| Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
Altera |
EE PLD |
Ball |
100 |
BGA |
Square |
Plastic/Epoxy |
5 ns |
Yes |
64 |
CMOS |
1.8/3.3,2.5 V |
Grid Array |
BGA100,10X10,40 |
Programmable Logic Devices |
Yes |
1 mm |
Tin Silver Copper |
Bottom |
S-PBGA-B100 |
No |
e1 |
Yes |
||||||||||||||||||||||||||
|
Altera |
UV PLD |
Industrial |
Through-Hole |
20 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
45 ns |
No |
5.5 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
In-Line, Window |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
72 |
2.54 mm |
85 °C (185 °F) |
9 Dedicated Inputs, 8 I/O |
9 |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
4.826 mm |
7.62 mm |
No |
8 Macrocells; Shared Input/Clock |
e0 |
30.3 MHz |
8 |
220 °C (428 °F) |
24.003 mm |
8 |
||||||||||
|
Altera |
EE PLD |
Industrial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.5 V |
96 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC68,1.0SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 52 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J68 |
5.08 mm |
24.23 mm |
No |
96 Macrocells |
e0 |
166.7 MHz |
220 °C (428 °F) |
24.23 mm |
No |
52 |
|||||||||||
|
|
Altera |
EE PLD |
Commercial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
16.2 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack, Fine Pitch |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 159 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
580 Flip Flops; Configurable I/O operation with 3.3 V or 5 V |
e3 |
117.6 MHz |
32 mm |
159 |
|||||||||||||||||
|
Altera |
EE PLD |
Industrial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
160 |
CMOS |
5 |
3.3/5,5 V |
Flatpack |
QFP100,.7X.9 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.65 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
R-PQFP-G100 |
3 |
3.65 mm |
14 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
76.9 MHz |
220 °C (428 °F) |
20 mm |
Yes |
80 |
||||||||||
|
Altera |
Flash PLD |
Ball |
100 |
BGA |
Square |
Plastic/Epoxy |
4.7 ns |
Yes |
192 |
CMOS |
1.8,1.8/3 V |
Grid Array |
BGA100,10X10,40 |
Programmable Logic Devices |
Yes |
1 mm |
Bottom |
S-PBGA-B100 |
No |
Yes |
|||||||||||||||||||||||||||||
|
Altera |
Loadable PLD |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
4160 |
Yes |
2.625 V |
CMOS |
84 |
2.5 |
1.8,1.8/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
4 Dedicated Inputs, 92 I/O |
4 |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
84 |
220 °C (428 °F) |
20 mm |
92 |
||||||||||||||||
|
Altera |
EE PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
23.6 ns |
Yes |
5.5 V |
560 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Fine Pitch |
HQFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 153 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
772 Flip Flops; Configurable I/O operation with 3.3 V or 5 V |
e0 |
100 MHz |
220 °C (428 °F) |
28 mm |
Yes |
153 |
||||||||||
|
Altera |
OT PLD |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
25 ns |
Yes |
5.25 V |
192 |
CMOS |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 64 I/O |
7 |
0 °C (32 °F) |
Tin Lead |
Quad |
R-PQFP-G100 |
3 |
3.425 mm |
14 mm |
No |
Labs interconnected by PIA; 12 Labs; 1 External Clock |
e0 |
83.3 MHz |
220 °C (428 °F) |
20 mm |
No |
64 |
||||||||||
|
Altera |
Flash PLD |
Gull Wing |
100 |
QFP |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
1.8 |
Flatpack |
Macrocell |
1.71 V |
0 Dedicated Inputs, 0 I/O |
0 |
Tin Lead |
Quad |
S-PQFP-G100 |
No |
e0 |
0 |
|||||||||||||||||||||||||||||
|
Altera |
OT PLD |
Commercial |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
CMOS |
24 |
PAL-TYPE |
5 |
5 V |
Small Outline |
SOP28,.5 |
Programmable Logic Devices |
Macrocell |
4.75 V |
320 |
1.27 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 16 I/O |
7 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G28 |
2.65 mm |
7.5 mm |
No |
Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
83.3 MHz |
16 |
220 °C (428 °F) |
17.9 mm |
16 |
||||||||||
|
Altera |
Loadable PLD |
Commercial |
Pin/Peg |
599 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
0.8 ns |
9984 |
No |
2.7 V |
CMOS |
470 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
SPGA599,47X47 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
