Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
1008 |
Yes |
5.5 V |
CMOS |
184 |
5 |
3.3/5,5 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Registered |
4.5 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 180 I/O |
4 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G240 |
3 |
4.2 mm |
32 mm |
No |
1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e0 |
357 MHz |
180 |
220 °C (428 °F) |
32 mm |
180 |
|||||||||||
Altera |
Loadable PLD |
Other |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.8 |
Grid Array |
Macrocell |
85 °C (185 °F) |
4 Dedicated Inputs, 246 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B672 |
No |
e1 |
246 |
||||||||||||||||||||||||||||
Altera |
Loadable PLD |
Military |
Pin/Peg |
232 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
CMOS |
5 |
Grid Array |
Registered |
4.5 V |
2.54 mm |
125 °C (257 °F) |
4 Dedicated Inputs, 180 I/O |
4 |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P232 |
5.207 mm |
44.7 mm |
No |
1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
44.7 mm |
180 |
||||||||||||||||||||||
Altera |
Loadable PLD |
Commercial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
0.9 ns |
1728 |
Yes |
3.6 V |
CMOS |
246 |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Registered |
3 V |
.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 189 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
1728 Logic Elements; 216 Labs |
e0 |
80 MHz |
20 s |
246 |
220 °C (428 °F) |
32 mm |
189 |
|||||||||
Altera |
EE PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Flatpack, Low Profile, Fine Pitch |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 120 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
512 Macrocells; 32 Labs; Configurable I/O operation with 2.5 V or 3.3 V |
e3 |
166.7 MHz |
20 mm |
120 |
||||||||||||||||||
Altera |
Mask PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
40 ns |
Yes |
5.25 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 28 I/O |
7 |
0 °C (32 °F) |
Quad |
S-PQCC-J44 |
4.572 mm |
16.5862 mm |
No |
Labs interconnected by PIA; 4 Labs; 64 Macrocells; 1 External Clock; Shared Input/Clock |
50 MHz |
220 °C (428 °F) |
16.5862 mm |
28 |
|||||||||||||||||||
Altera |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
60 ns |
Yes |
CMOS |
36 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Macrocell |
240 |
1.27 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
No |
e0 |
16.7 MHz |
24 |
220 °C (428 °F) |
||||||||||||||||||||
Altera |
Loadable PLD |
Ball |
100 |
LBGA |
Square |
Plastic/Epoxy |
1320 |
Yes |
3.6 V |
CMOS |
81 |
3.3 |
2.5/3.3,3.3 V |
Grid Array, Low Profile |
BGA100,10X10,40 |
Field Programmable Gate Arrays |
Macrocell |
3 V |
1 mm |
4 Dedicated Inputs, 81 I/O |
4 |
Tin Lead |
Bottom |
S-PBGA-B100 |
3 |
1.7 mm |
11 mm |
No |
e0 |
172 MHz |
81 |
220 °C (428 °F) |
11 mm |
81 |
|||||||||||||||
Altera |
EE PLD |
Commercial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
96 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC68,1.0SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 52 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J68 |
3 |
5.08 mm |
24.2316 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
100 MHz |
220 °C (428 °F) |
24.2316 mm |
No |
52 |
||||||||||
Altera |
Loadable PLD |
Military |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Low Profile, Fine Pitch |
Registered |
4.5 V |
.5 mm |
125 °C (257 °F) |
4 Dedicated Inputs, 74 I/O |
4 |
-55 °C (-67 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
1.27 mm |
14 mm |
No |
282 Flip Flops; 208 Logic elements; Built-in JTAG boundry-scan test circuitry |
e3 |
14 mm |
74 |
||||||||||||||||||||
Altera |
Loadable PLD |
Other |
Ball |
1020 |
BGA |
Square |
Plastic/Epoxy |
2.13 ns |
51840 |
Yes |
1.89 V |
CMOS |
800 |
1.8 |
1.8,1.8/3.3 V |
Grid Array |
BGA1020,32X32,40 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 808 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B1020 |
5A |
3.5 mm |
33 mm |
No |
e0 |
20 s |
800 |
220 °C (428 °F) |
33 mm |
808 |
|||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
HFQFP |
Square |
Plastic/Epoxy |
21.1 ns |
2304 |
Yes |
5.25 V |
