Altera Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
EPF10K200SQI240-1X	Altera	Loadable PLD	Industrial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	9 ns		Yes	2.7 V		CMOS				2.5		Flatpack, Fine Pitch				Mixed	2.3 V		.5 mm	85 °C (185 °F)	182 I/O		-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3					32 mm		182
EPM7256AFI256-12	Altera	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	12 ns		Yes	3.6 V	256	CMOS				3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 164 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	78.1 MHz			220 °C (428 °F)	17 mm	Yes	164
EPM9560RC304-20	Altera	EE PLD	Commercial	Gull Wing	304	FQFP	Square	Plastic/Epoxy	23.6 ns		Yes	5.25 V	560	CMOS				5	3.3/5,5 V	Flatpack, Fine Pitch	HQFP304,1.7SQ,20	Programmable Logic Devices	Yes	Macrocell	4.75 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 216 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G304	3	4.5 mm	40 mm	No	772 Flip Flops; Configurable I/O operation with 3.3 V or 5 V	e0	100 MHz			220 °C (428 °F)	40 mm	Yes	216
EPM5032LC28-20	Altera	OT PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	20 ns		Yes	5.25 V		CMOS		24	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	320	1.27 mm	70 °C (158 °F)	7 Dedicated Inputs, 16 I/O	7	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28		4.57 mm	11.5062 mm	No	32 Macrocells; Shared Input/Clock; Shared Product Terms	e0	62.5 MHz		16	220 °C (428 °F)	11.5062 mm		16
EP320DI-1	Altera	UV PLD	Industrial	Through-Hole	20	WDIP	Rectangular	Ceramic, Glass-Sealed	25 ns		No	5.5 V		CMOS				5		In-Line, Window				Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)		Dual	R-GDIP-T20		4.826 mm	7.62 mm	No	8 Macrocells; Shared Input/Clock		58.8 MHz				24.003 mm		8
EPF10K50ERI240-1	Altera	Loadable PLD	Industrial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	8.5 ns	2880	Yes	2.7 V		CMOS		189		2.5	2.5,2.5/3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Mixed	2.3 V		.5 mm	85 °C (185 °F)	189 I/O		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e0			189	220 °C (428 °F)	32 mm		189
EPF10K50EBI356-3	Altera	Loadable PLD	Industrial	Ball	356	LBGA	Square	Plastic/Epoxy	13.5 ns	2880	Yes	2.7 V		CMOS		220		2.5	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Mixed	2.3 V		1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 220 I/O	4	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e0			220	220 °C (428 °F)	35 mm		220
EPF10K40BC356-4	Altera	Loadable PLD	Commercial	Ball	356	HLBGA	Square	Plastic/Epoxy	23.8 ns		Yes	5.25 V		CMOS				5		Grid Array, Heat Sink/Slug, Low Profile				Registered	4.75 V		1.27 mm	70 °C (158 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No	2304 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	60.6 MHz				35 mm
EPS464JC44-20	Altera	UV PLD	Commercial	J Bend	44	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	20 ns		Yes	5.25 V		CMOS				5		Chip Carrier, Window				Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 32 I/O	0	0 °C (32 °F)		Quad	S-CQCC-J44		4.57 mm	16.51 mm	No	64 Macrocells; Shared Input/Clock; Shared Product Terms		66.7 MHz				16.51 mm		32
EP1K10FI256-2	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	0.5 ns	576	Yes	2.625 V		CMOS		136		2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,50	Field Programmable Gate Arrays		Mixed	2.375 V		1 mm	85 °C (185 °F)	136 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	37.5 MHz	20 s	136	220 °C (428 °F)	17 mm		136
EPF8820AQM160-4	Altera	Loadable PLD	Military	Gull Wing	160	QFP	Square	Plastic/Epoxy			Yes	5.5 V		CMOS				5		Flatpack				Registered	4.5 V		.65 mm	125 °C (257 °F)	4 Dedicated Inputs, 116 I/O	4	-55 °C (-67 °F)	Matte Tin	Quad	S-PQFP-G160		4.07 mm	28 mm	No	820 Flip Flops; 672 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3					28 mm		116
