| Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Altera |
UV PLD |
Industrial |
Through-Hole |
24 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
32 ns |
No |
5.5 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
In-Line, Window |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
160 |
2.54 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
5.08 mm |
7.62 mm |
No |
16 Macrocells; 2 External Clocks |
e0 |
41.7 MHz |
16 |
220 °C (428 °F) |
32 mm |
16 |
||||||||||
|
Altera |
EE PLD |
Industrial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
5.5 V |
160 |
CMOS |
5 |
3.3/5,5 V |
Flatpack |
QFP160,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
.65 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 104 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G160 |
3 |
4.07 mm |
28 mm |
No |
160 Macrocells |
e0 |
125 MHz |
220 °C (428 °F) |
28 mm |
No |
104 |
||||||||||
|
Altera |
Loadable PLD |
Industrial |
Ball |
225 |
BGA |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
CMOS |
5 |
Grid Array |
Registered |
4.5 V |
1.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 148 I/O |
4 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B225 |
2.3 mm |
27 mm |
No |
820 Flip Flops; 672 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e1 |
27 mm |
148 |
||||||||||||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 120 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
4.07 mm |
28 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e3 |
100 MHz |
28 mm |
120 |
||||||||||||||||||
|
Altera |
OT PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
45 ns |
Yes |
5.25 V |
5 |
Chip Carrier |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
4.3688 mm |
11.5316 mm |
Seated HGT-NOM |
e0 |
26.3 MHz |
220 °C (428 °F) |
11.5316 mm |
||||||||||||||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
128 |
CMOS |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
R-PQFP-G100 |
3 |
3.425 mm |
14 mm |
No |
128 Macrocells; Shared Input/Clock |
e0 |
100 MHz |
220 °C (428 °F) |
20 mm |
No |
80 |
||||||||||
|
Altera |
Flash PLD |
Other |
Ball |
324 |
LBGA |
Square |
Plastic/Epoxy |
9.1 ns |
Yes |
1.89 V |
980 |
CMOS |
1.8 |
1.8,1.2/3.3 V |
Grid Array, Low Profile |
BGA324,18X18,40 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
271 I/O |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B324 |
1.55 mm |
19 mm |
No |
e0 |
247.5 MHz |
19 mm |
Yes |
271 |
||||||||||||||
|
Altera |
UV PLD |
Industrial |
Pin/Peg |
68 |
WPGA |
Square |
Ceramic, Metal-Sealed Cofired |
25 ns |
No |
5.5 V |
CMOS |
5 |
Grid Array, Window |
Macrocell |
4.5 V |
2.54 mm |
85 °C (185 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
-40 °C (-40 °F) |
Perpendicular |
S-CPGA-P68 |
4.953 mm |
27.94 mm |
No |
Labs interconnected by PIA; 8 Labs; 1 External Clock |
83.3 MHz |
27.94 mm |
52 |
||||||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
16.1 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack, Fine Pitch |
Registered |
4.75 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 134 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
e3 |
28 mm |
134 |
||||||||||||||||||||
|
Altera |
EE PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
512 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 208 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
3.5 mm |
17 mm |
No |
e0 |
20 s |
220 °C (428 °F) |
17 mm |
Yes |
208 |
|||||||||||
|
Altera |
Loadable PLD |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
672 |
Yes |
5.25 V |
CMOS |
152 |
5 |
3.3/5,5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Registered |
4.75 V |
.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 148 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
4.07 mm |
28 mm |
No |
820 Flip Flops; 672 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e0 |
148 |
220 °C (428 °F) |
28 mm |
148 |
|||||||||||||
|
Altera |
EE PLD |
Military |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
12 ns |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.5 V |
1.27 mm |
125 °C (257 °F) |
0 Dedicated Inputs, 59 I/O |
0 |
-55 °C (-67 °F) |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
400 Macrocells; 580 Flip Flops; Configurable I/O operation with 3.3 V or 5 V |
118 MHz |
29.3116 mm |
59 |
