| Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Altera |
UV PLD |
Commercial |
Pin/Peg |
68 |
WPGA |
Square |
Ceramic, Metal-Sealed Cofired |
25 ns |
No |
5.25 V |
128 |
CMOS |
5 |
5 V |
Grid Array, Window |
PGA68,11X11 |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
2.54 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
0 °C (32 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P68 |
1 |
3.81 mm |
27.94 mm |
No |
Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
83.3 MHz |
220 °C (428 °F) |
27.94 mm |
No |
52 |
||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
6 ns |
Yes |
3.6 V |
256 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.63SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 116 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
166.7 MHz |
220 °C (428 °F) |
20 mm |
Yes |
116 |
|||||||||||
|
Altera |
Loadable PLD |
Ball |
652 |
BGA |
Square |
Plastic/Epoxy |
1.83 ns |
16640 |
Yes |
1.89 V |
CMOS |
480 |
1.8 |
1.8,1.8/3.3 V |
Grid Array |
BGA652,35X35,50 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
1.27 mm |
4 Dedicated Inputs, 488 I/O |
4 |
Tin Silver Copper |
Bottom |
S-PBGA-B652 |
3.5 mm |
45 mm |
No |
e1 |
480 |
220 °C (428 °F) |
45 mm |
488 |
||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
4160 |
Yes |
2.625 V |
CMOS |
153 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
HQFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 159 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
e0 |
153 |
220 °C (428 °F) |
28 mm |
159 |
||||||||||||||
|
Altera |
OT PLD |
Industrial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
28 ns |
Yes |
5.5 V |
48 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC68,1.0SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 48 I/O |
12 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J68 |
No |
Macrocells Interconnected By Global And/Or Local Bus; 48 Macrocells; 4 External Clocks |
e0 |
40 MHz |
220 °C (428 °F) |
No |
48 |
||||||||||||||
|
|
Altera |
Loadable PLD |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
0.7 ns |
4992 |
Yes |
2.625 V |
CMOS |
147 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
.5 mm |
70 °C (158 °F) |
147 I/O |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
4992 Logic Elements |
e3 |
140 MHz |
147 |
28 mm |
147 |
|||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
44 |
LQFP |
Square |
Plastic/Epoxy |
6 ns |
Yes |
5.25 V |
32 |
CMOS |
5 |
5 V |
Flatpack, Low Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
1.27 mm |
10 mm |
No |
e0 |
200 MHz |
220 °C (428 °F) |
10 mm |
Yes |
36 |
|||||||||||
|
|
Altera |
Loadable PLD |
Other |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
1.72 ns |
Yes |
1.89 V |
CMOS |
1.8 |
Flatpack, Fine Pitch |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 151 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e3 |
160 MHz |
32 mm |
151 |
|||||||||||||||||
|
Altera |
Loadable PLD |
Military |
Pin/Peg |
232 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
CMOS |
5 |
Grid Array |
Registered |
4.5 V |
2.54 mm |
125 °C (257 °F) |
4 Dedicated Inputs, 180 I/O |
4 |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P232 |
5.207 mm |
44.7 mm |
No |
1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
44.7 mm |
180 |
||||||||||||||||||||||
|
Altera |
UV PLD |
Industrial |
Gull Wing |
100 |
WQFP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
55 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Window |
Macrocell |
4.5 V |
.65 mm |
85 °C (185 °F) |
19 Dedicated Inputs, 64 I/O |
19 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
R-CQFP-G100 |
3.35 mm |
13.2 mm |
No |
128 Macrocells; Shared Input/Clock; Shared Product Terms |
e3 |
33.3 MHz |
19.2 mm |
64 |
||||||||||||||||||
|
|
Altera |
EE PLD |
Industrial |
Gull Wing |
100 |
QFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
64 |
CMOS |
3.3/5,5 V |
Flatpack |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
.5 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
No |
e3 |
No |
|||||||||||||||||||||||
|
