Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Altera |
Loadable PLD |
Industrial |
Pin/Peg |
599 |
IPGA |
Square |
Ceramic, Metal-Sealed Cofired |
16 ns |
9984 |
No |
2.7 V |
CMOS |
470 |
2.5 |
2.5,2.5/3.3 V |
Grid Array, Interstitial Pitch |
SPGA599,47X47 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
2.54 mm |
85 °C (185 °F) |
470 I/O |
-40 °C (-40 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P599 |
1 |
5.08 mm |
62.484 mm |
No |
e0 |
470 |
220 °C (428 °F) |
62.484 mm |
470 |
|||||||||||||
Altera |
|||||||||||||||||||||||||||||||||||||||||||||||||
Altera |
OT PLD |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
32 ns |
No |
5.5 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
160 |
2.54 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
4.318 mm |
7.62 mm |
No |
16 Macrocells; 2 External Clocks |
e0 |
41.7 MHz |
16 |
220 °C (428 °F) |
31.6865 mm |
16 |
||||||||||
Altera |
EE PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J44 |
4.572 mm |
16.5862 mm |
No |
100 MHz |
16.5862 mm |
36 |
|||||||||||||||||||||
Altera |
Loadable PLD |
Commercial |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
0.6 ns |
Yes |
2.625 V |
CMOS |
2.5 |
Grid Array |
Mixed |
2.375 V |
1 mm |
70 °C (158 °F) |
413 I/O |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B672 |
2.1 mm |
27 mm |
No |
e1 |
27 mm |
413 |
|||||||||||||||||||||
Altera |
EE PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
12 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
128 Macrocells |
e0 |
72.5 MHz |
220 °C (428 °F) |
29.3116 mm |
Yes |
68 |
|||||||||||
Altera |
EE PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
32 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
32 Macrocells |
e0 |
103.1 MHz |
220 °C (428 °F) |
16.5862 mm |
Yes |
36 |
|||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
2.5 |
Flatpack, Fine Pitch |
Mixed |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 189 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
32 mm |
189 |
||||||||||||||||||||||||
Altera |
Flash PLD |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
6.2 ns |
Yes |
980 |
CMOS |
1.5/3.3,2.5/3.3 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
1 mm |
Tin Lead |
Bottom |
S-PBGA-B256 |
1 |
No |
e0 |
Yes |
||||||||||||||||||||||||||
Altera |
OT PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
38 ns |
Yes |
5.25 V |
CMOS |
36 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
240 |
1.27 mm |
70 °C (158 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
24 Macrocells; 2 External Clocks |
e0 |
37 MHz |
24 |
220 °C (428 °F) |
16.5862 mm |
24 |
||||||||||
Altera |
Flash PLD |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
8.7 ns |
Yes |
2.625 V |
440 |
CMOS |
2.5 |
1.5/3.3,2.5/3.3 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
1 mm |
0 Dedicated Inputs, 160 I/O |
0 |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
2.2 mm |
17 mm |
No |
It can also operate at 3.3 V |
e0 |
20 s |
220 °C (428 °F) |
17 mm |
Yes |
160 |
|||||||||||||
|
Altera |
Flash PLD |
Ball |
256 |
BGA |
Rectangular |
Plastic/Epoxy |
8.7 ns |
Yes |
1.89 V |
440 |
CMOS |
1.8 |
1.5/3.3,1.8 V |
Grid Array |
BGA256,20X20,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
.5 mm |
0 Dedicated Inputs, 160 I/O |
0 |
Tin Silver Copper |
Bottom |
R-PBGA-B256 |
3 |
No |
It can also operate at 3.3 V |
e1 |
30 s |
260 °C (500 °F) |
Yes |
160 |
|||||||||||||||
Altera |
UV PLD |
Military |
Through-Hole |
28 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
25 ns |
No |
CMOS |
38535Q/M;38534H;883B |
24 |
PAL-TYPE |
5 |
5 V |
In-Line, Window |
DIP28,.3 |
Programmable Logic Devices |
Macrocell |
320 |
2.54 mm |
125 °C (257 °F) |
7 Dedicated Inputs, 16 I/O |
7 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T28 |
5.08 mm |
7.62 mm |
No |
e0 |
62.5 MHz |
16 |
220 °C (428 °F) |
36.83 mm |
16 |
||||||||||||
Altera |
OT PLD |
Military |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
45 ns |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.5 V |
1.27 mm |
125 °C (257 °F) |
19 Dedicated Inputs, 48 I/O |
19 |
