Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Altera |
EE PLD |
Commercial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 52 I/O |
0 |
0 °C (32 °F) |
Quad |
S-PQCC-J68 |
5.08 mm |
24.2316 mm |
No |
125 MHz |
24.2316 mm |
52 |
|||||||||||||||||||||
Altera |
Loadable PLD |
Commercial |
Ball |
225 |
BGA |
Square |
Plastic/Epoxy |
672 |
Yes |
5.25 V |
CMOS |
152 |
5 |
3.3/5,5 V |
Grid Array |
BGA225,15X15 |
Field Programmable Gate Arrays |
Registered |
4.75 V |
1.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 148 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B225 |
2.3 mm |
27 mm |
No |
820 Flip Flops; 672 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e0 |
148 |
220 °C (428 °F) |
27 mm |
148 |
|||||||||||||
Altera |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic |
17 ns |
No |
CMOS |
16 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
160 |
2.54 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-XDIP-T20 |
No |
e0 |
8 |
220 °C (428 °F) |
||||||||||||||||||||||
Altera |
Flash PLD |
Commercial Extended |
Ball |
324 |
BGA |
Square |
Plastic/Epoxy |
11.2 ns |
Yes |
1.89 V |
1700 |
CMOS |
1.8 |
1.5/3.3,1.8 V |
Grid Array |
BGA324,18X18,40 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 272 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B324 |
3 |
2.2 mm |
19 mm |
No |
e0 |
20 s |
220 °C (428 °F) |
19 mm |
Yes |
272 |
|||||||||||
Altera |
Loadable PLD |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
1.8 |
Flatpack, Fine Pitch |
Macrocell |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 118 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
220 °C (428 °F) |
28 mm |
118 |
||||||||||||||||||||||
Altera |
Loadable PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
1.8 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Chip Carrier |
Registered |
3 V |
1.27 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 68 I/O |
4 |
0 °C (32 °F) |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
Can also operate at 5 V supply |
29.3116 mm |
68 |
|||||||||||||||||||||
|
Altera |
Loadable PLD |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
CMOS |
5 |
Flatpack, Fine Pitch |
Registered |
4.75 V |
.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 152 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
672 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e3 |
28 mm |
152 |
|||||||||||||||||||
|
Altera |
EE PLD |
Commercial |
Ball |
100 |
LBGA |
Square |
Plastic/Epoxy |
4 ns |
Yes |
2.625 V |
128 |
CMOS |
2.5 |
1.8/3.3,2.5 V |
Grid Array, Low Profile |
BGA100,10X10,40 |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
1 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B100 |
3 |
1.7 mm |
11 mm |
No |
e1 |
243.9 MHz |
11 mm |
Yes |
84 |
|||||||||||
|
Altera |
Flash PLD |
Other |
Ball |
68 |
TFBGA |
Square |
Plastic/Epoxy |
7.9 ns |
Yes |
1.89 V |
192 |
CMOS |
1.8 |
1.8,1.2/3.3 V |
Grid Array, Thin Profile, Fine Pitch |
BGA68,9X9,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
52 I/O |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B68 |
1.2 mm |
5 mm |
No |
e1 |
184.1 MHz |
5 mm |
Yes |
52 |
|||||||||||||
Altera |
Loadable PLD |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
1200 |
Yes |
2.625 V |
CMOS |
117 |
2.5 |
1.8,1.8/3.3 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
4 Dedicated Inputs, 125 I/O |
4 |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
e3 |
117 |
220 °C (428 °F) |
28 mm |
125 |
|||||||||||||||||
Altera |
Loadable PLD |
Other |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
2.32 ns |
38400 |
Yes |
1.89 V |
CMOS |
500 |
1.8 |
1.8,1.8/3.3 V |
Grid Array |
BGA672,26X26,40 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 508 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B672 |
3 |
3.5 mm |
27 mm |
No |
e0 |
160 MHz |
20 s |
500 |
220 °C (428 °F) |
27 mm |
508 |
||||||||||
Altera |
Loadable PLD |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
2.41 ns |
2560 |
Yes |
1.89 V |
CMOS |
140 |
1.8 |
1.8,1.8/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 148 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e0 |
160 MHz |
20 s |
140 |
220 °C (428 °F) |
28 mm |
148 |
||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
5.5 ns |
Yes |
2.625 V |
512 |
CMOS |
2.5 |
