Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Altera |
EE PLD |
Commercial |
Pin/Peg |
160 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
15 ns |
No |
5.25 V |
192 |
CMOS |
5 |
5 V |
Grid Array |
PGA160M,15X15 |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
2.54 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 120 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P160 |
1 |
5.34 mm |
39.624 mm |
No |
192 Macrocells; Shared Input/Clock |
e0 |
76.9 MHz |
220 °C (428 °F) |
39.624 mm |
No |
120 |
||||||||||
Altera |
EE PLD |
Commercial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 128 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
4.07 mm |
28 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e3 |
125 MHz |
28 mm |
128 |
||||||||||||||||||
Altera |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
23 ns |
Yes |
5.25 V |
320 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 60 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
e0 |
220 °C (428 °F) |
29.3116 mm |
Yes |
60 |
|||||||||||||
Altera |
Loadable PLD |
Commercial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
2.5 |
Grid Array |
Registered |
2.375 V |
1 mm |
70 °C (158 °F) |
6 Dedicated Inputs, 171 I/O |
6 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
2.1 mm |
17 mm |
No |
e1 |
17 mm |
171 |
||||||||||||||||||||||
Altera |
Loadable PLD |
Commercial |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
CMOS |
5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Registered |
4.75 V |
.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e3 |
28 mm |
|||||||||||||||||||||
Altera |
OT PLD |
Commercial |
Through-Hole |
40 |
DIP |
Rectangular |
Plastic/Epoxy |
12 ns |
No |
5.25 V |
CMOS |
36 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP40,.6 |
Programmable Logic Devices |
Macrocell |
4.75 V |
240 |
2.54 mm |
70 °C (158 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T40 |
4.826 mm |
15.24 mm |
No |
24 Macrocells; 2 External Clocks |
e0 |
125 MHz |
24 |
220 °C (428 °F) |
52.4256 mm |
24 |
||||||||||
Altera |
Loadable PLD |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.8 |
Grid Array |
Macrocell |
4 Dedicated Inputs, 246 I/O |
4 |
Tin Lead |
Bottom |
S-PBGA-B484 |
3 |
No |
e0 |
220 °C (428 °F) |
246 |
|||||||||||||||||||||||||||||
Altera |
Flash PLD |
Gull Wing |
100 |
QFP |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
1.8 |
Flatpack |
Macrocell |
1.71 V |
0 Dedicated Inputs, 0 I/O |
0 |
Tin Lead |
Quad |
S-PQFP-G100 |
No |
e0 |
0 |
|||||||||||||||||||||||||||||
Altera |
EE PLD |
Commercial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
256 |
CMOS |
5 |
3.3/5,5 V |
Flatpack |
QFP160,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 128 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G160 |
3 |
4.07 mm |
28 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
76.9 MHz |
220 °C (428 °F) |
28 mm |
Yes |
128 |
||||||||||
|
Altera |
Loadable PLD |
Commercial |
Ball |
356 |
LBGA |
Square |
Plastic/Epoxy |
0.5 ns |
Yes |
2.625 V |
CMOS |
2.5 |
Grid Array, Low Profile |
Mixed |
2.375 V |
1.27 mm |
70 °C (158 °F) |
274 I/O |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B356 |
1.63 mm |
35 mm |
No |
e1 |
35 mm |
274 |
||||||||||||||||||||
Altera |
EE PLD |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
R-PQFP-G100 |
3.65 mm |
14 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e3 |
76.9 MHz |
20 mm |
80 |
||||||||||||||||||
Altera |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
CMOS |
36 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Macrocell |
240 |
1.27 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
No |
e0 |
24 |
220 °C (428 °F) |
|||||||||||||||||||||
Altera |
Flash PLD |
Ball |
100 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
1.8 |
Grid Array |
Macrocell |
1.71 V |
0 Dedicated Inputs, 80 I/O |
0 |
Tin Lead |
Bottom |
S-PBGA-B100 |
No |
e0 |
80 |
|||||||||||||||||||||||||||||
|
Altera |
Flash PLD |
