Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Altera |
EE PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
6 ns |
Yes |
5.5 V |
64 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
64 Macrocells |
e0 |
200 MHz |
220 °C (428 °F) |
29.3116 mm |
No |
68 |
|||||||||||
Altera |
OT PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
17 ns |
Yes |
5.25 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
0 °C (32 °F) |
Quad |
S-PQCC-J28 |
4.572 mm |
11.5062 mm |
No |
16 Macrocells; 2 External Clocks |
71.4 MHz |
11.5062 mm |
16 |
||||||||||||||||||||
Altera |
Loadable PLD |
Commercial |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Registered |
3 V |
.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 134 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
e3 |
28 mm |
134 |
||||||||||||||||||||
|
Altera |
Loadable PLD |
Commercial |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
0.4 ns |
2880 |
Yes |
2.625 V |
CMOS |
249 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
1 mm |
70 °C (158 °F) |
249 I/O |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B484 |
3 |
2.1 mm |
23 mm |
No |
e1 |
37.5 MHz |
30 s |
249 |
260 °C (500 °F) |
23 mm |
249 |
||||||||||
Altera |
UV PLD |
Commercial |
J Bend |
84 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
45 ns |
Yes |
5.25 V |
128 |
CMOS |
5 |
5 V |
Chip Carrier, Window |
LDCC84,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
19 Dedicated Inputs, 48 I/O |
19 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-CQCC-J84 |
5.08 mm |
29.21 mm |
No |
Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
40 MHz |
220 °C (428 °F) |
29.21 mm |
No |
48 |
|||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
652 |
BGA |
Square |
Plastic/Epoxy |
2.13 ns |
Yes |
1.89 V |
CMOS |
1.8 |
Grid Array |
Macrocell |
1.71 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 488 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B652 |
3.5 mm |
45 mm |
No |
e1 |
160 MHz |
45 mm |
488 |
||||||||||||||||||
Altera |
Loadable PLD |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
1.58 ns |
8320 |
Yes |
1.89 V |
CMOS |
128 |
1.8 |
1.8,1.8/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 136 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e0 |
20 s |
128 |
220 °C (428 °F) |
28 mm |
136 |
|||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
16.4 ns |
Yes |
5.5 V |
480 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
HQFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 146 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
480 Macrocells; 676 Flip Flops; Configurable I/O operation with 3.3 V or 5 V |
e0 |
117.6 MHz |
220 °C (428 °F) |
28 mm |
Yes |
146 |
|||||||||||
Altera |
OT PLD |
Industrial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
5.5 V |
CMOS |
5 |
In-Line |
Registered |
4.5 V |
2.54 mm |
85 °C (185 °F) |
8 Dedicated Inputs, 0 I/O |
8 |
-40 °C (-40 °F) |
Dual |
R-PDIP-T28 |
4.318 mm |
7.62 mm |
No |
PLS |
20 MHz |
34.29 mm |
0 |
|||||||||||||||||||||
Altera |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic |
No |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
74 |
2.54 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDIP-T20 |
No |
23.8 MHz |
8 |
||||||||||||||||||||||||
Altera |
Loadable PLD |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
2.5 |
Grid Array |
Macrocell |
2.375 V |
1 mm |
4 Dedicated Inputs, 252 I/O |
4 |
Tin Silver Copper |
Bottom |
S-PBGA-B672 |
3 |
2.1 mm |
27 mm |
No |
e1 |
220 °C (428 °F) |
27 mm |
252 |
|||||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
9 ns |
9984 |
Yes |
2.7 V |
CMOS |
369 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
1 mm |
85 °C (185 °F) |
369 I/O |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B484 |
3 |
2.1 mm |
23 mm |
No |
e0 |
369 |
220 °C (428 °F) |
23 mm |
369 |
|||||||||||||
Altera |
Loadable PLD |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
6400 |
Yes |
2.625 V |
CMOS |
167 |
2.5 |
1.8,1.8/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
4 Dedicated Inputs, 175 I/O |
4 |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
167 |
220 °C (428 °F) |
32 mm |
175 |
|||||||||||||||||
Altera |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic |
No |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
160 |
2.54 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDIP-T24 |
No |
18.2 MHz |
16 |
||||||||||||||||||||||||
Altera |
Loadable PLD |
Other |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
1.8 |
Grid Array |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 508 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B672 |
2.1 mm |
27 mm |
No |
e1 |
27 mm |
508 |
||||||||||||||||||||||
Altera |
Loadable PLD |
Other |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
3.6 ns |
8320 |
Yes |
2.625 V |
CMOS |
376 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 382 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B484 |
3 |
2.1 mm |
23 mm |
No |
e1 |
376 |
220 °C (428 °F) |
23 mm |
382 |
||||||||||||
Altera |
Flash PLD |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