1.8/3.3,2.5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 120 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
163.9 MHz |
20 mm |
Yes |
120 |
|||||||||||
|
Altera |
EE PLD |
Commercial |
Ball |
169 |
LFBGA |
Square |
Plastic/Epoxy |
5.5 ns |
Yes |
2.625 V |
512 |
CMOS |
2.5 |
1.8/3.3,2.5 V |
Grid Array, Low Profile, Fine Pitch |
BGA169,13X13,32 |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 141 I/O |
0 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B169 |
1.55 mm |
11 mm |
No |
e1 |
163.9 MHz |
11 mm |
Yes |
141 |
||||||||||||
Altera |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
32 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
4.572 mm |
16.5862 mm |
No |
e0 |
100 MHz |
220 °C (428 °F) |
16.5862 mm |
No |
36 |
||||||||||||
Altera |
Flash PLD |
Ball |
100 |
FBGA |
Square |
Plastic/Epoxy |
5.4 ns |
Yes |
440 |
CMOS |
1.8,1.8/3 V |
Grid Array, Fine Pitch |
BGA100,11X11,20 |
Programmable Logic Devices |
Yes |
.5 mm |
Bottom |
S-PBGA-B100 |
No |
Yes |
|||||||||||||||||||||||||||||
Altera |
Loadable PLD |
Ball |
1020 |
HBGA |
Square |
Plastic/Epoxy |
1.6 ns |
24320 |
Yes |
1.89 V |
CMOS |
580 |
1.8 |
1.8,1.8/3.3 V |
Grid Array, Heat Sink/Slug |
BGA1020,32X32,40 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
1 mm |
4 Dedicated Inputs, 588 I/O |
4 |
Tin Lead |
Bottom |
S-PBGA-B1020 |
3 |
3.5 mm |
33 mm |
No |
e0 |
580 |
220 °C (428 °F) |
33 mm |
588 |
|||||||||||||||
Altera |
EE PLD |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
3.6 V |
512 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 176 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
512 Macrocells; 32 Labs; Configurable I/O operation with 2.5 V or 3.3 V |
e0 |
71.9 MHz |
20 s |
220 °C (428 °F) |
28 mm |
Yes |
176 |
|||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
356 |
LBGA |
Square |
Plastic/Epoxy |
9 ns |
Yes |
2.7 V |
CMOS |
2.5 |
Grid Array, Low Profile |
Mixed |
2.3 V |
1.27 mm |
85 °C (185 °F) |
274 I/O |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B356 |
1.63 mm |
35 mm |
No |
e1 |
35 mm |
274 |
|||||||||||||||||||||
Altera |
Loadable PLD |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
6400 |
Yes |
2.625 V |
CMOS |
167 |
2.5 |
1.8,1.8/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
4 Dedicated Inputs, 175 I/O |
4 |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
167 |
220 °C (428 °F) |
32 mm |
175 |
|||||||||||||||||
|
Altera |
Loadable PLD |
Commercial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
0.5 ns |
Yes |
2.625 V |
CMOS |
2.5 |
Grid Array |
Mixed |
2.375 V |
1 mm |
70 °C (158 °F) |
191 I/O |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
2.1 mm |
17 mm |
No |
e1 |
17 mm |
191 |
||||||||||||||||||||
Altera |
OT PLD |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
25 ns |
No |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
72 |
2.54 mm |
70 °C (158 °F) |
9 Dedicated Inputs, 8 I/O |
9 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T20 |
7.62 mm |
No |
8 Macrocells; Shared Input/Clock |
e0 |
58.8 MHz |
8 |
220 °C (428 °F) |
26.162 mm |
8 |
|||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Registered |
4.5 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e3 |
28 mm |
|||||||||||||||||||||
Altera |
EE PLD |
Commercial |
Pin/Peg |
160 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
20 ns |
No |
5.25 V |
192 |
CMOS |
5 |
3.3/5,5 V |
Grid Array |
PGA160M,15X15 |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
2.54 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 124 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P160 |
1 |
5.34 mm |
39.624 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
83.3 MHz |
220 °C (428 °F) |
39.624 mm |
No |
124 |
||||||||||
Altera |
OT PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
30 ns |
Yes |
5.5 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
200 |
1.27 mm |
85 °C (185 °F) |
8 Dedicated Inputs, 12 I/O |
8 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
4.572 mm |
11.5062 mm |
No |
12 Macrocells |
e0 |
50 MHz |
12 |
220 °C (428 °F) |
11.5062 mm |
12 |
||||||||||
Altera |
Loadable PLD |
Other |
Ball |
1508 |
BGA |
Square |
Plastic/Epoxy |
2.87 ns |
67200 |
Yes |
1.575 V |
CMOS |
1048 |
1.5 |
1.5,1.5/3.3 V |
Grid Array |
BGA1508,39X39,40 |
Field Programmable Gate Arrays |