2.54 mm |
70 °C (158 °F) |
470 I/O |
0 °C (32 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P599 |
1 |
5.08 mm |
62.484 mm |
No |
9984 Logic Elements |
e0 |
140 MHz |
470 |
220 °C (428 °F) |
62.484 mm |
470 |
|||||||||||
|
|
Altera |
Loadable PLD |
Commercial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
0.3 ns |
2880 |
Yes |
2.625 V |
CMOS |
191 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
1 mm |
70 °C (158 °F) |
191 I/O |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
3 |
2.1 mm |
17 mm |
No |
e1 |
191 |
17 mm |
191 |
|||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
1008 |
Yes |
5.5 V |
CMOS |
148 |
5 |
3.3/5,5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Registered |
4.5 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 144 I/O |
4 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e0 |
357 MHz |
20 s |
144 |
220 °C (428 °F) |
28 mm |
144 |
||||||||||
|
|
Altera |
Flash PLD |
Ball |
100 |
BGA |
Square |
Plastic/Epoxy |
5.4 ns |
Yes |
2.625 V |
440 |
CMOS |
2.5 |
1.5/3.3,2.5/3.3 V |
Grid Array |
BGA100,11X11,20 |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
.5 mm |
0 Dedicated Inputs, 76 I/O |
0 |
Tin Silver Copper |
Bottom |
S-PBGA-B100 |
No |
It can also operate at 3.3 V |
e1 |
Yes |
76 |
||||||||||||||||||
|
|
Altera |
Loadable PLD |
Commercial |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
0.5 ns |
2880 |
Yes |
3.6 V |
CMOS |
59 |
3.3 |
3.3 V |
Grid Array |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
Registered |
3 V |
1 mm |
70 °C (158 °F) |
4 Dedicated Inputs |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B484 |
3 |
2.1 mm |
23 mm |
No |
e1 |
30 s |
59 |
260 °C (500 °F) |
23 mm |
|||||||||||
|
Altera |
Flash PLD |
Ball |
100 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
1.8 |
Grid Array |
Macrocell |
1.71 V |
0 Dedicated Inputs, 0 I/O |
0 |
Tin Lead |
Bottom |
S-PBGA-B100 |
No |
e0 |
0 |
|||||||||||||||||||||||||||||
|
|
Altera |
Loadable PLD |
Ball |
144 |
LBGA |
Square |
Plastic/Epoxy |
2.41 ns |
Yes |
1.89 V |
CMOS |
1.8 |
Grid Array, Low Profile |
Macrocell |
1.71 V |
1 mm |
4 Dedicated Inputs, 93 I/O |
4 |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
1.7 mm |
13 mm |
No |
e1 |
13 mm |
93 |
||||||||||||||||||||||
|
Altera |
EE PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Grid Array |
Macrocell |
3 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 212 I/O |
0 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
2.3 mm |
27 mm |
No |
384 Macrocells |
e1 |
166.7 MHz |
27 mm |
212 |
||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
1320 |
Yes |
5.25 V |
CMOS |
204 |
5 |
3.3/5,5 V |
Grid Array |
BGA256(UNSPEC) |
Field Programmable Gate Arrays |
Macrocell |
4.75 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 204 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
2.3 mm |
27 mm |
No |
Can Also Be Used 16000 Logic Gates |
e0 |
133 MHz |
20 s |
204 |
220 °C (428 °F) |
27 mm |
204 |
||||||||||
|
Altera |
OT PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
40 ns |
Yes |
5.25 V |
64 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 28 I/O |
7 |
0 °C (32 °F) |
Tin/Lead |
Quad |
S-PQCC-J44 |
No |
Labs interconnected by PIA; 4 Labs; 64 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
50 MHz |
30 s |
220 °C (428 °F) |
No |
28 |
|||||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
44 |
LQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Flatpack, Low Profile |
Macrocell |
3 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
1.27 mm |
10 mm |
No |
64 Macrocells; 4 Labs; Configurable I/O operation with 2.5 V or 3.3 V |
e3 |
125 MHz |
10 mm |
36 |
||||||||||||||||||
|
Altera |
EE PLD |
Military |
Pin/Peg |
192 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
20 ns |
No |
2.625 V |
CMOS |
MIL-STD-883 |
2.5 |
Grid Array |
Macrocell |
2.375 V |
2.54 mm |
125 °C (257 °F) |
0 Dedicated Inputs |
0 |
-55 °C (-67 °F) |
Gold |
Perpendicular |
S-CPGA-P192 |
5.43 mm |
45.15 mm |
No |
256 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; Shared Input/Clock |
e4 |
62.5 MHz |
45.15 mm |
||||||||||||||||||
|
Altera |
EE PLD |
Commercial |
Pin/Peg |
192 |
PGA |
Square |
Ceramic |
15 ns |
No |
256 |
CMOS |
3.3/5,5 V |
Grid Array |
PGA192M,17X17 |
Programmable Logic Devices |
