| Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Altera |
OT PLD |
Commercial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
40 ns |
Yes |
5.25 V |
128 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC68,1.0SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J68 |
5.08 mm |
24.23 mm |
No |
128 Macrocells; Shared Input/Clock; Shared Product Terms |
e0 |
50 MHz |
220 °C (428 °F) |
24.23 mm |
No |
52 |
|||||||||||
|
Altera |
EE PLD |
Industrial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
7.5 ns |
Yes |
5.5 V |
128 |
CMOS |
5 |
3.3/5,5 V |
Flatpack |
QFP100,.7X.9 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.65 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
R-PQFP-G100 |
3 |
3.65 mm |
14 mm |
No |
128 Macrocells |
e0 |
166.7 MHz |
220 °C (428 °F) |
20 mm |
Yes |
84 |
||||||||||
|
|
Altera |
Loadable PLD |
Other |
Ball |
652 |
BGA |
Square |
Plastic/Epoxy |
2.5 ns |
Yes |
2.625 V |
CMOS |
2.5 |
Grid Array |
Macrocell |
2.375 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 502 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B652 |
3.5 mm |
45 mm |
No |
e1 |
45 mm |
502 |
|||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
652 |
BGA |
Square |
Plastic/Epoxy |
2.5 ns |
Yes |
2.625 V |
CMOS |
2.5 |
Grid Array |
Macrocell |
2.375 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 502 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B652 |
3.5 mm |
45 mm |
No |
e1 |
100 MHz |
45 mm |
502 |
|||||||||||||||||||
|
Altera |
Loadable PLD |
Commercial |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
0.9 ns |
Yes |
2.7 V |
2.5 |
Grid Array |
Mixed |
2.3 V |
70 °C (158 °F) |
4 Dedicated Inputs, 369 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B484 |
No |
e1 |
369 |
|||||||||||||||||||||||||
|
Altera |
Flash PLD |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
9.1 ns |
Yes |
1700 |
CMOS |
1.5/3.3,2.5/3.3 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
1 mm |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
No |
e0 |
220 °C (428 °F) |
Yes |
|||||||||||||||||||||||||
|
Altera |
UV PLD |
Commercial |
Pin/Peg |
68 |
WPGA |
Square |
Ceramic, Metal-Sealed Cofired |
55 ns |
No |
5.25 V |
128 |
CMOS |
5 |
5 V |
Grid Array, Window |
PGA68,11X11 |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
2.54 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
0 °C (32 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P68 |
1 |
4.96 mm |
27.94 mm |
No |
Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
40 MHz |
220 °C (428 °F) |
27.94 mm |
No |
52 |
||||||||||
|
Altera |
UV PLD |
Commercial |
Gull Wing |
100 |
WQFP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
25 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack, Window |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
19 Dedicated Inputs, 64 I/O |
19 |
0 °C (32 °F) |
Matte Tin |
Quad |
R-CQFP-G100 |
2.99 mm |
14 mm |
No |
Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock |
e3 |
83.3 MHz |
19.2 mm |
64 |
||||||||||||||||||
|
Altera |
OT PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
38 ns |
Yes |
5.5 V |
CMOS |
36 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
240 |
1.27 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
No |
Macrocells Interconnected By Global Bus; 24 Macrocells; 2 External Clocks |
e0 |
28.6 MHz |
24 |
220 °C (428 °F) |
24 |
|||||||||||||
|
|
Altera |
Loadable PLD |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
0.5 ns |
Yes |
2.625 V |
CMOS |
2.5 |
Flatpack, Fine Pitch |
Mixed |
2.375 V |
.5 mm |
70 °C (158 °F) |
147 I/O |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
4992 Logic Elements |
e3 |
140 MHz |
28 mm |
147 |
|||||||||||||||||
|
Altera |
Military |
J Bend |
44 |
QCCJ |
Square |
Ceramic |
Yes |
CMOS |
36 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Macrocell |
240 |
1.27 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-XQCC-J44 |
No |
e0 |
22.2 MHz |
24 |
220 °C (428 °F) |
|||||||||||||||||||||
|
Altera |
OT PLD |
Industrial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
55 ns |
Yes |
5.5 V |
128 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC68,1.0SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J68 |
5.08 mm |
24.23 mm |
No |
128 Macrocells; Shared Input/Clock; Shared Product Terms |
e0 |
33.3 MHz |
220 °C (428 °F) |
24.23 mm |
No |
52 |
|||||||||||
|
Altera |
EE PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