Macrocell |
1.425 V |
1 mm |
85 °C (185 °F) |
1060 I/O |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B1508 |
3 |
3.5 mm |
40 mm |
No |
e0 |
1048 |
220 °C (428 °F) |
40 mm |
1060 |
|||||||||||||
Altera |
Loadable PLD |
Other |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
1.8 |
Grid Array |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 246 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B672 |
3 |
2.1 mm |
27 mm |
No |
e0 |
220 °C (428 °F) |
27 mm |
246 |
||||||||||||||||||||
Altera |
EE PLD |
Industrial |
Ball |
100 |
TBGA |
Square |
Plastic/Epoxy |
5 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Grid Array, Thin Profile |
BGA100,10X10,40 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B100 |
3 |
1.1 mm |
11 mm |
No |
e0 |
220 °C (428 °F) |
11 mm |
Yes |
84 |
||||||||||||
Altera |
EE PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Flatpack, Low Profile, Fine Pitch |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 120 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
e3 |
100 MHz |
20 mm |
120 |
|||||||||||||||||||
Altera |
EE PLD |
Commercial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.25 V |
128 |
CMOS |
5 |
5 V |
Flatpack |
QFP160,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 96 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G160 |
3 |
4.07 mm |
28 mm |
No |
128 Macrocells; Shared Input/Clock |
e0 |
62.5 MHz |
220 °C (428 °F) |
28 mm |
No |
96 |
||||||||||
Altera |
Loadable PLD |
Ball |
356 |
LBGA |
Square |
Plastic/Epoxy |
1.6 ns |
Yes |
1.89 V |
1.8 |
Grid Array, Low Profile |
Macrocell |
1.71 V |
1.27 mm |
271 I/O |
Tin Silver Copper |
Bottom |
S-PBGA-B356 |
1.63 mm |
35 mm |
No |
e1 |
35 mm |
271 |
|||||||||||||||||||||||||
Altera |
Loadable PLD |
Commercial |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
0.8 ns |
4992 |
Yes |
3.6 V |
CMOS |
369 |
3.3 |
2.5/3.3,3.3 V |
Grid Array |
BGA484,22X22,50 |
Field Programmable Gate Arrays |
Mixed |
3 V |
1.27 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 369 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B484 |
No |
e0 |
369 |
220 °C (428 °F) |
369 |
||||||||||||||||
|
Altera |
Loadable PLD |
Commercial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
0.9 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Grid Array |
Registered |
3 V |
1 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 191 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
2.1 mm |
17 mm |
No |
1728 Logic Elements; 216 Labs |
e1 |
80 MHz |
17 mm |
191 |
|||||||||||||||||
|
Altera |
EE PLD |
Industrial |
Gull Wing |
208 |
QFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
256 |
CMOS |
3.3/5,5 V |
Flatpack |
QFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
.5 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
No |
e3 |
Yes |
|||||||||||||||||||||||
Altera |
Loadable PLD |
Military |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
23.8 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Fine Pitch |
Registered |
4.5 V |
.5 mm |
125 °C (257 °F) |
4 Dedicated Inputs, 189 I/O |
4 |
-55 °C (-67 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
2880 Logic elements; Built-in JTAG boundry-scan test circuitry |
e3 |
60.6 MHz |
32 mm |
189 |
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Altera |
EE PLD |
Industrial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
256 |
CMOS |
5 |
3.3/5,5 V |
Flatpack |
QFP160,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.65 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 128 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G160 |
3 |
4.07 mm |
28 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
76.9 MHz |
220 °C (428 °F) |
28 mm |
Yes |
128 |
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Altera |
OT PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
12 ns |
Yes |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
72 |
1.27 mm |
70 °C (158 °F) |
13 Dedicated Inputs, 8 I/O |
13 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
4.572 mm |
11.5062 mm |
No |
8 Macrocells |
e0 |
90.9 MHz |
8 |
220 °C (428 °F) |
11.5062 mm |
8 |
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Altera |
Loadable PLD |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
3 ns |
4160 |
Yes |
2.625 V |
