Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Altera |
EE PLD |
Commercial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.25 V |
160 |
CMOS |
5 |
3.3/5,5 V |
Flatpack |
QFP160,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 104 I/O |
0 |
0 °C (32 °F) |
Tin/Lead |
Quad |
S-PQFP-G160 |
3 |
4.07 mm |
28 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
83.3 MHz |
30 s |
220 °C (428 °F) |
28 mm |
No |
104 |
|||||||||
|
Altera |
Loadable PLD |
Commercial |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
0.9 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Grid Array |
Registered |
3 V |
1 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 246 I/O |
4 |
0 °C (32 °F) |
Tin/Silver/Copper |
Bottom |
S-PBGA-B484 |
2.1 mm |
23 mm |
No |
1728 Logic Elements; 216 Labs |
e1 |
80 MHz |
40 s |
260 °C (500 °F) |
23 mm |
246 |
|||||||||||||||
Altera |
OT PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
18 ns |
40 |
Yes |
5.25 V |
CMOS |
32 |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Field Programmable Gate Arrays |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 30 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
4 Labs; 40 Macrocells Configurable I/O operation with 3.3 V or 5 V |
e0 |
50 MHz |
32 |
220 °C (428 °F) |
16.5862 mm |
30 |
|||||||||||
Altera |
EE PLD |
Military |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack |
Macrocell |
4.5 V |
.65 mm |
125 °C (257 °F) |
0 Dedicated Inputs, 128 I/O |
0 |
-55 °C (-67 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
4.07 mm |
28 mm |
No |
256 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; Shared Input/Clock |
e3 |
76.9 MHz |
28 mm |
128 |
||||||||||||||||||
|
Altera |
EE PLD |
Gull Wing |
208 |
QFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
256 |
CMOS |
1.8/3.3,2.5 V |
Flatpack |
QFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
.5 mm |
Matte Tin |
Quad |
S-PQFP-G208 |
No |
e3 |
Yes |
||||||||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Fine Pitch |
Registered |
4.5 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 132 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.07 mm |
28 mm |
No |
636 Flip Flops; 504 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e3 |
28 mm |
132 |
||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
0.6 ns |
Yes |
2.7 V |
2.5 |
Grid Array |
Mixed |
2.3 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 191 I/O |
4 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
2.3 mm |
27 mm |
No |
e1 |
27 mm |
191 |
|||||||||||||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 160 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.07 mm |
28 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e3 |
76.9 MHz |
28 mm |
160 |
||||||||||||||||||
Altera |
Loadable PLD |
Other |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
1200 |
Yes |
2.625 V |
CMOS |
117 |
2.5 |
1.8,1.8/3.3 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 125 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
e3 |
160 MHz |
117 |
220 °C (428 °F) |
28 mm |
125 |
|||||||||||||
Altera |
Loadable PLD |
Commercial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
0.5 ns |
4992 |
Yes |
2.625 V |
CMOS |
191 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
1 mm |
70 °C (158 °F) |
191 I/O |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
2.1 mm |
17 mm |
No |
e0 |
20 s |
191 |
220 °C (428 °F) |
17 mm |
191 |
||||||||||||
Altera |
OT PLD |
Commercial |
Pin/Peg |
68 |
PGA |
Square |
Ceramic |
28 ns |
No |
48 |
CMOS |
5 |
5 V |
Grid Array |
PGA68,11X11 |
Programmable Logic Devices |
No |
2.54 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Perpendicular |
S-XPGA-P68 |
1 |
No |
e0 |
220 °C (428 °F) |
No |
|||||||||||||||||||||
|
Altera |
Flash PLD |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
10 ns |
Yes |
1.89 V |
980 |
CMOS |
1.8 |
1.5/3.3,1.8 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
1 mm |
0 Dedicated Inputs, 212 I/O |
0 |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
3 |
2.2 mm |
17 mm |
No |
It can also operate at 3.3 V |
e1 |
30 s |
260 °C (500 °F) |
17 mm |
Yes |
212 |
||||||||||||
