| Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Altera |
EE PLD |
Commercial |
Ball |
356 |
LBGA |
Square |
Plastic/Epoxy |
23 ns |
Yes |
5.25 V |
320 |
CMOS |
5 |
3.3/5,5 V |
Grid Array, Low Profile |
BGA356,26X26,50 |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 168 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B356 |
1.63 mm |
35 mm |
No |
320 Macrocells; 20 Labs; 484 Flip Flops; Configurable I/O operation with 3.3 V or 5 V |
e0 |
100 MHz |
220 °C (428 °F) |
35 mm |
Yes |
168 |
|||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
96 |
CMOS |
5 |
3.3/5,5 V |
Flatpack |
QFP100,.7X.9 |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 72 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
R-PQFP-G100 |
3 |
3.65 mm |
14 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
76.9 MHz |
220 °C (428 °F) |
20 mm |
No |
72 |
||||||||||
|
Altera |
OT PLD |
Commercial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC20,.4SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
72 |
1.27 mm |
70 °C (158 °F) |
9 Dedicated Inputs, 8 I/O |
9 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J20 |
4.572 mm |
8.9662 mm |
No |
8 Macrocells |
e0 |
100 MHz |
8 |
220 °C (428 °F) |
8.9662 mm |
8 |
||||||||||
|
Altera |
Loadable PLD |
Commercial |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
0.3 ns |
6656 |
Yes |
2.625 V |
CMOS |
369 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
1 mm |
70 °C (158 °F) |
369 I/O |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B484 |
3 |
2.1 mm |
23 mm |
No |
e0 |
369 |
220 °C (428 °F) |
23 mm |
369 |
|||||||||||||
|
Altera |
Flash PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
14 ns |
80 |
Yes |
5.25 V |
CMOS |
62 |
5 |
5 V |
Chip Carrier |
LDCC84,1.2SQ |
Field Programmable Gate Arrays |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 60 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
8 Labs; 80 Macrocells Configurable I/O operation with 3.3 V or 5 V |
e0 |
58.8 MHz |
62 |
220 °C (428 °F) |
29.3116 mm |
60 |
|||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
1.6 ns |
Yes |
1.89 V |
1.8 |
Grid Array |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
376 I/O |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B672 |
2.1 mm |
27 mm |
No |
e1 |
27 mm |
376 |
||||||||||||||||||||||
|
|
Altera |
Loadable PLD |
Other |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
1.68 ns |
Yes |
1.89 V |
CMOS |
1.8 |
Grid Array |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 408 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B672 |
3 |
3.5 mm |
27 mm |
No |
e1 |
160 MHz |
245 °C (473 °F) |
27 mm |
408 |
||||||||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 128 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
4.07 mm |
28 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e3 |
62.5 MHz |
28 mm |
128 |
||||||||||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
44 |
LQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
32 |
CMOS |
36 |
PLA-TYPE |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1024 |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
1.27 mm |
10 mm |
No |
e0 |
138.9 MHz |
20 s |
36 |
235 °C (455 °F) |
10 mm |
Yes |
36 |
||||||
|
Altera |
Loadable PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack, Fine Pitch |
Registered |
4.75 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 147 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
1152 Logic elements Configurable I/O operation with 3.3 V or 5 V |
e3 |
60.6 MHz |
28 mm |
147 |
||||||||||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
11.2 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 142 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
480 Macrocells |
e3 |
28 mm |
142 |
|||||||||||||||||||
|
|
Altera |
Flash PLD |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
4.7 ns |
Yes |
1.89 V |
192 |
CMOS |
1.8 |
1.5/3.3,1.8 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
It can also operate at 3.3 V |
e3 |
30 s |
260 °C (500 °F) |
14 mm |
Yes |
80 |
|||||||||
|
|
Altera |
EE PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