-55 °C (-67 °F) |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock |
40 MHz |
29.3116 mm |
48 |
||||||||||||||||||||
Altera |
Loadable PLD |
Commercial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
27 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack, Fine Pitch |
Registered |
4.75 V |
.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 189 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
2880 Logic elements; Built-in JTAG boundry-scan test circuitry |
e3 |
53.76 MHz |
32 mm |
189 |
||||||||||||||||||
Altera |
Loadable PLD |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.8 |
Grid Array |
Macrocell |
4 Dedicated Inputs, 246 I/O |
4 |
Tin Lead |
Bottom |
S-PBGA-B484 |
3 |
No |
e0 |
220 °C (428 °F) |
246 |
|||||||||||||||||||||||||||||
Altera |
EE PLD |
Commercial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 100 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
4.07 mm |
28 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e3 |
125 MHz |
28 mm |
100 |
||||||||||||||||||
Altera |
UV PLD |
Industrial |
J Bend |
28 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
45 ns |
Yes |
5.5 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
Chip Carrier, Window |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
160 |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-CQCC-J28 |
4.57 mm |
11.43 mm |
No |
16 Macrocells |
e0 |
26.3 MHz |
16 |
220 °C (428 °F) |
11.43 mm |
16 |
||||||||||
|
Altera |
Flash PLD |
Automotive |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
7 ns |
Yes |
2.625 V |
440 |
CMOS |
2.5 |
1.5/3.3,2.5/3.3 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
1 mm |
125 °C (257 °F) |
0 Dedicated Inputs, 160 I/O |
0 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
2.2 mm |
17 mm |
No |
It can also operate at 3.3 V |
e1 |
17 mm |
Yes |
160 |
||||||||||||
|
Altera |
Flash PLD |
Other |
Ball |
256 |
BGA |
Rectangular |
Plastic/Epoxy |
5.4 ns |
Yes |
2.625 V |
440 |
CMOS |
2.5 |
1.5/3.3,2.5/3.3 V |
Grid Array |
BGA256,20X20,20 |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 160 I/O |
0 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
R-PBGA-B256 |
No |
It can also operate at 3.3 V |
e1 |
Yes |
160 |
|||||||||||||||
Altera |
Loadable PLD |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
16640 |
Yes |
2.625 V |
CMOS |
496 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA672,26X26,40 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
1 mm |
4 Dedicated Inputs, 502 I/O |
4 |
Tin Lead |
Bottom |
S-PBGA-B672 |
3 |
2.1 mm |
27 mm |
No |
e0 |
496 |
220 °C (428 °F) |
27 mm |
502 |
||||||||||||||||
|
Altera |
EE PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.5 V |
64 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin/Copper |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
64 Macrocells |
e2 |
166.7 MHz |
40 s |
245 °C (473 °F) |
29.3116 mm |
No |
68 |
|||||||||
Altera |
OT PLD |
Military |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
55 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack |
Macrocell |
4.5 V |
.65 mm |
125 °C (257 °F) |
19 Dedicated Inputs, 64 I/O |
19 |
-55 °C (-67 °F) |
Matte Tin |
Quad |
R-PQFP-G100 |
3.425 mm |
14 mm |
No |
128 Macrocells; Shared Input/Clock; Shared Product Terms |
e3 |
33.3 MHz |
20 mm |
64 |
||||||||||||||||||
|
Altera |
EE PLD |
Commercial |
Ball |
169 |
LFBGA |
Square |
Plastic/Epoxy |
5 ns |
Yes |
2.625 V |
256 |
CMOS |
2.5 |
1.8/3.3,2.5 V |
Grid Array, Low Profile, Fine Pitch |
BGA169,13X13,32 |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 141 I/O |
0 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B169 |
3 |
1.55 mm |
11 mm |
No |
e1 |
188.7 MHz |
11 mm |
Yes |
141 |
|||||||||||
|
Altera |
Loadable PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
0.5 ns |
Yes |
2.625 V |
CMOS |
2.5 |
Flatpack, Low Profile, Fine Pitch |
Mixed |
2.375 V |
.5 mm |
70 °C (158 °F) |
102 I/O |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
20 mm |
102 |
|||||||||||||||||||
Altera |
UV PLD |
Military |
Through-Hole |
40 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
43 ns |