17.7 ns |
Yes |
1.89 V |
1.8 |
Flatpack, Low Profile, Fine Pitch |
Macrocell |
1.71 V |
.5 mm |
100 °C (212 °F) |
114 I/O |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
e0 |
118.3 MHz |
20 mm |
114 |
|||||||||||||||||||||
|
Altera |
Flash PLD |
Industrial |
Gull Wing |
144 |
QFP |
Square |
Plastic/Epoxy |
17.7 ns |
Yes |
192 |
CMOS |
1.8,1.2/3.3 V |
Flatpack |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
.5 mm |
105 °C (221 °F) |
-40 °C (-40 °F) |
Quad |
S-PQFP-G144 |
No |
Yes |
|||||||||||||||||||||||||
Altera |
Loadable PLD |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
8320 |
Yes |
2.625 V |
CMOS |
160 |
2.5 |
1.8,1.8/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
4 Dedicated Inputs, 168 I/O |
4 |
Matte Tin |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e3 |
160 |
220 °C (428 °F) |
32 mm |
168 |
||||||||||||||||
Altera |
OT PLD |
Commercial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
28 ns |
Yes |
5.25 V |
48 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC68,1.0SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
12 Dedicated Inputs, 48 I/O |
12 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J68 |
4.572 mm |
24.2316 mm |
No |
48 Macrocells; 4 External Clocks; Shared Input/Clock |
e0 |
40 MHz |
220 °C (428 °F) |
24.2316 mm |
No |
48 |
|||||||||||
|
Altera |
EE PLD |
Commercial |
Ball |
49 |
FBGA |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
128 |
CMOS |
1.8/3.3,2.5 V |
Grid Array, Fine Pitch |
BGA49,7X7,32 |
Programmable Logic Devices |
Yes |
.8 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B49 |
No |
e1 |
Yes |
|||||||||||||||||||||||
Altera |
EE PLD |
Commercial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
5.5 ns |
Yes |
3.6 V |
512 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Grid Array |
BGA256,20X20,50 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 212 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
2.3 mm |
27 mm |
No |
512 Macrocells; 32 Labs; Configurable I/O operation with 2.5 V or 3.3 V |
e0 |
163.9 MHz |
20 s |
220 °C (428 °F) |
27 mm |
Yes |
212 |
|||||||||
Altera |
Loadable PLD |
Other |
Ball |
1020 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
1.8 |
Grid Array |
Macrocell |
1.71 V |
85 °C (185 °F) |
4 Dedicated Inputs, 708 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B1020 |
No |
e1 |
708 |
||||||||||||||||||||||||||
Altera |
UV PLD |
Military |
J Bend |
68 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier, Window |
Macrocell |
4.5 V |
1.27 mm |
125 °C (257 °F) |
12 Dedicated Inputs, 48 I/O |
12 |
-55 °C (-67 °F) |
Quad |
S-CQCC-J68 |
5.08 mm |
24.13 mm |
No |
48 Macrocells |
18.5 MHz |
24.13 mm |
48 |
|||||||||||||||||||||
Altera |
Loadable PLD |
Other |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
2.23 ns |
24320 |
Yes |
1.575 V |
CMOS |
480 |
1.5 |
1.5,1.5/3.3 V |
Grid Array |
BGA672,26X26,40 |
Field Programmable Gate Arrays |
Macrocell |
1.425 V |
1 mm |
85 °C (185 °F) |
492 I/O |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B672 |
3 |
2.1 mm |
27 mm |
No |
e0 |
480 |
220 °C (428 °F) |
27 mm |
492 |
|||||||||||||
Altera |
Loadable PLD |
Commercial |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
0.6 ns |
Yes |
2.625 V |
CMOS |
2.5 |
Grid Array |
Mixed |
2.375 V |
1 mm |
70 °C (158 °F) |
369 I/O |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B484 |
2.1 mm |
23 mm |
No |
e1 |
23 mm |
369 |
|||||||||||||||||||||
Altera |
Loadable PLD |
Commercial |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
CMOS |
5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Registered |
4.75 V |
.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e3 |
28 mm |
|||||||||||||||||||||
Altera |
Loadable PLD |
Other |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
Yes |
1.8 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Macrocell |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 118 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
e3 |
220 °C (428 °F) |
28 mm |
118 |
|||||||||||||||||||||||
Altera |
EE PLD |
Commercial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
10 ns |
Yes |
384 |
CMOS |
2.5/3.3,3.3 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
1 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
No |
e0 |
220 °C (428 °F) |
Yes |
||||||||||||||||||||||
Altera |
Flash PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
12 ns |
160 |
Yes |
5.25 V |
CMOS |
172 |
5 |
3.3/5,5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
4.75 V |
.5 mm |
85 °C (185 °F) |
48 Dedicated Inputs, 120 I/O |
48 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
80 MHz |
172 |
220 °C (428 °F) |
28 mm |
120 |
||||||||||
Altera |
OT PLD |
Military |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
37 ns |
Yes |
5.5 V |
CMOS |
5 |
Small Outline |
Macrocell |
4.5 V |
1.27 mm |
125 °C (257 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
-55 °C (-67 °F) |
Dual |
R-PDSO-G24 |
2.65 mm |
7.5 mm |
No |
Macrocells Interconnected By Global Bus; 16 Macrocells; 2 External Clocks |
28.6 MHz |
15.4 mm |
16 |
||||||||||||||||||||
