Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Altera |
EE PLD |
Industrial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack |
Macrocell |
4.5 V |
.65 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 120 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
4.07 mm |
28 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e3 |
62.5 MHz |
28 mm |
120 |
||||||||||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
44 |
QFP |
Square |
Plastic/Epoxy |
5 ns |
Yes |
64 |
CMOS |
2.5/3.3,3.3 V |
Flatpack |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
.8 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
No |
e0 |
220 °C (428 °F) |
Yes |
||||||||||||||||||||||
Altera |
Loadable PLD |
Other |
Ball |
784 |
BGA |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
2.5 |
Grid Array |
Macrocell |
2.375 V |
85 °C (185 °F) |
4 Dedicated Inputs |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B784 |
3 |
No |
e1 |
220 °C (428 °F) |
|||||||||||||||||||||||||
Altera |
EE PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
2.1 mm |
17 mm |
No |
e0 |
100 MHz |
220 °C (428 °F) |
17 mm |
Yes |
68 |
|||||||||||
Altera |
UV PLD |
Commercial |
Through-Hole |
24 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
45 ns |
No |
5.25 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
In-Line, Window |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
160 |
2.54 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
4.826 mm |
7.62 mm |
No |
16 Macrocells |
e0 |
26.3 MHz |
16 |
220 °C (428 °F) |
31.9405 mm |
16 |
||||||||||
Altera |
EE PLD |
Military |
Pin/Peg |
160 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
15 ns |
No |
2.625 V |
192 |
CMOS |
MIL-STD-883 |
2.5 |
3.3/5,5 V |
Grid Array |
PGA160M,15X15 |
Programmable Logic Devices |
No |
Macrocell |
2.375 V |
2.54 mm |
125 °C (257 °F) |
0 Dedicated Inputs |
0 |
-55 °C (-67 °F) |
Gold |
Perpendicular |
S-CPGA-P160 |
5.34 mm |
39.624 mm |
No |
192 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; Shared Input/Clock |
e4 |
76.9 MHz |
220 °C (428 °F) |
39.624 mm |
No |
|||||||||||
Altera |
EE PLD |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack, Fine Pitch |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 160 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Labs interconnected by PIA; 16 Labs; 2 External Clocks |
e0 |
62.5 MHz |
28 mm |
160 |
|||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
2.25 ns |
24320 |
Yes |
1.89 V |
CMOS |
500 |
1.8 |
1.8,1.8/3.3 V |
Grid Array |
BGA672,26X26,40 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 508 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B672 |
4 |
3.5 mm |
27 mm |
No |
e1 |
160 MHz |
30 s |
500 |
245 °C (473 °F) |
27 mm |
508 |
|||||||||
Altera |
Loadable PLD |
Other |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
2.5 ns |
16640 |
Yes |
2.625 V |
CMOS |
496 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA672,26X26,40 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
1 mm |
85 °C (185 °F) |
502 I/O |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B672 |
3 |
2.1 mm |
27 mm |
No |
e0 |
20 s |
496 |
220 °C (428 °F) |
27 mm |
502 |
||||||||||||
Altera |
Loadable PLD |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
1320 |
Yes |
3.6 V |
CMOS |
117 |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.63SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 117 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Can Also Be Used 16000 Logic Gates |
e0 |
153 MHz |
20 s |
117 |
220 °C (428 °F) |
20 mm |
117 |
||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
100 |
LBGA |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
3.3 |
Grid Array, Low Profile |
Macrocell |
3 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 81 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B100 |
3 |
1.7 mm |
11 mm |
No |
e1 |
133 MHz |
11 mm |
81 |
|||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
9 ns |
Yes |
2.7 V |
CMOS |
2.5 |
Flatpack, Fine Pitch |
Mixed |
2.3 V |
.5 mm |
85 °C (185 °F) |
189 I/O |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
32 mm |
189 |
|||||||||||||||||||||
Altera |
Loadable PLD |
Other |
Ball |
780 |
HBGA |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
CMOS |
1.8 |
Grid Array, Heat Sink/Slug |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 486 I/O |
0 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B780 |
3.5 mm |
29 mm |
No |
e1 |
29 mm |
486 |
|||||||||||||||||||||
Altera |
Loadable PLD |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
3 ns |
4160 |
Yes |
2.625 V |
CMOS |
183 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
4 Dedicated Inputs, 189 I/O |
4 |
Matte Tin |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e3 |
183 |
220 °C (428 °F) |
32 mm |
189 |
|||||||||||||||
Altera |
Loadable PLD |
Other |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
1.6 ns |
Yes |
1.89 V |
1.8 |
Flatpack, Fine Pitch |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
168 I/O |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
32 mm |
168 |
||||||||||||||||||||||
Altera |
Loadable PLD |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
0.4 ns |
1728 |
Yes |
2.625 V |
CMOS |
147 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
.5 mm |