CMOS |
189 |
5 |
3.3/5,5 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
HQFP240,1.37SQ,20 |
Field Programmable Gate Arrays |
Registered |
4.75 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 189 I/O |
4 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
2304 Logic Elements |
e0 |
62.89 MHz |
185 |
220 °C (428 °F) |
32 mm |
189 |
|||||||||||
Altera |
EE PLD |
Commercial |
Ball |
356 |
HLBGA |
Square |
Plastic/Epoxy |
8.2 ns |
Yes |
5.25 V |
320 |
CMOS |
5 |
3.3/5,5 V |
Grid Array, Heat Sink/Slug, Low Profile |
BGA356,26X26,50 |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 168 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B356 |
1.63 mm |
35 mm |
No |
320 Macrocells; 484 Flip Flops; 20 Labs; Configurable I/O operation with 3.3 V or 5 V |
e0 |
220 °C (428 °F) |
35 mm |
Yes |
168 |
||||||||||||
Altera |
Loadable PLD |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
CMOS |
2.5 |
Flatpack, Fine Pitch |
Macrocell |
2.375 V |
.5 mm |
4 Dedicated Inputs, 174 I/O |
4 |
Matte Tin |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e3 |
220 °C (428 °F) |
32 mm |
174 |
||||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Pin/Peg |
192 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
504 |
No |
5.5 V |
CMOS |
136 |
5 |
3.3/5,5 V |
Grid Array |
PGA192M,17X17 |
Field Programmable Gate Arrays |
Registered |
4.5 V |
2.54 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 130 I/O |
4 |
-40 °C (-40 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P192 |
1 |
5.43 mm |
45.15 mm |
No |
636 Flip Flops; 504 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e0 |
132 |
220 °C (428 °F) |
45.15 mm |
130 |
||||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack |
Macrocell |
4.5 V |
.65 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 100 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
4.07 mm |
28 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e3 |
76.9 MHz |
28 mm |
100 |
||||||||||||||||||
Altera |
EE PLD |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
512 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 176 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
512 Macrocells; 32 Labs; Configurable I/O operation with 2.5 V or 3.3 V |
e0 |
116.3 MHz |
20 s |
220 °C (428 °F) |
28 mm |
Yes |
176 |
|||||||||
Altera |
Loadable PLD |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
0.4 ns |
1728 |
Yes |
2.625 V |
CMOS |
147 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
.5 mm |
70 °C (158 °F) |
147 I/O |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e0 |
20 s |
147 |
220 °C (428 °F) |
28 mm |
147 |
||||||||||||
Altera |
Loadable PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
208 |
Yes |
3.6 V |
CMOS |
68 |
3.3 |
3.3 V |
Chip Carrier |
LDCC84,1.2SQ |
Field Programmable Gate Arrays |
Registered |
3 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 68 I/O |
4 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
208 Logic Elements |
e0 |
357 MHz |
64 |
220 °C (428 °F) |
29.3116 mm |
68 |
||||||||||||
Altera |
Loadable PLD |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
2560 |
Yes |
2.625 V |
CMOS |
143 |
2.5 |
1.8,1.8/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
4 Dedicated Inputs, 151 I/O |
4 |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
143 |
220 °C (428 °F) |
32 mm |
151 |
|||||||||||||||||
|
Altera |
EE PLD |
Commercial |
Ball |
100 |
LBGA |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Grid Array, Low Profile |
BGA100,10X10,40 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B100 |
3 |
1.7 mm |
11 mm |
No |
e1 |
98 MHz |
30 s |
260 °C (500 °F) |
11 mm |
Yes |
84 |
|||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
724 |
BGA |
Square |
Plastic/Epoxy |
1.94 ns |
Yes |
1.575 V |
CMOS |
1.5 |
Grid Array |
Macrocell |
1.425 V |
1.27 mm |
85 °C (185 °F) |
492 I/O |
0 °C (32 °F) |
Tin/Silver/Copper |
Bottom |
S-PBGA-B724 |
3.5 mm |
35 mm |
No |
e1 |
40 s |
245 °C (473 °F) |
35 mm |
492 |
||||||||||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 160 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e3 |
76.9 MHz |
28 mm |
160 |
||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