Altera |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
160 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 60 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
100 MHz |
220 °C (428 °F) |
29.3116 mm |
No |
60 |
|||||||||||
Altera |
Loadable PLD |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
CMOS |
2.5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Macrocell |
2.375 V |
.5 mm |
4 Dedicated Inputs, 151 I/O |
4 |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
e3 |
220 °C (428 °F) |
28 mm |
151 |
|||||||||||||||||||||||
Altera |
Loadable PLD |
Commercial |
Ball |
356 |
LBGA |
Square |
Plastic/Epoxy |
0.5 ns |
Yes |
2.625 V |
CMOS |
2.5 |
Grid Array, Low Profile |
Mixed |
2.375 V |
1.27 mm |
70 °C (158 °F) |
220 I/O |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B356 |
1.63 mm |
35 mm |
No |
e1 |
35 mm |
220 |
|||||||||||||||||||||
|
Altera |
Flash PLD |
Automotive |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
4.7 ns |
Yes |
2.625 V |
192 |
CMOS |
2.5 |
1.5/3.3,2.5/3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
.5 mm |
125 °C (257 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
1.2 mm |
14 mm |
No |
It can also operate at 3.3 V |
e3 |
14 mm |
Yes |
80 |
||||||||||||
Altera |
Loadable PLD |
Commercial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
12 ns |
4992 |
Yes |
2.7 V |
CMOS |
191 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
1 mm |
70 °C (158 °F) |
191 I/O |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
2.1 mm |
17 mm |
No |
4992 Logic Elements |
e0 |
140 MHz |
191 |
220 °C (428 °F) |
17 mm |
191 |
|||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
256 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 164 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
256 Macrocells |
e0 |
125 MHz |
220 °C (428 °F) |
28 mm |
Yes |
164 |
||||||||||
|
Altera |
Loadable PLD |
Other |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
5 |
Flatpack, Fine Pitch |
Macrocell |
4.75 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 199 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
Can Also Be Used 16000 Logic Gates |
e3 |
153 MHz |
32 mm |
199 |
||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
8 ns |
Yes |
2.7 V |
CMOS |
2.5 |
Grid Array |
Mixed |
2.3 V |
1 mm |
85 °C (185 °F) |
220 I/O |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B672 |
2.1 mm |
27 mm |
No |
e1 |
27 mm |
220 |
|||||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
356 |
LBGA |
Square |
Plastic/Epoxy |
1.97 ns |
Yes |
1.89 V |
CMOS |
1.8 |
Grid Array, Low Profile |
Macrocell |
1.71 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 271 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B356 |
1.63 mm |
35 mm |
No |
e1 |
35 mm |
271 |
|||||||||||||||||||
Altera |
Loadable PLD |
Other |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
CMOS |
2.5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Macrocell |
2.375 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 125 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
e3 |
160 MHz |
220 °C (428 °F) |
28 mm |
125 |
|||||||||||||||||||
Altera |
Loadable PLD |
Other |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
2.29 ns |
11520 |
Yes |
1.89 V |
CMOS |
400 |
1.8 |
1.8,1.8/3.3 V |
Grid Array |
BGA672,26X26,40 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 408 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B672 |
3 |
3.5 mm |
27 mm |
No |
e0 |
160 MHz |
20 s |
400 |
220 °C (428 °F) |
27 mm |
408 |
||||||||||
|
Altera |
Flash PLD |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
5.4 ns |
Yes |
1.89 V |
440 |
CMOS |
1.8 |
1.5/3.3,1.8 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
1 mm |
0 Dedicated Inputs, 160 I/O |
0 |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
3 |
2.2 mm |
17 mm |
No |
It can also operate at 3.3 V |
e1 |
245 °C (473 °F) |
17 mm |
Yes |
160 |
|||||||||||||
Altera |
Loadable PLD |
Other |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
3.6 ns |
16640 |
Yes |
2.625 V |
CMOS |
496 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA672,26X26,40 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
1 mm |
