| Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
Altera |
Flash PLD |
Ball |
100 |
BGA |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
2.5 |
Grid Array |
Macrocell |
2.375 V |
0 Dedicated Inputs, 0 I/O |
0 |
Tin Silver Copper |
Bottom |
S-PBGA-B100 |
No |
It can also operate at 3.3 V |
e1 |
0 |
|||||||||||||||||||||||||||
|
Altera |
Flash PLD |
Ball |
100 |
BGA |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
2.5 |
Grid Array |
Macrocell |
2.375 V |
0 Dedicated Inputs, 0 I/O |
0 |
Tin Lead |
Bottom |
S-PBGA-B100 |
No |
It can also operate at 3.3 V |
e0 |
0 |
||||||||||||||||||||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
128 Macrocells; 8 Labs; Configurable I/O operation with 2.5 V or 3.3 V |
e0 |
116.3 MHz |
220 °C (428 °F) |
14 mm |
Yes |
84 |
||||||||||
|
Altera |
Loadable PLD |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
1.8 |
Flatpack, Fine Pitch |
Macrocell |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 100 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
220 °C (428 °F) |
28 mm |
100 |
||||||||||||||||||||||
|
Altera |
EE PLD |
Industrial |
Gull Wing |
44 |
LQFP |
Square |
Plastic/Epoxy |
6 ns |
Yes |
5.5 V |
64 |
CMOS |
5 |
5 V |
Flatpack, Low Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
1.27 mm |
10 mm |
No |
64 Macrocells |
e0 |
200 MHz |
220 °C (428 °F) |
10 mm |
No |
36 |
||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
76.9 MHz |
220 °C (428 °F) |
14 mm |
Yes |
80 |
||||||||||
|
Altera |
EE PLD |
Ball |
100 |
BGA |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
128 |
CMOS |
1.8/3.3,2.5 V |
Grid Array |
BGA100,10X10 |
Programmable Logic Devices |
Yes |
1.5 mm |
Tin Lead |
Bottom |
S-PBGA-B100 |
No |
e0 |
220 °C (428 °F) |
Yes |
||||||||||||||||||||||||||
|
Altera |
Loadable PLD |
Commercial |
Ball |
600 |
BGA |
Square |
Plastic/Epoxy |
0.3 ns |
9984 |
Yes |
2.625 V |
CMOS |
470 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA600,35X35,50 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
1.27 mm |
70 °C (158 °F) |
470 I/O |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B600 |
3 |
1.93 mm |
45 mm |
No |
e0 |
20 s |
470 |
220 °C (428 °F) |
45 mm |
470 |
||||||||||||
|
|
Altera |
Loadable PLD |
Other |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
1.78 ns |
Yes |
1.89 V |
1.8 |
Grid Array |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 508 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B672 |
4 |
3.5 mm |
27 mm |
No |
e1 |
27 mm |
508 |
|||||||||||||||||||
|
Altera |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
200 |
1.27 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
No |
e0 |
30 MHz |
12 |
220 °C (428 °F) |
||||||||||||||||||||||
|
Altera |
Loadable PLD |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
8320 |
Yes |
2.625 V |
CMOS |
168 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
4 Dedicated Inputs, 174 I/O |
4 |
Tin Lead |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e0 |
168 |
220 °C (428 °F) |
32 mm |
174 |
||||||||||||||||
|
Altera |
EE PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
256 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 164 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
2.1 mm |
17 mm |
No |
e0 |
125 MHz |
220 °C (428 °F) |
17 mm |
Yes |
164 |
|||||||||||
|
Altera |
EE PLD |
Industrial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
e0 |
98 MHz |
220 °C (428 °F) |
14 mm |
Yes |
84 |
|||||||||||
|
Altera |
OT PLD |
Military |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
33 ns |
Yes |
5.5 V |
192 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
125 °C (257 °F) |
7 Dedicated Inputs, 64 I/O |
7 |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
Labs interconnected by PIA; 12 Labs; 1 External Clock |
e0 |
66.7 MHz |
220 °C (428 °F) |
29.3116 mm |
No |
64 |
|||||||||||
|
Altera |
220 °C (428 °F) |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Altera |
EE PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
64 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
e0 |
76.9 MHz |
220 °C (428 °F) |
16.5862 mm |
No |
32 |
||||||||||||
|
Altera |
UV PLD |
Commercial |
J Bend |
68 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
22 ns |
Yes |
5.25 V |
CMOS |
5 |
Chip Carrier, Window |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
12 Dedicated Inputs, 48 I/O |
12 |
0 °C (32 °F) |
Quad |
S-CQCC-J68 |
5.08 mm |
24.13 mm |
No |
48 Macrocells; Shared Input/Clock |
50 MHz |
24.13 mm |
48 |
||||||||||||||||||||
|
Altera |
EE PLD |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
45 ns |
No |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
72 |
2.54 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Dual |
R-PDIP-T20 |
No |
20 MHz |
8 |
||||||||||||||||||||||
|
Altera |
Military |
J Bend |
28 |
QCCJ |
Square |
Ceramic |
55 ns |
Yes |
CMOS |
38535Q/M;38534H;883B |
20 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
160 |
