Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Altera |
Loadable PLD |
Other |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
1.78 ns |
Yes |
1.575 V |
CMOS |
1.5 |
Grid Array |
Macrocell |
1.425 V |
1 mm |
85 °C (185 °F) |
492 I/O |
0 °C (32 °F) |
Tin/Silver/Copper |
Bottom |
S-PBGA-B672 |
2.1 mm |
27 mm |
No |
e1 |
40 s |
245 °C (473 °F) |
27 mm |
492 |
||||||||||||||||||
Altera |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
0 °C (32 °F) |
Quad |
S-PQCC-J44 |
4.572 mm |
16.5862 mm |
No |
100 MHz |
16.5862 mm |
36 |
|||||||||||||||||||||
|
Altera |
Loadable PLD |
Commercial |
Ball |
225 |
BGA |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
CMOS |
5 |
Grid Array |
Registered |
4.75 V |
1.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 152 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B225 |
3 |
2.3 mm |
27 mm |
No |
672 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e1 |
27 mm |
152 |
||||||||||||||||||
|
Altera |
Loadable PLD |
Commercial |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
0.5 ns |
Yes |
2.7 V |
CMOS |
2.5 |
Grid Array |
Mixed |
2.3 V |
1 mm |
70 °C (158 °F) |
254 I/O |
0 °C (32 °F) |
Tin/Silver/Copper |
Bottom |
S-PBGA-B484 |
2.1 mm |
23 mm |
No |
2880 Logic Elements |
e1 |
140 MHz |
40 s |
260 °C (500 °F) |
23 mm |
254 |
||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
9 ns |
9984 |
Yes |
2.7 V |
CMOS |
470 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA672,26X26,40 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
1 mm |
85 °C (185 °F) |
470 I/O |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B672 |
3 |
2.1 mm |
27 mm |
No |
e0 |
470 |
220 °C (428 °F) |
27 mm |
470 |
|||||||||||||
Altera |
Loadable PLD |
Commercial |
Ball |
600 |
BGA |
Square |
Plastic/Epoxy |
0.6 ns |
4992 |
Yes |
3.6 V |
CMOS |
406 |
3.3 |
2.5/3.3,3.3 V |
Grid Array |
BGA600,35X35,50 |
Field Programmable Gate Arrays |
Registered |
3 V |
1.27 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 406 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B600 |
3 |
1.93 mm |
45 mm |
No |
e0 |
20 s |
406 |
220 °C (428 °F) |
45 mm |
406 |
|||||||||||
Altera |
OT PLD |
Industrial |
Through-Hole |
40 |
DIP |
Rectangular |
Plastic/Epoxy |
25 ns |
No |
5.25 V |
CMOS |
5 |
In-Line |
Macrocell |
4.75 V |
2.54 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
-40 °C (-40 °F) |
Dual |
R-PDIP-T40 |
4.83 mm |
15.24 mm |
No |
62.5 MHz |
52.425 mm |
24 |
|||||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
2.02 ns |
4160 |
Yes |
1.89 V |
CMOS |
143 |
1.8 |
1.8,1.8/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 151 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
30 s |
143 |
245 °C (473 °F) |
28 mm |
151 |
||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
0.6 ns |
Yes |
3.6 V |
3.3 |
Grid Array |
Mixed |
3 V |
85 °C (185 °F) |
4 Dedicated Inputs, 369 I/O |
4 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B484 |
No |
e1 |
369 |
|||||||||||||||||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack |
Macrocell |
4.5 V |
.65 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 120 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
4.07 mm |
28 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e3 |
76.9 MHz |
28 mm |
120 |
||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
1.55 ns |
Yes |
1.89 V |
CMOS |
1.8 |
Grid Array |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 316 I/O |
4 |
0 °C (32 °F) |
Tin/Silver/Copper |
Bottom |
S-PBGA-B484 |
3 |
2.1 mm |
23 mm |
No |
e1 |
160 MHz |
40 s |
260 °C (500 °F) |
23 mm |
316 |
|||||||||||||||
Altera |
OT PLD |
Commercial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
27 ns |
Yes |
5.25 V |
CMOS |
5 |
Small Outline |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
0 °C (32 °F) |
Dual |
R-PDSO-G24 |
2.65 mm |
7.5 mm |
No |
16 Macrocells; 2 External Clocks |