70 °C (158 °F) |
147 I/O |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e0 |
147 |
220 °C (428 °F) |
28 mm |
147 |
|||||||||||||
Altera |
Loadable PLD |
Military |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
27 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Fine Pitch |
Registered |
4.5 V |
.5 mm |
125 °C (257 °F) |
4 Dedicated Inputs |
4 |
-55 °C (-67 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
1728 Logic elements; Built-in JTAG boundry-scan test circuitry |
e3 |
53.76 MHz |
32 mm |
|||||||||||||||||||
Altera |
Loadable PLD |
Other |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
8320 |
Yes |
2.625 V |
CMOS |
160 |
2.5 |
1.8,1.8/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 168 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
160 |
220 °C (428 °F) |
32 mm |
168 |
||||||||||||||
Altera |
Loadable PLD |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
0.4 ns |
4160 |
Yes |
2.625 V |
CMOS |
95 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 101 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
34 MHz |
95 |
220 °C (428 °F) |
20 mm |
101 |
|||||||||||
|
Altera |
Loadable PLD |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
2.41 ns |
2560 |
Yes |
1.89 V |
CMOS |
140 |
1.8 |
1.8,1.8/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 148 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
160 MHz |
30 s |
140 |
245 °C (473 °F) |
28 mm |
148 |
|||||||||
Altera |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
6 ns |
Yes |
5.25 V |
64 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
1 |
4.572 mm |
16.5862 mm |
No |
e0 |
200 MHz |
20 s |
220 °C (428 °F) |
16.5862 mm |
Yes |
36 |
||||||||||
Altera |
UV PLD |
Military |
Pin/Peg |
100 |
WPGA |
Square |
Ceramic, Metal-Sealed Cofired |
55 ns |
No |
5.5 V |
128 |
CMOS |
5 |
5 V |
Grid Array, Window |
PGA100M,13X13 |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
2.54 mm |
125 °C (257 °F) |
19 Dedicated Inputs, 64 I/O |
19 |
-55 °C (-67 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P100 |
3.81 mm |
33.528 mm |
No |
Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
33.3 MHz |
220 °C (428 °F) |
33.528 mm |
No |
64 |
|||||||||||
Altera |
EE PLD |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
4 ns |
Yes |
2.625 V |
128 |
CMOS |
2.5 |
1.8/3.3,2.5 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
1 mm |
0 Dedicated Inputs, 100 I/O |
0 |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
2.1 mm |
17 mm |
No |
e0 |
238.1 MHz |
220 °C (428 °F) |
17 mm |
Yes |
100 |
||||||||||||||
Altera |
Loadable PLD |
Other |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
2.5 ns |
4160 |
Yes |
2.625 V |
CMOS |
183 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 189 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e3 |
183 |
220 °C (428 °F) |
32 mm |
189 |
||||||||||||
Altera |
EE PLD |
Commercial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 96 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
4.07 mm |
28 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e3 |
62.5 MHz |
28 mm |
96 |
||||||||||||||||||
Altera |
OT PLD |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
22 ns |
No |
5.25 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
160 |
2.54 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
4.32 mm |
7.62 mm |
No |
Macrocells Interconnected By Global Bus; 16 Macrocells; 2 External Clocks |
e0 |
55.6 MHz |
16 |
220 °C (428 °F) |
31.68 mm |
16 |
||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
2.5 |
Grid Array |
Registered |
2.375 V |
1 mm |
85 °C (185 °F) |
6 Dedicated Inputs, 171 I/O |
6 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B484 |
2.1 mm |
23 mm |
No |
e1 |
23 mm |
171 |
||||||||||||||||||||||
Altera |
Military |
Through-Hole |
40 |
DIP |
Rectangular |
Ceramic |
60 ns |
No |
CMOS |
38535Q/M;38534H;883B |
36 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP40,.6 |
Programmable Logic Devices |
Macrocell |
240 |
2.54 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-XDIP-T40 |
No |
e0 |
16.7 MHz |
24 |
220 °C (428 °F) |
|||||||||||||||||||
Altera |
OT PLD |
Industrial |
Through-Hole |
40 |
DIP |
Rectangular |
Plastic/Epoxy |
65 ns |
No |
5.5 V |
CMOS |
5 |
In-Line |
Macrocell |
4.5 V |
2.54 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
-40 °C (-40 °F) |
Dual |
R-PDIP-T40 |
4.83 mm |
15.24 mm |
No |
28 Macrocells |
23.2 MHz |
52.324 mm |
24 |
||||||||||||||||||||
Altera |
OT PLD |
Industrial |
Through-Hole |
40 |
DIP |
Rectangular |
Plastic/Epoxy |
43 ns |
No |
5.5 V |
CMOS |
5 |
In-Line |
Macrocell |
4.5 V |
2.54 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
-40 °C (-40 °F) |
Dual |
R-PDIP-T40 |
4.826 mm |
15.24 mm |
No |
24 Macrocells; 2 External Clocks |
32.3 MHz |
52.4256 mm |
24 |
||||||||||||||||||||
Altera |
220 °C (428 °F) |
||||||||||||||||||||||||||||||||||||||||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
44 |
LQFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Flatpack, Low Profile |
Macrocell |
3 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
1.27 mm |
10 mm |
No |
32 Macrocells |
e3 |
125 MHz |
10 mm |
36 |
||||||||||||||||||
Altera |
Military |
Through-Hole |
40 |
DIP |
Rectangular |
Ceramic |
60 ns |
No |
CMOS |