Automotive |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
5.4 ns |
Yes |
1.89 V |
440 |
CMOS |
1.8 |
1.5/3.3,1.8 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
1 mm |
125 °C (257 °F) |
0 Dedicated Inputs, 160 I/O |
0 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
2.2 mm |
17 mm |
No |
It can also operate at 3.3 V |
e1 |
17 mm |
Yes |
160 |
||||||||||||
Altera |
Loadable PLD |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
8320 |
Yes |
2.625 V |
CMOS |
128 |
2.5 |
1.8,1.8/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
4 Dedicated Inputs, 136 I/O |
4 |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
128 |
220 °C (428 °F) |
28 mm |
136 |
||||||||||||||||
Altera |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
96 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 64 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
e0 |
220 °C (428 °F) |
29.3116 mm |
No |
64 |
|||||||||||||
|
Altera |
EE PLD |
Commercial |
Ball |
256 |
LBGA |
Square |
Plastic/Epoxy |
5.5 ns |
Yes |
2.625 V |
512 |
CMOS |
2.5 |
1.8/3.3,2.5 V |
Grid Array, Low Profile |
BGA256,20X20,50 |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 212 I/O |
0 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
1.7 mm |
27 mm |
No |
e1 |
163.9 MHz |
27 mm |
Yes |
212 |
||||||||||||
Altera |
UV PLD |
Commercial |
Through-Hole |
28 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
15 ns |
No |
5.25 V |
CMOS |
24 |
PAL-TYPE |
5 |
5 V |
In-Line, Window |
DIP28,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
320 |
2.54 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 16 I/O |
7 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-GDIP-T28 |
5.08 mm |
7.62 mm |
No |
32 Macrocells; Shared Input/Clock; Shared Product Terms |
e0 |
76.9 MHz |
16 |
220 °C (428 °F) |
36.83 mm |
16 |
||||||||||
Altera |
EE PLD |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
15 ns |
Yes |
128 |
CMOS |
3.3 |
3.3 V |
Flatpack |
QFP100,.7X.9 |
Programmable Logic Devices |
Yes |
.635 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
R-PQFP-G100 |
3 |
No |
e0 |
220 °C (428 °F) |
Yes |
|||||||||||||||||||||
Altera |
Loadable PLD |
Commercial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
9 ns |
9984 |
Yes |
2.7 V |
CMOS |
182 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
.5 mm |
70 °C (158 °F) |
182 I/O |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e0 |
182 |
220 °C (428 °F) |
32 mm |
182 |
|||||||||||||
Altera |
EE PLD |
Commercial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
12 ns |
Yes |
3.6 V |
512 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 212 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
2.1 mm |
17 mm |
No |
512 Macrocells; 32 Labs; Configurable I/O operation with 2.5 V or 3.3 V |
e0 |
71.9 MHz |
20 s |
220 °C (428 °F) |
17 mm |
Yes |
212 |
|||||||||
Altera |
UV PLD |
Industrial |
Pin/Peg |
84 |
WPGA |
Square |
Ceramic, Metal-Sealed Cofired |
55 ns |
No |
5.5 V |
192 |
CMOS |
5 |
5 V |
Grid Array, Window |
PGA84M,11X11 |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
2.54 mm |
85 °C (185 °F) |
7 Dedicated Inputs, 64 I/O |
7 |
-40 °C (-40 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P84 |
1 |
4.96 mm |
28.448 mm |
No |
192 Macrocells; Shared Input/Clock; Shared Product Terms |
e0 |
33.3 MHz |
220 °C (428 °F) |
28.448 mm |
No |
64 |
||||||||||
Altera |
Loadable PLD |
Other |
Ball |
652 |
BGA |
Square |
Plastic/Epoxy |
1.84 ns |
51840 |
Yes |
1.89 V |
CMOS |
480 |
1.8 |
1.8,1.8/3.3 V |
Grid Array |
BGA652,35X35,50 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 488 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B652 |
5A |
3.5 mm |
45 mm |
No |
e0 |
160 MHz |
20 s |
480 |
220 °C (428 °F) |
45 mm |
488 |
||||||||||
Altera |
OT PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier |
Registered |
4.5 V |
1.27 mm |
85 °C (185 °F) |
8 Dedicated Inputs, 0 I/O |
8 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J28 |
4.572 mm |