40 MHz |
15.4 mm |
16 |
||||||||||||||||||||
Altera |
Loadable PLD |
Other |
Ball |
784 |
BGA |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
2.5 |
Grid Array |
Macrocell |
2.375 V |
85 °C (185 °F) |
4 Dedicated Inputs |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B784 |
3 |
No |
e1 |
220 °C (428 °F) |
|||||||||||||||||||||||||
|
Altera |
EE PLD |
Commercial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
5.5 ns |
Yes |
2.625 V |
512 |
CMOS |
2.5 |
1.8/3.3,2.5 V |
Grid Array |
BGA256,20X20,50 |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
1 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 212 I/O |
0 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
3 |
3.5 mm |
17 mm |
No |
e1 |
163.9 MHz |
17 mm |
Yes |
212 |
|||||||||||
|
Altera |
EE PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
5 ns |
Yes |
2.625 V |
256 |
CMOS |
2.5 |
1.8/3.3,2.5 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
1 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 164 I/O |
0 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
3.5 mm |
17 mm |
No |
e1 |
188.7 MHz |
17 mm |
Yes |
164 |
||||||||||||
Altera |
220 °C (428 °F) |
||||||||||||||||||||||||||||||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
8.5 ns |
Yes |
2.7 V |
CMOS |
2.5 |
Flatpack, Fine Pitch |
Mixed |
2.3 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 147 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
e3 |
28 mm |
147 |
||||||||||||||||||||
Altera |
Flash PLD |
Ball |
100 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
1.8 |
Grid Array |
Macrocell |
1.71 V |
0 Dedicated Inputs, 80 I/O |
0 |
Tin Lead |
Bottom |
S-PBGA-B100 |
No |
e0 |
80 |
|||||||||||||||||||||||||||||
Altera |
UV PLD |
Military |
Pin/Peg |
68 |
WPGA |
Square |
Ceramic, Metal-Sealed Cofired |
33 ns |
No |
5.5 V |
CMOS |
5 |
Grid Array, Window |
Macrocell |
4.5 V |
2.54 mm |
125 °C (257 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P68 |
3.81 mm |
27.94 mm |
No |
Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock |
66.7 MHz |
27.94 mm |
52 |
||||||||||||||||||||
Altera |
OT PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
CMOS |
36 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
240 |
1.27 mm |
70 °C (158 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
No |
Macrocells Interconnected By Global Bus; 24 Macrocells; 2 External Clocks |
e0 |
76.9 MHz |
24 |
220 °C (428 °F) |
24 |
|||||||||||||
Altera |
Loadable PLD |
Ball |
784 |
BGA |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
2.5 |
Grid Array |
Macrocell |
2.375 V |
4 Dedicated Inputs |
4 |
Tin Silver Copper |
Bottom |
S-PBGA-B784 |
3 |
No |
e1 |
220 °C (428 °F) |
||||||||||||||||||||||||||||
Altera |
Loadable PLD |
Commercial |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
0.9 ns |
Yes |
2.7 V |
2.5 |
Grid Array |
Mixed |
2.3 V |
70 °C (158 °F) |
4 Dedicated Inputs, 338 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B484 |
No |
e1 |
338 |
|||||||||||||||||||||||||
Altera |
Industrial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
17 ns |
Yes |
CMOS |
16 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC20,.4SQ |
Programmable Logic Devices |
160 |
1.27 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J20 |
No |
e0 |
8 |
220 °C (428 °F) |
||||||||||||||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
128 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
76.9 MHz |
220 °C (428 °F) |
14 mm |
Yes |
80 |
||||||||||
Altera |
EE PLD |
Military |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack |
Macrocell |
4.5 V |
.65 mm |
125 °C (257 °F) |
0 Dedicated Inputs, 120 I/O |
0 |
-55 °C (-67 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
4.07 mm |
28 mm |
No |
192 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; Shared Input/Clock |
e3 |
76.9 MHz |
28 mm |
120 |