12 ns |
Yes |
5.5 V |
96 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 64 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
96 Macrocells |
e0 |
125 MHz |
220 °C (428 °F) |
29.3116 mm |
No |
64 |
|||||||||||
|
|
Altera |
Loadable PLD |
Commercial |
Gull Wing |
240 |
HFQFP |
Square |
Plastic/Epoxy |
0.7 ns |
4992 |
Yes |
3.6 V |
CMOS |
189 |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
HQFP240,1.37SQ,20 |
Field Programmable Gate Arrays |
Registered |
3 V |
.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 189 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e3 |
30 s |
189 |
245 °C (473 °F) |
32 mm |
189 |
||||||||||
|
Altera |
Loadable PLD |
Industrial |
Pin/Peg |
192 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
672 |
No |
5.5 V |
CMOS |
152 |
5 |
3.3/5,5 V |
Grid Array |
PGA192M,17X17 |
Field Programmable Gate Arrays |
Registered |
4.5 V |
2.54 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 132 I/O |
4 |
-40 °C (-40 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P192 |
1 |
5.43 mm |
45.15 mm |
No |
820 Flip Flops; 672 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e0 |
148 |
220 °C (428 °F) |
45.15 mm |
132 |
||||||||||||
|
Altera |
Loadable PLD |
Commercial |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
1008 |
Yes |
5.25 V |
CMOS |
148 |
5 |
5 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
QFP208(UNSPEC) |
Field Programmable Gate Arrays |
Registered |
4.75 V |
.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs |
4 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e0 |
144 |
220 °C (428 °F) |
28 mm |
||||||||||||||
|
|
Altera |
EE PLD |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
3.6 V |
512 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 176 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
512 Macrocells; 32 Labs; Configurable I/O operation with 2.5 V or 3.3 V |
e3 |
71.9 MHz |
30 s |
245 °C (473 °F) |
28 mm |
Yes |
176 |
||||||||
|
Altera |
EE PLD |
Industrial |
Ball |
49 |
FBGA |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
64 |
CMOS |
2.5/3.3,3.3 V |
Grid Array, Fine Pitch |
BGA49,7X7,32 |
Programmable Logic Devices |
Yes |
.8 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B49 |
3 |
No |
e0 |
220 °C (428 °F) |
Yes |
||||||||||||||||||||||
|
|
Altera |
Loadable PLD |
Commercial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
504 |
Yes |
5.25 V |
CMOS |
118 |
5 |
3.3,3.3/5,5 V |
Flatpack |
QFP160,1.2SQ |
Field Programmable Gate Arrays |
Registered |
4.75 V |
.65 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 118 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
3 |
4.07 mm |
28 mm |
No |
504 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e3 |
30 s |
118 |
245 °C (473 °F) |
28 mm |
118 |
||||||||||
|
Altera |
EE PLD |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
6 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Flatpack, Low Profile, Fine Pitch |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 120 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
e3 |
166.7 MHz |
20 mm |
120 |
|||||||||||||||||||
|
Altera |
OT PLD |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
55 ns |
No |
5.25 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
160 |
2.54 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
7.62 mm |
No |
16 Macrocells |
e0 |
22.2 MHz |
16 |
220 °C (428 °F) |
26.162 mm |
16 |
|||||||||||
|
Altera |
EE PLD |
Industrial |
Ball |
100 |
TBGA |
Square |
Plastic/Epoxy |
12 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Grid Array, Thin Profile |
Macrocell |
3 V |
1 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B100 |
1.1 mm |
11 mm |
No |
e1 |
100 MHz |
11 mm |
84 |
|||||||||||||||||||
|
Altera |
OT PLD |
Commercial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
17 ns |
Yes |
5.25 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
Small Outline |
SOP24,.4 |
Programmable Logic Devices |
Macrocell |
4.75 V |
160 |
1.27 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G24 |
2.65 mm |
7.5 mm |
No |
Macrocells Interconnected By Global Bus; 16 Macrocells; 2 External Clocks |
e0 |
71.4 MHz |
16 |
220 °C (428 °F) |
15.4 mm |
16 |
||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
3.1 ns |
16640 |
Yes |
2.625 V |
CMOS |
496 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA672,26X26,40 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
1 mm |