No |
5.5 V |
CMOS |
36 |
PAL-TYPE |
5 |
5 V |
In-Line, Window |
DIP40,.6 |
Programmable Logic Devices |
Macrocell |
4.5 V |
240 |
2.54 mm |
125 °C (257 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T40 |
5.588 mm |
15.24 mm |
No |
Macrocells Interconnected By Global Bus; 24 Macrocells; 2 External Clocks |
e0 |
25 MHz |
24 |
220 °C (428 °F) |
52.07 mm |
24 |
||||||||||
Altera |
Loadable PLD |
Commercial |
Ball |
356 |
LBGA |
Square |
Plastic/Epoxy |
0.3 ns |
2880 |
Yes |
2.625 V |
CMOS |
220 |
2.5 |
2.5,2.5/3.3 V |
Grid Array, Low Profile |
BGA356,26X26,50 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
1.27 mm |
70 °C (158 °F) |
220 I/O |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B356 |
3 |
1.63 mm |
35 mm |
No |
e0 |
20 s |
220 |
220 °C (428 °F) |
35 mm |
220 |
||||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
9.5 ns |
1728 |
Yes |
2.7 V |
CMOS |
220 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA672,26X26,40 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
1 mm |
85 °C (185 °F) |
220 I/O |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B672 |
3 |
2.1 mm |
27 mm |
No |
e0 |
220 |
220 °C (428 °F) |
27 mm |
220 |
|||||||||||||
Altera |
OT PLD |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
12 ns |
No |
5.5 V |
CMOS |
5 |
In-Line |
Macrocell |
4.5 V |
2.54 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
-40 °C (-40 °F) |
Dual |
R-PDIP-T24 |
4.318 mm |
7.62 mm |
No |
Macrocells Interconnected By Global Bus; 16 Macrocells; 2 External Clocks |
83.3 MHz |
31.6865 mm |
16 |
||||||||||||||||||||
Altera |
OT PLD |
Industrial |
Through-Hole |
40 |
DIP |
Rectangular |
Plastic/Epoxy |
15 ns |
No |
5.25 V |
CMOS |
36 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP40,.6 |
Programmable Logic Devices |
Macrocell |
4.75 V |
240 |
2.54 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDIP-T40 |
4.83 mm |
15.24 mm |
No |
e0 |
76.9 MHz |
24 |
220 °C (428 °F) |
52.425 mm |
24 |
|||||||||||
Altera |
Loadable PLD |
Commercial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
0.6 ns |
2880 |
Yes |
2.7 V |
CMOS |
189 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
.5 mm |
70 °C (158 °F) |
189 I/O |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
2880 Logic Elements |
e0 |
140 MHz |
20 s |
189 |
220 °C (428 °F) |
32 mm |
189 |
||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
HFQFP |
Square |
Plastic/Epoxy |
9 ns |
9984 |
Yes |
2.7 V |
CMOS |
182 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
HQFP240,1.37SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
.5 mm |
85 °C (185 °F) |
182 I/O |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e0 |
182 |
220 °C (428 °F) |
32 mm |
182 |
||||||||||||||
Altera |
Loadable PLD |
Industrial |
Pin/Peg |
504 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
27 ns |
No |
5.5 V |
CMOS |
5 |
Grid Array |
Registered |
4.5 V |
85 °C (185 °F) |
4 Dedicated Inputs, 358 I/O |
4 |
-40 °C (-40 °F) |
Perpendicular |
S-CPGA-P504 |
No |
3744 Logic elements Configurable I/O operation with 3.3 V or 5 V |
53.76 MHz |
358 |
||||||||||||||||||||||||
|
Altera |
Flash PLD |
Ball |
100 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
1.8 |
Grid Array |
Macrocell |
1.71 V |
0 Dedicated Inputs, 0 I/O |
0 |
Tin Silver Copper |
Bottom |
S-PBGA-B100 |
No |
e1 |
0 |
||||||||||||||||||||||||||||
Altera |
EE PLD |
Industrial |
Ball |
100 |
BGA |
Square |
Plastic/Epoxy |
6 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Grid Array |
Macrocell |
3 V |
85 °C (185 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B100 |
No |
128 Macrocells |
e1 |
166.7 MHz |
84 |
||||||||||||||||||||||
Altera |
Flash PLD |
Ball |
100 |
BGA |
Square |
Plastic/Epoxy |
6.1 ns |
Yes |
192 |
CMOS |
1.8,1.8/3 V |
Grid Array |
BGA100,10X10,40 |
Programmable Logic Devices |
Yes |
1 mm |
Bottom |
S-PBGA-B100 |
No |
Yes |
|||||||||||||||||||||||||||||
Altera |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.25 V |
128 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
2 |
5.08 mm |
29.3116 mm |
No |
128 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; Shared Input/Clock |