1.27 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-XQCC-J28 |
1 |
No |
e0 |
18.2 MHz |
16 |
|||||||||||||||||||
|
Altera |
Loadable PLD |
Ball |
324 |
BGA |
Square |
Plastic/Epoxy |
4160 |
Yes |
CMOS |
238 |
1.8 |
1.8,1.8/3.3 V |
Grid Array |
BGA324,18X18,40 |
Field Programmable Gate Arrays |
Macrocell |
1 mm |
4 Dedicated Inputs, 246 I/O |
4 |
Tin Lead |
Bottom |
S-PBGA-B324 |
3 |
No |
e0 |
238 |
220 °C (428 °F) |
246 |
|||||||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Registered |
4.5 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 132 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
636 Flip Flops; 504 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e3 |
28 mm |
132 |
||||||||||||||||||||
|
|
Altera |
Loadable PLD |
Other |
Ball |
652 |
BGA |
Square |
Plastic/Epoxy |
1.83 ns |
Yes |
1.89 V |
CMOS |
1.8 |
Grid Array |
Macrocell |
1.71 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 488 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B652 |
3.5 mm |
45 mm |
No |
e1 |
45 mm |
488 |
|||||||||||||||||||
|
Altera |
Loadable PLD |
Commercial |
Ball |
225 |
BGA |
Square |
Plastic/Epoxy |
672 |
Yes |
5.25 V |
CMOS |
152 |
5 |
3.3/5,5 V |
Grid Array |
BGA225,15X15 |
Field Programmable Gate Arrays |
Registered |
4.75 V |
1.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 152 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B225 |
2.3 mm |
27 mm |
No |
672 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e0 |
417 MHz |
148 |
220 °C (428 °F) |
27 mm |
152 |
||||||||||||
|
Altera |
Loadable PLD |
Other |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
3 ns |
8320 |
Yes |
2.625 V |
CMOS |
168 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
HQFP240,1.37SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 174 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e0 |
168 |
220 °C (428 °F) |
32 mm |
174 |
|||||||||||||
|
Altera |
OT PLD |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
12 ns |
No |
5.25 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
160 |
2.54 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
4.318 mm |
7.62 mm |
No |
Macrocells Interconnected By Global Bus; 16 Macrocells; 2 External Clocks |
e0 |
83.3 MHz |
16 |
220 °C (428 °F) |
31.6865 mm |
16 |
||||||||||
|
Altera |
Loadable PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
0.6 ns |
1728 |
Yes |
2.625 V |
CMOS |
102 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
.5 mm |
70 °C (158 °F) |
102 I/O |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
20 s |
102 |
220 °C (428 °F) |
20 mm |
102 |
||||||||||||
|
|
Altera |
EE PLD |
Industrial |
Gull Wing |
44 |
QFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
64 |
CMOS |
5 |
5 V |
Flatpack |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
.8 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
No |
e3 |
No |
||||||||||||||||||||||
|
Altera |
EE PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.5 V |
64 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
64 Macrocells |
e0 |
166.7 MHz |
220 °C (428 °F) |
16.5862 mm |
No |
36 |
|||||||||||
|
Altera |
Loadable PLD |
Commercial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
21.1 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack, Fine Pitch |
Registered |
4.75 V |
.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 189 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
2304 Logic elements; Built-in JTAG boundry-scan test circuitry |
e3 |
60.6 MHz |
32 mm |
189 |
||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
2.5 |
Grid Array |
Macrocell |
2.375 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 252 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B484 |
3 |
2.1 mm |
23 mm |
No |
e1 |
220 °C (428 °F) |
23 mm |
252 |
||||||||||||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 120 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
4.07 mm |
28 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e3 |
125 MHz |
28 mm |
120 |
||||||||||||||||||
|
Altera |
UV PLD |
Military |
Through-Hole |
20 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
50 ns |
No |
5.5 V |
CMOS |
38535Q/M;38534H;883B |
18 |
PAL-TYPE |
5 |
5 V |
In-Line, Window |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
74 |
2.54 mm |
125 °C (257 °F) |
9 Dedicated Inputs, 8 I/O |
9 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
4.826 mm |
7.62 mm |
No |
Shared Input/Clock |
e0 |
31.3 MHz |
8 |
220 °C (428 °F) |
24.003 mm |
8 |
|||||||||
|
Altera |
Loadable PLD |
Ball |
196 |
BGA |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
2.5 |
Grid Array |
Macrocell |
2.375 V |
4 Dedicated Inputs, 149 I/O |
4 |
Tin Silver Copper |
Bottom |
S-PBGA-B196 |
No |
e1 |
149 |
|||||||||||||||||||||||||||||
|
Altera |
UV PLD |
Industrial |
J Bend |
68 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
55 ns |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier, Window |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
