| Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
Altera |
Flash PLD |
Ball |
100 |
BGA |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
2.5 |
Grid Array |
Macrocell |
2.375 V |
0 Dedicated Inputs, 0 I/O |
0 |
Tin Silver Copper |
Bottom |
S-PBGA-B100 |
No |
It can also operate at 3.3 V |
e1 |
0 |
|||||||||||||||||||||||||||
|
Altera |
EE PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
12 ns |
Yes |
5.5 V |
160 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 64 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
160 Macrocells |
e0 |
125 MHz |
220 °C (428 °F) |
29.3116 mm |
No |
64 |
|||||||||||
|
Altera |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
32 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
4.572 mm |
16.5862 mm |
No |
e0 |
220 °C (428 °F) |
16.5862 mm |
No |
36 |
|||||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 160 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e3 |
76.9 MHz |
28 mm |
160 |
||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
1.97 ns |
8320 |
Yes |
1.89 V |
CMOS |
368 |
1.8 |
1.8,1.8/3.3 V |
Grid Array |
BGA672,26X26,40 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 376 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B672 |
3 |
3.5 mm |
27 mm |
No |
e0 |
160 MHz |
20 s |
368 |
220 °C (428 °F) |
27 mm |
376 |
||||||||||
|
|
Altera |
Loadable PLD |
Commercial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
0.6 ns |
2880 |
Yes |
2.7 V |
CMOS |
189 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
.5 mm |
70 °C (158 °F) |
189 I/O |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
2880 Logic Elements |
e3 |
140 MHz |
189 |
245 °C (473 °F) |
32 mm |
189 |
||||||||||
|
Altera |
Loadable PLD |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
11 ns |
Yes |
CMOS |
2.5 |
Flatpack, Fine Pitch |
Mixed |
.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 147 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
e3 |
28 mm |
147 |
||||||||||||||||||||||
|
Altera |
Loadable PLD |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
1.6 ns |
Yes |
1.89 V |
1.8 |
Grid Array |
Macrocell |
1.71 V |
1 mm |
4 Dedicated Inputs, 376 I/O |
4 |
Tin Silver Copper |
Bottom |
S-PBGA-B672 |
3 |
2.1 mm |
27 mm |
No |
e1 |
220 °C (428 °F) |
27 mm |
376 |
||||||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
0.4 ns |
4160 |
Yes |
2.625 V |
CMOS |
153 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 159 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
e3 |
34 MHz |
153 |
220 °C (428 °F) |
28 mm |
159 |
||||||||||||
|
|
Altera |
Flash PLD |
Other |
Ball |
256 |
BGA |
Rectangular |
Plastic/Epoxy |
8.7 ns |
Yes |
1.89 V |
440 |
CMOS |
1.8 |
1.5/3.3,1.8 V |
Grid Array |
BGA256,20X20,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 160 I/O |
0 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
R-PBGA-B256 |
3 |
No |
It can also operate at 3.3 V |
e1 |
30 s |
260 °C (500 °F) |
Yes |
160 |
||||||||||||
|
Altera |
Loadable PLD |
Military |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Registered |
4.5 V |
.5 mm |
125 °C (257 °F) |
4 Dedicated Inputs, 132 I/O |
4 |
-55 °C (-67 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
636 Flip Flops; 504 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e3 |
28 mm |
132 |
||||||||||||||||||||
|
|
Altera |
Loadable PLD |
Commercial |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
0.5 ns |
Yes |
2.625 V |
CMOS |
2.5 |
Grid Array |
Mixed |
2.375 V |
1 mm |
70 °C (158 °F) |
413 I/O |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B672 |
2.1 mm |
27 mm |
No |
e1 |
27 mm |
413 |
||||||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
11 ns |
Yes |
CMOS |
2.5 |
Flatpack, Fine Pitch |
Mixed |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 189 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
32 mm |
189 |
||||||||||||||||||||||
|
Altera |
OT PLD |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
55 ns |
No |