0.5 ns |
Yes |
2.7 V |
2.5 |
Grid Array |
Mixed |
2.3 V |
85 °C (185 °F) |
4 Dedicated Inputs, 470 I/O |
4 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B672 |
No |
e1 |
470 |
|||||||||||||||||||||||||
Altera |
Loadable PLD |
Commercial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
672 |
Yes |
5.25 V |
CMOS |
120 |
5 |
3.3/5,5 V |
Flatpack |
QFP160,1.2SQ |
Field Programmable Gate Arrays |
Registered |
4.75 V |
.65 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 120 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G160 |
3 |
4.07 mm |
28 mm |
No |
672 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e0 |
417 MHz |
20 s |
116 |
220 °C (428 °F) |
28 mm |
120 |
||||||||||
Altera |
EE PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
3.6 V |
512 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.63SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 120 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
512 Macrocells; 32 Labs; Configurable I/O operation with 2.5 V or 3.3 V |
e0 |
71.9 MHz |
20 s |
220 °C (428 °F) |
20 mm |
Yes |
120 |
|||||||||
Altera |
Loadable PLD |
Commercial |
Pin/Peg |
403 |
IPGA |
Square |
Ceramic, Metal-Sealed Cofired |
27 ns |
2880 |
No |
5.25 V |
CMOS |
310 |
5 |
3.3/5,5 V |
Grid Array, Interstitial Pitch |
SPGA403M,37X37 |
Field Programmable Gate Arrays |
Registered |
4.75 V |
2.54 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 310 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P403 |
1 |
3.916 mm |
49.78 mm |
No |
2880 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e0 |
57.8 MHz |
310 |
220 °C (428 °F) |
49.78 mm |
310 |
||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
2.5 |
Grid Array |
Registered |
2.375 V |
1 mm |
85 °C (185 °F) |
6 Dedicated Inputs, 186 I/O |
6 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
2.1 mm |
17 mm |
No |
e1 |
17 mm |
186 |
||||||||||||||||||||||
Altera |
Flash PLD |
Ball |
100 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
1.8 |
Grid Array |
Macrocell |
1.71 V |
0 Dedicated Inputs, 0 I/O |
0 |
Tin Lead |
Bottom |
S-PBGA-B100 |
No |
e0 |
0 |
|||||||||||||||||||||||||||||
Altera |
Loadable PLD |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
3.56 ns |
Yes |
1.89 V |
CMOS |
1.8 |
Flatpack, Fine Pitch |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 148 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
160 MHz |
220 °C (428 °F) |
28 mm |
148 |
|||||||||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
44 |
QFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
32 |
CMOS |
5 |
5 V |
Flatpack |
QFP44,.5SQ,32 |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
2.45 mm |
10 mm |
No |
e0 |
100 MHz |
220 °C (428 °F) |
10 mm |
No |
32 |
|||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
356 |
LBGA |
Square |
Plastic/Epoxy |
2.33 ns |
Yes |
1.89 V |
CMOS |
1.8 |
Grid Array, Low Profile |
Macrocell |
1.71 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 271 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B356 |
1.63 mm |
35 mm |
No |
e1 |
35 mm |
271 |
|||||||||||||||||||
Altera |
Flash PLD |
Ball |
100 |
BGA |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
2.5 |
Grid Array |
Macrocell |
2.375 V |
0 Dedicated Inputs, 76 I/O |
0 |
Tin Lead |
Bottom |
S-PBGA-B100 |
No |
It can also operate at 3.3 V |
e0 |
76 |
||||||||||||||||||||||||||||
Altera |
EE PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
4.5 ns |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
e0 |
222.2 MHz |
220 °C (428 °F) |
16.5862 mm |
Yes |
36 |
||||||||||||
|
Altera |
EE PLD |
Industrial |
Ball |
49 |
FBGA |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
128 |
CMOS |
1.8/3.3,2.5 V |
Grid Array, Fine Pitch |
BGA49,7X7,32 |
Programmable Logic Devices |
Yes |
.8 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B49 |
No |
e1 |
Yes |
|||||||||||||||||||||||
Altera |
EE PLD |
Gull Wing |
44 |
LQFP |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
CMOS |
2.5 |
Flatpack, Low Profile |
Macrocell |
2.375 V |
.8 mm |
4 Dedicated Inputs, 36 I/O |
4 |
Matte Tin |
Quad |
S-PQFP-G44 |
1.27 mm |
10 mm |
No |
e3 |
10 mm |
36 |
||||||||||||||||||||||||