36 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP40,.6 |
Programmable Logic Devices |
Macrocell |
240 |
2.54 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDIP-T40 |
No |
16.7 MHz |
24 |
|||||||||||||||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
5 ns |
Yes |
2.625 V |
256 |
CMOS |
2.5 |
1.8/3.3,2.5 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
e3 |
188.7 MHz |
14 mm |
Yes |
84 |
|||||||||||
Altera |
UV PLD |
Military |
Gull Wing |
100 |
WQFP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
45 ns |
Yes |
5.5 V |
CMOS |
MIL-STD-883 |
5 |
Flatpack, Window |
Macrocell |
4.5 V |
.65 mm |
125 °C (257 °F) |
19 Dedicated Inputs, 64 I/O |
19 |
-55 °C (-67 °F) |
Tin Lead |
Quad |
R-CQFP-G100 |
2.99 mm |
14 mm |
No |
Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
40 MHz |
19.2 mm |
64 |
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Altera |
UV PLD |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
50 ns |
No |
5.5 V |
CMOS |
MIL-STD-883 |
5 |
In-Line |
Mixed |
4.5 V |
125 °C (257 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
-55 °C (-67 °F) |
Dual |
R-GDIP-T20 |
No |
8 |
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Altera |
OT PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
9 ns |
Yes |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
132 |
1.27 mm |
70 °C (158 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
4.57 mm |
11.505 mm |
No |
Macrocells Interconnected By Global Bus; 10 Macrocells; 1 External Clock |
e0 |
109.8 MHz |
10 |
220 °C (428 °F) |
11.505 mm |
10 |
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Altera |
EE PLD |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.63SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 96 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
98 MHz |
20 s |
220 °C (428 °F) |
20 mm |
Yes |
96 |
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Altera |
Industrial |
Through-Hole |
40 |
DIP |
Rectangular |
Plastic |
60 ns |
No |
CMOS |
36 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP40,.6 |
Programmable Logic Devices |
Macrocell |
240 |
2.54 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDIP-T40 |
No |
e0 |
16.7 MHz |
24 |
220 °C (428 °F) |
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Altera |
OT PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
22 ns |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J28 |
4.572 mm |
11.5062 mm |
No |
16 Macrocells; 2 External Clocks |
62.5 MHz |
11.5062 mm |
16 |
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Altera |
Loadable PLD |
Industrial |
Pin/Peg |
232 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
1008 |
No |
5.5 V |
CMOS |
184 |
5 |
3.3/5,5 V |
Grid Array |
PGA232M,17X17 |
Field Programmable Gate Arrays |
Registered |
4.5 V |
2.54 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 180 I/O |
4 |
-40 °C (-40 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P232 |
1 |
5.207 mm |
44.7 mm |
No |
1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e0 |
180 |
220 °C (428 °F) |
44.7 mm |
180 |
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Altera |
Loadable PLD |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
1.8 |
Flatpack, Fine Pitch |
Macrocell |
.5 mm |
4 Dedicated Inputs, 150 I/O |
4 |
Matte Tin |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e3 |
220 °C (428 °F) |
32 mm |
150 |
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Altera |
EE PLD |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
12 ns |
Yes |
5.25 V |
64 |
CMOS |
5 |
3.3/5,5 V |
Flatpack |
QFP100,.7X.9 |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
R-PQFP-G100 |
3 |
3.65 mm |
14 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
125 MHz |
220 °C (428 °F) |
20 mm |
No |
68 |
||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
12.5 ns |
2880 |
Yes |
2.7 V |
CMOS |
191 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
1 mm |
85 °C (185 °F) |
191 I/O |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
2.1 mm |
17 mm |
No |
e0 |
191 |
220 °C (428 °F) |
17 mm |
191 |
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Altera |
Loadable PLD |
Ball |
784 |
BGA |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
2.5 |
Grid Array |
Macrocell |
2.375 V |
4 Dedicated Inputs |
4 |
Tin Silver Copper |
Bottom |
S-PBGA-B784 |
No |
e1 |
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Altera |
Loadable PLD |
Other |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
1.8 |
Grid Array |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 246 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B484 |
3 |
2.1 mm |
23 mm |
No |
e1 |
160 MHz |
220 °C (428 °F) |
23 mm |
246 |
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Altera |
OT PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
5 |
Chip Carrier |
Macrocell |
4.5 V |
85 °C (185 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J28 |
No |
83.3 MHz |
16 |
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Altera |
Loadable PLD |
Commercial |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
0.6 ns |
Yes |
2.7 V |
2.5 |
Grid Array |
Mixed |
2.3 V |
70 °C (158 °F) |
4 Dedicated Inputs, 254 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B484 |
No |
e1 |
254 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.