| Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Altera |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic |
50 ns |
No |
CMOS |
38535Q/M;38534H;883B |
18 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
74 |
2.54 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDIP-T20 |
No |
16.6 MHz |
8 |
||||||||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Pin/Peg |
599 |
IPGA |
Square |
Ceramic, Metal-Sealed Cofired |
16 ns |
9984 |
No |
2.7 V |
CMOS |
470 |
2.5 |
2.5,2.5/3.3 V |
Grid Array, Interstitial Pitch |
SPGA599,47X47 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
2.54 mm |
85 °C (185 °F) |
470 I/O |
-40 °C (-40 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P599 |
1 |
5.08 mm |
62.484 mm |
No |
e0 |
470 |
220 °C (428 °F) |
62.484 mm |
470 |
|||||||||||||
|
Altera |
OT PLD |
Commercial |
Through-Hole |
40 |
DIP |
Rectangular |
Plastic/Epoxy |
43 ns |
No |
5.25 V |
CMOS |
5 |
In-Line |
Macrocell |
4.75 V |
2.54 mm |
70 °C (158 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
0 °C (32 °F) |
Dual |
R-PDIP-T40 |
4.826 mm |
15.24 mm |
No |
24 Macrocells; 2 External Clocks |
32.3 MHz |
52.4256 mm |
24 |
||||||||||||||||||||
|
Altera |
OT PLD |
Commercial |
Through-Hole |
40 |
DIP |
Rectangular |
Plastic/Epoxy |
28 ns |
No |
5.25 V |
CMOS |
36 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP40,.6 |
Programmable Logic Devices |
Macrocell |
4.75 V |
240 |
2.54 mm |
70 °C (158 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T40 |
4.826 mm |
15.24 mm |
No |
Macrocells Interconnected By Global Bus; 24 Macrocells; 2 External Clocks |
e0 |
40 MHz |
24 |
220 °C (428 °F) |
52.4256 mm |
24 |
||||||||||
|
Altera |
Flash PLD |
Ball |
100 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
1.8 |
Grid Array |
Macrocell |
1.71 V |
0 Dedicated Inputs, 76 I/O |
0 |
Tin Lead |
Bottom |
S-PBGA-B100 |
No |
e0 |
76 |
|||||||||||||||||||||||||||||
|
Altera |
Loadable PLD |
Commercial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
0.4 ns |
2880 |
Yes |
2.625 V |
CMOS |
189 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
.5 mm |
70 °C (158 °F) |
189 I/O |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e0 |
20 s |
189 |
220 °C (428 °F) |
32 mm |
189 |
||||||||||||
|
Altera |
Loadable PLD |
Commercial |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
0.4 ns |
2880 |
Yes |
2.625 V |
CMOS |
254 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
1 mm |
70 °C (158 °F) |
254 I/O |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B484 |
3 |
2.1 mm |
23 mm |
No |
e0 |
20 s |
254 |
220 °C (428 °F) |
23 mm |
254 |
||||||||||||
|
|
Altera |
Flash PLD |
Automotive |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
7 ns |
Yes |
2.625 V |
440 |
CMOS |
2.5 |
1.5/3.3,2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
.5 mm |
125 °C (257 °F) |
0 Dedicated Inputs, 116 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
It can also operate at 3.3 V |
e3 |
20 mm |
Yes |
116 |
||||||||||||
|
|
Altera |
Loadable PLD |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
CMOS |
5 |
Flatpack, Fine Pitch |
Registered |
4.75 V |
.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 136 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
504 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e3 |
28 mm |
136 |
||||||||||||||||||
|
Altera |
EE PLD |
Industrial |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
16.6 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 149 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
560 Macrocells |
e3 |
28 mm |
149 |
|||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
8320 |
Yes |
2.625 V |
CMOS |
168 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 174 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e3 |
168 |
220 °C (428 °F) |
32 mm |
174 |
|||||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
64 |
CMOS |
5 |
3.3/5,5 V |
Flatpack |
QFP100,.7X.9 |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
R-PQFP-G100 |
3 |
3.65 mm |
14 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
100 MHz |
220 °C (428 °F) |
20 mm |
No |
68 |
||||||||||
|
Altera |
OT PLD |