5.5 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
160 |
2.54 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
7.62 mm |
No |
16 Macrocells |
e0 |
22.2 MHz |
16 |
220 °C (428 °F) |
26.162 mm |
16 |
|||||||||||
|
Altera |
OT PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
55 ns |
Yes |
5.25 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
160 |
1.27 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
11.5316 mm |
No |
16 Macrocells |
e0 |
22.2 MHz |
16 |
220 °C (428 °F) |
11.5316 mm |
16 |
|||||||||||
|
Altera |
EE PLD |
Military |
Pin/Peg |
192 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
15 ns |
No |
2.625 V |
CMOS |
MIL-STD-883 |
2.5 |
Grid Array |
Macrocell |
2.375 V |
2.54 mm |
125 °C (257 °F) |
0 Dedicated Inputs |
0 |
-55 °C (-67 °F) |
Gold |
Perpendicular |
S-CPGA-P192 |
5.43 mm |
45.15 mm |
No |
256 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; Shared Input/Clock |
e4 |
76.9 MHz |
45.15 mm |
||||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
0.6 ns |
Yes |
2.7 V |
2.5 |
Grid Array |
Mixed |
2.3 V |
85 °C (185 °F) |
4 Dedicated Inputs, 369 I/O |
4 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B484 |
No |
e1 |
369 |
|||||||||||||||||||||||||
|
|
Altera |
Loadable PLD |
Other |
Ball |
652 |
BGA |
Square |
Plastic/Epoxy |
2.13 ns |
Yes |
1.89 V |
CMOS |
1.8 |
Grid Array |
Macrocell |
1.71 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 488 I/O |
4 |
0 °C (32 °F) |
Tin/Silver/Copper |
Bottom |
S-PBGA-B652 |
3.5 mm |
45 mm |
No |
e1 |
160 MHz |
40 s |
245 °C (473 °F) |
45 mm |
488 |
||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.8 |
Grid Array |
Macrocell |
85 °C (185 °F) |
4 Dedicated Inputs, 246 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B672 |
No |
e1 |
246 |
||||||||||||||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
16 ns |
Yes |
2.7 V |
CMOS |
2.5 |
Grid Array |
Mixed |
2.3 V |
1 mm |
85 °C (185 °F) |
413 I/O |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B672 |
2.1 mm |
27 mm |
No |
e1 |
27 mm |
413 |
|||||||||||||||||||||
|
|
Altera |
EE PLD |
Gull Wing |
48 |
QFP |
Plastic/Epoxy |
7.5 ns |
Yes |
32 |
CMOS |
1.8/3.3,2.5 V |
Flatpack |
QFP48(UNSPEC) |
Programmable Logic Devices |
Yes |
Matte Tin |
Quad |
No |
e3 |
Yes |
|||||||||||||||||||||||||||||
|
|
Altera |
Loadable PLD |
Other |
Ball |
356 |
LBGA |
Square |
Plastic/Epoxy |
1.97 ns |
8320 |
Yes |
1.89 V |
CMOS |
263 |
1.8 |
1.8,1.8/3.3 V |
Grid Array, Low Profile |
BGA356,26X26,50 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 271 I/O |
4 |
0 °C (32 °F) |
Tin/Silver/Copper |
Bottom |
S-PBGA-B356 |
3 |
1.63 mm |
35 mm |
No |
e1 |
30 s |
263 |
260 °C (500 °F) |
35 mm |
271 |
||||||||||
|
Altera |
UV PLD |
Military |
Pin/Peg |
84 |
WPGA |
Square |
Ceramic, Metal-Sealed Cofired |
55 ns |
No |
5.5 V |
CMOS |
MIL-STD-883 |
5 |
Grid Array, Window |
Macrocell |
4.5 V |
2.54 mm |
125 °C (257 °F) |
7 Dedicated Inputs, 64 I/O |
7 |
-55 °C (-67 °F) |
Gold |
Perpendicular |
S-CPGA-P84 |
3.81 mm |
27.94 mm |
No |
Labs interconnected by PIA; 12 Labs; 192 Macrocells; 1 External Clock; Shared Input/Clock |
e4 |
33.3 MHz |
27.94 mm |
64 |
|||||||||||||||||
|
Altera |
Loadable PLD |
Commercial |
Pin/Peg |
503 |
IPGA |
Square |
Ceramic, Metal-Sealed Cofired |
17.2 ns |
No |
5.25 V |
CMOS |
5 |
Grid Array, Interstitial Pitch |
Registered |
4.75 V |
2.54 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 358 I/O |
4 |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P503 |
5.077 mm |
57.4 mm |
No |
57.4 mm |
358 |
||||||||||||||||||||||
|
Altera |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
12 ns |
Yes |
5.25 V |
128 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 64 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
128 Macrocells; Shared Input/Clock |
e0 |
90.9 MHz |
220 °C (428 °F) |
29.3116 mm |
No |
64 |
|||||||||||
|
|
Altera |
Flash PLD |
Automotive |
Ball |
100 |
LBGA |
Square |
Plastic/Epoxy |
6.1 ns |
Yes |
1.89 V |
192 |
CMOS |
1.8 |
1.5/3.3,1.8 V |