Altera |
Loadable PLD |
Commercial |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
11 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Registered |
3 V |
.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 147 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
e3 |
28 mm |
147 |
||||||||||||||||||||
|
Altera |
EE PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
64 |
CMOS |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
1.27 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Quad |
S-PQCC-J84 |
No |
No |
|||||||||||||||||||||||||
Altera |
OT PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
60 ns |
Yes |
5.25 V |
CMOS |
36 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
240 |
1.27 mm |
70 °C (158 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
16.6116 mm |
No |
24 Macrocells |
e0 |
20 MHz |
24 |
220 °C (428 °F) |
16.6116 mm |
24 |
|||||||||||
Altera |
EE PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
512 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 212 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
2.1 mm |
17 mm |
No |
e0 |
116.3 MHz |
220 °C (428 °F) |
17 mm |
Yes |
212 |
|||||||||||
Altera |
Loadable PLD |
Other |
Ball |
356 |
LBGA |
Square |
Plastic/Epoxy |
2.41 ns |
2560 |
Yes |
1.89 V |
CMOS |
188 |
1.8 |
1.8,1.8/3.3 V |
Grid Array, Low Profile |
BGA356,26X26,50 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 196 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B356 |
3 |
1.63 mm |
35 mm |
No |
e0 |
160 MHz |
20 s |
188 |
220 °C (428 °F) |
35 mm |
196 |
||||||||||
Altera |
EE PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
5 ns |
Yes |
2.625 V |
256 |
CMOS |
2.5 |
1.8/3.3,2.5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.63SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 120 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
188.7 MHz |
20 s |
220 °C (428 °F) |
20 mm |
Yes |
120 |
||||||||||
Altera |
UV PLD |
Military |
Through-Hole |
40 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
50 ns |
No |
5.5 V |
CMOS |
5 |
In-Line, Window |
Macrocell |
4.5 V |
2.54 mm |
125 °C (257 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
-55 °C (-67 °F) |
Dual |
R-GDIP-T40 |
5.715 mm |
15.24 mm |
No |
28 Macrocells |
28.5 MHz |
52.07 mm |
24 |
||||||||||||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack |
Macrocell |
4.5 V |
.65 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 96 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
4.07 mm |
28 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e3 |
100 MHz |
28 mm |
96 |
||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
9 ns |
Yes |
2.625 V |
CMOS |
2.5 |
Flatpack, Fine Pitch |
Mixed |
2.375 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
32 mm |
|||||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
1.78 ns |
Yes |
2.625 V |
2.5 |
Grid Array |
Macrocell |
2.375 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 376 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B484 |
3 |
2.1 mm |
23 mm |
No |
e1 |
245 °C (473 °F) |
23 mm |
376 |
||||||||||||||||||
Altera |
Loadable PLD |
Other |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
1.8 |
Grid Array |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 128 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B672 |
2.1 mm |
27 mm |
No |
e1 |
160 MHz |
27 mm |
128 |
|||||||||||||||||||||
Altera |
Loadable PLD |
Other |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
0.4 ns |
Yes |
2.625 V |
2.5 |
Grid Array |
Macrocell |
2.375 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 382 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B672 |
2.1 mm |
27 mm |
No |
e1 |
34 MHz |
27 mm |
382 |
||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
HFQFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Registered |
4.5 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 180 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e3 |
32 mm |
180 |
||||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
3.3 |
Flatpack, Low Profile, Fine Pitch |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 102 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Can Also Be Used 10000 Logic Gates |
e3 |
153 MHz |
20 mm |
102 |
||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
9.5 ns |
Yes |
2.625 V |
CMOS |
2.5 |
Flatpack, Fine Pitch |
Mixed |
2.375 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 147 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
e3 |
28 mm |
147 |
||||||||||||||||||||
Altera |
Loadable PLD |
Commercial |
Gull Wing |
240 |
HFQFP |
Square |
Plastic/Epoxy |
12 ns |
4992 |
Yes |
2.7 V |
CMOS |
189 |
2.5 |
2.5/3.3,3.3 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
.5 mm |
70 °C (158 °F) |
189 I/O |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e0 |
189 |
220 °C (428 °F) |
32 mm |
189 |
||||||||||||||
|
Altera |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Chip Carrier |
Macrocell |
3 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
e3 |
129.9 MHz |
29.3116 mm |
68 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.