Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Altera |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
12.8 ns |
Yes |
5.25 V |
320 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 60 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
484 Flip Flops; Configurable I/O operation with 3.3 V or 5 V |
e0 |
125 MHz |
220 °C (428 °F) |
29.3116 mm |
Yes |
60 |
|||||||||||
Altera |
Loadable PLD |
Commercial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
208 |
Yes |
3.6 V |
CMOS |
78 |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
Registered |
3 V |
.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 74 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
282 Flip Flops; 208 Logic elements; Built-in JTAG boundry-scan test circuitry |
e0 |
74 |
220 °C (428 °F) |
14 mm |
74 |
||||||||||||
Altera |
UV PLD |
Commercial |
Pin/Peg |
84 |
WPGA |
Square |
Ceramic, Metal-Sealed Cofired |
55 ns |
No |
5.25 V |
192 |
CMOS |
5 |
5 V |
Grid Array, Window |
PGA84M,11X11 |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
2.54 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 64 I/O |
7 |
0 °C (32 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P84 |
1 |
4.96 mm |
28.448 mm |
No |
192 Macrocells; Shared Input/Clock; Shared Product Terms |
e0 |
33.3 MHz |
220 °C (428 °F) |
28.448 mm |
No |
64 |
||||||||||
Altera |
EE PLD |
Commercial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
6 ns |
Yes |
5.25 V |
96 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC68,1.0SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 48 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J68 |
5.08 mm |
24.23 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
151.5 MHz |
220 °C (428 °F) |
24.23 mm |
No |
48 |
|||||||||||
Altera |
UV PLD |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
25 ns |
No |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
200 |
2.54 mm |
70 °C (158 °F) |
8 Dedicated Inputs, 12 I/O |
8 |
0 °C (32 °F) |
Tin/Lead |
Dual |
R-GDIP-T24 |
No |
12 Macrocells |
e0 |
66 MHz |
30 s |
12 |
220 °C (428 °F) |
12 |
||||||||||||
Altera |
EE PLD |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic |
40 ns |
No |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
72 |
2.54 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-XDIP-T20 |
No |
e0 |
21.7 MHz |
8 |
220 °C (428 °F) |
|||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
2.33 ns |
Yes |
1.89 V |
CMOS |
1.8 |
Flatpack, Fine Pitch |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 168 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e3 |
32 mm |
168 |
||||||||||||||||||
Altera |
OT PLD |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
30 ns |
No |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
200 |
2.54 mm |
70 °C (158 °F) |
8 Dedicated Inputs, 12 I/O |
8 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
4.318 mm |
7.62 mm |
No |
12 Macrocells |
e0 |
50 MHz |
12 |
220 °C (428 °F) |
31.6865 mm |
12 |
||||||||||
|
Altera |
Loadable PLD |
Commercial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
0.4 ns |
Yes |
2.625 V |
CMOS |
2.5 |
Grid Array |
Mixed |
2.375 V |
1 mm |
70 °C (158 °F) |
191 I/O |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
2.1 mm |
17 mm |
No |
e1 |
17 mm |
191 |
||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
0.7 ns |
Yes |
2.7 V |
2.5 |
Grid Array |
Mixed |
2.3 V |
85 °C (185 °F) |
4 Dedicated Inputs, 413 I/O |
4 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B672 |
No |
e1 |
413 |
|||||||||||||||||||||||||
Altera |
UV PLD |
Commercial |
Pin/Peg |
68 |
PGA |
Square |
Ceramic |
70 ns |
No |
48 |
CMOS |
5 |
5 V |
Grid Array |
PGA68,11X11 |
Programmable Logic Devices |
No |
2.54 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Perpendicular |
S-XPGA-P68 |
No |
No |
|||||||||||||||||||||||||
Altera |
UV PLD |
Military |
J Bend |
28 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
37 ns |
Yes |
5.5 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
Chip Carrier, Window |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
160 |
1.27 mm |
125 °C (257 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-J28 |
4.826 mm |
11.43 mm |
No |
