Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Altera |
EE PLD |
Commercial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
5.5 ns |
Yes |
2.625 V |
512 |
CMOS |
2.5 |
1.8/3.3,2.5 V |
Grid Array |
BGA256,20X20,50 |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
1 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 212 I/O |
0 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
3 |
3.5 mm |
17 mm |
No |
e1 |
163.9 MHz |
17 mm |
Yes |
212 |
|||||||||||
|
Altera |
EE PLD |
Gull Wing |
44 |
QFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
32 |
CMOS |
1.8/3.3,2.5 V |
Flatpack |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
.8 mm |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
No |
e3 |
260 °C (500 °F) |
Yes |
||||||||||||||||||||||||
Altera |
Loadable PLD |
Commercial |
Ball |
225 |
BGA |
Square |
Plastic/Epoxy |
1.7 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Grid Array |
Registered |
3 V |
1.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 152 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B225 |
2.3 mm |
27 mm |
No |
Can also operate at 5 V supply |
e1 |
27 mm |
152 |
|||||||||||||||||||
Altera |
EE PLD |
Commercial |
Ball |
49 |
LFBGA |
Square |
Plastic/Epoxy |
3.5 ns |
Yes |
2.625 V |
64 |
CMOS |
2.5 |
1.8/3.3,2.5 V |
Grid Array, Low Profile, Fine Pitch |
BGA49,7X7,32 |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 41 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B49 |
1.55 mm |
7 mm |
No |
e0 |
303 MHz |
220 °C (428 °F) |
7 mm |
Yes |
41 |
||||||||||||
|
Altera |
Loadable PLD |
Commercial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
CMOS |
5 |
Flatpack |
Registered |
4.75 V |
.65 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 120 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
3 |
4.07 mm |
28 mm |
No |
672 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e3 |
28 mm |
120 |
||||||||||||||||||
Altera |
UV PLD |
Industrial |
Pin/Peg |
68 |
WPGA |
Square |
Ceramic, Metal-Sealed Cofired |
40 ns |
No |
5.5 V |
CMOS |
5 |
Grid Array, Window |
Macrocell |
4.5 V |
2.54 mm |
85 °C (185 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
-40 °C (-40 °F) |
Perpendicular |
S-CPGA-P68 |
4.96 mm |
27.94 mm |
No |
128 Macrocells; 8 Labs |
62.5 MHz |
27.94 mm |
52 |
||||||||||||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
R-PQFP-G100 |
3 |
3.65 mm |
14 mm |
No |
e3 |
125 MHz |
20 mm |
84 |
|||||||||||||||||
Altera |
EE PLD |
Commercial |
Gull Wing |
100 |
QFP |
Square |
Plastic/Epoxy |
6 ns |
Yes |
128 |
CMOS |
3.3/5,5 V |
Flatpack |
TQFP100,.63SQ |
Programmable Logic Devices |
No |
.5 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
No |
e0 |
220 °C (428 °F) |
No |
||||||||||||||||||||||
Altera |
UV PLD |
Industrial |
J Bend |
84 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
55 ns |
Yes |
5.5 V |
192 |
CMOS |
5 |
5 V |
Chip Carrier, Window |
LDCC84,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
7 Dedicated Inputs, 64 I/O |
7 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-CQCC-J84 |
5.08 mm |
29.21 mm |
No |
Labs interconnected by PIA; 12 Labs; 192 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
40 MHz |
220 °C (428 °F) |
29.21 mm |
No |
64 |
|||||||||||
Altera |
OT PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
CMOS |
5 |
Chip Carrier |
Registered |
4.75 V |
1.27 mm |
70 °C (158 °F) |
8 Dedicated Inputs, 0 I/O |
8 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
4.572 mm |
11.5062 mm |
No |
Stand-Alone Microsequencer |
e0 |
30 MHz |
220 °C (428 °F) |
11.5062 mm |
0 |
||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
3.6 ns |
Yes |
2.625 V |
CMOS |
2.5 |
Flatpack, Fine Pitch |
Macrocell |
2.375 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 144 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
e3 |
28 mm |
144 |
|||||||||||||||||||
Altera |
EE PLD |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
45 ns |
No |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
72 |
2.54 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Dual |
R-PDIP-T20 |
No |
20 MHz |
8 |
||||||||||||||||||||||
Altera |
UV PLD |
Commercial |
Pin/Peg |
84 |
WPGA |
Square |
