| Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Altera |
OT PLD |
Industrial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
55 ns |
Yes |
5.5 V |
128 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC68,1.0SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J68 |
5.08 mm |
24.23 mm |
No |
Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
40 MHz |
220 °C (428 °F) |
24.23 mm |
No |
52 |
|||||||||||
|
Altera |
EE PLD |
Industrial |
Gull Wing |
240 |
HFQFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 159 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
400 Macrocells; 580 Flip Flops; Configurable I/O operation with 3.3 V or 5 V |
e3 |
118 MHz |
32 mm |
159 |
||||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier |
Registered |
4.5 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 64 I/O |
4 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
282 Flip Flops; 208 Logic elements; Built-in JTAG boundry-scan test circuitry |
29.3116 mm |
64 |
||||||||||||||||||||||
|
|
Altera |
EE PLD |
Industrial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
15 ns |
Yes |
128 |
CMOS |
3.3/5,5 V |
Flatpack |
QFP100,.7X.9 |
Programmable Logic Devices |
Yes |
.635 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
R-PQFP-G100 |
No |
e3 |
Yes |
|||||||||||||||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
256 |
CMOS |
5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 160 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e3 |
100 MHz |
28 mm |
160 |
|||||||||||||||||
|
Altera |
OT PLD |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
16 ns |
Yes |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
Small Outline |
SOP20,.4 |
Programmable Logic Devices |
Macrocell |
4.75 V |
72 |
1.27 mm |
70 °C (158 °F) |
9 Dedicated Inputs, 8 I/O |
9 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G20 |
2.65 mm |
7.5 mm |
No |
8 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
83.3 MHz |
8 |
220 °C (428 °F) |
12.8 mm |
8 |
||||||||||
|
Altera |
EE PLD |
Commercial |
Ball |
100 |
LBGA |
Square |
Plastic/Epoxy |
4 ns |
Yes |
2.625 V |
128 |
CMOS |
2.5 |
1.8/3.3,2.5 V |
Grid Array, Low Profile |
BGA100,10X10,40 |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
1 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B100 |
3 |
1.7 mm |
11 mm |
No |
e0 |
243.9 MHz |
20 s |
235 °C (455 °F) |
11 mm |
Yes |
84 |
||||||||||
|
Altera |
OT PLD |
Commercial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
17 ns |
Yes |
5.25 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
Small Outline |
SOP24,.4 |
Programmable Logic Devices |
Macrocell |
4.75 V |
160 |
1.27 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G24 |
No |
Macrocells Interconnected By Global Bus; 16 Macrocells; 2 External Clocks |
e0 |
71.4 MHz |
16 |
220 °C (428 °F) |
16 |
|||||||||||||
|
Altera |
EE PLD |
Ball |
169 |
FBGA |
Square |
Plastic/Epoxy |
10 ns |
Yes |
256 |
CMOS |
1.8/3.3,2.5 V |
Grid Array, Fine Pitch |
BGA169,13X13,32 |
Programmable Logic Devices |
Yes |
.8 mm |
Tin Lead |
Bottom |
S-PBGA-B169 |
No |
e0 |
220 °C (428 °F) |
Yes |
||||||||||||||||||||||||||
|
Altera |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Ceramic |
25 ns |
Yes |
CMOS |
24 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
320 |
1.27 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-XQCC-J28 |
No |
e0 |
62.5 MHz |
16 |
220 °C (428 °F) |
|||||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
CMOS |
2.5 |
Flatpack, Fine Pitch |
Macrocell |
2.375 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 189 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
220 °C (428 °F) |
32 mm |
189 |
||||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
1020 |
HBGA |
Square |
Plastic/Epoxy |
0.5 ns |
Yes |
2.625 V |
CMOS |
2.5 |
Grid Array, Heat Sink/Slug |
Macrocell |
2.375 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 588 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B1020 |