Macrocells Interconnected By Global Bus; 16 Macrocells; 2 External Clocks |
e0 |
28.6 MHz |
16 |
220 °C (428 °F) |
11.43 mm |
16 |
||||||||||
Altera |
Loadable PLD |
Ball |
400 |
BGA |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
2.5 |
Grid Array |
Macrocell |
2.375 V |
4 Dedicated Inputs |
4 |
Tin Silver Copper |
Bottom |
S-PBGA-B400 |
3 |
No |
e1 |
220 °C (428 °F) |
||||||||||||||||||||||||||||
Altera |
Loadable PLD |
Other |
Ball |
356 |
LBGA |
Square |
Plastic/Epoxy |
2.41 ns |
2560 |
Yes |
1.89 V |
CMOS |
188 |
1.8 |
1.8,1.8/3.3 V |
Grid Array, Low Profile |
BGA356,26X26,50 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 196 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B356 |
3 |
1.63 mm |
35 mm |
No |
e0 |
160 MHz |
20 s |
188 |
220 °C (428 °F) |
35 mm |
196 |
||||||||||
|
Altera |
Loadable PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
0.4 ns |
1728 |
Yes |
2.625 V |
CMOS |
102 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
.5 mm |
70 °C (158 °F) |
102 I/O |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
90 MHz |
30 s |
102 |
260 °C (500 °F) |
20 mm |
102 |
||||||||||
Altera |
Loadable PLD |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
1320 |
Yes |
5.25 V |
CMOS |
171 |
5 |
3.3/5,5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
4.75 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 171 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Can Also Be Used 16000 Logic Gates |
e0 |
153 MHz |
20 s |
171 |
220 °C (428 °F) |
28 mm |
171 |
||||||||||
Altera |
OT PLD |
Commercial |
Through-Hole |
40 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
128 |
CMOS |
5 |
5 V |
In-Line |
DIP40,.6 |
Programmable Logic Devices |
No |
2.54 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T40 |
No |
e0 |
220 °C (428 °F) |
No |
|||||||||||||||||||||||
Altera |
Loadable PLD |
Other |
Ball |
780 |
HBGA |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
CMOS |
1.8 |
Grid Array, Heat Sink/Slug |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 486 I/O |
0 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B780 |
3.5 mm |
29 mm |
No |
e1 |
29 mm |
486 |
|||||||||||||||||||||
Altera |
Flash PLD |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
14 ns |
Yes |
1.89 V |
1.8 |
Flatpack, Thin Profile, Fine Pitch |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
79 I/O |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
1.2 mm |
14 mm |
No |
e0 |
118.3 MHz |
14 mm |
79 |
|||||||||||||||||||||
Altera |
OT PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
18 ns |
Yes |
5.25 V |
CMOS |
36 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
240 |
1.27 mm |
70 °C (158 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
No |
Macrocells Interconnected By Global Bus; 24 Macrocells; 2 External Clocks |
e0 |
66.6 MHz |
24 |
220 °C (428 °F) |
24 |
|||||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
256 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 164 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e0 |
95.2 MHz |
220 °C (428 °F) |
28 mm |
Yes |
164 |
|||||||||||
Altera |
Loadable PLD |
Other |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
1.8 |
Grid Array |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 426 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B672 |
3 |
2.1 mm |
27 mm |
No |
e0 |
20 s |
220 °C (428 °F) |
27 mm |
426 |
|||||||||||||||||||
Altera |
Loadable PLD |
Other |
Ball |
1020 |
BGA |
Square |
Plastic/Epoxy |
2.05 ns |
38400 |
Yes |
1.575 V |
CMOS |
723 |
1.5 |
1.5,1.5/3.3 V |
Grid Array |
BGA1020,32X32,40 |
Field Programmable Gate Arrays |
Macrocell |
1.425 V |
1 mm |
85 °C (185 °F) |
735 I/O |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B1020 |
3 |
3.5 mm |
33 mm |
No |
e0 |
723 |
220 °C (428 °F) |
33 mm |
735 |
|||||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
24.2 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack, Fine Pitch |
Registered |
4.75 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 189 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
3744 Logic elements; Built-in JTAG boundry-scan test circuitry |
e3 |
60.6 MHz |
32 mm |
189 |
||||||||||||||||||
Altera |
Loadable PLD |
Commercial |
Ball |
600 |
BGA |