10 ns |
Yes |
128 |
CMOS |
1.8/3.3,2.5 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
1 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
No |
e1 |
Yes |
|||||||||||||||||||||||
|
Altera |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
6 ns |
Yes |
5.25 V |
32 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
1 |
4.572 mm |
16.5862 mm |
No |
Labs interconnected by PIA; 2 Labs; 32 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
200 MHz |
220 °C (428 °F) |
16.5862 mm |
No |
36 |
||||||||||
|
Altera |
EE PLD |
Industrial |
Pin/Peg |
280 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
23 ns |
No |
5.5 V |
320 |
CMOS |
5 |
3.3/5,5 V |
Grid Array |
PGA280,19X19 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
2.54 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 168 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P280 |
1 |
5.08 mm |
49.78 mm |
No |
484 Flip Flops; Configurable I/O operation with 3.3 V or 5 V |
e0 |
100 MHz |
220 °C (428 °F) |
49.78 mm |
Yes |
168 |
||||||||||
|
|
Altera |
Loadable PLD |
Ball |
144 |
LBGA |
Square |
Plastic/Epoxy |
2.02 ns |
Yes |
1.89 V |
CMOS |
1.8 |
Grid Array, Low Profile |
Macrocell |
1.71 V |
1 mm |
4 Dedicated Inputs, 93 I/O |
4 |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
1.7 mm |
13 mm |
No |
e1 |
13 mm |
93 |
||||||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
4160 |
Yes |
2.625 V |
CMOS |
175 |
2.5 |
1.8,1.8/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 183 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
175 |
220 °C (428 °F) |
32 mm |
183 |
||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
9 ns |
6656 |
Yes |
2.7 V |
CMOS |
186 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
.5 mm |
85 °C (185 °F) |
186 I/O |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e0 |
186 |
220 °C (428 °F) |
32 mm |
186 |
|||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
0.6 ns |
Yes |
2.7 V |
2.5 |
Grid Array |
Mixed |
2.3 V |
85 °C (185 °F) |
4 Dedicated Inputs, 338 I/O |
4 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B484 |
No |
e1 |
338 |
|||||||||||||||||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
128 |
CMOS |
5 |
3.3/5,5 V |
Flatpack |
QFP160,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 100 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G160 |
3 |
4.07 mm |
28 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
125 MHz |
220 °C (428 °F) |
28 mm |
No |
100 |
||||||||||
|
|
Altera |
Loadable PLD |
Other |
Ball |
652 |
BGA |
Square |
Plastic/Epoxy |
3.1 ns |
Yes |
2.625 V |
CMOS |
2.5 |
Grid Array |
Macrocell |
2.375 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 502 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B652 |
3.5 mm |
45 mm |
No |
e1 |
45 mm |
502 |
|||||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
208 |
Yes |
5.5 V |
CMOS |
68 |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Field Programmable Gate Arrays |
Registered |
4.5 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 64 I/O |
4 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
No |
282 Flip Flops; 208 Logic elements; Built-in JTAG boundry-scan test circuitry |
e0 |
64 |
220 °C (428 °F) |
29.3116 mm |
64 |
||||||||||||
|
Altera |
Loadable PLD |
Ball |
356 |
LBGA |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
1.8 |
Grid Array, Low Profile |
Macrocell |
1.71 V |
1.27 mm |
271 I/O |
Tin Silver Copper |
Bottom |
S-PBGA-B356 |
1.63 mm |
35 mm |
No |
e1 |
35 mm |
271 |
||||||||||||||||||||||||||
|
Altera |
EE PLD |
Commercial |
Ball |
100 |
LBGA |
Square |
Plastic/Epoxy |
3.5 ns |
Yes |
2.625 V |
64 |
CMOS |
2.5 |
1.8/3.3,2.5 V |
Grid Array, Low Profile |
BGA100,10X10,40 |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
1 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B100 |
3 |
1.7 mm |
11 mm |
No |
e0 |
303 MHz |
20 s |
235 °C (455 °F) |
11 mm |
Yes |
68 |
||||||||||
|
|
Altera |
Flash PLD |
Ball |
100 |
LBGA |
Square |
Plastic/Epoxy |
8.7 ns |
Yes |
1.89 V |
440 |
CMOS |
1.8 |
1.5/3.3,1.8 V |
Grid Array, Low Profile |
BGA100,10X10,40 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