EP610LI28-30	Altera	OT PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	32 ns		Yes	5.5 V		CMOS				5		Chip Carrier				Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 16 I/O	4	-40 °C (-40 °F)		Quad	S-PQCC-J28		4.572 mm	11.5062 mm	No	16 Macrocells; 2 External Clocks		41.7 MHz				11.5062 mm		16
EPF10K250EGI599-2	Altera	Loadable PLD	Industrial	Pin/Peg	599	HIPGA	Square	Ceramic, Metal-Sealed Cofired		12160	No	2.7 V		CMOS		470		2.5	2.5,2.5/3.3 V	Grid Array, Heat Sink/Slug, Interstitial Pitch	SPGA599,47X47	Field Programmable Gate Arrays		Mixed	2.3 V		2.54 mm	85 °C (185 °F)	4 Dedicated Inputs, 470 I/O	4	-40 °C (-40 °F)	Tin Lead	Perpendicular	S-CPGA-P599	1	5.08 mm	62.484 mm	No		e0			470	220 °C (428 °F)	62.484 mm		470
EP20K300EBC652-2XN	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	2.29 ns		Yes	1.89 V		CMOS				1.8		Grid Array				Macrocell	1.71 V		1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 408 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		3.5 mm	45 mm	No		e1	160 MHz				45 mm		408
5M240ZM68I5N	Altera	Flash PLD	Industrial	Ball	68	TFBGA	Square	Plastic/Epoxy	14 ns		Yes	1.89 V	192	CMOS				1.8	1.8,1.2/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA68,9X9,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	100 °C (212 °F)	52 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B68		1.2 mm	5 mm	No		e1	118.3 MHz				5 mm	Yes	52
EPF10K50SQC208-1	Altera	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	0.3 ns	2880	Yes	2.625 V		CMOS		147		2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Mixed	2.375 V		.5 mm	70 °C (158 °F)	147 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0			147	220 °C (428 °F)	28 mm		147
EPM5130AGC-20	Altera	UV PLD	Commercial	Pin/Peg	100	WPGA	Square	Ceramic, Metal-Sealed Cofired	33 ns		No	5.25 V		CMOS				5		Grid Array, Window				Macrocell	4.75 V		2.54 mm	70 °C (158 °F)	19 Dedicated Inputs, 64 I/O	19	0 °C (32 °F)		Perpendicular	S-CPGA-P100		3.81 mm	33.528 mm	No	Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock		66.7 MHz				33.528 mm		64
EPM7256ATC144-10	Altera	EE PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	256	CMOS				3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 120 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	256 Macrocells; 16 Labs; Configurable I/O operation with 2.5 V or 3.3 V	e0	93.5 MHz			220 °C (428 °F)	20 mm	Yes	120
EPM7064AEFC49-7	Altera	EE PLD	Commercial	Ball	49	FBGA	Square	Plastic/Epoxy	7.5 ns		Yes		64	CMOS					2.5/3.3,3.3 V	Grid Array, Fine Pitch	BGA49,7X7,32	Programmable Logic Devices	Yes				.8 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B49	3			No		e0				220 °C (428 °F)		Yes
EPF10K50STI144-2X	Altera	Loadable PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	9.5 ns		Yes	2.7 V		CMOS				2.5		Flatpack, Low Profile, Fine Pitch				Mixed	2.3 V		.5 mm	85 °C (185 °F)	102 I/O		-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144		1.6 mm	20 mm	No		e3					20 mm		102
EPM570GM256I5	Altera	Flash PLD		Ball	256	FBGA	Square	Plastic/Epoxy	8.7 ns		Yes		440	CMOS					1.8,1.8/3 V	Grid Array, Fine Pitch	BGA256,20X20,20	Programmable Logic Devices	Yes				.5 mm						Bottom	S-PBGA-B256				No								Yes
EPM7128STC100-6N	Altera	EE PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	6 ns		Yes	5.25 V	128	CMOS				5	3.3/5,5 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 84 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No	Configurable I/O operation with 3.3 V or 5 V	e3	166.7 MHz				14 mm	Yes	84
EPF10K100BRC240-3	Altera	Loadable PLD	Commercial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	14.5 ns	4992	Yes	2.7 V		CMOS		189		2.5	2.5/3.3,3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays		Mixed	2.3 V		.5 mm	70 °C (158 °F)	189 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e0			189	220 °C (428 °F)	32 mm		189