3.5 mm |
33 mm |
No |
e1 |
160 MHz |
33 mm |
588 |
|||||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
7.5 ns |
576 |
Yes |
2.625 V |
CMOS |
66 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
Registered |
2.375 V |
.5 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
e0 |
90 MHz |
66 |
220 °C (428 °F) |
14 mm |
||||||||||||||
|
Altera |
UV PLD |
Military |
Through-Hole |
24 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
55 ns |
No |
5.5 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
In-Line, Window |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
160 |
2.54 mm |
125 °C (257 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
4.826 mm |
7.62 mm |
No |
16 Macrocells |
e0 |
22.2 MHz |
16 |
220 °C (428 °F) |
31.9405 mm |
16 |
||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
16.6 ns |
Yes |
5.25 V |
560 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Fine Pitch |
HQFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 153 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
772 Flip Flops; Configurable I/O operation with 3.3 V or 5 V |
e0 |
117.6 MHz |
220 °C (428 °F) |
28 mm |
Yes |
153 |
||||||||||
|
Altera |
UV PLD |
Commercial |
Gull Wing |
100 |
WQFP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
55 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack, Window |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
19 Dedicated Inputs, 64 I/O |
19 |
0 °C (32 °F) |
Matte Tin |
Quad |
R-CQFP-G100 |
3.35 mm |
13.2 mm |
No |
128 Macrocells; Shared Input/Clock; Shared Product Terms |
e3 |
33.3 MHz |
19.2 mm |
64 |
||||||||||||||||||
|
Altera |
EE PLD |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
CMOS |
2.5 |
Grid Array |
Macrocell |
2.375 V |
1 mm |
4 Dedicated Inputs, 68 I/O |
4 |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
2.1 mm |
17 mm |
No |
e1 |
17 mm |
68 |
||||||||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
3.1 ns |
Yes |
2.625 V |
CMOS |
2.5 |
Grid Array |
Macrocell |
2.375 V |
1 mm |
85 °C (185 °F) |
502 I/O |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B672 |
3 |
2.1 mm |
27 mm |
No |
e0 |
220 °C (428 °F) |
27 mm |
502 |
|||||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
11 ns |
Yes |
CMOS |
2.5 |
Flatpack, Fine Pitch |
Mixed |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 147 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
e3 |
28 mm |
147 |
||||||||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Ball |
560 |
BGA |
Square |
Plastic/Epoxy |
23.8 ns |
Yes |
5.5 V |
CMOS |
5 |
Grid Array |
Registered |
4.5 V |
85 °C (185 °F) |
4 Dedicated Inputs |
4 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B560 |
No |
3744 Logic elements Configurable I/O operation with 3.3 V or 5 V |
e1 |
60.6 MHz |
|||||||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
1020 |
HBGA |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
1.8 |
Grid Array, Heat Sink/Slug |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
808 I/O |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B1020 |
3.5 mm |
33 mm |
No |
e1 |
33 mm |
808 |
|||||||||||||||||||||||
|
Altera |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
1 |
4.572 mm |
16.5862 mm |
No |
e0 |
135.1 MHz |
20 s |
220 °C (428 °F) |
16.5862 mm |
Yes |
34 |
||||||||||
|
|
Altera |
Loadable PLD |
Other |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
CMOS |
1.8 |
Grid Array |
Mixed |
1.71 V |
1 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 303 I/O |
0 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B484 |
3 |
2.1 mm |
23 mm |
No |
e1 |
245 °C (473 °F) |
23 mm |
303 |
||||||||||||||||||
|
Altera |
EE PLD |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
7.5 ns |
No |
5.25 V |
CMOS |
5 |
In-Line |
Macrocell |
4.75 V |
2.54 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
0 °C (32 °F) |
Dual |
R-PDIP-T24 |
4.318 mm |
7.62 mm |
No |
