| Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Altera |
Loadable PLD |
Commercial |
Gull Wing |
304 |
FQFP |
Square |
Plastic/Epoxy |
23.8 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack, Fine Pitch |
Registered |
4.75 V |
.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 249 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G304 |
4.5 mm |
40 mm |
No |
2880 Logic elements; Built-in JTAG boundry-scan test circuitry |
e3 |
60.6 MHz |
40 mm |
249 |
||||||||||||||||||
|
Altera |
OT PLD |
Industrial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
16 ns |
Yes |
5.5 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
Small Outline |
SOP20,.4 |
Programmable Logic Devices |
Macrocell |
4.5 V |
72 |
1.27 mm |
85 °C (185 °F) |
9 Dedicated Inputs, 8 I/O |
9 |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G20 |
2.65 mm |
7.5 mm |
No |
8 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
83.3 MHz |
8 |
220 °C (428 °F) |
12.8 mm |
8 |
||||||||||
|
Altera |
Loadable PLD |
Military |
Pin/Peg |
192 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
CMOS |
5 |
Grid Array |
Registered |
4.5 V |
2.54 mm |
125 °C (257 °F) |
4 Dedicated Inputs, 148 I/O |
4 |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P192 |
5.43 mm |
45.15 mm |
No |
820 Flip Flops; 672 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
45.15 mm |
148 |
||||||||||||||||||||||
|
Altera |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic |
50 ns |
No |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
74 |
2.54 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-XDIP-T20 |
No |
e0 |
18 MHz |
8 |
220 °C (428 °F) |
||||||||||||||||||||
|
|
Altera |
Loadable PLD |
Commercial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
CMOS |
5 |
Flatpack, Low Profile, Fine Pitch |
Registered |
4.75 V |
.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 78 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
208 Logic Elements |
e3 |
14 mm |
78 |
||||||||||||||||||
|
Altera |
OT PLD |
Commercial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
17 ns |
Yes |
5.25 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
Small Outline |
SOP24,.4 |
Programmable Logic Devices |
Macrocell |
4.75 V |
160 |
1.27 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G24 |
2.65 mm |
7.5 mm |
No |
Macrocells Interconnected By Global Bus; 16 Macrocells; 2 External Clocks |
e0 |
71.4 MHz |
16 |
220 °C (428 °F) |
15.4 mm |
16 |
||||||||||
|
Altera |
Loadable PLD |
Military |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
CMOS |
5 |
Flatpack |
Registered |
4.5 V |
.65 mm |
125 °C (257 °F) |
4 Dedicated Inputs, 116 I/O |
4 |
-55 °C (-67 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
4.07 mm |
28 mm |
No |
Labs With Fasttrack Interconnect; 452 Flip Flops; 336 Logic Elements |
e3 |
28 mm |
116 |
||||||||||||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
12 ns |
Yes |
5.25 V |
96 |
CMOS |
5 |
3.3/5,5 V |
Flatpack |
QFP100,.7X.9 |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 76 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
R-PQFP-G100 |
3 |
3.65 mm |
14 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
125 MHz |
220 °C (428 °F) |
20 mm |
No |
76 |
||||||||||
|
Altera |
Loadable PLD |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
2.5 |
Grid Array |
Macrocell |
2.375 V |
4 Dedicated Inputs, 382 I/O |
4 |
Tin Silver Copper |
Bottom |
S-PBGA-B484 |
No |
e1 |
382 |
|||||||||||||||||||||||||||||
|
Altera |
Loadable PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
0.4 ns |
Yes |
5.25 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
4 Dedicated Inputs |
4 |
0 °C (32 °F) |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
16.5862 mm |
|||||||||||||||||||||||
|
Altera |
Flash PLD |
Ball |
256 |
FBGA |
Square |
Plastic/Epoxy |
10 ns |
Yes |
980 |
CMOS |
1.8,1.8/3 V |
Grid Array, Fine Pitch |
BGA256,20X20,20 |
Programmable Logic Devices |
Yes |
.5 mm |
Bottom |
S-PBGA-B256 |
No |
Yes |
|||||||||||||||||||||||||||||
|
Altera |
Loadable PLD |
Ball |
1020 |
HBGA |
Square |
Plastic/Epoxy |
38400 |