EPM7256BQI208-10	Altera	EE PLD		Gull Wing	208	FQFP	Square	Plastic/Epoxy	10 ns		Yes	2.625 V	256	CMOS				2.5	1.8/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm		0 Dedicated Inputs, 164 I/O	0		Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0	94.3 MHz			220 °C (428 °F)	28 mm	Yes	164
EP20K100EQI240-3X	Altera	Loadable PLD		Gull Wing	240	FQFP	Square	Plastic/Epoxy			Yes	2.625 V		CMOS				2.5		Flatpack, Fine Pitch				Macrocell	2.375 V		.5 mm		4 Dedicated Inputs, 183 I/O	4		Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3				220 °C (428 °F)	32 mm		183
EPM7128BFC256-7	Altera	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	4 ns		Yes	2.625 V	128	CMOS				2.5	1.8/3.3,2.5 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 100 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	3.5 mm	17 mm	No		e0	243.9 MHz	20 s		220 °C (428 °F)	17 mm	Yes	100
EP20K160EFC484	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes							1.8		Grid Array				Macrocell			1 mm	85 °C (185 °F)	4 Dedicated Inputs, 324 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1				220 °C (428 °F)	23 mm		324
EPF10K100EQI240-1	Altera	Loadable PLD	Industrial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	9 ns	4992	Yes	2.7 V		CMOS		189		2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays		Mixed	2.3 V		.5 mm	85 °C (185 °F)	189 I/O		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0			189	220 °C (428 °F)	32 mm		189
EPM7256EWM883B-15	Altera	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	5 ns		Yes	2.625 V	256	CMOS	38535Q/M;38534H;883B			2.5	3.3/5,5 V	Grid Array	QFP208,1.2SQ,20	Programmable Logic Devices	No	Macrocell	2.375 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 0 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256		2.3 mm	27 mm	No		e0	188.7 MHz			220 °C (428 °F)	27 mm	No	0
EPM7032BLI44-3N	Altera	EE PLD		J Bend	44	QCCJ	Square	Plastic/Epoxy	3.5 ns		Yes		32	CMOS					1.8/3.3,2.5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes				1.27 mm					Matte Tin	Quad	S-PQCC-J44	1			No		e3						Yes
EPF8282ALI84-A-3	Altera	Loadable PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	1.8 ns		Yes	3.6 V		CMOS				3.3		Chip Carrier				Registered	3 V		1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 68 I/O	4	-40 °C (-40 °F)		Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	Can also operate at 5 V supply						29.3116 mm		68
EPM9400RI240-20C	Altera	EE PLD	Industrial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	23.2 ns		Yes	5.5 V		CMOS				5		Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell	4.5 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 159 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No	580 Flip Flops; Configurable I/O operation with 3.3 V or 5 V	e3	100 MHz				32 mm		159
EPF10K100BRC240	Altera	Loadable PLD	Commercial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy			Yes							2.5		Flatpack, Heat Sink/Slug, Fine Pitch				Mixed			.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3					32 mm		189
EPF10K100EFC672-1X	Altera	Loadable PLD	Commercial	Ball	672	BGA	Square	Plastic/Epoxy	9 ns		Yes	2.7 V		CMOS				2.5		Grid Array				Mixed	2.3 V		1 mm	70 °C (158 °F)	338 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1					27 mm		338
EPF10K200SFC484-3X	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.8 ns		Yes	2.625 V		CMOS				2.5		Grid Array				Mixed	2.375 V		1 mm	70 °C (158 °F)	369 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm		369
EPF10K130EBI484-3	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	0.9 ns		Yes	2.7 V						2.5		Grid Array				Mixed	2.3 V			85 °C (185 °F)	4 Dedicated Inputs, 369 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484				No		e1							369
EP20K160ERI240-3	Altera	Loadable PLD		Gull Wing	240	FQFP	Square	Plastic/Epoxy		6400	Yes	2.625 V		CMOS		167		2.5	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays		Macrocell	2.375 V		.5 mm		4 Dedicated Inputs, 175 I/O	4		Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3			167	220 °C (428 °F)	32 mm		175