16 Macrocells; 2 External Clocks |
125 MHz |
31.6865 mm |
16 |
||||||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
9 ns |
Yes |
2.625 V |
CMOS |
2.5 |
Flatpack, Fine Pitch |
Mixed |
2.375 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 186 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
32 mm |
186 |
||||||||||||||||||||
|
Altera |
Flash PLD |
Ball |
100 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
1.8 |
Grid Array |
Macrocell |
1.71 V |
0 Dedicated Inputs, 80 I/O |
0 |
Tin Lead |
Bottom |
S-PBGA-B100 |
No |
e0 |
80 |
|||||||||||||||||||||||||||||
|
Altera |
Loadable PLD |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
3 ns |
8320 |
Yes |
2.625 V |
CMOS |
168 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
4 Dedicated Inputs, 174 I/O |
4 |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
168 |
220 °C (428 °F) |
32 mm |
174 |
||||||||||||||||
|
Altera |
Loadable PLD |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
4160 |
Yes |
2.625 V |
CMOS |
175 |
2.5 |
1.8,1.8/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
4 Dedicated Inputs, 183 I/O |
4 |
Matte Tin |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e3 |
175 |
220 °C (428 °F) |
32 mm |
183 |
||||||||||||||||
|
Altera |
Flash PLD |
Ball |
100 |
BGA |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
2.5 |
Grid Array |
Macrocell |
2.375 V |
0 Dedicated Inputs, 0 I/O |
0 |
Tin Lead |
Bottom |
S-PBGA-B100 |
No |
It can also operate at 3.3 V |
e0 |
0 |
||||||||||||||||||||||||||||
|
Altera |
Loadable PLD |
Commercial |
Ball |
356 |
LBGA |
Square |
Plastic/Epoxy |
0.7 ns |
4992 |
Yes |
2.625 V |
CMOS |
274 |
2.5 |
2.5,2.5/3.3 V |
Grid Array, Low Profile |
BGA356,26X26,50 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
1.27 mm |
70 °C (158 °F) |
274 I/O |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B356 |
3 |
1.63 mm |
35 mm |
No |
e0 |
20 s |
274 |
220 °C (428 °F) |
35 mm |
274 |
||||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.63SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 100 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
128 Macrocells; 8 Labs; Configurable I/O operation with 2.5 V or 3.3 V |
e0 |
125 MHz |
220 °C (428 °F) |
20 mm |
Yes |
100 |
||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
256 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
HQFP208,1.2SQ,20 |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 160 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
100 MHz |
220 °C (428 °F) |
28 mm |
No |
160 |
|||||||||||
|
Altera |
EE PLD |
Industrial |
Gull Wing |
44 |
LQFP |
Square |
Plastic/Epoxy |
20 ns |
Yes |
3.6 V |
32 |
CMOS |
3.3 |
3.3 V |
Flatpack, Low Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
No |
Macrocell |
3 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
1.27 mm |
10 mm |
No |
Labs interconnected by PIA; 2 Labs; 32 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
62.5 MHz |
220 °C (428 °F) |
10 mm |
No |
32 |
||||||||||
|
Altera |
220 °C (428 °F) |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Altera |
UV PLD |
Industrial |
Through-Hole |
24 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
27 ns |
No |
5.5 V |
CMOS |
5 |
In-Line, Window |
Macrocell |
4.5 V |
2.54 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
-40 °C (-40 °F) |
Dual |
R-GDIP-T24 |
5.08 mm |
7.62 mm |
No |
16 Macrocells; 2 External Clocks |
47.6 MHz |
32 mm |
16 |
||||||||||||||||||||
|
|
Altera |
Loadable PLD |
Other |
Ball |
356 |
LBGA |
Square |
Plastic/Epoxy |
2.02 ns |
Yes |
1.89 V |
CMOS |
1.8 |
Grid Array, Low Profile |
Macrocell |
1.71 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 246 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B356 |
1.63 mm |
35 mm |
No |
e1 |
35 mm |
246 |
|||||||||||||||||||
|
Altera |
UV PLD |
Military |
J Bend |
68 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
25 ns |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier, Window |