||||||||||||||||||
Altera |
OT PLD |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
10 ns |
No |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
132 |
2.54 mm |
70 °C (158 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
4.32 mm |
7.62 mm |
No |
Macrocells Interconnected By Global Bus; 10 Macrocells; 1 External Clock |
e0 |
95.2 MHz |
10 |
220 °C (428 °F) |
31.68 mm |
10 |
||||||||||
Altera |
OT PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
55 ns |
Yes |
5.5 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
160 |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
11.5316 mm |
No |
16 Macrocells |
e0 |
22.2 MHz |
16 |
220 °C (428 °F) |
11.5316 mm |
16 |
|||||||||||
Altera |
OT PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
45 ns |
Yes |
5.5 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
160 |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
11.5316 mm |
No |
16 Macrocells |
e0 |
26.3 MHz |
16 |
220 °C (428 °F) |
11.5316 mm |
16 |
|||||||||||
Altera |
EE PLD |
Commercial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
256 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 164 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
2.1 mm |
17 mm |
No |
256 Macrocells; 16 Labs; Configurable I/O operation with 2.5 V or 3.3 V |
e0 |
125 MHz |
220 °C (428 °F) |
17 mm |
Yes |
164 |
||||||||||
Altera |
EE PLD |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
5.5 ns |
Yes |
2.625 V |
512 |
CMOS |
2.5 |
1.8/3.3,2.5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 176 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e0 |
163.9 MHz |
20 s |
220 °C (428 °F) |
28 mm |
Yes |
176 |
||||||||||
|
Altera |
Loadable PLD |
Ball |
724 |
HBGA |
Square |
Plastic/Epoxy |
1.7 ns |
Yes |
1.575 V |
CMOS |
1.5 |
Grid Array, Heat Sink/Slug |
Macrocell |
1.425 V |
1.27 mm |
536 I/O |
Tin/Silver/Copper |
Bottom |
S-PBGA-B724 |
3.5 mm |
35 mm |
No |
e1 |
35 mm |
536 |
|||||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
12.5 ns |
Yes |
2.7 V |
CMOS |
2.5 |
Flatpack, Fine Pitch |
Mixed |
2.3 V |
.5 mm |
85 °C (185 °F) |
189 I/O |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
32 mm |
189 |
|||||||||||||||||||||
Altera |
UV PLD |
Commercial |
J Bend |
44 |
WQCCJ |
Square |
Ceramic, Glass-Sealed |
65 ns |
Yes |
5.25 V |
CMOS |
36 |
PAL-TYPE |
5 |
Chip Carrier, Window |
LDCC44,.7SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
236 |
1.27 mm |
70 °C (158 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-GQCC-J44 |
4.57 mm |
16.51 mm |
No |
28 Macrocells |
e0 |
23.2 MHz |
24 |
220 °C (428 °F) |
16.51 mm |
24 |
|||||||||||
Altera |
UV PLD |
Military |
Through-Hole |
40 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
90 ns |
No |
5.5 V |
CMOS |
36 |
PAL-TYPE |
5 |
In-Line, Window |
DIP40,.6 |
Programmable Logic Devices |
Macrocell |
4.5 V |
236 |
2.54 mm |
125 °C (257 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T40 |
5.715 mm |
15.24 mm |
No |
28 Macrocells |
e0 |
17.5 MHz |
24 |
220 °C (428 °F) |
52.07 mm |
24 |
|||||||||||
|
Altera |
Loadable PLD |
Industrial |
Ball |
356 |
LBGA |
Square |
Plastic/Epoxy |
0.6 ns |
2880 |
Yes |
3.6 V |
CMOS |
274 |
3.3 |
3.3 V |
Grid Array, Low Profile |
BGA356,26X26,50 |
Field Programmable Gate Arrays |
Registered |
3 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 274 I/O |
4 |
-40 °C (-40 °F) |
Tin/Silver/Copper |
Bottom |
S-PBGA-B356 |
3 |
1.63 mm |
35 mm |
No |
e1 |
30 s |
274 |
260 °C (500 °F) |
35 mm |
274 |
||||||||||
Altera |
Loadable PLD |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
2560 |
Yes |
2.625 V |
CMOS |
143 |
2.5 |
1.8,1.8/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
4 Dedicated Inputs, 151 I/O |
4 |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
143 |
220 °C (428 °F) |
32 mm |
151 |
|||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