-40 °C (-40 °F) |
Quad |
S-CQCC-J68 |
5.08 mm |
24.13 mm |
No |
128 Macrocells; Shared Input/Clock; Shared Product Terms |
33.3 MHz |
24.13 mm |
52 |
||||||||||||||||||||
|
Altera |
OT PLD |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
22 ns |
No |
5.5 V |
CMOS |
5 |
In-Line |
Macrocell |
4.5 V |
2.54 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
-40 °C (-40 °F) |
Dual |
R-PDIP-T24 |
4.318 mm |
7.62 mm |
No |
16 Macrocells; 2 External Clocks |
62.5 MHz |
31.6865 mm |
16 |
||||||||||||||||||||
|
Altera |
Loadable PLD |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
27 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack, Fine Pitch |
Registered |
4.75 V |
.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
1728 Logic elements Configurable I/O operation with 3.3 V or 5 V |
e3 |
53.76 MHz |
28 mm |
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|
Altera |
Loadable PLD |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
8320 |
Yes |
2.625 V |
CMOS |
160 |
2.5 |
1.8,1.8/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
4 Dedicated Inputs, 168 I/O |
4 |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
160 |
220 °C (428 °F) |
32 mm |
168 |
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|
Altera |
Flash PLD |
Gull Wing |
100 |
QFP |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
1.8 |
Flatpack |
Macrocell |
1.71 V |
0 Dedicated Inputs, 0 I/O |
0 |
Tin Lead |
Quad |
S-PQFP-G100 |
No |
e0 |
0 |
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|
Altera |
Loadable PLD |
Ball |
196 |
BGA |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
2.5 |
Grid Array |
Macrocell |
2.375 V |
1 mm |
4 Dedicated Inputs |
4 |
Tin Silver Copper |
Bottom |
S-PBGA-B196 |
3 |
2.1 mm |
15 mm |
No |
e1 |
220 °C (428 °F) |
15 mm |
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|
Altera |
EE PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
256 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.63SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 120 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
95.2 MHz |
20 s |
220 °C (428 °F) |
20 mm |
Yes |
120 |
||||||||||
|
Altera |
EE PLD |
Military |
Pin/Peg |
160 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
15 ns |
No |
192 |
CMOS |
5 |
3.3/5,5 V |
Grid Array |
PGA160M,15X15 |
Programmable Logic Devices |
No |
Macrocell |
2.54 mm |
125 °C (257 °F) |
0 Dedicated Inputs |
0 |
-55 °C (-67 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P160 |
5.34 mm |
39.624 mm |
No |
192 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; Shared Input/Clock |
e0 |
76.9 MHz |
220 °C (428 °F) |
39.624 mm |
No |
||||||||||||||
|
Altera |
Loadable PLD |
Other |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
2.5 |
Flatpack, Fine Pitch |
Macrocell |
2.375 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 189 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e3 |
220 °C (428 °F) |
32 mm |
189 |
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|
|
Altera |
Loadable PLD |
Other |
Ball |
652 |
BGA |
Square |
Plastic/Epoxy |
2.25 ns |
Yes |
1.89 V |
CMOS |
1.8 |
Grid Array |
Macrocell |
1.71 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 488 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B652 |
3.5 mm |
45 mm |
No |
e1 |
160 MHz |
45 mm |
488 |
||||||||||||||||||
|
Altera |
Flash PLD |
Gull Wing |
144 |
QFP |
Square |
Plastic/Epoxy |
8.1 ns |
Yes |
980 |
CMOS |
1.5/3.3,2.5/3.3 V |
Flatpack |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
.5 mm |
Tin Lead |
Quad |
S-PQFP-G144 |
1 |
No |
e0 |
Yes |
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|
Altera |
Loadable PLD |
Ball |
652 |
LBGA |
Square |
Plastic/Epoxy |
16640 |
Yes |
CMOS |
480 |
1.8 |
1.8,1.8/3.3 V |
Grid Array, Low Profile |
BGA652,35X35,50 |
Field Programmable Gate Arrays |
Macrocell |
1.27 mm |
4 Dedicated Inputs, 488 I/O |
4 |
Tin Silver Copper |
Bottom |
S-PBGA-B652 |
1.63 mm |
45 mm |
No |
e1 |
480 |
220 °C (428 °F) |
45 mm |
488 |
|||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
8320 |
Yes |
2.625 V |
CMOS |
128 |
2.5 |
1.8,1.8/3.3 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 136 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
e3 |
128 |
220 °C (428 °F) |
28 mm |
136 |
||||||||||||||
|
Altera |
Loadable PLD |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
0.7 ns |
Yes |
2.625 V |
CMOS |
2.5 |
Flatpack, Fine Pitch |
Mixed |
2.375 V |
.5 mm |
70 °C (158 °F) |
147 I/O |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
4992 Logic Elements |
e3 |
140 MHz |
28 mm |
147 |
|||||||||||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
256 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 164 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
256 Macrocells; 16 Labs; Configurable I/O operation with 3.3 V or 5 V |
e0 |
125 MHz |
220 °C (428 °F) |
28 mm |
Yes |
164 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.