Yes |
1.89 V |
CMOS |
700 |
1.8 |
1.8,1.8/3.3 V |
Grid Array, Heat Sink/Slug |
BGA1020,32X32,40 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
1 mm |
4 Dedicated Inputs, 708 I/O |
4 |
Tin Lead |
Bottom |
S-PBGA-B1020 |
3 |
3.5 mm |
33 mm |
No |
e0 |
700 |
220 °C (428 °F) |
33 mm |
708 |
||||||||||||||||
|
Altera |
Flash PLD |
Commercial Extended |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
7 ns |
Yes |
2.625 V |
440 |
CMOS |
2.5 |
1.5/3.3,2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 116 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
It can also operate at 3.3 V |
e0 |
20 s |
220 °C (428 °F) |
20 mm |
Yes |
116 |
||||||||||
|
Altera |
Loadable PLD |
Military |
Ball |
356 |
HLBGA |
Square |
Plastic/Epoxy |
23.8 ns |
Yes |
5.5 V |
CMOS |
5 |
Grid Array, Heat Sink/Slug, Low Profile |
Registered |
4.5 V |
1.27 mm |
125 °C (257 °F) |
4 Dedicated Inputs |
4 |
-55 °C (-67 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B356 |
1.63 mm |
35 mm |
No |
576 Logic elements Configurable I/O operation with 3.3 V or 5 V |
e1 |
60.6 MHz |
35 mm |
|||||||||||||||||||
|
Altera |
EE PLD |
Military |
Pin/Peg |
160 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
20 ns |
No |
5.5 V |
CMOS |
5 |
Grid Array |
Macrocell |
4.5 V |
2.54 mm |
125 °C (257 °F) |
0 Dedicated Inputs, 120 I/O |
0 |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P160 |
5.34 mm |
39.624 mm |
No |
192 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; Shared Input/Clock |
62.5 MHz |
39.624 mm |
120 |
||||||||||||||||||||
|
Altera |
Flash PLD |
Industrial |
Ball |
68 |
TFBGA |
Square |
Plastic/Epoxy |
14 ns |
Yes |
1.89 V |
192 |
CMOS |
1.8 |
1.8,1.2/3.3 V |
Grid Array, Thin Profile, Fine Pitch |
BGA68,9X9,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
.5 mm |
100 °C (212 °F) |
52 I/O |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B68 |
1.2 mm |
5 mm |
No |
e0 |
118.3 MHz |
5 mm |
Yes |
52 |
||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
0.5 ns |
Yes |
3.6 V |
3.3 |
Grid Array |
Mixed |
3 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 150 I/O |
4 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
2.3 mm |
27 mm |
No |
e1 |
27 mm |
150 |
|||||||||||||||||||||
|
Altera |
EE PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
256 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 164 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
2.1 mm |
17 mm |
No |
e0 |
126.6 MHz |
20 s |
220 °C (428 °F) |
17 mm |
Yes |
164 |
||||||||||
|
|
Altera |
Loadable PLD |
Other |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
2.23 ns |
Yes |
1.575 V |
CMOS |
1.5 |
Grid Array |
Macrocell |
1.425 V |
1 mm |
85 °C (185 °F) |
492 I/O |
0 °C (32 °F) |
Tin/Silver/Copper |
Bottom |
S-PBGA-B672 |
2.1 mm |
27 mm |
No |
e1 |
40 s |
245 °C (473 °F) |
27 mm |
492 |
||||||||||||||||||
|
|
Altera |
Flash PLD |
Automotive |
Ball |
100 |
BGA |
Square |
Plastic/Epoxy |
12 ns |
Yes |
1.89 V |
192 |
CMOS |
1.8 |
1.5/3.3,1.8 V |
Grid Array |
BGA100,11X11,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
.5 mm |
125 °C (257 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B100 |
No |
It can also operate at 3.3 V |
e1 |
Yes |
80 |
|||||||||||||||
|
|
Altera |
Flash PLD |
Ball |
100 |
LBGA |
Square |
Plastic/Epoxy |
5.4 ns |
Yes |
2.625 V |
440 |
CMOS |
2.5 |
1.5/3.3,2.5/3.3 V |
Grid Array, Low Profile |
BGA100,10X10,40 |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
1 mm |
0 Dedicated Inputs, 76 I/O |
0 |
Tin Silver Copper |
Bottom |
S-PBGA-B100 |
1.7 mm |
11 mm |
No |
It can also operate at 3.3 V |
e1 |
11 mm |
Yes |
76 |
|||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
0.5 ns |
Yes |
3.6 V |
3.3 |
Grid Array |
Mixed |
3 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 150 I/O |
4 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B484 |
1.86 mm |
23 mm |
No |
e1 |
23 mm |
150 |
|||||||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
12.5 ns |
1728 |
Yes |
2.7 V |
CMOS |
176 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
1 mm |
85 °C (185 °F) |
176 I/O |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
