| Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
Altera |
EE PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
5 ns |
Yes |
2.625 V |
256 |
CMOS |
2.5 |
1.8/3.3,2.5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 120 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
188.7 MHz |
20 mm |
Yes |
120 |
|||||||||||
|
|
Altera |
EE PLD |
Industrial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
6 ns |
Yes |
160 |
CMOS |
3.3/5,5 V |
Flatpack |
QFP160,1.2SQ |
Programmable Logic Devices |
Yes |
.635 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
No |
e3 |
Yes |
|||||||||||||||||||||||
|
Altera |
Loadable PLD |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
1.8 |
Grid Array |
Macrocell |
1.71 V |
1 mm |
376 I/O |
Tin Silver Copper |
Bottom |
S-PBGA-B672 |
2.1 mm |
27 mm |
No |
e1 |
27 mm |
376 |
||||||||||||||||||||||||||
|
|
Altera |
Flash PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
11.2 ns |
Yes |
1700 |
CMOS |
AEC-Q100 |
1.8,1.2/3.3 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
1 mm |
105 °C (221 °F) |
-40 °C (-40 °F) |
Bottom |
S-PBGA-B256 |
No |
Yes |
||||||||||||||||||||||||
|
Altera |
Loadable PLD |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
6400 |
Yes |
2.625 V |
CMOS |
135 |
2.5 |
1.8,1.8/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
4 Dedicated Inputs, 143 I/O |
4 |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
135 |
220 °C (428 °F) |
28 mm |
143 |
||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
724 |
BGA |
Square |
Plastic/Epoxy |
1.69 ns |
16640 |
Yes |
1.575 V |
CMOS |
480 |
1.5 |
1.5,1.5/3.3 V |
Grid Array |
BGA724,27X27,50 |
Field Programmable Gate Arrays |
Macrocell |
1.425 V |
1.27 mm |
85 °C (185 °F) |
492 I/O |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B724 |
3.5 mm |
35 mm |
No |
e0 |
480 |
220 °C (428 °F) |
35 mm |
492 |
||||||||||||||
|
|
Altera |
Loadable PLD |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
1.93 ns |
Yes |
1.89 V |
CMOS |
1.8 |
Flatpack, Low Profile, Fine Pitch |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 88 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
160 MHz |
20 mm |
88 |
|||||||||||||||||
|
Altera |
Loadable PLD |
Gull Wing |
240 |
HFQFP |
Square |
Plastic/Epoxy |
Yes |
1.8 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Macrocell |
.5 mm |
4 Dedicated Inputs, 173 I/O |
4 |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
220 °C (428 °F) |
32 mm |
173 |
||||||||||||||||||||||||||
|
Altera |
Loadable PLD |
Ball |
652 |
LBGA |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
1.8 |
Grid Array, Low Profile |
Macrocell |
1.71 V |
1.27 mm |
4 Dedicated Inputs, 488 I/O |
4 |
Tin Silver Copper |
Bottom |
S-PBGA-B652 |
1.63 mm |
45 mm |
No |
e1 |
220 °C (428 °F) |
45 mm |
488 |
||||||||||||||||||||||||
|
Altera |
Loadable PLD |
Commercial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
1008 |
Yes |
5.25 V |
CMOS |
184 |
5 |
3.3/5,5 V |
Flatpack, Fine Pitch |
HQFP240,1.37SQ,20 |
Field Programmable Gate Arrays |
Registered |
4.75 V |
.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 184 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e0 |
417 MHz |
180 |
220 °C (428 °F) |
32 mm |
184 |
|||||||||||
|
Altera |
Loadable PLD |
Industrial |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
2.5 |
Grid Array |
Registered |
2.375 V |
1 mm |
85 °C (185 °F) |
6 Dedicated Inputs, 249 I/O |
6 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B484 |
2.1 mm |
23 mm |
No |
e1 |
23 mm |
249 |
||||||||||||||||||||||
|
Altera |
Mask PLD |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
45 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 64 I/O |
7 |
0 °C (32 °F) |
Matte Tin |
Quad |
R-PQFP-G100 |
3 |
3.13 mm |
13.2 mm |
No |
Labs interconnected by PIA; 12 Labs; 192 Macrocells; 1 External Clock; Shared Input/Clock |
e3 |
40 MHz |
220 °C (428 °F) |
20 mm |
64 |
||||||||||||||||
|
Altera |
Flash PLD |
Ball |
100 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
1.8 |
Grid Array |
Macrocell |
1.71 V |
0 Dedicated Inputs, 0 I/O |
0 |