e0 |
166.7 MHz |
20 s |
220 °C (428 °F) |
29.3116 mm |
No |
68 |
|||||||||
Altera |
Loadable PLD |
Ball |
356 |
LBGA |
Square |
Plastic/Epoxy |
6400 |
Yes |
2.625 V |
CMOS |
263 |
2.5 |
1.8,1.8/3.3 V |
Grid Array, Low Profile |
BGA356,26X26,50 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
1.27 mm |
4 Dedicated Inputs, 271 I/O |
4 |
Tin Silver Copper |
Bottom |
S-PBGA-B356 |
1.63 mm |
35 mm |
No |
e1 |
263 |
220 °C (428 °F) |
35 mm |
271 |
|||||||||||||||||
Altera |
EE PLD |
Commercial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
64 |
CMOS |
68 |
PLA-TYPE |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
2048 |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
e0 |
135.1 MHz |
20 s |
68 |
235 °C (455 °F) |
14 mm |
Yes |
68 |
||||||
Altera |
Loadable PLD |
Commercial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
0.5 ns |
4992 |
Yes |
2.625 V |
CMOS |
189 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
.5 mm |
70 °C (158 °F) |
189 I/O |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
4992 Logic Elements |
e0 |
140 MHz |
189 |
220 °C (428 °F) |
32 mm |
189 |
|||||||||||
Altera |
Flash PLD |
Ball |
100 |
FBGA |
Square |
Plastic/Epoxy |
8.7 ns |
Yes |
440 |
CMOS |
1.8,1.8/3 V |
Grid Array, Fine Pitch |
BGA100,11X11,20 |
Programmable Logic Devices |
Yes |
.5 mm |
Bottom |
S-PBGA-B100 |
No |
Yes |
|||||||||||||||||||||||||||||
Altera |
UV PLD |
Military |
Pin/Peg |
84 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
59 ns |
No |
5.5 V |
192 |
CMOS |
MIL-STD-883 Class B |
5 |
5 V |
Grid Array |
PGA84M,11X11 |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
2.54 mm |
125 °C (257 °F) |
7 Dedicated Inputs, 64 I/O |
7 |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P84 |
4.96 mm |
28.45 mm |
No |
27.7 MHz |
220 °C (428 °F) |
28.45 mm |
No |
64 |
|||||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
600 |
BGA |
Square |
Plastic/Epoxy |
9 ns |
9984 |
Yes |
2.7 V |
CMOS |
470 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA600,35X35,50 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
1.27 mm |
85 °C (185 °F) |
470 I/O |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B600 |
1.93 mm |
45 mm |
No |
e0 |
470 |
220 °C (428 °F) |
45 mm |
470 |
||||||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
208 |
Yes |
5.5 V |
CMOS |
78 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
Registered |
4.5 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 78 I/O |
4 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
208 Logic Elements |
e0 |
385 MHz |
20 s |
74 |
235 °C (455 °F) |
14 mm |
78 |
||||||||||
Altera |
EE PLD |
Commercial |
Ball |
49 |
LFBGA |
Square |
Plastic/Epoxy |
3.5 ns |
Yes |
2.625 V |
CMOS |
2.5 |
Grid Array, Low Profile, Fine Pitch |
Macrocell |
2.375 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B49 |
1.55 mm |
7 mm |
No |
e1 |
303 MHz |
7 mm |
36 |
|||||||||||||||||||
Altera |
Loadable PLD |
Other |
Ball |
144 |
LBGA |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
1.8 |
Grid Array, Low Profile |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 108 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
1.7 mm |
13 mm |
No |
e1 |
160 MHz |
13 mm |
108 |
|||||||||||||||||||||
Altera |
OT PLD |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
17 ns |
No |
5.25 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
160 |
2.54 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
4.318 mm |
7.62 mm |
No |
16 Macrocells; 2 External Clocks |
e0 |
83.3 MHz |
16 |
220 °C (428 °F) |
31.6865 mm |
16 |
||||||||||
Altera |
OT PLD |
Commercial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
22 ns |
Yes |
5.25 V |
48 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC68,1.0SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
12 Dedicated Inputs, 48 I/O |
12 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J68 |
4.572 mm |
24.2316 mm |
No |
48 Macrocells; 4 External Clocks; Shared Input/Clock |
e0 |
50 MHz |
220 °C (428 °F) |
24.2316 mm |
No |
48 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.