||||||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
9.5 ns |
2880 |
Yes |
2.7 V |
CMOS |
189 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
.5 mm |
85 °C (185 °F) |
189 I/O |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e0 |
189 |
220 °C (428 °F) |
32 mm |
189 |
|||||||||||||
|
Altera |
EE PLD |
Military |
Gull Wing |
304 |
HFQFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Macrocell |
4.5 V |
.5 mm |
125 °C (257 °F) |
0 Dedicated Inputs, 216 I/O |
0 |
-55 °C (-67 °F) |
Matte Tin |
Quad |
S-PQFP-G304 |
4.5 mm |
40 mm |
No |
560 Macrocells; 772 Flip Flops; Configurable I/O operation with 3.3 V or 5 V |
e3 |
117.6 MHz |
40 mm |
216 |
||||||||||||||||||
|
Altera |
Flash PLD |
Gull Wing |
100 |
QFP |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
2.5 |
Flatpack |
Macrocell |
2.375 V |
0 Dedicated Inputs, 80 I/O |
0 |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
No |
It can also operate at 3.3 V |
e0 |
80 |
|||||||||||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
2.5 ns |
Yes |
2.625 V |
2.5 |
Grid Array |
Macrocell |
2.375 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 382 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B484 |
3 |
2.1 mm |
23 mm |
No |
e1 |
220 °C (428 °F) |
23 mm |
382 |
|||||||||||||||||||
|
|
Altera |
Loadable PLD |
Other |
Ball |
652 |
BGA |
Square |
Plastic/Epoxy |
1.49 ns |
Yes |
1.89 V |
1.8 |
Grid Array |
Macrocell |
1.71 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 488 I/O |
4 |
0 °C (32 °F) |
Tin/Silver/Copper |
Bottom |
S-PBGA-B652 |
3.5 mm |
45 mm |
No |
e1 |
40 s |
245 °C (473 °F) |
45 mm |
488 |
||||||||||||||||||
|
Altera |
Loadable PLD |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
1960 |
Yes |
3.6 V |
CMOS |
218 |
3.3 |
2.5/3.3,3.3 V |
Grid Array |
BGA256(UNSPEC) |
Field Programmable Gate Arrays |
Macrocell |
3 V |
1.27 mm |
4 Dedicated Inputs, 218 I/O |
4 |
Tin Lead |
Bottom |
S-PBGA-B256 |
2.3 mm |
27 mm |
No |
Also Configurable with 5 V VCC |
e0 |
133 MHz |
218 |
220 °C (428 °F) |
27 mm |
218 |
|||||||||||||||
|
Altera |
Loadable PLD |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
2.13 ns |
38400 |
Yes |
1.89 V |
CMOS |
500 |
1.8 |
1.8,1.8/3.3 V |
Grid Array |
BGA672,26X26,40 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
1 mm |
4 Dedicated Inputs, 508 I/O |
4 |
Tin Lead |
Bottom |
S-PBGA-B672 |
3 |
3.5 mm |
27 mm |
No |
e0 |
20 s |
500 |
220 °C (428 °F) |
27 mm |
508 |
||||||||||||||
|
Altera |
UV PLD |
Commercial |
Through-Hole |
40 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
15 ns |
No |
5.25 V |
CMOS |
36 |
PAL-TYPE |
5 |
5 V |
In-Line, Window |
DIP40,.6 |
Programmable Logic Devices |
Macrocell |
4.75 V |
240 |
2.54 mm |
70 °C (158 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-GDIP-T40 |
5.75 mm |
15.24 mm |
No |
24 Macrocells; 2 External Clocks |
e0 |
100 MHz |
24 |
220 °C (428 °F) |
52.07 mm |
24 |
||||||||||
|
Altera |
Loadable PLD |
Military |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
23.8 ns |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier |
Registered |
4.5 V |
1.27 mm |
125 °C (257 °F) |
4 Dedicated Inputs |
4 |
-55 °C (-67 °F) |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
1152 Logic elements; Built-in JTAG boundry-scan test circuitry |
60.6 MHz |
29.3116 mm |
|||||||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Ball |
356 |
LBGA |
Square |
Plastic/Epoxy |
12.5 ns |
2880 |
Yes |
2.7 V |
CMOS |
220 |
2.5 |
2.5,2.5/3.3 V |
Grid Array, Low Profile |
BGA356,26X26,50 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
1.27 mm |
85 °C (185 °F) |
220 I/O |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B356 |
1.63 mm |
35 mm |
No |
e0 |
220 |
220 °C (428 °F) |
35 mm |
220 |
||||||||||||||
|
Altera |
Loadable PLD |
Other |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
1.58 ns |
8320 |
Yes |
1.89 V |
CMOS |
160 |
1.8 |
1.8,1.8/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 168 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e0 |
20 s |
160 |
220 °C (428 °F) |
32 mm |
168 |
|||||||||||
|
|
Altera |
Loadable PLD |
Commercial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
0.6 ns |
2880 |
Yes |
2.7 V |
CMOS |
191 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
1 mm |
70 °C (158 °F) |