Ceramic, Metal-Sealed Cofired |
55 ns |
No |
5.25 V |
192 |
CMOS |
5 |
5 V |
Grid Array, Window |
PGA84M,11X11 |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
2.54 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 64 I/O |
7 |
0 °C (32 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P84 |
1 |
4.96 mm |
28.45 mm |
No |
Labs interconnected by PIA; 12 Labs; 192 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
40 MHz |
220 °C (428 °F) |
28.45 mm |
No |
64 |
||||||||||
Altera |
EE PLD |
Military |
Pin/Peg |
192 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
20 ns |
No |
5.5 V |
CMOS |
5 |
Grid Array |
Macrocell |
4.5 V |
2.54 mm |
125 °C (257 °F) |
0 Dedicated Inputs, 160 I/O |
0 |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P192 |
5.43 mm |
45.15 mm |
No |
256 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; Shared Input/Clock |
62.5 MHz |
45.15 mm |
160 |
||||||||||||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.63SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 100 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
100 MHz |
220 °C (428 °F) |
20 mm |
Yes |
100 |
|||||||||||
Altera |
Loadable PLD |
Military |
Pin/Peg |
403 |
IPGA |
Square |
Ceramic, Metal-Sealed Cofired |
23.8 ns |
No |
5.5 V |
CMOS |
5 |
Grid Array, Interstitial Pitch |
Registered |
4.5 V |
2.54 mm |
125 °C (257 °F) |
4 Dedicated Inputs, 248 I/O |
4 |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P403 |
3.916 mm |
49.78 mm |
No |
1728 Logic elements Configurable I/O operation with 3.3 V or 5 V |
60.6 MHz |
49.78 mm |
248 |
||||||||||||||||||||
Altera |
EE PLD |
Commercial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.25 V |
256 |
CMOS |
5 |
3.3/5,5 V |
Flatpack |
QFP160,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 128 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G160 |
3 |
4.07 mm |
28 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
125 MHz |
220 °C (428 °F) |
28 mm |
No |
128 |
||||||||||
|
Altera |
EE PLD |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
5 ns |
Yes |
64 |
CMOS |
1.8/3.3,2.5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
1.27 mm |
Matte Tin |
Quad |
S-PQCC-J44 |
1 |
No |
e3 |
Yes |
|||||||||||||||||||||||||
Altera |
Loadable PLD |
Commercial |
Pin/Peg |
599 |
HIPGA |
Square |
Ceramic, Metal-Sealed Cofired |
12160 |
No |
2.7 V |
CMOS |
470 |
2.5 |
2.5,2.5/3.3 V |
Grid Array, Heat Sink/Slug, Interstitial Pitch |
SPGA599,47X47 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
2.54 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 470 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P599 |
1 |
5.08 mm |
62.484 mm |
No |
e0 |
470 |
220 °C (428 °F) |
62.484 mm |
470 |
|||||||||||||
|
Altera |
Flash PLD |
Automotive |
Ball |
100 |
BGA |
Square |
Plastic/Epoxy |
6.1 ns |
Yes |
1.89 V |
192 |
CMOS |
1.8 |
1.5/3.3,1.8 V |
Grid Array |
BGA100,11X11,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
.5 mm |
125 °C (257 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B100 |
No |
It can also operate at 3.3 V |
e1 |
Yes |
80 |
|||||||||||||||
|
Altera |
Loadable PLD |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
1320 |
Yes |
3.6 V |
CMOS |
171 |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 171 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Can Also Be Used 16000 Logic Gates |
e3 |
133 MHz |
30 s |
171 |
245 °C (473 °F) |
28 mm |
171 |
|||||||||
Altera |
OT PLD |
Commercial |
Gull Wing |
44 |
QFP |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack |
Macrocell |
4.75 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
2.23 mm |
10 mm |
No |
Macrocells Interconnected By Global Bus; Synchronous Timing Generator; 64 Macrocells |
e0 |
50 MHz |
220 °C (428 °F) |
10 mm |
32 |
||||||||||||||||
|
Altera |
Flash PLD |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
6.2 ns |
Yes |
1.89 V |
980 |
CMOS |
1.8 |
1.5/3.3,1.8 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 116 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
It can also operate at 3.3 V |
e3 |
30 s |
260 °C (500 °F) |
20 mm |
Yes |
116 |
|||||||||
Altera |
Loadable PLD |
Ball |
196 |
BGA |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