2.1 mm |
17 mm |
No |
e0 |
176 |
220 °C (428 °F) |
17 mm |
176 |
|||||||||||||
|
Altera |
Loadable PLD |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
CMOS |
5 |
Flatpack, Fine Pitch |
Registered |
4.75 V |
.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 148 I/O |
4 |
0 °C (32 °F) |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
220 °C (428 °F) |
28 mm |
148 |
|||||||||||||||||||||
|
Altera |
EE PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.5 V |
256 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Fine Pitch |
HQFP208,1.2SQ,20 |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 164 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
83.3 MHz |
220 °C (428 °F) |
28 mm |
No |
164 |
||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack, Fine Pitch |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 160 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Labs interconnected by PIA; 16 Labs; 2 External Clocks |
e0 |
50 MHz |
28 mm |
160 |
|||||||||||||||||
|
Altera |
EE PLD |
Industrial |
Gull Wing |
44 |
LQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
1.27 mm |
10 mm |
No |
64 Macrocells |
e0 |
100 MHz |
220 °C (428 °F) |
10 mm |
Yes |
36 |
||||||||||
|
Altera |
Loadable PLD |
Industrial |
Ball |
600 |
BGA |
Square |
Plastic/Epoxy |
9 ns |
6656 |
Yes |
2.7 V |
CMOS |
424 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA600,35X35,50 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
1.27 mm |
85 °C (185 °F) |
424 I/O |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B600 |
1.93 mm |
45 mm |
No |
e0 |
424 |
220 °C (428 °F) |
45 mm |
424 |
||||||||||||||
|
Altera |
Loadable PLD |
Military |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier |
Registered |
4.5 V |
1.27 mm |
125 °C (257 °F) |
4 Dedicated Inputs, 64 I/O |
4 |
-55 °C (-67 °F) |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
Labs With Fasttrack Interconnect; 452 Flip Flops; 336 Logic Elements |
29.3116 mm |
64 |
||||||||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
0.9 ns |
Yes |
2.7 V |
2.5 |
Grid Array |
Mixed |
2.3 V |
85 °C (185 °F) |
4 Dedicated Inputs, 338 I/O |
4 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B484 |
No |
e1 |
338 |
|||||||||||||||||||||||||
|
Altera |
EE PLD |
Industrial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
3.5 ns |
Yes |
2.625 V |
64 |
CMOS |
2.5 |
1.8/3.3,2.5 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
e0 |
303 MHz |
220 °C (428 °F) |
14 mm |
Yes |
68 |
|||||||||||
|
Altera |
OT PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
40 ns |
Yes |
5.25 V |
192 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 64 I/O |
7 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
192 Macrocells; Shared Input/Clock; Shared Product Terms |
e0 |
50 MHz |
220 °C (428 °F) |
29.3116 mm |
No |
64 |
|||||||||||
|
Altera |
UV PLD |
Commercial |
J Bend |
28 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
15 ns |
Yes |
5.25 V |
CMOS |
24 |
PAL-TYPE |
5 |
5 V |
Chip Carrier, Window |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
320 |
1.27 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 16 I/O |
7 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-CQCC-J28 |
4.57 mm |
11.43 mm |
No |
Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
76.9 MHz |
16 |
220 °C (428 °F) |
11.43 mm |
16 |
||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
2.05 ns |
38400 |
Yes |
1.575 V |
CMOS |
480 |
1.5 |
1.5,1.5/3.3 V |
Grid Array |
BGA672,26X26,40 |
Field Programmable Gate Arrays |
Macrocell |
1.425 V |
1 mm |
85 °C (185 °F) |
492 I/O |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B672 |
3 |
2.1 mm |
27 mm |
No |
e0 |
480 |
220 °C (428 °F) |
27 mm |
492 |
|||||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
23.4 ns |
Yes |
5.25 V |
480 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Fine Pitch |
HQFP240,1.37SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 175 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
676 Flip Flops; Configurable I/O operation with 3.3 V or 5 V |