Altera |
Loadable PLD |
Other |
Ball |
356 |
LBGA |
Square |
Plastic/Epoxy |
3.56 ns |
Yes |
1.89 V |
CMOS |
1.8 |
Grid Array, Low Profile |
Macrocell |
1.71 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 196 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B356 |
1.63 mm |
35 mm |
No |
e1 |
160 MHz |
220 °C (428 °F) |
35 mm |
196 |
||||||||||||||||||
Altera |
Mask PLD |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
55 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 64 I/O |
7 |
0 °C (32 °F) |
Matte Tin |
Quad |
R-PQFP-G100 |
3 |
3.13 mm |
13.2 mm |
No |
Labs interconnected by PIA; 12 Labs; 192 Macrocells; 1 External Clock; Shared Input/Clock |
e3 |
33.3 MHz |
220 °C (428 °F) |
20 mm |
64 |
||||||||||||||||
Altera |
UV PLD |
Military |
Pin/Peg |
68 |
WPGA |
Square |
Ceramic, Metal-Sealed Cofired |
90 ns |
No |
5.5 V |
48 |
CMOS |
5 |
5 V |
Grid Array, Window |
PGA68,11X11 |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
2.54 mm |
125 °C (257 °F) |
12 Dedicated Inputs, 48 I/O |
12 |
-55 °C (-67 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P68 |
5.0038 mm |
27.94 mm |
No |
48 Macrocells |
e0 |
220 °C (428 °F) |
27.94 mm |
No |
48 |
||||||||||||
Altera |
OT PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
33 ns |
Yes |
5.25 V |
192 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 64 I/O |
7 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
Labs interconnected by PIA; 12 Labs; 1 External Clock |
e0 |
66.7 MHz |
220 °C (428 °F) |
29.3116 mm |
No |
64 |
|||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
10.8 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack, Fine Pitch |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 132 I/O |
0 |
0 °C (32 °F) |
Matte Tin/Copper |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
320 Macrocells; 20 Labs; 484 Flip Flops; Configurable I/O operation with 3.3 V or 5 V |
e2 |
144.9 MHz |
40 s |
245 °C (473 °F) |
28 mm |
132 |
||||||||||||||
Altera |
OT PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.25 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
0 °C (32 °F) |
Quad |
S-PQCC-J44 |
4.572 mm |
16.5862 mm |
No |
64 Macrocells; Shared Input/Clock; Shared Product Terms |
66.7 MHz |
16.5862 mm |
32 |
||||||||||||||||||||
Altera |
EE PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
5 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 96 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
192.3 MHz |
20 s |
220 °C (428 °F) |
20 mm |
Yes |
96 |
||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
0.7 ns |
Yes |
2.7 V |
2.5 |
Grid Array |
Mixed |
2.3 V |
85 °C (185 °F) |
4 Dedicated Inputs, 369 I/O |
4 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B484 |
No |
e1 |
369 |
|||||||||||||||||||||||||
Altera |
Loadable PLD |
Other |
Ball |
324 |
BGA |
Square |
Plastic/Epoxy |
2.2 ns |
4160 |
Yes |
1.89 V |
CMOS |
238 |
1.8 |
1.8,1.8/3.3 V |
Grid Array |
BGA324,18X18,40 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 246 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B324 |
3 |
3.5 mm |
19 mm |
No |
e0 |
160 MHz |
20 s |
238 |
220 °C (428 °F) |
19 mm |
246 |
||||||||||
Altera |
Loadable PLD |
Other |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
1.68 ns |
11520 |
Yes |
1.89 V |
CMOS |
144 |
1.8 |
1.8,1.8/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 152 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e0 |
160 MHz |
20 s |
144 |
220 °C (428 °F) |
32 mm |
152 |
||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
CMOS |
5 |
Flatpack |
Registered |
4.5 V |
.65 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 116 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
4.07 mm |
28 mm |
No |
Labs With Fasttrack Interconnect; 452 Flip Flops; 336 Logic Elements |
e3 |
28 mm |
116 |
||||||||||||||||||||
Altera |
Loadable PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
0.5 ns |
2880 |
Yes |
2.625 V |
CMOS |
102 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
.5 mm |
70 °C (158 °F) |
102 I/O |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
20 s |
102 |
220 °C (428 °F) |
20 mm |
102 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.