2.5 |
Grid Array |
Macrocell |
2.375 V |
1 mm |
4 Dedicated Inputs |
4 |
Tin Silver Copper |
Bottom |
S-PBGA-B196 |
3 |
2.1 mm |
15 mm |
No |
e1 |
220 °C (428 °F) |
15 mm |
||||||||||||||||||||||||
Altera |
EE PLD |
Commercial |
Gull Wing |
44 |
QFP |
Square |
Plastic/Epoxy |
5 ns |
Yes |
5.25 V |
32 |
CMOS |
5 |
5 V |
Flatpack |
QFP44,.5SQ,32 |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
2.45 mm |
10 mm |
No |
2 Labs; 32 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
178.6 MHz |
220 °C (428 °F) |
10 mm |
No |
32 |
||||||||||
Altera |
UV PLD |
Military |
Pin/Peg |
84 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
90 ns |
No |
5.5 V |
192 |
CMOS |
MIL-STD-883 Class B |
5 |
5 V |
Grid Array |
PGA84M,11X11 |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
2.54 mm |
125 °C (257 °F) |
7 Dedicated Inputs, 64 I/O |
7 |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P84 |
4.96 mm |
28.45 mm |
No |
19.6 MHz |
220 °C (428 °F) |
28.45 mm |
No |
64 |
|||||||||||||
|
Altera |
Loadable PLD |
Commercial |
Gull Wing |
240 |
HFQFP |
Square |
Plastic/Epoxy |
0.5 ns |
3744 |
Yes |
5.25 V |
CMOS |
189 |
5 |
3.3/5 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
HQFP240,1.37SQ,20 |
Field Programmable Gate Arrays |
Registered |
4.75 V |
.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 189 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
3744 Logic Elements |
e3 |
54.1 MHz |
30 s |
189 |
245 °C (473 °F) |
32 mm |
189 |
||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Fine Pitch |
Registered |
4.5 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 184 I/O |
4 |
-40 °C (-40 °F) |
Quad |
S-PQFP-G240 |
4.2 mm |
32 mm |
No |
32 mm |
184 |
|||||||||||||||||||||||
Altera |
UV PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Ceramic |
Yes |
128 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
1.27 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-XQCC-J44 |
No |
e0 |
220 °C (428 °F) |
No |
|||||||||||||||||||||||
Altera |
Loadable PLD |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
2.29 ns |
Yes |
1.89 V |
CMOS |
1.8 |
Flatpack, Fine Pitch |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 143 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
160 MHz |
220 °C (428 °F) |
28 mm |
143 |
|||||||||||||||||
Altera |
Loadable PLD |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
Yes |
1.8 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Macrocell |
.5 mm |
4 Dedicated Inputs, 100 I/O |
4 |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
e3 |
220 °C (428 °F) |
28 mm |
100 |
||||||||||||||||||||||||||
Altera |
Loadable PLD |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
3.6 ns |
Yes |
2.625 V |
CMOS |
2.5 |
Flatpack, Fine Pitch |
Macrocell |
2.375 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 159 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
220 °C (428 °F) |
28 mm |
159 |
||||||||||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
4 ns |
Yes |
2.625 V |
128 |
CMOS |
2.5 |
1.8/3.3,2.5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 100 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
243.9 MHz |
20 mm |
Yes |
100 |
|||||||||||
Altera |
Loadable PLD |
Other |
Ball |
724 |
BGA |
Square |
Plastic/Epoxy |
2.87 ns |
67200 |
Yes |
1.575 V |
CMOS |
524 |
1.5 |
1.5,1.5/3.3 V |
Grid Array |
BGA724,27X27,50 |
Field Programmable Gate Arrays |
Macrocell |
1.425 V |
1.27 mm |
85 °C (185 °F) |
536 I/O |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B724 |
3.5 mm |
35 mm |
No |
e0 |
524 |
220 °C (428 °F) |
35 mm |
536 |
||||||||||||||
Altera |
Loadable PLD |
Industrial |
Pin/Peg |
232 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
CMOS |
5 |
Grid Array |
Registered |
4.5 V |
2.54 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 180 I/O |
4 |
-40 °C (-40 °F) |
Perpendicular |
S-CPGA-P232 |
5.207 mm |
44.7 mm |
No |
1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
44.7 mm |
180 |
||||||||||||||||||||||
Altera |
Loadable PLD |
Military |
Ball |
356 |
HLBGA |
Square |
Plastic/Epoxy |
27 ns |
Yes |
5.5 V |
CMOS |
5 |
Grid Array, Heat Sink/Slug, Low Profile |
Registered |
4.5 V |