1 mm |
0 Dedicated Inputs, 76 I/O |
0 |
Tin/Silver/Copper |
Bottom |
S-PBGA-B100 |
3 |
1.7 mm |
11 mm |
No |
It can also operate at 3.3 V |
e1 |
30 s |
260 °C (500 °F) |
11 mm |
Yes |
76 |
||||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
2.92 ns |
Yes |
1.89 V |
CMOS |
1.8 |
Grid Array |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 508 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B672 |
3 |
3.5 mm |
27 mm |
No |
e1 |
160 MHz |
220 °C (428 °F) |
27 mm |
508 |
|||||||||||||||||
|
Altera |
Loadable PLD |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
0.5 ns |
576 |
Yes |
5.25 V |
CMOS |
134 |
5 |
3.3/5,5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Registered |
4.75 V |
.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 134 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
576 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e0 |
71.43 MHz |
20 s |
134 |
220 °C (428 °F) |
28 mm |
134 |
|||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
R-PQFP-G100 |
3.65 mm |
14 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e3 |
100 MHz |
20 mm |
80 |
||||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Flatpack, Fine Pitch |
Registered |
3 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 134 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
e3 |
28 mm |
134 |
||||||||||||||||||||
|
Altera |
UV PLD |
Industrial |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
20 ns |
No |
5.5 V |
CMOS |
24 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP28,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
320 |
2.54 mm |
85 °C (185 °F) |
7 Dedicated Inputs, 16 I/O |
7 |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-GDIP-T28 |
No |
Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
62.5 MHz |
16 |
220 °C (428 °F) |
16 |
|||||||||||||
|
Altera |
UV PLD |
Commercial |
Through-Hole |
24 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
15 ns |
No |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
In-Line, Window |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
132 |
2.54 mm |
70 °C (158 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
5.08 mm |
7.62 mm |
No |
Macrocells Interconnected By Global Bus; 10 Macrocells; 1 External Clock |
e0 |
64.5 MHz |
10 |
220 °C (428 °F) |
32 mm |
10 |
||||||||||
|
|
Altera |
Flash PLD |
Automotive |
Ball |
256 |
BGA |
Rectangular |
Plastic/Epoxy |
8.1 ns |
Yes |
1.89 V |
980 |
CMOS |
1.8 |
1.5/3.3,1.8 V |
Grid Array |
BGA256,20X20,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
.5 mm |
125 °C (257 °F) |
0 Dedicated Inputs, 212 I/O |
0 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
R-PBGA-B256 |
No |
It can also operate at 3.3 V |
e1 |
Yes |
212 |
|||||||||||||||
|
|
Altera |
Loadable PLD |
Other |
Ball |
652 |
BGA |
Square |
Plastic/Epoxy |
1.68 ns |
Yes |
1.89 V |
CMOS |
1.8 |
Grid Array |
Macrocell |
1.71 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 408 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B652 |
3.5 mm |
45 mm |
No |
e1 |
160 MHz |
45 mm |
408 |
||||||||||||||||||
|
Altera |
UV PLD |
Commercial |
J Bend |
68 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
25 ns |
Yes |
5.25 V |
CMOS |
5 |
Chip Carrier, Window |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
0 °C (32 °F) |
Quad |
S-CQCC-J68 |
5.08 mm |
24.13 mm |
No |
Labs interconnected by PIA; 8 Labs; 1 External Clock |
83.3 MHz |
24.13 mm |
52 |
||||||||||||||||||||
|
|
Altera |
Loadable PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier |
Registered |
4.5 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 64 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
No |
636 Flip Flops; 504 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e3 |
29.3116 mm |
64 |
||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
0.4 ns |
4160 |
Yes |
2.625 V |
CMOS |
153 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 159 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
34 MHz |
153 |
220 °C (428 °F) |
28 mm |
159 |
|||||||||||
|
|
Altera |
Flash PLD |
Ball |
100 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
1.8 |