Yes |
2.54 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Perpendicular |
S-XPGA-P192 |
1 |
No |
e0 |
220 °C (428 °F) |
Yes |
||||||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
1.8 |
Grid Array |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 204 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B484 |
3 |
2.1 mm |
23 mm |
No |
e1 |
160 MHz |
220 °C (428 °F) |
23 mm |
204 |
|||||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
13.5 ns |
Yes |
2.7 V |
CMOS |
2.5 |
Flatpack, Fine Pitch |
Mixed |
2.3 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 147 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
e3 |
28 mm |
147 |
||||||||||||||||||||
|
Altera |
UV PLD |
Industrial |
Through-Hole |
24 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
45 ns |
No |
5.5 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
In-Line, Window |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
160 |
2.54 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
4.826 mm |
7.62 mm |
No |
16 Macrocells |
e0 |
26.3 MHz |
16 |
220 °C (428 °F) |
31.9405 mm |
16 |
||||||||||
|
|
Altera |
Flash PLD |
Automotive |
Ball |
100 |
BGA |
Square |
Plastic/Epoxy |
6.1 ns |
Yes |
2.625 V |
192 |
CMOS |
2.5 |
1.5/3.3,2.5/3.3 V |
Grid Array |
BGA100,11X11,20 |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
.5 mm |
125 °C (257 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B100 |
No |
It can also operate at 3.3 V |
e1 |
Yes |
80 |
|||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
16 ns |
6656 |
Yes |
2.7 V |
CMOS |
186 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
.5 mm |
85 °C (185 °F) |
186 I/O |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e0 |
186 |
220 °C (428 °F) |
32 mm |
186 |
|||||||||||||
|
|
Altera |
Loadable PLD |
Other |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
1.72 ns |
Yes |
1.89 V |
CMOS |
1.8 |
Flatpack, Fine Pitch |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 151 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e3 |
160 MHz |
32 mm |
151 |
|||||||||||||||||
|
|
Altera |
Loadable PLD |
Other |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
3.3 |
Grid Array |
Macrocell |
3 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 171 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
2.1 mm |
17 mm |
No |
e1 |
153 MHz |
17 mm |
171 |
||||||||||||||||||||
|
Altera |
EE PLD |
Industrial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
128 |
CMOS |
5 |
3.3/5,5 V |
Flatpack |
QFP160,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
.65 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 96 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G160 |
3 |
4.07 mm |
28 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
76.9 MHz |
220 °C (428 °F) |
28 mm |
No |
96 |
||||||||||
|
Altera |
UV PLD |
Industrial |
J Bend |
44 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
43 ns |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier, Window |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
-40 °C (-40 °F) |
Quad |
S-CQCC-J44 |
4.57 mm |
16.51 mm |
No |
24 Macrocells; 2 External Clocks |
25 MHz |
16.51 mm |
24 |
||||||||||||||||||||
|
Altera |
EE PLD |
Industrial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
160 |
CMOS |
5 |
3.3/5,5 V |
Flatpack |
QFP100,.7X.9 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.65 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
R-PQFP-G100 |
3 |
3.65 mm |
14 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
100 MHz |
220 °C (428 °F) |
20 mm |
Yes |
80 |
||||||||||
|
|
Altera |
Loadable PLD |
Commercial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
CMOS |
5 |
Flatpack |
Registered |
4.75 V |
.65 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 120 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
3 |
4.07 mm |
28 mm |
No |
672 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e3 |
28 mm |
120 |
||||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
9 ns |
Yes |
2.7 V |
CMOS |
2.5 |
Grid Array |
Mixed |
2.3 V |
1 mm |
85 °C (185 °F) |
338 I/O |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B672 |
2.1 mm |
27 mm |
No |
e1 |
27 mm |
338 |
|||||||||||||||||||||
|
Altera |
EE PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