1.27 mm |
125 °C (257 °F) |
4 Dedicated Inputs |
4 |
-55 °C (-67 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B356 |
1.63 mm |
35 mm |
No |
1152 Logic elements Configurable I/O operation with 3.3 V or 5 V |
e1 |
53.76 MHz |
35 mm |
|||||||||||||||||||
Altera |
Loadable PLD |
Other |
Ball |
652 |
LBGA |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
2.5 |
Grid Array, Low Profile |
Macrocell |
2.375 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 502 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B652 |
1.63 mm |
45 mm |
No |
e1 |
220 °C (428 °F) |
45 mm |
502 |
|||||||||||||||||||||
Altera |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
8.2 ns |
Yes |
5.25 V |
320 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 56 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
320 Macrocells |
e0 |
220 °C (428 °F) |
29.3116 mm |
Yes |
56 |
||||||||||||
Altera |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
5.25 V |
CMOS |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Macrocell |
4.75 V |
2.54 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Dual |
R-PDIP-T24 |
4.318 mm |
7.62 mm |
31.6865 mm |
|||||||||||||||||||||||||
Altera |
Loadable PLD |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
4160 |
Yes |
2.625 V |
CMOS |
84 |
2.5 |
1.8,1.8/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
4 Dedicated Inputs, 92 I/O |
4 |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
84 |
220 °C (428 °F) |
20 mm |
92 |
||||||||||||||||
Altera |
Loadable PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
27 ns |
Yes |
5.25 V |
CMOS |
5 |
Chip Carrier |
Registered |
4.75 V |
1.27 mm |
70 °C (158 °F) |
4 Dedicated Inputs |
4 |
0 °C (32 °F) |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
1152 Logic elements; Built-in JTAG boundry-scan test circuitry |
53.76 MHz |
29.3116 mm |
|||||||||||||||||||||
Altera |
Flash PLD |
Commercial Extended |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
8.1 ns |
Yes |
1.89 V |
980 |
CMOS |
1.8 |
1.5/3.3,1.8 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 212 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
2.2 mm |
17 mm |
No |
e0 |
20 s |
220 °C (428 °F) |
17 mm |
Yes |
212 |
|||||||||||
Altera |
Loadable PLD |
Military |
Gull Wing |
240 |
HFQFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Registered |
4.5 V |
.5 mm |
125 °C (257 °F) |
4 Dedicated Inputs, 180 I/O |
4 |
-55 °C (-67 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e3 |
32 mm |
180 |
||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
14.5 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Grid Array |
Registered |
3 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 369 I/O |
4 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B484 |
2.1 mm |
23 mm |
No |
e1 |
23 mm |
369 |
||||||||||||||||||||
Altera |
Loadable PLD |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
Yes |
1.8 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Macrocell |
.5 mm |
4 Dedicated Inputs, 100 I/O |
4 |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
e3 |
220 °C (428 °F) |
28 mm |
100 |
||||||||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
16 ns |
Yes |
2.7 V |
CMOS |
2.5 |
Flatpack, Fine Pitch |
Mixed |
2.3 V |
.5 mm |
85 °C (185 °F) |
182 I/O |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
32 mm |
182 |
|||||||||||||||||||||
Altera |
Loadable PLD |
Commercial |
Ball |
356 |
LBGA |
Square |
Plastic/Epoxy |
0.4 ns |
2880 |
Yes |
3.6 V |
CMOS |
310 |
3.3 |
3.3 V |
Grid Array, Low Profile |
BGA356,26X26,50 |
Field Programmable Gate Arrays |
Registered |
3 V |
1.27 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 274 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B356 |
3 |
1.63 mm |
35 mm |
No |
e0 |
20 s |
310 |
220 °C (428 °F) |
35 mm |
274 |
|||||||||||
Altera |
Loadable PLD |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
8320 |
Yes |
2.625 V |
CMOS |
160 |
2.5 |
1.8,1.8/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
4 Dedicated Inputs, 168 I/O |
4 |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
160 |
220 °C (428 °F) |
32 mm |
168 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.