CMOS |
153 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
4 Dedicated Inputs, 159 I/O |
4 |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
153 |
220 °C (428 °F) |
28 mm |
159 |
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Altera |
Loadable PLD |
Commercial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
0.4 ns |
576 |
Yes |
2.625 V |
CMOS |
136 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA256,16X16,50 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
1 mm |
70 °C (158 °F) |
136 I/O |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
2.1 mm |
17 mm |
No |
e0 |
90 MHz |
20 s |
136 |
220 °C (428 °F) |
17 mm |
136 |
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Altera |
UV PLD |
Military |
Pin/Peg |
68 |
PGA |
Square |
Ceramic |
90 ns |
No |
48 |
CMOS |
5 |
5 V |
Grid Array |
PGA68,11X11 |
Programmable Logic Devices |
No |
2.54 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Perpendicular |
S-XPGA-P68 |
No |
No |
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Altera |
Loadable PLD |
Industrial |
Pin/Peg |
192 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
504 |
No |
5.5 V |
CMOS |
136 |
5 |
3.3/5,5 V |
Grid Array |
PGA192M,17X17 |
Field Programmable Gate Arrays |
Registered |
4.5 V |
2.54 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 136 I/O |
4 |
-40 °C (-40 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P192 |
1 |
5.43 mm |
45.15 mm |
No |
504 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e0 |
385 MHz |
132 |
220 °C (428 °F) |
45.15 mm |
136 |
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Altera |
Flash PLD |
Other |
Ball |
68 |
TFBGA |
Square |
Plastic/Epoxy |
7.9 ns |
Yes |
1.89 V |
64 |
CMOS |
1.8 |
1.8,1.2/3.3 V |
Grid Array, Thin Profile, Fine Pitch |
BGA68,9X9,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
52 I/O |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B68 |
1.2 mm |
5 mm |
No |
e0 |
184.1 MHz |
5 mm |
Yes |
52 |
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|
Altera |
EE PLD |
Ball |
100 |
BGA |
Square |
Plastic/Epoxy |
3.5 ns |
Yes |
64 |
CMOS |
1.8/3.3,2.5 V |
Grid Array |
BGA100,10X10,40 |
Programmable Logic Devices |
Yes |
1 mm |
Tin Silver Copper |
Bottom |
S-PBGA-B100 |
No |
e1 |
Yes |
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Altera |
EE PLD |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
6 ns |
Yes |
2.625 V |
CMOS |
2.5 |
Flatpack, Low Profile, Fine Pitch |
Macrocell |
2.375 V |
.5 mm |
0 Dedicated Inputs, 84 I/O |
0 |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
e3 |
147.1 MHz |
220 °C (428 °F) |
14 mm |
84 |
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Altera |
OT PLD |
Industrial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
45 ns |
Yes |
5.5 V |
128 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC68,1.0SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J68 |
5.08 mm |
24.23 mm |
No |
e0 |
40 MHz |
220 °C (428 °F) |
24.23 mm |
No |
52 |
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Altera |
EE PLD |
Military |
Gull Wing |
208 |
FQFP |
Square |
Ceramic, Metal-Sealed Cofired |
15 ns |
Yes |
2.625 V |
CMOS |
MIL-STD-883 |
2.5 |
Flatpack, Fine Pitch |
Macrocell |
2.375 V |
.5 mm |
125 °C (257 °F) |
0 Dedicated Inputs |
0 |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQFP-G208 |
3.82 mm |
27.2 mm |
No |
256 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; Shared Input/Clock |
e0 |
76.9 MHz |
27.2 mm |
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Altera |
Loadable PLD |
Other |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
Yes |
1.8 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Macrocell |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 149 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
e3 |
220 °C (428 °F) |
28 mm |
149 |
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|
Altera |
Loadable PLD |
Other |
Ball |
652 |
BGA |
Square |
Plastic/Epoxy |
1.83 ns |
16640 |
Yes |
1.89 V |
CMOS |
480 |
1.8 |
1.8,1.8/3.3 V |
Grid Array |
BGA652,35X35,50 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 488 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B652 |
3 |
3.5 mm |
45 mm |
No |
e1 |
30 s |
480 |
245 °C (473 °F) |
45 mm |
488 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.