191 I/O |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
2.1 mm |
17 mm |
No |
2880 Logic Elements |
e1 |
140 MHz |
191 |
17 mm |
191 |
||||||||||||
|
Altera |
EE PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
12 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Grid Array |
Macrocell |
3 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 100 I/O |
0 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
2.3 mm |
27 mm |
No |
128 Macrocells |
e1 |
100 MHz |
27 mm |
100 |
||||||||||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
5.25 V |
128 |
CMOS |
5 |
5 V |
Flatpack |
QFP160,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 96 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G160 |
3 |
4.07 mm |
28 mm |
No |
128 Macrocells; Shared Input/Clock |
e0 |
90.9 MHz |
220 °C (428 °F) |
28 mm |
No |
96 |
||||||||||
|
|
Altera |
Flash PLD |
Automotive |
Ball |
100 |
LBGA |
Square |
Plastic/Epoxy |
8.7 ns |
Yes |
1.89 V |
440 |
CMOS |
1.8 |
1.5/3.3,1.8 V |
Grid Array, Low Profile |
BGA100,10X10,40 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
1 mm |
125 °C (257 °F) |
0 Dedicated Inputs, 76 I/O |
0 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B100 |
1.7 mm |
11 mm |
No |
It can also operate at 3.3 V |
e1 |
11 mm |
Yes |
76 |
||||||||||||
|
|
Altera |
EE PLD |
Industrial |
Ball |
100 |
BGA |
Square |
Plastic/Epoxy |
4 ns |
Yes |
128 |
CMOS |
1.8/3.3,2.5 V |
Grid Array |
BGA100,10X10,40 |
Programmable Logic Devices |
Yes |
1 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B100 |
No |
e1 |
Yes |
|||||||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
1.72 ns |
2560 |
Yes |
1.89 V |
CMOS |
84 |
1.8 |
1.8,1.8/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 92 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
160 MHz |
20 s |
84 |
220 °C (428 °F) |
20 mm |
92 |
||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
324 |
BGA |
Square |
Plastic/Epoxy |
3.56 ns |
2560 |
Yes |
1.89 V |
CMOS |
188 |
1.8 |
1.8,1.8/3.3 V |
Grid Array |
BGA324,18X18,40 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 196 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B324 |
3 |
3.5 mm |
19 mm |
No |
e0 |
160 MHz |
20 s |
188 |
220 °C (428 °F) |
19 mm |
196 |
||||||||||
|
Altera |
Loadable PLD |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
CMOS |
2.5 |
Flatpack, Low Profile, Fine Pitch |
Macrocell |
2.375 V |
.5 mm |
4 Dedicated Inputs, 92 I/O |
4 |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
220 °C (428 °F) |
20 mm |
92 |
||||||||||||||||||||||
|
Altera |
Loadable PLD |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
CMOS |
2.5 |
Flatpack, Fine Pitch |
Macrocell |
2.375 V |
.5 mm |
4 Dedicated Inputs, 175 I/O |
4 |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
220 °C (428 °F) |
32 mm |
175 |
|||||||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
356 |
LBGA |
Square |
Plastic/Epoxy |
0.3 ns |
8320 |
Yes |
2.625 V |
CMOS |
271 |
2.5 |
2.5,2.5/3.3 V |
Grid Array, Low Profile |
BGA356,26X26,50 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 279 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B356 |
1.63 mm |
35 mm |
No |
e1 |
100 MHz |
271 |
220 °C (428 °F) |
35 mm |
279 |
||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Ball |
600 |
BGA |
Square |
Plastic/Epoxy |
12 ns |
6656 |
Yes |
2.7 V |
CMOS |
424 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA600,35X35,50 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
1.27 mm |
85 °C (185 °F) |
424 I/O |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B600 |
1.93 mm |
45 mm |
No |
e0 |
424 |
220 °C (428 °F) |
45 mm |
424 |
||||||||||||||
|
Altera |
UV PLD |
Commercial |
Through-Hole |
40 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
15 ns |
No |
5.25 V |
CMOS |
36 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP40,.6 |
Programmable Logic Devices |
Macrocell |
4.75 V |
240 |
2.54 mm |
70 °C (158 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-GDIP-T40 |
No |
Macrocells Interconnected By Global Bus; 24 Macrocells; 2 External Clocks |
e0 |
76.9 MHz |
24 |
220 °C (428 °F) |
24 |
|||||||||||||
|
Altera |
Loadable PLD |
Commercial |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
9.5 ns |
Yes |
2.7 V |
CMOS |
2.5 |
Grid Array |
Mixed |
