2.54 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
5.08 mm |
7.62 mm |
No |
16 Macrocells; 2 External Clocks |
e0 |
47.6 MHz |
16 |
220 °C (428 °F) |
32 mm |
16 |
||||||||||
|
Altera |
Flash PLD |
Commercial Extended |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
7 ns |
Yes |
1.89 V |
440 |
CMOS |
1.8 |
1.5/3.3,1.8 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 76 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e0 |
20 s |
235 °C (455 °F) |
14 mm |
Yes |
76 |
|||||||||||
|
|
Altera |
Loadable PLD |
Other |
Ball |
652 |
BGA |
Square |
Plastic/Epoxy |
2.07 ns |
16640 |
Yes |
1.89 V |
CMOS |
480 |
1.8 |
1.8,1.8/3.3 V |
Grid Array |
BGA652,35X35,50 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 488 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B652 |
3 |
3.5 mm |
45 mm |
No |
e1 |
30 s |
480 |
245 °C (473 °F) |
45 mm |
488 |
||||||||||
|
Altera |
Loadable PLD |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
3 ns |
4160 |
Yes |
2.625 V |
CMOS |
153 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 159 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e0 |
20 s |
153 |
220 °C (428 °F) |
28 mm |
159 |
|||||||||||
|
Altera |
UV PLD |
Commercial |
Pin/Peg |
100 |
WPGA |
Square |
Ceramic, Metal-Sealed Cofired |
25 ns |
No |
5.25 V |
CMOS |
5 |
Grid Array, Window |
Macrocell |
4.75 V |
2.54 mm |
70 °C (158 °F) |
19 Dedicated Inputs, 64 I/O |
19 |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P100 |
3.81 mm |
33.528 mm |
No |
Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock |
83.3 MHz |
33.528 mm |
64 |
||||||||||||||||||||
|
Altera |
Flash PLD |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
6.2 ns |
Yes |
980 |
CMOS |
1.5/3.3,2.5/3.3 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
1 mm |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
No |
e0 |
220 °C (428 °F) |
Yes |
|||||||||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
1020 |
BGA |
Square |
Plastic/Epoxy |
2.32 ns |
51840 |
Yes |
1.89 V |
CMOS |
800 |
1.8 |
1.8,1.8/3.3 V |
Grid Array |
BGA1020,32X32,40 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 808 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B1020 |
5A |
3.5 mm |
33 mm |
No |
e0 |
20 s |
800 |
220 °C (428 °F) |
33 mm |
808 |
|||||||||||
|
Altera |
EE PLD |
Commercial |
Pin/Peg |
160 |
PGA |
Square |
Ceramic |
10 ns |
No |
192 |
CMOS |
3.3/5,5 V |
Grid Array |
PGA160M,15X15 |
Programmable Logic Devices |
Yes |
2.54 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Perpendicular |
S-XPGA-P160 |
1 |
No |
e0 |
220 °C (428 °F) |
Yes |
||||||||||||||||||||||
|
Altera |
Loadable PLD |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
2.5 |
Grid Array |
Macrocell |
2.375 V |
1 mm |
4 Dedicated Inputs, 252 I/O |
4 |
Tin Silver Copper |
Bottom |
S-PBGA-B484 |
3 |
2.1 mm |
23 mm |
No |
e1 |
220 °C (428 °F) |
23 mm |
252 |
|||||||||||||||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
CMOS |
5 |
Small Outline |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
0 °C (32 °F) |
Dual |
R-PDSO-G24 |
2.65 mm |
7.5 mm |
No |
16 Macrocells; 2 External Clocks |
100 MHz |
15.4 mm |
16 |
||||||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
9 ns |
4992 |
Yes |
2.625 V |
CMOS |
333 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Registered |
2.375 V |
.5 mm |
85 °C (185 °F) |
6 Dedicated Inputs, 147 I/O |
6 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e0 |
90 MHz |
333 |
220 °C (428 °F) |
28 mm |
147 |
|||||||||||
|
Altera |
Loadable PLD |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
4160 |
Yes |
2.625 V |
CMOS |
95 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
4 Dedicated Inputs, 101 I/O |
4 |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
95 |
220 °C (428 °F) |
20 mm |
101 |
||||||||||||||||
|
|
Altera |
Flash PLD |
Gull Wing |
100 |
QFP |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
1.8 |
Flatpack |
Macrocell |
1.71 V |
0 Dedicated Inputs, 0 I/O |
0 |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
No |
e3 |
0 |
|||||||||||||||||||||||||||
|
|
Altera |
Flash PLD |
Ball |
100 |
BGA |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
2.5 |
Grid Array |
Macrocell |
2.375 V |
0 Dedicated Inputs, 0 I/O |
0 |
Tin Silver Copper |
Bottom |
S-PBGA-B100 |
No |
It can also operate at 3.3 V |
e1 |
0 |
|||||||||||||||||||||||||||
|
Altera |
EE PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
128 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 64 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
128 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; Shared Input/Clock |
e0 |
76.9 MHz |
220 °C (428 °F) |
29.3116 mm |
No |
64 |
|||||||||||
|
Altera |
Loadable PLD |
Ball |
652 |
LBGA |
Square |
Plastic/Epoxy |
38400 |
Yes |
1.89 V |
CMOS |
480 |
1.8 |
1.8,1.8/3.3 V |
Grid Array, Low Profile |
BGA652,35X35,50 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
1.27 mm |
4 Dedicated Inputs, 488 I/O |
4 |
Tin Lead |
Bottom |
S-PBGA-B652 |
1.63 mm |
45 mm |
No |
e0 |
480 |
220 °C (428 °F) |
45 mm |
488 |
|||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Pin/Peg |
655 |
IPGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
2.625 V |
2.5 |
Grid Array, Interstitial Pitch |
Macrocell |
2.375 V |
2.54 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 502 I/O |
4 |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P655 |
4.08 mm |
62.484 mm |
No |
220 °C (428 °F) |
62.484 mm |
502 |
|||||||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
1.68 ns |
11520 |
Yes |
1.89 V |
CMOS |
400 |
1.8 |
1.8,1.8/3.3 V |
Grid Array |
BGA672,26X26,40 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 408 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B672 |
3 |
3.5 mm |
27 mm |
No |
e0 |
160 MHz |
20 s |
400 |
220 °C (428 °F) |
27 mm |
408 |
||||||||||
|
|
Altera |
Loadable PLD |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
3.3 |
Flatpack, Low Profile, Fine Pitch |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 117 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Can Also Be Used 24000 Logic Gates |
e3 |
133 MHz |
20 mm |
117 |
||||||||||||||||||
|
|
Altera |
Loadable PLD |
Other |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
1.57 ns |
24320 |
Yes |
1.89 V |
CMOS |
500 |
1.8 |
1.8,1.8/3.3 V |
Grid Array |
BGA672,26X26,40 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 508 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B672 |
4 |
3.5 mm |
27 mm |
No |
e1 |
160 MHz |
30 s |
500 |
245 °C (473 °F) |
27 mm |
508 |
|||||||||
|
Altera |
Loadable PLD |
Industrial |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
14 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Grid Array |
Registered |
3 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 291 I/O |
4 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B484 |
2.1 mm |
23 mm |
No |
e1 |
23 mm |
291 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.