12 ns |
Yes |
128 |
CMOS |
2.5/3.3,3.3 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
1 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
No |
e0 |
220 °C (428 °F) |
Yes |
|||||||||||||||||||||||
|
|
Altera |
Loadable PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
0.5 ns |
576 |
Yes |
2.625 V |
CMOS |
92 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
.5 mm |
70 °C (158 °F) |
92 I/O |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
37.5 MHz |
30 s |
92 |
260 °C (500 °F) |
20 mm |
92 |
||||||||||
|
Altera |
UV PLD |
Military |
J Bend |
68 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
20 ns |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier, Window |
Macrocell |
4.5 V |
1.27 mm |
125 °C (257 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
-55 °C (-67 °F) |
Quad |
S-CQCC-J68 |
5.08 mm |
24.13 mm |
No |
Labs interconnected by PIA; 8 Labs; 1 External Clock |
111.1 MHz |
24.13 mm |
52 |
||||||||||||||||||||
|
Altera |
Loadable PLD |
Commercial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
336 |
Yes |
5.25 V |
CMOS |
120 |
5 |
3.3/5,5 V |
Flatpack |
QFP160,1.2SQ |
Field Programmable Gate Arrays |
Registered |
4.75 V |
.65 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 116 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G160 |
3 |
4.07 mm |
28 mm |
No |
452 Flip Flops; 336 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e0 |
116 |
220 °C (428 °F) |
28 mm |
116 |
||||||||||||
|
Altera |
Loadable PLD |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
1.93 ns |
6400 |
Yes |
1.89 V |
CMOS |
308 |
1.8 |
1.8,1.8/3.3 V |
Grid Array |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
1 mm |
4 Dedicated Inputs, 316 I/O |
4 |
Tin Lead |
Bottom |
S-PBGA-B484 |
3 |
2.1 mm |
23 mm |
No |
e0 |
20 s |
308 |
220 °C (428 °F) |
23 mm |
316 |
||||||||||||||
|
Altera |
Loadable PLD |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
1.8 |
Flatpack, Fine Pitch |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 120 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
160 MHz |
220 °C (428 °F) |
28 mm |
120 |
|||||||||||||||||||
|
|
Altera |
Loadable PLD |
Other |
Ball |
652 |
BGA |
Square |
Plastic/Epoxy |
3.1 ns |
Yes |
2.625 V |
CMOS |
2.5 |
Grid Array |
Macrocell |
2.375 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 502 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B652 |
3.5 mm |
45 mm |
No |
e1 |
45 mm |
502 |
|||||||||||||||||||
|
Altera |
Loadable PLD |
Commercial |
Ball |
600 |
BGA |
Square |
Plastic/Epoxy |
0.7 ns |
12160 |
Yes |
3.6 V |
CMOS |
470 |
3.3 |
2.5/3.3,3.3 V |
Grid Array |
BGA600,35X35,50 |
Field Programmable Gate Arrays |
Registered |
3 V |
1.27 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 470 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B600 |
1.93 mm |
45 mm |
No |
12160 Logic Elements; 1520 Labs |
e0 |
80 MHz |
470 |
220 °C (428 °F) |
45 mm |
470 |
|||||||||||
|
Altera |
UV PLD |
Commercial |
Pin/Peg |
68 |
PGA |
Square |
Ceramic |
90 ns |
No |
48 |
CMOS |
5 |
5 V |
Grid Array |
PGA68,11X11 |
Programmable Logic Devices |
No |
2.54 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Perpendicular |
S-XPGA-P68 |
1 |
No |
e0 |
220 °C (428 °F) |
No |
|||||||||||||||||||||
|
Altera |
Loadable PLD |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.8 |
Grid Array |
Macrocell |
1 mm |
4 Dedicated Inputs, 376 I/O |
4 |
Tin Silver Copper |
Bottom |
S-PBGA-B484 |
3 |
2.1 mm |
23 mm |
No |
e1 |
220 °C (428 °F) |
23 mm |
376 |
|||||||||||||||||||||||||
|
Altera |
Loadable PLD |
Military |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier |
Registered |
4.5 V |
1.27 mm |
125 °C (257 °F) |
4 Dedicated Inputs, 64 I/O |
4 |
-55 °C (-67 °F) |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
452 Flip Flops; 336 Logic Elements |
29.3116 mm |
64 |
||||||||||||||||||||||
|
Altera |
Loadable PLD |
Military |
Pin/Peg |
192 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
CMOS |
5 |
Grid Array |
Registered |
4.5 V |
2.54 mm |
125 °C (257 °F) |
4 Dedicated Inputs, 148 I/O |
4 |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P192 |
5.43 mm |
45.15 mm |
No |
820 Flip Flops; 672 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
45.15 mm |
148 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.