Tin Lead |
Bottom |
S-PBGA-B100 |
No |
e0 |
0 |
|||||||||||||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Pin/Peg |
984 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
1.89 V |
1.8 |
Grid Array |
Macrocell |
1.71 V |
85 °C (185 °F) |
4 Dedicated Inputs, 716 I/O |
4 |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P984 |
No |
160 MHz |
716 |
|||||||||||||||||||||||||||
|
Altera |
OT PLD |
Industrial |
Through-Hole |
40 |
DIP |
Rectangular |
Plastic/Epoxy |
90 ns |
No |
5.5 V |
CMOS |
36 |
PAL-TYPE |
5 |
In-Line |
DIP40,.6 |
Programmable Logic Devices |
Macrocell |
4.5 V |
236 |
2.54 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDIP-T40 |
4.83 mm |
15.24 mm |
No |
28 Macrocells |
e0 |
17.5 MHz |
24 |
220 °C (428 °F) |
52.324 mm |
24 |
|||||||||||
|
Altera |
Flash PLD |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
14 ns |
Yes |
1.89 V |
1.8 |
Flatpack, Thin Profile, Fine Pitch |
Macrocell |
1.71 V |
.5 mm |
100 °C (212 °F) |
79 I/O |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
1.2 mm |
14 mm |
No |
e0 |
118.3 MHz |
14 mm |
79 |
|||||||||||||||||||||
|
|
Altera |
EE PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
e3 |
100 MHz |
30 s |
245 °C (473 °F) |
16.5862 mm |
Yes |
34 |
|||||||||
|
Altera |
OT PLD |
Commercial |
Gull Wing |
100 |
QFP |
Square |
Plastic/Epoxy |
40 ns |
Yes |
5.25 V |
128 |
CMOS |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
.635 mm |
70 °C (158 °F) |
19 Dedicated Inputs, 64 I/O |
19 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
No |
Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
50 MHz |
220 °C (428 °F) |
No |
64 |
|||||||||||||
|
Altera |
EE PLD |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
45 ns |
No |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
72 |
2.54 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Dual |
R-PDIP-T20 |
No |
20 MHz |
8 |
||||||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
652 |
LBGA |
Square |
Plastic/Epoxy |
1.6 ns |
Yes |
1.89 V |
1.8 |
Grid Array, Low Profile |
Macrocell |
1.71 V |
1.27 mm |
85 °C (185 °F) |
376 I/O |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B652 |
1.63 mm |
45 mm |
No |
e1 |
45 mm |
376 |
||||||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
652 |
BGA |
Square |
Plastic/Epoxy |
2.92 ns |
Yes |
1.89 V |
CMOS |
1.8 |
Grid Array |
Macrocell |
1.71 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 488 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B652 |
3.5 mm |
45 mm |
No |
e1 |
160 MHz |
220 °C (428 °F) |
45 mm |
488 |
||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
2.5 |
Grid Array |
Macrocell |
2.375 V |
85 °C (185 °F) |
4 Dedicated Inputs, 382 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B484 |
No |
e1 |
382 |
||||||||||||||||||||||||||
|
Altera |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic |
20 ns |
No |
CMOS |
16 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
160 |
2.54 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-XDIP-T20 |
No |
e0 |
8 |
220 °C (428 °F) |
||||||||||||||||||||||
|
Altera |
Flash PLD |
Gull Wing |
100 |
QFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
192 |
CMOS |
1.5/3.3,2.5/3.3 V |
Flatpack |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
.5 mm |
Tin Lead |
Quad |
S-PQFP-G100 |
1 |
No |
e0 |
Yes |
||||||||||||||||||||||||||
|
Altera |
UV PLD |
Military |
Pin/Peg |
84 |
WPGA |
Square |
Ceramic, Metal-Sealed Cofired |
45 ns |
No |
5.5 V |
CMOS |
MIL-STD-883 |
5 |
Grid Array, Window |
Macrocell |
4.5 V |
2.54 mm |
125 °C (257 °F) |
7 Dedicated Inputs, 64 I/O |
7 |
-55 °C (-67 °F) |
Gold |
Perpendicular |
S-CPGA-P84 |
3.81 mm |
27.94 mm |
No |
Labs interconnected by PIA; 12 Labs; 192 Macrocells; 1 External Clock; Shared Input/Clock |
e4 |
40 MHz |
27.94 mm |
64 |
|||||||||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
44 |
LQFP |
Square |
Plastic/Epoxy |
6 ns |
Yes |
5.25 V |
32 |
CMOS |
5 |
5 V |
Flatpack, Low Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
1.27 mm |
10 mm |
No |
2 Labs; 32 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