EP20K200RC208-1X	Altera	Loadable PLD	Other	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	2.5 ns	8320	Yes	2.625 V		CMOS		138		2.5	2.5,2.5/3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Macrocell	2.375 V		.5 mm	85 °C (185 °F)	144 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3			138	220 °C (428 °F)	28 mm		144
EPM7064AEUI49-10	Altera	EE PLD	Industrial	Ball	49	FBGA	Square	Plastic/Epoxy	10 ns		Yes		64	CMOS					2.5/3.3,3.3 V	Grid Array, Fine Pitch	BGA49,7X7,32	Programmable Logic Devices	Yes				.8 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B49				No		e0				220 °C (428 °F)		Yes
EP20K200RC208	Altera	Loadable PLD	Other	Gull Wing	208	HFQFP	Square	Plastic/Epoxy			Yes	2.625 V						2.5		Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell	2.375 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 144 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3				220 °C (428 °F)	28 mm		144
EPF10K20RI240-4	Altera	Loadable PLD	Industrial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	0.6 ns	1152	Yes	5.25 V		CMOS		189		5	3.3/5,5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Registered	4.75 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 189 I/O	4	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	1152 Logic Elements	e0	67.11 MHz	20 s	189	220 °C (428 °F)	32 mm		189
EP20K60EFC484-2	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes	1.89 V						1.8		Grid Array				Macrocell	1.71 V		1 mm	85 °C (185 °F)	4 Dedicated Inputs, 204 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1	160 MHz			220 °C (428 °F)	23 mm		204
EP20K1500EFC1020-2	Altera	Loadable PLD	Other	Ball	1020	HBGA	Square	Plastic/Epoxy		51840	Yes	2.625 V		CMOS		808		2.5	1.8,2.5,3.3 V	Grid Array, Heat Sink/Slug	BGA1020,32X32,40	Field Programmable Gate Arrays		Macrocell	2.375 V		1 mm	85 °C (185 °F)	4 Dedicated Inputs, 808 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e0	160 MHz		808	220 °C (428 °F)	33 mm		808
5M160ZM100C4N	Altera	Flash PLD	Other	Ball	100	TFBGA	Square	Plastic/Epoxy	7.9 ns		Yes	1.89 V	128	CMOS				1.8	1.2/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	79 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100		1.2 mm	6 mm	No		e1	184.1 MHz				6 mm	Yes	79
EPM9560RC240-15C	Altera	EE PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	16.6 ns		Yes	5.25 V	560	CMOS				5	3.3/5,5 V	Flatpack, Fine Pitch	HQFP240,1.37SQ,20	Programmable Logic Devices	Yes	Macrocell	4.75 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 191 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240		4.1 mm	32 mm	No	772 Flip Flops; Configurable I/O operation with 3.3 V or 5 V	e0	117.6 MHz			220 °C (428 °F)	32 mm	Yes	191
EPF10K50ERC240-3	Altera	Loadable PLD	Commercial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	13.5 ns	2880	Yes	2.7 V		CMOS		189		2.5	3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Mixed	2.3 V		.5 mm	70 °C (158 °F)	189 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e0			189	220 °C (428 °F)	32 mm		189
EP20K160EQC240-3N	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	2.29 ns	6400	Yes	1.89 V		CMOS		167		1.8	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays		Macrocell	1.71 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 175 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3	160 MHz	30 s	167	245 °C (473 °F)	32 mm		175
EPM7032QC44-6	Altera	EE PLD	Commercial	Gull Wing	44	QFP	Square	Plastic/Epoxy	6 ns		Yes	5.25 V	32	CMOS				5	5 V	Flatpack	QFP44,.5SQ,32	Programmable Logic Devices	No	Macrocell	4.75 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 32 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G44	3	2.45 mm	10 mm	No	2 Labs; 32 Macrocells; 1 External Clock; Shared Input/Clock	e0	151.5 MHz			220 °C (428 °F)	10 mm	No	32

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.