Altera |
EE PLD |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic |
45 ns |
No |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
72 |
2.54 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDIP-T20 |
No |
20 MHz |
8 |
||||||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
3.98 ns |
Yes |
1.89 V |
CMOS |
1.8 |
Flatpack, Fine Pitch |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 125 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
160 MHz |
220 °C (428 °F) |
28 mm |
125 |
|||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
1020 |
BGA |
Square |
Plastic/Epoxy |
1.79 ns |
Yes |
1.89 V |
1.8 |
Grid Array |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 708 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B1020 |
3 |
3.5 mm |
33 mm |
No |
e0 |
20 s |
220 °C (428 °F) |
33 mm |
708 |
||||||||||||||||||
|
Altera |
Loadable PLD |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
8320 |
Yes |
2.625 V |
CMOS |
128 |
2.5 |
1.8,1.8/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
4 Dedicated Inputs, 136 I/O |
4 |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
128 |
220 °C (428 °F) |
28 mm |
136 |
||||||||||||||||
|
Altera |
Flash PLD |
Ball |
100 |
BGA |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
2.5 |
Grid Array |
Macrocell |
2.375 V |
0 Dedicated Inputs, 0 I/O |
0 |
Tin Lead |
Bottom |
S-PBGA-B100 |
No |
It can also operate at 3.3 V |
e0 |
0 |
||||||||||||||||||||||||||||
|
Altera |
OT PLD |
Industrial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
40 ns |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J68 |
5.08 mm |
24.23 mm |
No |
128 Macrocells; 8 Labs |
62.5 MHz |
24.23 mm |
52 |
||||||||||||||||||||
|
Altera |
EE PLD |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
CMOS |
2.5 |
Grid Array |
Macrocell |
2.375 V |
1 mm |
4 Dedicated Inputs, 68 I/O |
4 |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
2.1 mm |
17 mm |
No |
e1 |
17 mm |
68 |
||||||||||||||||||||||||
|
Altera |
UV PLD |
Commercial |
Through-Hole |
40 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
25 ns |
No |
5.25 V |
CMOS |
5 |
In-Line, Window |
Macrocell |
4.75 V |
2.54 mm |
70 °C (158 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
0 °C (32 °F) |
Dual |
R-GDIP-T40 |
5.75 mm |
15.24 mm |
No |
24 Macrocells; 2 External Clocks |
62.5 MHz |
52.07 mm |
24 |
||||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
324 |
BGA |
Square |
Plastic/Epoxy |
1.73 ns |
4160 |
Yes |
1.89 V |
CMOS |
238 |
1.8 |
1.8,1.8/3.3 V |
Grid Array |
BGA324,18X18,40 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 246 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B324 |
3 |
3.5 mm |
19 mm |
No |
e0 |
160 MHz |
20 s |
238 |
220 °C (428 °F) |
19 mm |
246 |
||||||||||
|
Altera |
UV PLD |
Commercial |
J Bend |
68 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
33 ns |
Yes |
5.25 V |
CMOS |
5 |
Chip Carrier, Window |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
0 °C (32 °F) |
Quad |
S-CQCC-J68 |
5.08 mm |
24.13 mm |
No |
Labs interconnected by PIA; 8 Labs; 1 External Clock |
66.7 MHz |
24.13 mm |
52 |
||||||||||||||||||||
|
Altera |
Loadable PLD |
Commercial |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
9 ns |
4992 |
Yes |
2.7 V |
CMOS |
338 |
2.5 |
2.5/3.3,3.3 V |
Grid Array |
BGA672,26X26,40 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
1 mm |
70 °C (158 °F) |
338 I/O |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B672 |
3 |
2.1 mm |
27 mm |
No |
e0 |
338 |
220 °C (428 °F) |
27 mm |
338 |
|||||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
64 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
64 Macrocells; 4 Labs; Configurable I/O operation with 3.3 V or 5 V |
e0 |
125 MHz |
20 s |
235 °C (455 °F) |
14 mm |
Yes |
68 |
|||||||||
|
Altera |
EE PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
256 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 164 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
256 Macrocells |
e0 |
125 MHz |
220 °C (428 °F) |
28 mm |
Yes |
164 |
||||||||||
|