Military |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.5 V |
CMOS |
24 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
320 |
1.27 mm |
125 °C (257 °F) |
7 Dedicated Inputs, 16 I/O |
7 |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
No |
Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
50 MHz |
16 |
220 °C (428 °F) |
11.5062 mm |
16 |
||||||||||
|
|
Altera |
EE PLD |
Industrial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
192 |
CMOS |
3.3/5,5 V |
Flatpack |
QFP160,1.2SQ |
Programmable Logic Devices |
Yes |
.635 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
No |
e3 |
Yes |
|||||||||||||||||||||||
|
Altera |
EE PLD |
Industrial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
12 ns |
Yes |
5.5 V |
160 |
CMOS |
5 |
3.3/5,5 V |
Flatpack |
QFP100,.7X.9 |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
.65 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
R-PQFP-G100 |
3 |
3.65 mm |
14 mm |
No |
160 Macrocells |
e0 |
125 MHz |
220 °C (428 °F) |
20 mm |
No |
84 |
||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
5.5 ns |
Yes |
3.6 V |
256 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.63SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 120 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
172.4 MHz |
20 s |
220 °C (428 °F) |
20 mm |
Yes |
120 |
||||||||||
|
Altera |
Flash PLD |
Ball |
100 |
BGA |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
2.5 |
Grid Array |
Macrocell |
2.375 V |
0 Dedicated Inputs, 76 I/O |
0 |
Tin Lead |
Bottom |
S-PBGA-B100 |
No |
It can also operate at 3.3 V |
e0 |
76 |
||||||||||||||||||||||||||||
|
Altera |
Flash PLD |
Ball |
100 |
BGA |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
2.5 |
Grid Array |
Macrocell |
2.375 V |
0 Dedicated Inputs, 76 I/O |
0 |
Tin Lead |
Bottom |
S-PBGA-B100 |
No |
It can also operate at 3.3 V |
e0 |
76 |
||||||||||||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
356 |
LBGA |
Square |
Plastic/Epoxy |
3.6 ns |
4160 |
Yes |
2.625 V |
CMOS |
246 |
2.5 |
2.5,2.5/3.3 V |
Grid Array, Low Profile |
BGA356,26X26,50 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 252 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B356 |
3 |
1.63 mm |
35 mm |
No |
e0 |
20 s |
246 |
220 °C (428 °F) |
35 mm |
252 |
|||||||||||
|
Altera |
UV PLD |
Military |
J Bend |
44 |
WQCCJ |
Square |
Ceramic, Glass-Sealed |
60 ns |
Yes |
5.5 V |
CMOS |
36 |
PAL-TYPE |
5 |
5 V |
Chip Carrier, Window |
LDCC44,.7SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
240 |
1.27 mm |
125 °C (257 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-GQCC-J44 |
4.57 mm |
16.51 mm |
No |
24 Macrocells |
e0 |
20 MHz |
24 |
220 °C (428 °F) |
16.51 mm |
24 |
||||||||||
|
Altera |
Loadable PLD |
Military |
Gull Wing |
304 |
QFP |
Square |
Plastic/Epoxy |
23.8 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack |
Registered |
4.5 V |
125 °C (257 °F) |
4 Dedicated Inputs |
4 |
-55 °C (-67 °F) |
Matte Tin |
Quad |
S-PQFP-G304 |
No |
3744 Logic elements; Built-in JTAG boundry-scan test circuitry |
e3 |
60.6 MHz |
|||||||||||||||||||||||
|
Altera |
EE PLD |
Industrial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack |
Macrocell |
4.5 V |
.65 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 128 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
4.07 mm |
28 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e3 |
76.9 MHz |
28 mm |
128 |
||||||||||||||||||
|
Altera |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic |
No |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
200 |
2.54 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-XDIP-T24 |
No |
e0 |
33 MHz |
12 |
220 °C (428 °F) |
||||||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
6400 |
Yes |
2.625 V |
CMOS |
167 |
2.5 |
1.8,1.8/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 175 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
160 MHz |
167 |
220 °C (428 °F) |
32 mm |
175 |
|||||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
5.5 ns |
Yes |
2.625 V |
512 |
CMOS |
2.5 |
1.8/3.3,2.5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 176 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e0 |