11.5062 mm |
No |
PLS |
20 MHz |
11.5062 mm |
0 |
|||||||||||||||||||||
Altera |
Flash PLD |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
7 ns |
Yes |
440 |
CMOS |
1.5/3.3,1.8 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
1 mm |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
No |
e0 |
220 °C (428 °F) |
Yes |
|||||||||||||||||||||||||
Altera |
Loadable PLD |
Commercial |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
0.6 ns |
9984 |
Yes |
2.625 V |
CMOS |
470 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA672,26X26,40 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
1 mm |
70 °C (158 °F) |
470 I/O |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B672 |
3 |
2.1 mm |
27 mm |
No |
e0 |
470 |
220 °C (428 °F) |
27 mm |
470 |
|||||||||||||
Altera |
Loadable PLD |
Commercial |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
0.3 ns |
9984 |
Yes |
2.625 V |
CMOS |
369 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
1 mm |
70 °C (158 °F) |
369 I/O |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B484 |
3 |
2.1 mm |
23 mm |
No |
e0 |
20 s |
369 |
220 °C (428 °F) |
23 mm |
369 |
||||||||||||
Altera |
EE PLD |
Commercial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
6 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
e0 |
166.7 MHz |
220 °C (428 °F) |
14 mm |
Yes |
84 |
|||||||||||
Altera |
Loadable PLD |
Other |
Ball |
356 |
LBGA |
Square |
Plastic/Epoxy |
3.6 ns |
Yes |
2.625 V |
CMOS |
2.5 |
Grid Array, Low Profile |
Macrocell |
2.375 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 277 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B356 |
1.63 mm |
35 mm |
No |
e1 |
220 °C (428 °F) |
35 mm |
277 |
|||||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
0.4 ns |
1728 |
Yes |
2.625 V |
CMOS |
171 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
1 mm |
85 °C (185 °F) |
171 I/O |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
3 |
2.1 mm |
17 mm |
No |
e1 |
37.5 MHz |
30 s |
171 |
260 °C (500 °F) |
17 mm |
171 |
||||||||||
Altera |
OT PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
55 ns |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
19 Dedicated Inputs, 48 I/O |
19 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
128 Macrocells; Shared Input/Clock; Shared Product Terms |
33.3 MHz |
29.3116 mm |
48 |
||||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
1.55 ns |
Yes |
1.575 V |
CMOS |
1.5 |
Grid Array |
Macrocell |
1.425 V |
1 mm |
85 °C (185 °F) |
492 I/O |
0 °C (32 °F) |
Tin/Silver/Copper |
Bottom |
S-PBGA-B672 |
2.1 mm |
27 mm |
No |
e1 |
40 s |
245 °C (473 °F) |
27 mm |
492 |
||||||||||||||||||
Altera |
UV PLD |
Military |
Pin/Peg |
68 |
WPGA |
Square |
Ceramic, Metal-Sealed Cofired |
55 ns |
No |
5.5 V |
CMOS |
5 |
Grid Array, Window |
Macrocell |
4.5 V |
2.54 mm |
125 °C (257 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P68 |
4.953 mm |
27.94 mm |
No |
128 Macrocells; Shared Input/Clock; Shared Product Terms |
33.3 MHz |
27.94 mm |
52 |
||||||||||||||||||||
Altera |
Loadable PLD |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
2560 |
Yes |
2.625 V |
CMOS |
84 |
2.5 |
1.8,1.8/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
4 Dedicated Inputs, 92 I/O |
4 |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
84 |
220 °C (428 °F) |
20 mm |
92 |
||||||||||||||||
Altera |
Loadable PLD |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
2560 |
Yes |
2.625 V |
CMOS |
140 |
2.5 |
1.8,1.8/3.3 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
4 Dedicated Inputs, 148 I/O |
4 |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
e3 |
140 |
220 °C (428 °F) |
28 mm |
148 |
|||||||||||||||||
Altera |
EE PLD |
Commercial |
Ball |
49 |
LFBGA |
Square |
Plastic/Epoxy |
3.5 ns |
Yes |
2.625 V |
32 |
CMOS |
2.5 |
1.8/3.3,2.5 V |
Grid Array, Low Profile, Fine Pitch |
BGA49,7X7,32 |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B49 |
1.55 mm |
7 mm |
No |
e0 |
303 MHz |