Grid Array |
Macrocell |
1.71 V |
0 Dedicated Inputs, 0 I/O |
0 |
Tin Silver Copper |
Bottom |
S-PBGA-B100 |
No |
e1 |
0 |
||||||||||||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
356 |
LBGA |
Square |
Plastic/Epoxy |
3.56 ns |
2560 |
Yes |
1.89 V |
CMOS |
188 |
1.8 |
1.8,1.8/3.3 V |
Grid Array, Low Profile |
BGA356,26X26,50 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 196 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B356 |
3 |
1.63 mm |
35 mm |
No |
e0 |
160 MHz |
20 s |
188 |
220 °C (428 °F) |
35 mm |
196 |
||||||||||
|
Altera |
Loadable PLD |
Military |
Ball |
356 |
HLBGA |
Square |
Plastic/Epoxy |
23.8 ns |
Yes |
5.5 V |
CMOS |
5 |
Grid Array, Heat Sink/Slug, Low Profile |
Registered |
4.5 V |
1.27 mm |
125 °C (257 °F) |
4 Dedicated Inputs |
4 |
-55 °C (-67 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B356 |
1.63 mm |
35 mm |
No |
2304 Logic elements Configurable I/O operation with 3.3 V or 5 V |
e1 |
60.6 MHz |
35 mm |
|||||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
1.78 ns |
24320 |
Yes |
1.89 V |
CMOS |
500 |
1.8 |
1.8,1.8/3.3 V |
Grid Array |
BGA672,26X26,40 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 508 I/O |
4 |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B672 |
4 |
3.5 mm |
27 mm |
No |
e0 |
20 s |
500 |
220 °C (428 °F) |
27 mm |
508 |
|||||||||||
|
Altera |
Loadable PLD |
Commercial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
0.5 ns |
Yes |
Grid Array |
Mixed |
1.27 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 191 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
2.3 mm |
27 mm |
No |
e1 |
27 mm |
191 |
||||||||||||||||||||||||
|
|
Altera |
EE PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
12 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Grid Array |
Macrocell |
3 V |
1 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 212 I/O |
0 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
3 |
2.1 mm |
17 mm |
No |
e1 |
71.9 MHz |
245 °C (473 °F) |
17 mm |
212 |
||||||||||||||||
|
Altera |
UV PLD |
Military |
Through-Hole |
40 |
DIP |
Rectangular |
60 ns |
No |
5.5 V |
CMOS |
MIL-STD-883 |
5 |
In-Line |
Macrocell |
4.5 V |
125 °C (257 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
-55 °C (-67 °F) |
Dual |
R-XDIP-T40 |
No |
14.3 MHz |
24 |
|||||||||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
6400 |
Yes |
2.625 V |
CMOS |
135 |
2.5 |
1.8,1.8/3.3 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 143 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
e3 |
160 MHz |
135 |
220 °C (428 °F) |
28 mm |
143 |
|||||||||||||
|
Altera |
EE PLD |
Military |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.5 V |
256 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Fine Pitch |
HQFP208,1.2SQ,20 |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
.5 mm |
125 °C (257 °F) |
0 Dedicated Inputs, 160 I/O |
0 |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
4.07 mm |
28 mm |
No |
256 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; Shared Input/Clock |
e0 |
62.5 MHz |
220 °C (428 °F) |
28 mm |
No |
160 |
|||||||||||
|
|
Altera |
Loadable PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
0.5 ns |
Yes |
2.7 V |
CMOS |
2.5 |
Flatpack, Low Profile, Fine Pitch |
Mixed |
2.3 V |
.5 mm |
70 °C (158 °F) |
102 I/O |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
2880 Logic Elements |
e3 |
140 MHz |
20 mm |
102 |
|||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
1.8 |
Flatpack, Fine Pitch |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
168 I/O |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
32 mm |
168 |
|||||||||||||||||||||||
|
Altera |
UV PLD |
Military |
Pin/Peg |
84 |
WPGA |
Square |
Ceramic, Metal-Sealed Cofired |
45 ns |
No |
5.5 V |
CMOS |
5 |
Grid Array, Window |
Macrocell |
4.5 V |
2.54 mm |
125 °C (257 °F) |
7 Dedicated Inputs, 64 I/O |
7 |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P84 |
3.81 mm |
27.94 mm |
No |
Labs interconnected by PIA; 12 Labs; 192 Macrocells; 1 External Clock; Shared Input/Clock |
40 MHz |
27.94 mm |
64 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.