85 °C (185 °F) |
502 I/O |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B672 |
3 |
2.1 mm |
27 mm |
No |
e0 |
20 s |
496 |
220 °C (428 °F) |
27 mm |
502 |
||||||||||||
Altera |
Loadable PLD |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
8320 |
Yes |
2.625 V |
CMOS |
160 |
2.5 |
1.8,1.8/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
4 Dedicated Inputs, 168 I/O |
4 |
Matte Tin |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e3 |
160 |
220 °C (428 °F) |
32 mm |
168 |
||||||||||||||||
Altera |
Loadable PLD |
Other |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
1.8 |
Grid Array |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 128 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B484 |
2.1 mm |
23 mm |
No |
e1 |
160 MHz |
23 mm |
128 |
|||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
356 |
LBGA |
Square |
Plastic/Epoxy |
16 ns |
6656 |
Yes |
2.7 V |
CMOS |
274 |
2.5 |
2.5,2.5/3.3 V |
Grid Array, Low Profile |
BGA356,26X26,50 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
1.27 mm |
85 °C (185 °F) |
274 I/O |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B356 |
1.63 mm |
35 mm |
No |
e0 |
274 |
220 °C (428 °F) |
35 mm |
274 |
||||||||||||||
Altera |
EE PLD |
Commercial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Grid Array |
BGA256,16X16,50 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 100 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
2.1 mm |
17 mm |
No |
128 Macrocells; 8 Labs; Configurable I/O operation with 2.5 V or 3.3 V |
e0 |
116.3 MHz |
220 °C (428 °F) |
17 mm |
Yes |
100 |
||||||||||
Altera |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
3.6 V |
32 |
CMOS |
3.3 |
3.3 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
Macrocell |
3 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
Labs interconnected by PIA; 2 Labs; 32 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
76.9 MHz |
220 °C (428 °F) |
16.5862 mm |
No |
32 |
|||||||||||
Altera |
Loadable PLD |
Ball |
780 |
HBGA |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
CMOS |
1.8 |
Grid Array, Heat Sink/Slug |
Macrocell |
1.71 V |
1 mm |
0 Dedicated Inputs, 486 I/O |
0 |
Tin Silver Copper |
Bottom |
S-PBGA-B780 |
3.5 mm |
29 mm |
No |
e1 |
29 mm |
486 |
||||||||||||||||||||||||
Altera |
Loadable PLD |
Commercial |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
0.5 ns |
Yes |
2.7 V |
2.5 |
Grid Array |
Mixed |
2.3 V |
70 °C (158 °F) |
4 Dedicated Inputs, 470 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B672 |
No |
e1 |
470 |
|||||||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
16 ns |
9984 |
Yes |
2.7 V |
CMOS |
182 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
.5 mm |
85 °C (185 °F) |
182 I/O |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e0 |
182 |
220 °C (428 °F) |
32 mm |
182 |
|||||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
0.4 ns |
2880 |
Yes |
2.625 V |
CMOS |
249 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
1 mm |
85 °C (185 °F) |
249 I/O |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B484 |
3 |
2.1 mm |
23 mm |
No |
e0 |
37.5 MHz |
249 |
220 °C (428 °F) |
23 mm |
249 |
||||||||||||
Altera |
Loadable PLD |
Ball |
324 |
BGA |
Square |
Plastic/Epoxy |
2.02 ns |
4160 |
Yes |
1.89 V |
CMOS |
238 |
1.8 |
1.8,1.8/3.3 V |
Grid Array |
BGA324,18X18,40 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
1 mm |
4 Dedicated Inputs, 246 I/O |
4 |
Tin Lead |
Bottom |
S-PBGA-B324 |
3 |
3.5 mm |
19 mm |
No |
e0 |
20 s |
238 |
220 °C (428 °F) |
19 mm |
246 |
||||||||||||||
Altera |
UV PLD |
Military |
Through-Hole |
24 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
37 ns |
No |
5.5 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
In-Line, Window |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
160 |
2.54 mm |
125 °C (257 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
5.334 mm |
7.62 mm |
No |
Macrocells Interconnected By Global Bus; 16 Macrocells; 2 External Clocks |
e0 |
28.6 MHz |
16 |
220 °C (428 °F) |
31.75 mm |
16 |
||||||||||
Altera |
UV PLD |
Commercial |
Through-Hole |
24 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
25 ns |
No |