Macrocell |
4.5 V |
1.27 mm |
125 °C (257 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
-55 °C (-67 °F) |
Quad |
S-CQCC-J68 |
5.08 mm |
24.13 mm |
No |
Labs interconnected by PIA; 8 Labs; 1 External Clock |
83.3 MHz |
24.13 mm |
52 |
||||||||||||||||||||
|
Altera |
OT PLD |
Military |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
25 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack |
Macrocell |
4.5 V |
.65 mm |
125 °C (257 °F) |
7 Dedicated Inputs, 64 I/O |
7 |
-55 °C (-67 °F) |
Matte Tin |
Quad |
R-PQFP-G100 |
3.425 mm |
14 mm |
No |
Labs interconnected by PIA; 12 Labs; 1 External Clock |
e3 |
83.3 MHz |
220 °C (428 °F) |
20 mm |
64 |
|||||||||||||||||
|
Altera |
Loadable PLD |
Commercial |
Pin/Peg |
560 |
IPGA |
Square |
Ceramic, Metal-Sealed Cofired |
4032 |
No |
5.25 V |
CMOS |
360 |
5 |
5 V |
Grid Array, Interstitial Pitch |
PGA560,43X43,50 |
Field Programmable Gate Arrays |
Registered |
4.75 V |
2.54 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 360 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P560 |
1 |
15.75 mm |
60.07 mm |
No |
4 EPF81188 devices with Field programmable Interconnect; 4656 Flip Flops; 4032 Logic elements |
e0 |
360 |
220 °C (428 °F) |
60.07 mm |
360 |
||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Registered |
4.5 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 148 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
820 Flip Flops; 672 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e3 |
28 mm |
148 |
||||||||||||||||||||
|
Altera |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
96 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 60 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
100 MHz |
220 °C (428 °F) |
29.3116 mm |
No |
60 |
|||||||||||
|
|
Altera |
Loadable PLD |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
1.97 ns |
Yes |
1.89 V |
CMOS |
1.8 |
Flatpack, Fine Pitch |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 136 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
28 mm |
136 |
||||||||||||||||||
|
|
Altera |
EE PLD |
Commercial |
Ball |
169 |
FBGA |
Square |
Plastic/Epoxy |
4 ns |
Yes |
128 |
CMOS |
1.8/3.3,2.5 V |
Grid Array, Fine Pitch |
BGA169,13X13,32 |
Programmable Logic Devices |
Yes |
.8 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B169 |
No |
e1 |
Yes |
|||||||||||||||||||||||
|
Altera |
EE PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 98 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
3.5 mm |
17 mm |
No |
e0 |
20 s |
220 °C (428 °F) |
17 mm |
Yes |
98 |
|||||||||||
|
Altera |
Loadable PLD |
Industrial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
336 |
Yes |
5.5 V |
CMOS |
68 |
5 |
3.3/5,5 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 68 I/O |
4 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
336 Logic elements; 42 Labs; Configurable I/O operation with 3.3 V or 5 V |
e0 |
64 |
220 °C (428 °F) |
14 mm |
68 |
||||||||||||
|
Altera |
Loadable PLD |
Commercial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
0.6 ns |
Yes |
2.7 V |
2.5 |
Grid Array |
Mixed |
2.3 V |
1.27 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 191 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
2.3 mm |
27 mm |
No |
e1 |
27 mm |
191 |
|||||||||||||||||||||
|
Altera |
Loadable PLD |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
1200 |
Yes |
2.625 V |
CMOS |
117 |
2.5 |
1.8,1.8/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
4 Dedicated Inputs, 125 I/O |
4 |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
117 |
220 °C (428 °F) |
28 mm |
125 |
||||||||||||||||
|
|
Altera |
EE PLD |
Commercial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
4.5 ns |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
64 MICROCELLS; 4 Labs; Configurable I/O operation with 2.5 V or 3.3 V |
e3 |
222.2 MHz |
30 s |
260 °C (500 °F) |
14 mm |
Yes |
68 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.