163.9 MHz |
20 s |
220 °C (428 °F) |
28 mm |
Yes |
176 |
||||||||||
|
Altera |
Loadable PLD |
Industrial |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
12 ns |
Yes |
2.7 V |
CMOS |
2.5 |
Grid Array |
Mixed |
2.3 V |
1 mm |
85 °C (185 °F) |
413 I/O |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B672 |
2.1 mm |
27 mm |
No |
e1 |
27 mm |
413 |
|||||||||||||||||||||
|
|
Altera |
EE PLD |
Commercial |
Ball |
169 |
FBGA |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
128 |
CMOS |
1.8/3.3,2.5 V |
Grid Array, Fine Pitch |
BGA169,13X13,32 |
Programmable Logic Devices |
Yes |
.8 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B169 |
No |
e1 |
Yes |
|||||||||||||||||||||||
|
|
Altera |
Loadable PLD |
Commercial |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
0.6 ns |
Yes |
2.625 V |
CMOS |
2.5 |
Grid Array |
Mixed |
2.375 V |
1 mm |
70 °C (158 °F) |
220 I/O |
0 °C (32 °F) |
Tin/Silver/Copper |
Bottom |
S-PBGA-B484 |
3 |
2.1 mm |
23 mm |
No |
e1 |
40 s |
260 °C (500 °F) |
23 mm |
220 |
|||||||||||||||||
|
Altera |
Loadable PLD |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
504 |
Yes |
5.25 V |
CMOS |
136 |
5 |
3.3/5,5 V |
Flatpack, Fine Pitch |
HQFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Registered |
4.75 V |
.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 136 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
504 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e0 |
385 MHz |
132 |
220 °C (428 °F) |
28 mm |
136 |
||||||||||||
|
Altera |
EE PLD |
Commercial |
Ball |
100 |
TBGA |
Square |
Plastic/Epoxy |
12 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Grid Array, Thin Profile |
Macrocell |
3 V |
1 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B100 |
1.1 mm |
11 mm |
No |
e1 |
100 MHz |
11 mm |
84 |
|||||||||||||||||||
|
Altera |
OT PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
45 ns |
Yes |
5.25 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
160 |
1.27 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
11.5316 mm |
No |
16 Macrocells |
e0 |
26.3 MHz |
16 |
220 °C (428 °F) |
11.5316 mm |
16 |
|||||||||||
|
|
Altera |
Loadable PLD |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
3 ns |
Yes |
2.625 V |
CMOS |
2.5 |
Flatpack, Fine Pitch |
Macrocell |
2.375 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 144 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
e3 |
28 mm |
144 |
|||||||||||||||||||
|
Altera |
Loadable PLD |
Commercial |
Pin/Peg |
503 |
IPGA |
Square |
Ceramic, Metal-Sealed Cofired |
0.5 ns |
4992 |
No |
5.25 V |
CMOS |
406 |
5 |
3.3/5,5 V |
Grid Array, Interstitial Pitch |
SPGA503,43X43 |
Field Programmable Gate Arrays |
Registered |
4.75 V |
2.54 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 406 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P503 |
1 |
5.077 mm |
57.4 mm |
No |
e0 |
406 |
220 °C (428 °F) |
57.4 mm |
406 |
||||||||||||
|
|
Altera |
Loadable PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
0.6 ns |
576 |
Yes |
5.25 V |
CMOS |
102 |
5 |
3.3/5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.63SQ,20 |
Field Programmable Gate Arrays |
Registered |
4.75 V |
.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 102 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
30 s |
102 |
260 °C (500 °F) |
20 mm |
102 |
||||||||||
|
Altera |
OT PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
55 ns |
Yes |
5.5 V |
64 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
7 Dedicated Inputs, 28 I/O |
7 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
No |
Labs interconnected by PIA; 4 Labs; 64 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
33.3 MHz |
220 °C (428 °F) |
No |
28 |
||||||||||||||
|
Altera |
Flash PLD |
Commercial Extended |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
5.4 ns |
Yes |
1.89 V |
440 |
CMOS |
1.8 |
1.5/3.3,1.8 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 76 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e0 |
20 s |
235 °C (455 °F) |
14 mm |
Yes |
76 |
|||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
23.2 ns |
Yes |
5.25 V |