220 °C (428 °F) |
7 mm |
Yes |
36 |
||||||||||||
|
Altera |
Loadable PLD |
Other |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
1.93 ns |
Yes |
1.89 V |
CMOS |
1.8 |
Flatpack, Fine Pitch |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 175 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e3 |
160 MHz |
32 mm |
175 |
|||||||||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
20 ns |
Yes |
5.5 V |
160 |
CMOS |
5 |
3.3/5,5 V |
Flatpack |
QFP100,.7X.9 |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
.65 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
R-PQFP-G100 |
3 |
3.65 mm |
14 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
62.5 MHz |
220 °C (428 °F) |
20 mm |
No |
80 |
||||||||||
|
Altera |
Loadable PLD |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
CMOS |
5 |
Flatpack, Fine Pitch |
Registered |
4.75 V |
.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 152 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
672 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e3 |
28 mm |
152 |
||||||||||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
304 |
HFQFP |
Square |
Plastic/Epoxy |
16.6 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 212 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G304 |
4.5 mm |
40 mm |
No |
560 Macrocells |
e3 |
40 mm |
212 |
|||||||||||||||||||
Altera |
Loadable PLD |
Commercial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
0.6 ns |
Yes |
2.625 V |
CMOS |
2.5 |
Grid Array |
Mixed |
2.375 V |
1 mm |
70 °C (158 °F) |
176 I/O |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
2.1 mm |
17 mm |
No |
e1 |
17 mm |
176 |
|||||||||||||||||||||
Altera |
Loadable PLD |
Commercial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
0.4 ns |
2880 |
Yes |
2.625 V |
CMOS |
191 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
1 mm |
70 °C (158 °F) |
191 I/O |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
2.1 mm |
17 mm |
No |
e0 |
20 s |
191 |
220 °C (428 °F) |
17 mm |
191 |
||||||||||||
Altera |
Military |
J Bend |
28 |
QCCJ |
Square |
Ceramic |
22 ns |
Yes |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
160 |
1.27 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-XQCC-J28 |
No |
e0 |
55.5 MHz |
16 |
220 °C (428 °F) |
||||||||||||||||||||
Altera |
Loadable PLD |
Other |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
1.8 |
Grid Array |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
376 I/O |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B484 |
2.1 mm |
23 mm |
No |
e1 |
23 mm |
376 |
|||||||||||||||||||||||
Altera |
EE PLD |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
160 |
CMOS |
5 |
3.3/5,5 V |
Flatpack |
QFP100,.7X.9 |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
R-PQFP-G100 |
3 |
3.65 mm |
14 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
125 MHz |
220 °C (428 °F) |
20 mm |
No |
84 |
||||||||||
Altera |
UV PLD |
Military |
J Bend |
84 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
45 ns |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier, Window |
Macrocell |
4.5 V |
1.27 mm |
125 °C (257 °F) |
19 Dedicated Inputs, 48 I/O |
19 |
-55 °C (-67 °F) |
Quad |
S-CQCC-J84 |
5.08 mm |
29.21 mm |
No |
Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock |
40 MHz |
29.21 mm |
48 |
||||||||||||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
23.4 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 146 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
676 Flip Flops; Configurable I/O operation with 3.3 V or 5 V |
e3 |
100 MHz |
28 mm |
146 |
||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
780 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
CMOS |
1.8 |
Grid Array |
Mixed |
1.71 V |
1 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 486 I/O |
0 |
0 °C (32 °F) |
Tin/Silver/Copper |
Bottom |
S-PBGA-B780 |
3.5 mm |
29 mm |
No |
e1 |
40 s |
245 °C (473 °F) |
29 mm |
486 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.