85 °C (185 °F) |
502 I/O |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B672 |
3 |
2.1 mm |
27 mm |
No |
e0 |
20 s |
496 |
220 °C (428 °F) |
27 mm |
502 |
||||||||||||
|
|
Altera |
Flash PLD |
Ball |
100 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
1.8 |
Grid Array |
Macrocell |
1.71 V |
0 Dedicated Inputs, 0 I/O |
0 |
Tin Silver Copper |
Bottom |
S-PBGA-B100 |
No |
e1 |
0 |
||||||||||||||||||||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.25 V |
160 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
160 Macrocells; 10 Labs; Configurable I/O operation with 3.3 V or 5 V |
e0 |
166.7 MHz |
20 s |
235 °C (455 °F) |
14 mm |
Yes |
84 |
|||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
304 |
FQFP |
Square |
Plastic/Epoxy |
23.6 ns |
Yes |
5.25 V |
560 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Fine Pitch |
HQFP304,1.7SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 216 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G304 |
4.5 mm |
40 mm |
No |
772 Flip Flops; Configurable I/O operation with 3.3 V or 5 V |
e0 |
100 MHz |
220 °C (428 °F) |
40 mm |
Yes |
216 |
|||||||||||
|
Altera |
UV PLD |
Commercial |
Gull Wing |
100 |
WQFP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
45 ns |
Yes |
5.25 V |
128 |
CMOS |
5 |
5 V |
Flatpack, Window |
QFP100,.7X.9 |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
19 Dedicated Inputs, 64 I/O |
19 |
0 °C (32 °F) |
Tin Lead |
Quad |
R-CQFP-G100 |
2.99 mm |
14 mm |
No |
Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
40 MHz |
220 °C (428 °F) |
19.2 mm |
No |
64 |
|||||||||||
|
Altera |
Loadable PLD |
Military |
Pin/Peg |
403 |
IPGA |
Square |
Ceramic, Metal-Sealed Cofired |
27 ns |
No |
5.5 V |
CMOS |
5 |
Grid Array, Interstitial Pitch |
Registered |
4.5 V |
2.54 mm |
125 °C (257 °F) |
4 Dedicated Inputs, 310 I/O |
4 |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P403 |
3.916 mm |
49.78 mm |
No |
2880 Logic elements Configurable I/O operation with 3.3 V or 5 V |
53.76 MHz |
49.78 mm |
310 |
||||||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Ball |
600 |
BGA |
Square |
Plastic/Epoxy |
24.2 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Grid Array |
Registered |
3 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 470 I/O |
4 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B600 |
1.93 mm |
45 mm |
No |
e1 |
45 mm |
470 |
||||||||||||||||||||
|
Altera |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
12 ns |
Yes |
3.6 V |
32 |
CMOS |
3.3 |
3.3 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
Macrocell |
3 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
Labs interconnected by PIA; 2 Labs; 32 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
90.9 MHz |
220 °C (428 °F) |
16.5862 mm |
No |
32 |
|||||||||||
|
Altera |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
3.3 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 64 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
76.9 MHz |
220 °C (428 °F) |
29.3116 mm |
Yes |
64 |
|||||||||||
|
Altera |
Loadable PLD |
Commercial |
Ball |
600 |
BGA |
Square |
Plastic/Epoxy |
0.6 ns |
9984 |
Yes |
2.625 V |
CMOS |
470 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA600,35X35,50 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
1.27 mm |
70 °C (158 °F) |
470 I/O |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B600 |
3 |
1.93 mm |
45 mm |
No |
e0 |
20 s |
470 |
220 °C (428 °F) |
45 mm |
470 |
||||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
652 |
LBGA |
Square |
Plastic/Epoxy |
Yes |
1.8 |
Grid Array, Low Profile |
Macrocell |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 488 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B652 |
1.63 mm |
45 mm |
No |
e1 |
220 °C (428 °F) |
45 mm |
488 |
|||||||||||||||||||||||
|
|
Altera |
Loadable PLD |
Commercial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
1.7 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Flatpack, Fine Pitch |
Registered |
3 V |
.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 181 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
Can also operate at 5 V supply |
e3 |
32 mm |
181 |
|||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
2.29 ns |
11520 |
Yes |
1.89 V |
CMOS |
144 |
1.8 |
1.8,1.8/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 152 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e0 |
160 MHz |
20 s |
144 |
220 °C (428 °F) |