400 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Fine Pitch |
HQFP240,1.37SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 159 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
580 Flip Flops; Configurable I/O operation with 3.3 V or 5 V |
e0 |
100 MHz |
220 °C (428 °F) |
32 mm |
Yes |
159 |
|||||||||||
|
Altera |
Loadable PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
1.9 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Chip Carrier |
Registered |
3 V |
1.27 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 68 I/O |
4 |
0 °C (32 °F) |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
Can also operate at 5 V supply |
29.3116 mm |
68 |
|||||||||||||||||||||
|
Altera |
Loadable PLD |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
8320 |
Yes |
2.625 V |
CMOS |
128 |
2.5 |
1.8,1.8/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
4 Dedicated Inputs, 136 I/O |
4 |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
128 |
220 °C (428 °F) |
28 mm |
136 |
||||||||||||||||
|
Altera |
Flash PLD |
Gull Wing |
100 |
QFP |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
1.8 |
Flatpack |
Macrocell |
1.71 V |
0 Dedicated Inputs, 0 I/O |
0 |
Tin Lead |
Quad |
S-PQFP-G100 |
No |
e0 |
0 |
|||||||||||||||||||||||||||||
|
Altera |
UV PLD |
Military |
Pin/Peg |
100 |
WPGA |
Square |
Ceramic, Metal-Sealed Cofired |
55 ns |
No |
5.5 V |
CMOS |
5 |
Grid Array, Window |
Macrocell |
4.5 V |
2.54 mm |
125 °C (257 °F) |
19 Dedicated Inputs, 64 I/O |
19 |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P100 |
4.953 mm |
33.528 mm |
No |
128 Macrocells; Shared Input/Clock; Shared Product Terms |
33.3 MHz |
33.528 mm |
64 |
||||||||||||||||||||
|
Altera |
OT PLD |
Industrial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
20 ns |
Yes |
5.5 V |
CMOS |
16 |
PAL-TYPE |
5 |
5 V |
Small Outline |
SOP20,.4 |
Programmable Logic Devices |
Macrocell |
4.5 V |
160 |
1.27 mm |
85 °C (185 °F) |
7 Dedicated Inputs, 8 I/O |
7 |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G20 |
2.65 mm |
7.5 mm |
No |
Macrocells interconnected by PIA; 16 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
62.5 MHz |
8 |
220 °C (428 °F) |
12.8 mm |
8 |
||||||||||
|
Altera |
EE PLD |
Industrial |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
16.2 ns |
Yes |
5.5 V |
400 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
HQFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 139 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
400 Macrocells; 580 Flip Flops; 25 Labs; Configurable I/O operation with 3.3 V or 5 V |
e0 |
117.6 MHz |
220 °C (428 °F) |
28 mm |
Yes |
139 |
|||||||||||
|
Altera |
Loadable PLD |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
14.5 ns |
Yes |
CMOS |
2.5 |
Flatpack, Fine Pitch |
Mixed |
.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 147 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
e3 |
28 mm |
147 |
||||||||||||||||||||||
|
Altera |
EE PLD |
Industrial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
20 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack |
Macrocell |
4.5 V |
.65 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
R-PQFP-G100 |
3.65 mm |
14 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e3 |
62.5 MHz |
20 mm |
80 |
||||||||||||||||||
|
|
Altera |
Loadable PLD |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
1.94 ns |
Yes |
1.575 V |
CMOS |
1.5 |
Grid Array |
Macrocell |
1.425 V |
1 mm |
492 I/O |
Tin/Silver/Copper |
Bottom |
S-PBGA-B672 |
2.1 mm |
27 mm |
No |
e1 |
40 s |
245 °C (473 °F) |
27 mm |
492 |
|||||||||||||||||||||
|
Altera |
EE PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
32 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
e0 |
100 MHz |
220 °C (428 °F) |
16.5862 mm |
Yes |
32 |
||||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
5.25 V |
192 |
CMOS |
5 |
3.3/5,5 V |
Flatpack |
QFP160,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 124 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G160 |
3 |
4.07 mm |
28 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
125 MHz |
220 °C (428 °F) |
28 mm |
No |
124 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.