e0 |
100 MHz |
220 °C (428 °F) |
32 mm |
Yes |
175 |
|||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
1.58 ns |
8320 |
Yes |
1.89 V |
CMOS |
368 |
1.8 |
1.8,1.8/3.3 V |
Grid Array |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 376 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B484 |
3 |
2.1 mm |
23 mm |
No |
e0 |
160 MHz |
20 s |
368 |
220 °C (428 °F) |
23 mm |
376 |
||||||||||
|
|
Altera |
Flash PLD |
Automotive |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
8.7 ns |
Yes |
1.89 V |
440 |
CMOS |
1.8 |
1.5/3.3,1.8 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
1 mm |
125 °C (257 °F) |
0 Dedicated Inputs, 160 I/O |
0 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
2.2 mm |
17 mm |
No |
It can also operate at 3.3 V |
e1 |
17 mm |
Yes |
160 |
||||||||||||
|
Altera |
Loadable PLD |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
8320 |
Yes |
2.625 V |
CMOS |
138 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
HQFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
4 Dedicated Inputs, 144 I/O |
4 |
Tin Lead |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
e0 |
138 |
220 °C (428 °F) |
28 mm |
144 |
|||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
CMOS |
5 |
Flatpack |
Registered |
4.5 V |
.65 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 116 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
4.07 mm |
28 mm |
No |
Labs With Fasttrack Interconnect; 452 Flip Flops; 336 Logic Elements |
e3 |
28 mm |
116 |
||||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
1320 |
Yes |
3.6 V |
CMOS |
171 |
3.3 |
2.5/3.3,3.3 V |
Grid Array |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
Macrocell |
3 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 171 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
2.1 mm |
17 mm |
No |
e0 |
133 MHz |
20 s |
171 |
220 °C (428 °F) |
17 mm |
171 |
|||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
10.8 ns |
Yes |
5.25 V |
320 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Fine Pitch |
HQFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 132 I/O |
0 |
0 °C (32 °F) |
Tin/Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
320 Macrocells; 20 Labs; 484 Flip Flops; Configurable I/O operation with 3.3 V or 5 V |
e0 |
144.9 MHz |
30 s |
220 °C (428 °F) |
28 mm |
Yes |
132 |
|||||||||
|
Altera |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
10.8 ns |
Yes |
5.25 V |
320 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 60 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
No |
320 Macrocells; 20 Labs; 484 Flip Flops; Configurable I/O operation with 3.3 V or 5 V |
e0 |
144.9 MHz |
220 °C (428 °F) |
29.3116 mm |
Yes |
60 |
||||||||||
|
Altera |
Loadable PLD |
Commercial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
1.8 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Flatpack |
Registered |
3 V |
.65 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 120 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
4.07 mm |
28 mm |
No |
Can also operate at 5 V supply |
e3 |
28 mm |
120 |
|||||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
0.6 ns |
Yes |
2.7 V |
2.5 |
Grid Array |
Mixed |
2.3 V |
85 °C (185 °F) |
4 Dedicated Inputs, 470 I/O |
4 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B672 |
No |
e1 |
470 |
|||||||||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
1.8 |
Flatpack, Fine Pitch |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 152 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
32 mm |
152 |
||||||||||||||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 100 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
4.07 mm |
28 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e3 |
100 MHz |
28 mm |
100 |
||||||||||||||||||
|
|
Altera |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
64 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
1.27 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Quad |
S-PQCC-J44 |
No |
No |
||||||||||||||||||||||||
|
Altera |
3 |
220 °C (428 °F) |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.