32 mm |
152 |
||||||||||
|
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
HFQFP |
Square |
Plastic/Epoxy |
12 ns |
9984 |
Yes |
2.7 V |
CMOS |
182 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
HQFP240,1.37SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
.5 mm |
85 °C (185 °F) |
182 I/O |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e0 |
182 |
220 °C (428 °F) |
32 mm |
182 |
||||||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
144 |
LBGA |
Square |
Plastic/Epoxy |
2.41 ns |
2560 |
Yes |
1.89 V |
CMOS |
85 |
1.8 |
1.8,1.8/3.3 V |
Grid Array, Low Profile |
BGA144,12X12,40 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 93 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B144 |
3 |
1.7 mm |
13 mm |
No |
e0 |
160 MHz |
20 s |
85 |
235 °C (455 °F) |
13 mm |
93 |
||||||||||
|
Altera |
EE PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
96 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 60 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
100 MHz |
220 °C (428 °F) |
29.3116 mm |
No |
60 |
|||||||||||
|
Altera |
EE PLD |
Industrial |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
23.6 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 153 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
772 Flip Flops; Configurable I/O operation with 3.3 V or 5 V |
e3 |
100 MHz |
28 mm |
153 |
||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
652 |
LBGA |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
1.8 |
Grid Array, Low Profile |
Macrocell |
1.71 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 488 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B652 |
1.63 mm |
45 mm |
No |
e1 |
45 mm |
488 |
||||||||||||||||||||||
|
Altera |
EE PLD |
Commercial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
5 ns |
Yes |
2.625 V |
256 |
CMOS |
2.5 |
1.8/3.3,2.5 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
1 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 164 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
3.5 mm |
17 mm |
No |
e0 |
188.7 MHz |
20 s |
220 °C (428 °F) |
17 mm |
Yes |
164 |
||||||||||
|
Altera |
OT PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.5 V |
CMOS |
24 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
320 |
1.27 mm |
85 °C (185 °F) |
7 Dedicated Inputs, 16 I/O |
7 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
No |
Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
50 MHz |
16 |
220 °C (428 °F) |
16 |
|||||||||||||
|
|
Altera |
EE PLD |
Industrial |
Gull Wing |
100 |
QFP |
Square |
Plastic/Epoxy |
6 ns |
Yes |
64 |
CMOS |
3.3/5,5 V |
Flatpack |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
.5 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
No |
e3 |
No |
|||||||||||||||||||||||
|
|
Altera |
Loadable PLD |
Commercial |
Ball |
600 |
BGA |
Square |
Plastic/Epoxy |
0.5 ns |
Yes |
2.625 V |
CMOS |
2.5 |
Grid Array |
Mixed |
2.375 V |
1.27 mm |
70 °C (158 °F) |
424 I/O |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B600 |
1.93 mm |
45 mm |
No |
e1 |
45 mm |
424 |
||||||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Pin/Peg |
160 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
336 |
No |
5.5 V |
CMOS |
120 |
5 |
3.3/5,5 V |
Grid Array |
PGA160M,15X15 |
Field Programmable Gate Arrays |
Registered |
4.5 V |
2.54 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 116 I/O |
4 |
-40 °C (-40 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P160 |
1 |
5.34 mm |
39.624 mm |
No |
452 Flip Flops; 336 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e0 |
116 |
220 °C (428 °F) |
39.624 mm |
116 |
||||||||||||
|
|
Altera |
Flash PLD |
Ball |
256 |
BGA |
Rectangular |
Plastic/Epoxy |
9.5 ns |
Yes |
1.89 V |
440 |
CMOS |
1.8 |
1.5/3.3,1.8 V |
Grid Array |
BGA256,20X20,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
.5 mm |
0 Dedicated Inputs, 160 I/O |
0 |
Tin Silver Copper |
Bottom |
R-PBGA-B256 |
No |
It can also operate at 3.3 V |
e1 |
Yes |
160 |
||||||||||||||||||
|
Altera |
Loadable PLD |
Ball |
356 |
LBGA |
Square |
Plastic/Epoxy |
2560 |
Yes |
2.625 V |
CMOS |
188 |
2.5 |
1.8,1.8/3.3 V |
Grid Array, Low Profile |
BGA356,26X26,50 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
1.27 mm |
4 Dedicated Inputs, 196 I/O |
4 |
Tin Silver Copper |
Bottom |
S-PBGA-B356 |
1.63 mm |
35 mm |
No |
e1 |
188 |
220 °C (428 °F) |
35 mm |
196 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.