Square |
Plastic/Epoxy |
0.8 ns |
9984 |
Yes |
2.625 V |
CMOS |
470 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA600,35X35,50 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
1.27 mm |
70 °C (158 °F) |
470 I/O |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B600 |
3 |
1.93 mm |
45 mm |
No |
e0 |
20 s |
470 |
220 °C (428 °F) |
45 mm |
470 |
||||||||||||
|
Altera |
Loadable PLD |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
1.48 ns |
Yes |
1.89 V |
1.8 |
Flatpack, Fine Pitch |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 136 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
28 mm |
136 |
|||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
21.1 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Grid Array |
Registered |
3 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 291 I/O |
4 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B484 |
2.1 mm |
23 mm |
No |
e1 |
23 mm |
291 |
||||||||||||||||||||
Altera |
Flash PLD |
Commercial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
12 ns |
80 |
Yes |
5.25 V |
CMOS |
104 |
5 |
5 V |
Flatpack |
QFP160,1.2SQ |
Field Programmable Gate Arrays |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G160 |
3 |
4.07 mm |
28 mm |
No |
8 Labs; 80 Macrocells Configurable I/O operation with 3.3 V or 5 V |
e0 |
71.4 MHz |
104 |
220 °C (428 °F) |
28 mm |
80 |
||||||||||
Altera |
OT PLD |
Industrial |
Through-Hole |
40 |
DIP |
Rectangular |
Plastic/Epoxy |
38 ns |
No |
5.5 V |
CMOS |
36 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP40,.6 |
Programmable Logic Devices |
Macrocell |
4.5 V |
240 |
2.54 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDIP-T40 |
4.826 mm |
15.24 mm |
No |
Macrocells Interconnected By Global Bus; 24 Macrocells; 2 External Clocks |
e0 |
28.6 MHz |
24 |
220 °C (428 °F) |
52.4256 mm |
24 |
||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
6 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.63SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 100 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
128 Macrocells |
e0 |
144.9 MHz |
220 °C (428 °F) |
20 mm |
Yes |
100 |
||||||||||
Altera |
Mask PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
40 ns |
Yes |
5.25 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 64 I/O |
7 |
0 °C (32 °F) |
Quad |
S-PQCC-J84 |
4.572 mm |
29.3116 mm |
No |
Labs interconnected by PIA; 12 Labs; 192 Macrocells; 1 External Clock; Shared Input/Clock |
50 MHz |
220 °C (428 °F) |
29.3116 mm |
64 |
|||||||||||||||||||
Altera |
EE PLD |
Commercial |
Gull Wing |
100 |
QFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
96 |
CMOS |
3.3/5,5 V |
Flatpack |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
.5 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
No |
e0 |
220 °C (428 °F) |
No |
||||||||||||||||||||||
Altera |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
96 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 60 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
76.9 MHz |
220 °C (428 °F) |
29.3116 mm |
No |
60 |
|||||||||||
Altera |
Loadable PLD |
Other |
Ball |
1020 |
HBGA |
Square |
Plastic/Epoxy |
1.4 ns |
Yes |
1.89 V |
1.8 |
Grid Array, Heat Sink/Slug |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 808 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B1020 |
3 |
3.5 mm |
33 mm |
No |
e1 |
220 °C (428 °F) |
33 mm |
808 |
|||||||||||||||||||
Altera |
Loadable PLD |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
1.8 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Flatpack, Fine Pitch |
Registered |
3 V |
.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 148 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
Can also operate at 5 V supply |
e3 |
28 mm |
148 |
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Altera |
OT PLD |
Industrial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
33 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack |
Macrocell |
4.5 V |
.65 mm |
85 °C (185 °F) |
7 Dedicated Inputs, 64 I/O |
7 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
R-PQFP-G100 |
3 |
3.425 mm |
14 mm |
No |
Labs interconnected by PIA; 12 Labs; 1 External Clock |
e3 |
66.7 MHz |
220 °C (428 °F) |
20 mm |