Altera |
EE PLD |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
6 ns |
Yes |
3.6 V |
256 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.63SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 116 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
166.7 MHz |
220 °C (428 °F) |
20 mm |
Yes |
116 |
|||||||||||
|
Altera |
EE PLD |
Industrial |
Ball |
356 |
LBGA |
Square |
Plastic/Epoxy |
16.6 ns |
Yes |
5.5 V |
560 |
CMOS |
5 |
3.3/5,5 V |
Grid Array, Low Profile |
BGA356,26X26,50 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 216 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B356 |
1.63 mm |
35 mm |
No |
560 Macrocells |
e0 |
117.6 MHz |
220 °C (428 °F) |
35 mm |
Yes |
216 |
|||||||||||
|
Altera |
Loadable PLD |
Ball |
400 |
BGA |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
2.5 |
Grid Array |
Macrocell |
2.375 V |
4 Dedicated Inputs |
4 |
Tin Lead |
Bottom |
S-PBGA-B400 |
3 |
No |
e0 |
220 °C (428 °F) |
||||||||||||||||||||||||||||
|
Altera |
Loadable PLD |
Ball |
780 |
HBGA |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
CMOS |
1.8 |
Grid Array, Heat Sink/Slug |
Macrocell |
1.71 V |
1 mm |
0 Dedicated Inputs, 486 I/O |
0 |
Tin Silver Copper |
Bottom |
S-PBGA-B780 |
3.5 mm |
29 mm |
No |
e1 |
29 mm |
486 |
||||||||||||||||||||||||
|
Altera |
Loadable PLD |
Commercial |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
0.7 ns |
Yes |
2.7 V |
2.5 |
Grid Array |
Mixed |
2.3 V |
70 °C (158 °F) |
4 Dedicated Inputs, 413 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B672 |
No |
e1 |
413 |
|||||||||||||||||||||||||
|
|
Altera |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
4.5 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Chip Carrier |
Macrocell |
3 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
64 MICROCELLS; 4 Labs; Configurable I/O operation with 2.5 V or 3.3 V |
e3 |
222.2 MHz |
16.5862 mm |
36 |
|||||||||||||||||
|
Altera |
EE PLD |
Commercial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
12 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Grid Array |
Macrocell |
3 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 164 I/O |
0 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
2.3 mm |
27 mm |
No |
256 Macrocells |
e1 |
100 MHz |
27 mm |
164 |
||||||||||||||||||
|
|
Altera |
Loadable PLD |
Commercial |
Ball |
356 |
LBGA |
Square |
Plastic/Epoxy |
0.4 ns |
Yes |
2.625 V |
CMOS |
2.5 |
Grid Array, Low Profile |
Mixed |
2.375 V |
1.27 mm |
70 °C (158 °F) |
274 I/O |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B356 |
1.63 mm |
35 mm |
No |
e1 |
35 mm |
274 |
||||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
2.41 ns |
2560 |
Yes |
1.89 V |
CMOS |
84 |
1.8 |
1.8,1.8/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 92 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
160 MHz |
20 s |
84 |
220 °C (428 °F) |
20 mm |
92 |
||||||||||
|
Altera |
OT PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
80 |
Yes |
5.25 V |
CMOS |
62 |
5 |
5 V |
Chip Carrier |
LDCC84,1.2SQ |
Field Programmable Gate Arrays |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 60 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
8 Labs; 80 Macrocells Configurable I/O operation with 3.3 V or 5 V |
e0 |
58.8 MHz |
62 |
220 °C (428 °F) |
29.3116 mm |
60 |
|||||||||||
|
Altera |
EE PLD |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
45 ns |
No |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
72 |
2.54 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Dual |
R-PDIP-T20 |
No |
20 MHz |
8 |
||||||||||||||||||||||
|
|
Altera |
Loadable PLD |
Commercial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
0.8 ns |
576 |
Yes |
3.6 V |
CMOS |
66 |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
Registered |
3 V |
.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 66 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
576 Logic Elements; 72 Labs |
e3 |
80 MHz |
30 s |
66 |
260 °C (500 °F) |
14 mm |
66 |
||||||||
|
Altera |