HFQFP |
Square |
Plastic/Epoxy |
16 ns |
6656 |
Yes |
2.7 V |
CMOS |
186 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
HQFP240,1.37SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
.5 mm |
85 °C (185 °F) |
186 I/O |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e0 |
186 |
220 °C (428 °F) |
32 mm |
186 |
||||||||||||||
Altera |
EE PLD |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
12 ns |
Yes |
5.25 V |
160 |
CMOS |
5 |
3.3/5,5 V |
Flatpack |
QFP100,.7X.9 |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
0 °C (32 °F) |
Tin/Lead |
Quad |
R-PQFP-G100 |
3 |
3.65 mm |
14 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
125 MHz |
30 s |
220 °C (428 °F) |
20 mm |
No |
84 |
|||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
44 |
LQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.5 V |
32 |
CMOS |
5 |
5 V |
Flatpack, Low Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
1.27 mm |
10 mm |
No |
32 Macrocells; 2 Labs; Configurable I/O operation with 3.3 V or 5 V |
e0 |
166.7 MHz |
220 °C (428 °F) |
10 mm |
Yes |
36 |
||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
27 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Fine Pitch |
Registered |
4.5 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 189 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
2880 Logic elements; Built-in JTAG boundry-scan test circuitry |
e3 |
53.76 MHz |
32 mm |
189 |
||||||||||||||||||
Altera |
220 °C (428 °F) |
||||||||||||||||||||||||||||||||||||||||||||||||
Altera |
OT PLD |
Commercial |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
17 ns |
Yes |
5.25 V |
CMOS |
24 |
PAL-TYPE |
5 |
5 V |
Small Outline |
SOP28,.5 |
Programmable Logic Devices |
Macrocell |
4.75 V |
320 |
1.27 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 16 I/O |
7 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G28 |
2.65 mm |
7.5 mm |
No |
Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
71.4 MHz |
16 |
220 °C (428 °F) |
17.9 mm |
16 |
||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
27 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Fine Pitch |
Registered |
4.5 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
576 Logic elements; Built-in JTAG boundry-scan test circuitry |
e3 |
53.76 MHz |
32 mm |
|||||||||||||||||||
|
Altera |
Loadable PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
0.6 ns |
Yes |
2.625 V |
CMOS |
2.5 |
Flatpack, Low Profile, Fine Pitch |
Mixed |
2.375 V |
.5 mm |
70 °C (158 °F) |
102 I/O |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
20 mm |
102 |
|||||||||||||||||||
Altera |
OT PLD |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
18 ns |
No |
5.5 V |
CMOS |
5 |
In-Line |
Macrocell |
4.5 V |
2.54 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
-40 °C (-40 °F) |
Dual |
R-PDIP-T24 |
4.318 mm |
7.62 mm |
No |
66 MHz |
31.6865 mm |
16 |
|||||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
356 |
LBGA |
Square |
Plastic/Epoxy |
1.73 ns |
Yes |
1.89 V |
CMOS |
1.8 |
Grid Array, Low Profile |
Macrocell |
1.71 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 246 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B356 |
1.63 mm |
35 mm |
No |
e1 |
35 mm |
246 |
|||||||||||||||||||
Altera |
OT PLD |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
18 ns |
No |
5.25 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
160 |
2.54 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
4.318 mm |
7.62 mm |
No |
e0 |
66 MHz |
16 |
220 °C (428 °F) |
31.6865 mm |
16 |
|||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
HFQFP |
Square |
Plastic/Epoxy |
14 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Registered |
3 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 189 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
32 mm |
189 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.