64 |
||||||||||||||||
Altera |
UV PLD |
Industrial |
J Bend |
84 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
45 ns |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier, Window |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
19 Dedicated Inputs, 48 I/O |
19 |
-40 °C (-40 °F) |
Quad |
S-CQCC-J84 |
5.08 mm |
29.21 mm |
No |
Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock |
40 MHz |
29.21 mm |
48 |
||||||||||||||||||||
Altera |
EE PLD |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
CMOS |
2.5 |
Flatpack, Low Profile, Fine Pitch |
Macrocell |
2.375 V |
.5 mm |
4 Dedicated Inputs, 84 I/O |
4 |
Matte Tin |
Quad |
S-PQFP-G100 |
1.27 mm |
14 mm |
No |
e3 |
14 mm |
84 |
||||||||||||||||||||||||
|
Altera |
Loadable PLD |
Commercial |
Ball |
600 |
BGA |
Square |
Plastic/Epoxy |
0.6 ns |
Yes |
2.625 V |
CMOS |
2.5 |
Grid Array |
Mixed |
2.375 V |
1.27 mm |
70 °C (158 °F) |
470 I/O |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B600 |
1.93 mm |
45 mm |
No |
e1 |
45 mm |
470 |
||||||||||||||||||||
Altera |
EE PLD |
Commercial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 128 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
4.07 mm |
28 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e3 |
100 MHz |
28 mm |
128 |
||||||||||||||||||
Altera |
EE PLD |
Industrial |
Pin/Peg |
280 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
23.2 ns |
No |
5.5 V |
400 |
CMOS |
5 |
3.3/5,5 V |
Grid Array |
PGA280,19X19 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
2.54 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 180 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P280 |
1 |
5.081 mm |
49.78 mm |
No |
400 Macrocells; 580 Flip Flops Configurable I/O operation with 3.3 V or 5 V |
e0 |
100 MHz |
220 °C (428 °F) |
49.78 mm |
Yes |
180 |
||||||||||
Altera |
Loadable PLD |
Ball |
356 |
LBGA |
Square |
Plastic/Epoxy |
8320 |
Yes |
2.625 V |
CMOS |
271 |
2.5 |
2.5,2.5/3.3 V |
Grid Array, Low Profile |
BGA356,26X26,50 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
1.27 mm |
4 Dedicated Inputs, 277 I/O |
4 |
Tin Silver Copper |
Bottom |
S-PBGA-B356 |
1.63 mm |
35 mm |
No |
e1 |
271 |
220 °C (428 °F) |
35 mm |
277 |
|||||||||||||||||
Altera |
Loadable PLD |
Other |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
2.5 |
Grid Array |
Macrocell |
2.375 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 382 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B672 |
3 |
2.1 mm |
27 mm |
No |
e1 |
220 °C (428 °F) |
27 mm |
382 |
||||||||||||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
11.4 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack, Fine Pitch |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 191 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
560 Macrocells; 35 Labs; 772 Flip Flops; Configurable I/O operation with 3.3 V or 5 V |
e3 |
144.9 MHz |
32 mm |
191 |
||||||||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
6 ns |
Yes |
5.5 V |
160 |
CMOS |
5 |
3.3/5,5 V |
Flatpack |
QFP160,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.65 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 104 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G160 |
3 |
4.07 mm |
28 mm |
No |
160 Macrocells |
e0 |
200 MHz |
220 °C (428 °F) |
28 mm |
Yes |
104 |
||||||||||
Altera |
Loadable PLD |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
3.3 |
Flatpack, Fine Pitch |
3 V |
.5 mm |
85 °C (185 °F) |
1320 Clbs, 8000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Can also use 16000 Gates |
e0 |
28 mm |
|||||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
HFQFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
2.7 V |
CMOS |
2.5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Mixed |
2.3 V |
.5 mm |
85 °C (185 °F) |
189 I/O |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
32 mm |
189 |
|||||||||||||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack |
Macrocell |
4.5 V |
.65 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 96 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
4.07 mm |
28 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e3 |
76.9 MHz |
28 mm |
96 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.