Grid Array, Low Profile |
BGA100,10X10,40 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
1 mm |
125 °C (257 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B100 |
1.7 mm |
11 mm |
No |
It can also operate at 3.3 V |
e1 |
11 mm |
Yes |
80 |
||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
HFQFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
2.7 V |
CMOS |
2.5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Mixed |
2.3 V |
.5 mm |
85 °C (185 °F) |
182 I/O |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
32 mm |
182 |
|||||||||||||||||||||
|
Altera |
Flash PLD |
Other |
Ball |
68 |
TFBGA |
Square |
Plastic/Epoxy |
7.9 ns |
Yes |
1.89 V |
128 |
CMOS |
1.8 |
1.2/3.3,1.8 V |
Grid Array, Thin Profile, Fine Pitch |
BGA68,9X9,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
52 I/O |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B68 |
1.2 mm |
5 mm |
No |
e0 |
184.1 MHz |
5 mm |
Yes |
52 |
||||||||||||||
|
|
Altera |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
32 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.57 mm |
16.5862 mm |
No |
32 Macrocells; 2 Labs; Configurable I/O operation with 2.5 V or 3.3 V |
e3 |
138.9 MHz |
30 s |
245 °C (473 °F) |
16.5862 mm |
Yes |
36 |
||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
1.97 ns |
8320 |
Yes |
1.89 V |
CMOS |
368 |
1.8 |
1.8,1.8/3.3 V |
Grid Array |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 376 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B484 |
3 |
2.1 mm |
23 mm |
No |
e0 |
160 MHz |
20 s |
368 |
220 °C (428 °F) |
23 mm |
376 |
||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
1.78 ns |
24320 |
Yes |
1.89 V |
CMOS |
500 |
1.8 |
1.8,1.8/3.3 V |
Grid Array |
BGA672,26X26,40 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 508 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B672 |
3 |
3.5 mm |
27 mm |
No |
e0 |
500 |
220 °C (428 °F) |
27 mm |
508 |
||||||||||||
|
Altera |
UV PLD |
Commercial |
Pin/Peg |
192 |
WPGA |
Square |
Ceramic, Metal-Sealed Cofired |
25 ns |
No |
5.25 V |
256 |
CMOS |
5 |
5 V |
Grid Array, Window |
PGA192M,17X17 |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
2.54 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 160 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P192 |
1 |
5.43 mm |
45.15 mm |
No |
256 Macrocells; Shared Input/Clock |
e0 |
40 MHz |
220 °C (428 °F) |
45.15 mm |
No |
160 |
||||||||||
|
|
Altera |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
4.5 ns |
Yes |
3.6 V |
32 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.57 mm |
16.5862 mm |
No |
32 Macrocells; 2 Labs; Configurable I/O operation with 2.5 V or 3.3 V |
e3 |
227.3 MHz |
30 s |
245 °C (473 °F) |
16.5862 mm |
Yes |
36 |
||||||||
|
Altera |
Loadable PLD |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
2560 |
Yes |
2.625 V |
CMOS |
140 |
2.5 |
1.8,1.8/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
4 Dedicated Inputs, 148 I/O |
4 |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
140 |
220 °C (428 °F) |
28 mm |
148 |
||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
8320 |
Yes |
2.625 V |
CMOS |
138 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 144 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
138 |
220 °C (428 °F) |
28 mm |
144 |
|||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
1.9 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Flatpack, Low Profile, Fine Pitch |
Registered |
3 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 78 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
1.27 mm |
14 mm |
No |
Can also operate at 5 V supply |
e3 |
14 mm |
78 |
|||||||||||||||||||
|
Altera |
Loadable PLD |
Military |
Pin/Peg |
160 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
CMOS |
5 |
Grid Array |
Registered |
4.5 V |
2.54 mm |
125 °C (257 °F) |
4 Dedicated Inputs, 116 I/O |
4 |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P160 |
5.34 mm |
39.624 mm |
No |