200 MHz |
220 °C (428 °F) |
10 mm |
No |
36 |
||||||||||
|
Altera |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
13 ns |
Yes |
5.25 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
0 °C (32 °F) |
Quad |
S-PQCC-J44 |
4.572 mm |
16.5862 mm |
No |
24 Macrocells; 2 External Clocks |
83.3 MHz |
16.5862 mm |
24 |
||||||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
17 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Flatpack, Fine Pitch |
Registered |
3 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 189 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
32 mm |
189 |
||||||||||||||||||||
|
|
Altera |
Loadable PLD |
Commercial |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
0.4 ns |
Yes |
2.625 V |
CMOS |
2.5 |
Grid Array |
Mixed |
2.375 V |
1 mm |
70 °C (158 °F) |
220 I/O |
0 °C (32 °F) |
Tin/Silver/Copper |
Bottom |
S-PBGA-B484 |
3 |
2.1 mm |
23 mm |
No |
e1 |
40 s |
260 °C (500 °F) |
23 mm |
220 |
|||||||||||||||||
|
Altera |
EE PLD |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
5 ns |
Yes |
2.625 V |
32 |
CMOS |
2.5 |
1.8/3.3,2.5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
1.27 mm |
0 Dedicated Inputs, 36 I/O |
0 |
Tin Lead |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
e0 |
185.2 MHz |
220 °C (428 °F) |
16.5862 mm |
Yes |
36 |
|||||||||||||||
|
Altera |
OT PLD |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
22 ns |
No |
5.25 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
160 |
2.54 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
4.318 mm |
7.62 mm |
No |
Macrocells Interconnected By Global Bus; 16 Macrocells; 2 External Clocks |
e0 |
55.5 MHz |
16 |
220 °C (428 °F) |
31.6865 mm |
16 |
||||||||||
|
Altera |
Loadable PLD |
Industrial |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
16 ns |
Yes |
2.7 V |
CMOS |
2.5 |
Grid Array |
Mixed |
2.3 V |
1 mm |
85 °C (185 °F) |
470 I/O |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B672 |
2.1 mm |
27 mm |
No |
e1 |
27 mm |
470 |
|||||||||||||||||||||
|
Altera |
EE PLD |
Commercial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
5.5 ns |
Yes |
2.625 V |
512 |
CMOS |
2.5 |
1.8/3.3,2.5 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
1 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 212 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
3.5 mm |
17 mm |
No |
e0 |
163.9 MHz |
20 s |
220 °C (428 °F) |
17 mm |
Yes |
212 |
||||||||||
|
Altera |
UV PLD |
Commercial |
J Bend |
84 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
40 ns |
Yes |
5.25 V |
192 |
CMOS |
5 |
5 V |
Chip Carrier, Window |
LDCC84,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 64 I/O |
7 |
0 °C (32 °F) |
Tin/Lead |
Quad |
S-CQCC-J84 |
5.08 mm |
29.21 mm |
No |
Labs interconnected by PIA; 12 Labs; 192 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
50 MHz |
30 s |
220 °C (428 °F) |
29.21 mm |
No |
64 |
||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
240 |
HFQFP |
Square |
Plastic/Epoxy |
13.4 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 191 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
772 Flip Flops; Configurable I/O operation with 3.3 V or 5 V |
e3 |
125 MHz |
32 mm |
191 |
||||||||||||||||||
|
Altera |
Loadable PLD |
Military |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
23.8 ns |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier |
Registered |
4.5 V |
1.27 mm |
125 °C (257 °F) |
4 Dedicated Inputs |
4 |
-55 °C (-67 °F) |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
576 Logic elements; Built-in JTAG boundry-scan test circuitry |
60.6 MHz |
29.3116 mm |
|||||||||||||||||||||
|
Altera |
EE PLD |
Industrial |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
23.2 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 139 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
580 Flip Flops; Configurable I/O operation with 3.3 V or 5 V |
e3 |
100 MHz |
28 mm |
139 |
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|
Altera |
EE PLD |
Commercial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
5.5 ns |
Yes |
3.6 V |