2.3 V |
1 mm |
70 °C (158 °F) |
254 I/O |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B672 |
2.1 mm |
27 mm |
No |
e1 |
27 mm |
254 |
|||||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
880 |
Yes |
3.6 V |
CMOS |
102 |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.63SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 102 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Can Also Be Used 10000 Logic Gates |
e0 |
153 MHz |
20 s |
102 |
220 °C (428 °F) |
20 mm |
102 |
||||||||||
|
|
Altera |
Loadable PLD |
Commercial |
Ball |
600 |
BGA |
Square |
Plastic/Epoxy |
0.3 ns |
Yes |
2.625 V |
CMOS |
2.5 |
Grid Array |
Mixed |
2.375 V |
1.27 mm |
70 °C (158 °F) |
470 I/O |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B600 |
1.93 mm |
45 mm |
No |
e1 |
45 mm |
470 |
||||||||||||||||||||
|
Altera |
OT PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
90 ns |
Yes |
5.25 V |
CMOS |
36 |
PAL-TYPE |
5 |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
236 |
1.27 mm |
70 °C (158 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
16.6116 mm |
No |
28 Macrocells |
e0 |
17.5 MHz |
24 |
220 °C (428 °F) |
16.6116 mm |
24 |
||||||||||||
|
Altera |
Loadable PLD |
Other |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
4160 |
Yes |
2.625 V |
CMOS |
143 |
2.5 |
1.8,1.8/3.3 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 151 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
e3 |
143 |
220 °C (428 °F) |
28 mm |
151 |
||||||||||||||
|
Altera |
EE PLD |
Commercial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Grid Array |
Macrocell |
3 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 164 I/O |
0 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
2.3 mm |
27 mm |
No |
256 Macrocells |
e1 |
166.7 MHz |
27 mm |
164 |
||||||||||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
7.5 ns |
Yes |
5.25 V |
96 |
CMOS |
5 |
3.3/5,5 V |
Flatpack |
QFP100,.7X.9 |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 76 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
R-PQFP-G100 |
3 |
3.65 mm |
14 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
166.7 MHz |
220 °C (428 °F) |
20 mm |
No |
76 |
||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
5 ns |
Yes |
2.625 V |
256 |
CMOS |
2.5 |
1.8/3.3,2.5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e0 |
188.7 MHz |
20 s |
220 °C (428 °F) |
28 mm |
Yes |
|||||||||||
|
Altera |
EE PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
5 ns |
Yes |
2.625 V |
256 |
CMOS |
2.5 |
1.8/3.3,2.5 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
1 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 164 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
3.5 mm |
17 mm |
No |
e0 |
188.7 MHz |
20 s |
220 °C (428 °F) |
17 mm |
Yes |
164 |
||||||||||
|
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
HFQFP |
Square |
Plastic/Epoxy |
12.5 ns |
Yes |
2.7 V |
CMOS |
2.5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Mixed |
2.3 V |
.5 mm |
85 °C (185 °F) |
189 I/O |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
32 mm |
189 |
|||||||||||||||||||||
|
Altera |
Loadable PLD |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
1.94 ns |
24320 |
Yes |
1.575 V |
CMOS |
480 |
1.5 |
1.5,1.5/3.3 V |
Grid Array |
BGA672,26X26,40 |
Field Programmable Gate Arrays |
Macrocell |
1.425 V |
1 mm |
492 I/O |
Tin Lead |
Bottom |
S-PBGA-B672 |
3 |
2.1 mm |
27 mm |
No |
e0 |
480 |
220 °C (428 °F) |
27 mm |
492 |
||||||||||||||||
|
Altera |
UV PLD |
Commercial |
J Bend |
84 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
45 ns |
Yes |
5.25 V |
192 |
CMOS |
5 |
5 V |
Chip Carrier, Window |
LDCC84,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 64 I/O |
7 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-CQCC-J84 |
5.08 mm |
29.21 mm |
No |
Labs interconnected by PIA; 12 Labs; 192 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
50 MHz |
220 °C (428 °F) |
29.21 mm |
No |
64 |
|||||||||||
|
Altera |
EE PLD |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
CMOS |
2.5 |
Flatpack, Low Profile, Fine Pitch |
Macrocell |
2.375 V |
.5 mm |
4 Dedicated Inputs, 84 I/O |
4 |
Matte Tin |
Quad |
S-PQFP-G100 |
1.27 mm |
14 mm |
No |
e3 |
14 mm |
84 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.