EE PLD |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.63SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 100 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
98 MHz |
220 °C (428 °F) |
20 mm |
Yes |
100 |
|||||||||||
|
|
Altera |
EE PLD |
Gull Wing |
48 |
QFP |
Plastic/Epoxy |
3.5 ns |
Yes |
32 |
CMOS |
1.8/3.3,2.5 V |
Flatpack |
QFP48(UNSPEC) |
Programmable Logic Devices |
Yes |
Matte Tin |
Quad |
No |
e3 |
Yes |
|||||||||||||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
356 |
LBGA |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
1.8 |
Grid Array, Low Profile |
Macrocell |
1.71 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 204 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B356 |
1.63 mm |
35 mm |
No |
e1 |
160 MHz |
35 mm |
204 |
|||||||||||||||||||||
|
Altera |
Loadable PLD |
Commercial |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
8.5 ns |
2880 |
Yes |
2.7 V |
CMOS |
254 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA672,26X26,40 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
1 mm |
70 °C (158 °F) |
254 I/O |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B672 |
3 |
2.1 mm |
27 mm |
No |
e0 |
254 |
220 °C (428 °F) |
27 mm |
254 |
|||||||||||||
|
Altera |
EE PLD |
Commercial |
Ball |
356 |
LBGA |
Square |
Plastic/Epoxy |
23.6 ns |
Yes |
5.25 V |
560 |
CMOS |
5 |
3.3/5,5 V |
Grid Array, Low Profile |
BGA356,26X26,50 |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 216 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B356 |
3 |
1.63 mm |
35 mm |
No |
560 Macrocells; 35 Labs; 772 Flip Flops; Configurable I/O operation with 3.3 V or 5 V |
e0 |
100 MHz |
220 °C (428 °F) |
35 mm |
Yes |
216 |
||||||||||
|
Altera |
UV PLD |
Industrial |
Pin/Peg |
192 |
WPGA |
Square |
Ceramic, Metal-Sealed Cofired |
25 ns |
No |
5.5 V |
CMOS |
5 |
Grid Array, Window |
Macrocell |
4.5 V |
2.54 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 160 I/O |
0 |
-40 °C (-40 °F) |
Perpendicular |
S-CPGA-P192 |
5.43 mm |
45.15 mm |
No |
256 Macrocells; Shared Input/Clock |
40 MHz |
45.15 mm |
160 |
||||||||||||||||||||
|
Altera |
Loadable PLD |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
8320 |
Yes |
1.89 V |
CMOS |
160 |
1.8 |
1.8,1.8/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
.5 mm |
4 Dedicated Inputs, 168 I/O |
4 |
Tin Lead |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e0 |
160 |
220 °C (428 °F) |
32 mm |
168 |
||||||||||||||||
|
Altera |
EE PLD |
Industrial |
Ball |
256 |
TBGA |
Square |
Plastic/Epoxy |
5 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Grid Array, Thin Profile |
BGA256,16X16,50 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 100 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
1.1 mm |
17 mm |
No |
e0 |
220 °C (428 °F) |
17 mm |
Yes |
100 |
||||||||||||
|
Altera |
Loadable PLD |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
1.73 ns |
4160 |
Yes |
1.89 V |
CMOS |
143 |
1.8 |
1.8,1.8/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 151 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e0 |
20 s |
143 |
220 °C (428 °F) |
28 mm |
151 |
|||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
96 |
CMOS |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 76 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
R-PQFP-G100 |
3 |
3.65 mm |
14 mm |
No |
e0 |
220 °C (428 °F) |
20 mm |
No |
76 |
||||||||||||
|
Altera |
EE PLD |
Commercial |
Ball |
169 |
BGA |
Square |
Plastic/Epoxy |
10 ns |
Yes |
128 |
CMOS |
2.5/3.3,3.3 V |
Grid Array |
BGA169,13X13 |
Programmable Logic Devices |
Yes |
1.5 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B169 |
3 |
No |
e0 |
220 °C (428 °F) |
Yes |
||||||||||||||||||||||
|
Altera |
UV PLD |
Military |
Through-Hole |
40 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
65 ns |
No |
5.5 V |
CMOS |
5 |
In-Line, Window |
Macrocell |
4.5 V |
2.54 mm |
125 °C (257 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
-55 °C (-67 °F) |
Dual |
R-GDIP-T40 |
5.715 mm |
15.24 mm |
No |
28 Macrocells |
23.2 MHz |
52.07 mm |
24 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.