256 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
e0 |
172.4 MHz |
20 s |
235 °C (455 °F) |
14 mm |
Yes |
84 |
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|
Altera |
UV PLD |
Military |
J Bend |
28 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
25 ns |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier, Window |
Macrocell |
4.5 V |
1.27 mm |
125 °C (257 °F) |
7 Dedicated Inputs, 16 I/O |
7 |
-55 °C (-67 °F) |
Quad |
S-CQCC-J28 |
4.57 mm |
11.43 mm |
No |
32 Macrocells; Shared Input/Clock; Shared Product Terms |
50 MHz |
11.43 mm |
16 |
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|
Altera |
Loadable PLD |
Other |
Ball |
324 |
BGA |
Square |
Plastic/Epoxy |
2.5 ns |
4160 |
Yes |
2.625 V |
CMOS |
246 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA324,18X18,40 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 252 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B324 |
3 |
3.5 mm |
19 mm |
No |
e1 |
100 MHz |
246 |
220 °C (428 °F) |
19 mm |
252 |
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|
Altera |
EE PLD |
Military |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack |
Macrocell |
4.5 V |
.65 mm |
125 °C (257 °F) |
0 Dedicated Inputs, 128 I/O |
0 |
-55 °C (-67 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
4.07 mm |
28 mm |
No |
256 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; Shared Input/Clock |
e3 |
62.5 MHz |
28 mm |
128 |
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|
Altera |
Loadable PLD |
Other |
Ball |
324 |
BGA |
Square |
Plastic/Epoxy |
2.69 ns |
1200 |
Yes |
1.89 V |
CMOS |
120 |
1.8 |
1.8,1.8/3.3 V |
Grid Array |
BGA324,18X18,40 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 128 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B324 |
3 |
2.1 mm |
19 mm |
No |
e1 |
160 MHz |
120 |
220 °C (428 °F) |
19 mm |
128 |
|||||||||||
|
Altera |
OT PLD |
Commercial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
40 ns |
Yes |
5.25 V |
48 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC68,1.0SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
12 Dedicated Inputs, 48 I/O |
12 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J68 |
5.08 mm |
24.2316 mm |
No |
48 Macrocells; Shared Input/Clock |
e0 |
28.6 MHz |
220 °C (428 °F) |
24.2316 mm |
No |
48 |
|||||||||||
|
Altera |
EE PLD |
Industrial |
Gull Wing |
240 |
HFQFP |
Square |
Plastic/Epoxy |
16.4 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 171 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
480 Macrocells |
e3 |
32 mm |
171 |
|||||||||||||||||||
|
Altera |
EE PLD |
Industrial |
Gull Wing |
240 |
HFQFP |
Square |
Plastic/Epoxy |
23.4 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 175 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
676 Flip Flops; Configurable I/O operation with 3.3 V or 5 V |
e3 |
100 MHz |
32 mm |
175 |
||||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
HFQFP |
Square |
Plastic/Epoxy |
14.5 ns |
4992 |
Yes |
2.7 V |
CMOS |
189 |
2.5 |
2.5/3.3,3.3 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
.5 mm |
85 °C (185 °F) |
189 I/O |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e0 |
189 |
220 °C (428 °F) |
32 mm |
189 |
||||||||||||||
|
Altera |
EE PLD |
Military |
Gull Wing |
304 |
HFQFP |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Macrocell |
4.5 V |
.5 mm |
125 °C (257 °F) |
0 Dedicated Inputs, 216 I/O |
0 |
-55 °C (-67 °F) |
Matte Tin |
Quad |
S-PQFP-G304 |
4.5 mm |
40 mm |
No |
560 Macrocells; 772 Flip Flops; Configurable I/O operation with 3.3 V or 5 V |
e3 |
66.7 MHz |
40 mm |
216 |
||||||||||||||||||
|
Altera |
UV PLD |
Commercial |
Through-Hole |
40 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
60 ns |
No |
5.25 V |
CMOS |
36 |
PAL-TYPE |
5 |
5 V |
In-Line, Window |
DIP40,.6 |
Programmable Logic Devices |
Macrocell |
4.75 V |
240 |
2.54 mm |
70 °C (158 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-GDIP-T40 |
5.715 mm |
15.24 mm |
No |
24 Macrocells |
e0 |
20 MHz |
24 |
220 °C (428 °F) |
52.07 mm |
24 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.