5.25 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
In-Line, Window |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
160 |
2.54 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
5.08 mm |
7.62 mm |
No |
e0 |
40 MHz |
16 |
220 °C (428 °F) |
32 mm |
16 |
|||||||||||
Altera |
Loadable PLD |
Other |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
2.92 ns |
24320 |
Yes |
1.89 V |
CMOS |
500 |
1.8 |
1.8,1.8/3.3 V |
Grid Array |
BGA672,26X26,40 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 508 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B672 |
3 |
3.5 mm |
27 mm |
No |
e0 |
160 MHz |
20 s |
500 |
220 °C (428 °F) |
27 mm |
508 |
||||||||||
Altera |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic |
No |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
74 |
2.54 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-XDIP-T20 |
No |
e0 |
30 MHz |
8 |
220 °C (428 °F) |
|||||||||||||||||||||
Altera |
UV PLD |
Industrial |
Through-Hole |
40 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
18 ns |
No |
5.5 V |
CMOS |
36 |
PAL-TYPE |
5 |
5 V |
In-Line, Window |
DIP40,.6 |
Programmable Logic Devices |
Macrocell |
4.5 V |
450 |
2.54 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-GDIP-T40 |
5.75 mm |
15.24 mm |
No |
Macrocells Interconnected By Global Bus; 24 Macrocells; 2 External Clocks |
e0 |
66.6 MHz |
24 |
220 °C (428 °F) |
52.07 mm |
24 |
||||||||||
Altera |
EE PLD |
Military |
Pin/Peg |
280 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
12 ns |
No |
5.5 V |
CMOS |
5 |
Grid Array |
Macrocell |
4.5 V |
2.54 mm |
125 °C (257 °F) |
0 Dedicated Inputs, 168 I/O |
0 |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P280 |
5.081 mm |
49.78 mm |
No |
320 Macrocells; 484 Flip Flops; Configurable I/O operation with 3.3 V or 5 V |
118 MHz |
49.78 mm |
168 |
||||||||||||||||||||
Altera |
Loadable PLD |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
1320 |
Yes |
3.6 V |
CMOS |
171 |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 171 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Can Also Be Used 16000 Logic Gates |
e0 |
133 MHz |
20 s |
171 |
220 °C (428 °F) |
28 mm |
171 |
||||||||||
Altera |
OT PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
40 ns |
Yes |
5.25 V |
128 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
19 Dedicated Inputs, 48 I/O |
19 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
No |
Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
50 MHz |
220 °C (428 °F) |
No |
48 |
||||||||||||||
Altera |
Flash PLD |
Ball |
100 |
BGA |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
2.5 |
Grid Array |
Macrocell |
2.375 V |
0 Dedicated Inputs, 0 I/O |
0 |
Tin Lead |
Bottom |
S-PBGA-B100 |
No |
It can also operate at 3.3 V |
e0 |
0 |
||||||||||||||||||||||||||||
Altera |
Loadable PLD |
Commercial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
23.8 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack, Fine Pitch |
Registered |
4.75 V |
.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
576 Logic elements; Built-in JTAG boundry-scan test circuitry |
e3 |
60.6 MHz |
32 mm |
|||||||||||||||||||
Altera |
UV PLD |
Military |
Through-Hole |
28 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
5.5 V |
CMOS |
5 |
In-Line, Window |
Registered |
4.5 V |
2.54 mm |
125 °C (257 °F) |
8 Dedicated Inputs, 0 I/O |
8 |
-55 °C (-67 °F) |
Dual |
R-GDIP-T28 |
5.08 mm |
7.62 mm |
No |
PLS |
20 MHz |
36.83 mm |
0 |
|||||||||||||||||||||
Altera |
Loadable PLD |
Commercial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
17.2 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack, Fine Pitch |
Registered |
4.75 V |
.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 189 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
32 mm |
189 |
||||||||||||||||||||
Altera |
Loadable PLD |
Other |
Ball |
652 |
LBGA |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
1.8 |
Grid Array, Low Profile |
Macrocell |
1.71 V |
1.27 mm |
85 °C (185 °F) |
376 I/O |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B652 |
1.63 mm |
45 mm |
No |
e1 |
45 mm |
376 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.