452 Flip Flops; 336 Logic Elements |
39.624 mm |
116 |
||||||||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
CMOS |
3.3 |
Flatpack, Low Profile, Fine Pitch |
Registered |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 74 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
1.27 mm |
14 mm |
No |
282 Flip Flops; 208 Logic elements; Built-in JTAG boundry-scan test circuitry |
e3 |
14 mm |
74 |
||||||||||||||||||||||
|
|
Altera |
EE PLD |
Industrial |
Gull Wing |
44 |
QFP |
Square |
Plastic/Epoxy |
5 ns |
Yes |
32 |
CMOS |
5 |
5 V |
Flatpack |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
.8 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
No |
e3 |
Yes |
||||||||||||||||||||||
|
Altera |
Loadable PLD |
Commercial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
1.7 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Flatpack |
Registered |
3 V |
.65 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 120 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
4.07 mm |
28 mm |
No |
Can also operate at 5 V supply |
e3 |
28 mm |
120 |
|||||||||||||||||||
|
Altera |
UV PLD |
Commercial |
Through-Hole |
28 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
5.25 V |
CMOS |
5 |
In-Line, Window |
Registered |
4.75 V |
2.54 mm |
70 °C (158 °F) |
8 Dedicated Inputs, 0 I/O |
8 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-GDIP-T28 |
5.334 mm |
7.62 mm |
No |
Stand-Alone Microsequencer |
e0 |
20 MHz |
220 °C (428 °F) |
36.83 mm |
0 |
||||||||||||||||||
|
Altera |
Loadable PLD |
Commercial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
336 |
Yes |
5.25 V |
CMOS |
120 |
5 |
3.3/5,5 V |
Flatpack |
QFP160,1.2SQ |
Field Programmable Gate Arrays |
Registered |
4.75 V |
.65 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 120 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G160 |
3 |
4.07 mm |
28 mm |
No |
336 Logic Elements |
e0 |
417 MHz |
20 s |
116 |
220 °C (428 °F) |
28 mm |
120 |
||||||||||
|
Altera |
UV PLD |
Industrial |
J Bend |
28 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
37 ns |
Yes |
5.5 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
Chip Carrier, Window |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
160 |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-CQCC-J28 |
4.826 mm |
11.43 mm |
No |
Macrocells Interconnected By Global Bus; 16 Macrocells; 2 External Clocks |
e0 |
28.6 MHz |
16 |
220 °C (428 °F) |
11.43 mm |
16 |
||||||||||
|
|
Altera |
EE PLD |
Gull Wing |
208 |
QFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
256 |
CMOS |
1.8/3.3,2.5 V |
Flatpack |
QFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
.5 mm |
Matte Tin |
Quad |
S-PQFP-G208 |
No |
e3 |
Yes |
||||||||||||||||||||||||||
|
|
Altera |
Loadable PLD |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
2.33 ns |
8320 |
Yes |
1.89 V |
CMOS |
128 |
1.8 |
1.8,1.8/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 136 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
30 s |
128 |
245 °C (473 °F) |
28 mm |
136 |
||||||||||
|
Altera |
Loadable PLD |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
8320 |
Yes |
1.89 V |
CMOS |
160 |
1.8 |
1.8,1.8/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
.5 mm |
4 Dedicated Inputs, 168 I/O |
4 |
Tin Lead |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e0 |
160 |
220 °C (428 °F) |
32 mm |
168 |
||||||||||||||||
|
Altera |
EE PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
2.625 V |
64 |
CMOS |
2.5 |
1.8/3.3,2.5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
e0 |
142.9 MHz |
220 °C (428 °F) |
16.5862 mm |
Yes |
36 |
||||||||||||
|
Altera |
Loadable PLD |
Commercial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
0.3 ns |
9984 |
Yes |
2.625 V |
CMOS |
182 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
.5 mm |
70 °C (158 °F) |
182 I/O |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e0 |
182 |
220 °C (428 °F) |
32 mm |
182 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.