Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Altera |
Loadable PLD |
Industrial |
Pin/Peg |
192 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
1.8 ns |
No |
3.6 V |
CMOS |
3.3 |
Grid Array |
Registered |
3 V |
2.54 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 152 I/O |
4 |
-40 °C (-40 °F) |
Perpendicular |
S-CPGA-P192 |
5.43 mm |
45.15 mm |
No |
Can also operate at 5 V supply |
45.15 mm |
152 |
|||||||||||||||||||||
|
Altera |
Flash PLD |
Industrial |
Ball |
100 |
FBGA |
Square |
Plastic/Epoxy |
17.7 ns |
Yes |
440 |
CMOS |
1.8,1.2/3.3 V |
Grid Array, Fine Pitch |
BGA100,11X11,20 |
Programmable Logic Devices |
Yes |
.5 mm |
105 °C (221 °F) |
-40 °C (-40 °F) |
Bottom |
S-PBGA-B100 |
No |
Yes |
|||||||||||||||||||||||||
Altera |
EE PLD |
Commercial |
Gull Wing |
44 |
LQFP |
Square |
Plastic/Epoxy |
5 ns |
Yes |
5.25 V |
64 |
CMOS |
5 |
5 V |
Flatpack, Low Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
1.27 mm |
10 mm |
No |
64 Macrocells; 4 Labs; Configurable I/O operation with 3.3 V or 5 V |
e0 |
250 MHz |
220 °C (428 °F) |
10 mm |
Yes |
36 |
||||||||||
Altera |
UV PLD |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Ceramic |
35 ns |
Yes |
128 |
CMOS |
5 |
5 V |
Flatpack |
QFP100,.7X1.0 |
Programmable Logic Devices |
No |
.635 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
R-XQFP-G100 |
No |
e0 |
220 °C (428 °F) |
No |
||||||||||||||||||||||
Altera |
OT PLD |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
10 ns |
No |
5.25 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
160 |
2.54 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
4.318 mm |
7.62 mm |
No |
16 Macrocells; 2 External Clocks |
e0 |
125 MHz |
16 |
220 °C (428 °F) |
31.6865 mm |
16 |
||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
2 ns |
1728 |
Yes |
3.6 V |
CMOS |
246 |
3.3 |
3.3 V |
Grid Array |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
Mixed |
3 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 191 I/O |
4 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
2.3 mm |
27 mm |
No |
e1 |
246 |
220 °C (428 °F) |
27 mm |
191 |
|||||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
CMOS |
3.3 |
Flatpack, Fine Pitch |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 164 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
e3 |
28 mm |
164 |
|||||||||||||||||||||
Altera |
Loadable PLD |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
1.8 |
Flatpack, Fine Pitch |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
136 I/O |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
e3 |
28 mm |
136 |
|||||||||||||||||||||||
Altera |
Loadable PLD |
Other |
Ball |
324 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
1.8 |
Grid Array |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 128 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B324 |
2.1 mm |
19 mm |
No |
e1 |
160 MHz |
19 mm |
128 |
|||||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
324 |
BGA |
Square |
Plastic/Epoxy |
1.72 ns |
Yes |
1.89 V |
CMOS |
1.8 |
Grid Array |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 196 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B324 |
3 |
3.5 mm |
19 mm |
No |
e1 |
160 MHz |
245 °C (473 °F) |
19 mm |
196 |
||||||||||||||||
Altera |
OT PLD |
Commercial |
Pin/Peg |
68 |
PGA |
Square |
Ceramic |
45 ns |
No |
48 |
CMOS |
5 |
5 V |
Grid Array |
PGA68,11X11 |
Programmable Logic Devices |
No |
2.54 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Perpendicular |
S-XPGA-P68 |
1 |
No |
e0 |
220 °C (428 °F) |
No |
|||||||||||||||||||||
Altera |
Loadable PLD |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.8 |
Grid Array |
Macrocell |
1 mm |
4 Dedicated Inputs, 324 I/O |
4 |
Tin Silver Copper |
Bottom |
S-PBGA-B484 |
3 |
2.1 mm |
23 mm |
No |
e1 |
220 °C (428 °F) |
23 mm |
324 |
|||||||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
304 |
FQFP |
Square |
Plastic/Epoxy |
23.8 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Fine Pitch |
Registered |
4.5 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 249 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G304 |
4.5 mm |
40 mm |
No |
2880 Logic elements; Built-in JTAG boundry-scan test circuitry |
e3 |
60.6 MHz |
40 mm |
249 |
||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
16 ns |
Yes |
2.7 V |
CMOS |
2.5 |
Grid Array |
Mixed |
2.3 V |
1 mm |
85 °C (185 °F) |
338 I/O |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B672 |
2.1 mm |
27 mm |
No |
e1 |
27 mm |
338 |
|||||||||||||||||||||
Altera |
OT PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
12 ns |
Yes |
5.25 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
160 |
1.27 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
4.572 mm |
11.5062 mm |
No |
Macrocells Interconnected By Global Bus; 16 Macrocells; 2 External Clocks |
e0 |
83.3 MHz |
16 |
220 °C (428 °F) |
11.5062 mm |
16 |
||||||||||
Altera |
Loadable PLD |
Commercial |
Pin/Peg |
403 |
IPGA |
Square |
Ceramic, Metal-Sealed Cofired |
27 ns |
No |
5.25 V |
CMOS |
5 |
Grid Array, Interstitial Pitch |
Registered |
4.75 V |
2.54 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 248 I/O |
4 |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P403 |
3.916 mm |
49.78 mm |
No |
1728 Logic elements Configurable I/O operation with 3.3 V or 5 V |
53.76 MHz |
49.78 mm |
248 |
||||||||||||||||||||
Altera |
Loadable PLD |
Other |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
4160 |
Yes |
2.625 V |
CMOS |
183 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 189 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
183 |
220 °C (428 °F) |
32 mm |
189 |
||||||||||||||
|
Altera |
Flash PLD |
Ball |
100 |
BGA |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
2.5 |
Grid Array |
Macrocell |
2.375 V |
0 Dedicated Inputs, 0 I/O |
0 |
Tin Silver Copper |
Bottom |
S-PBGA-B100 |
No |
It can also operate at 3.3 V |
e1 |
0 |
|||||||||||||||||||||||||||
Altera |
OT PLD |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
15 ns |
No |
5.25 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
160 |
2.54 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
4.318 mm |
7.62 mm |
No |
e0 |
100 MHz |
16 |
220 °C (428 °F) |
31.6865 mm |
16 |
|||||||||||
Altera |
Loadable PLD |
Commercial |
Pin/Peg |
232 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
1.8 ns |
No |
3.6 V |
CMOS |
3.3 |
Grid Array |
Registered |
3 V |
2.54 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 184 I/O |
4 |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P232 |
5.207 mm |
44.7 mm |
No |
Can also operate at 5 V supply |
44.7 mm |
184 |
|||||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
2.13 ns |
Yes |
1.89 V |
CMOS |
1.8 |
Grid Array |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 508 I/O |
4 |
0 °C (32 °F) |
Tin/Silver/Copper |
Bottom |
S-PBGA-B672 |
3.5 mm |
27 mm |
No |
e1 |
160 MHz |
40 s |
245 °C (473 °F) |
27 mm |
508 |
||||||||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
192 |
CMOS |
3.3/5,5 V |
Flatpack |
QFP160,1.2SQ |
Programmable Logic Devices |
No |
.635 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G160 |
3 |
No |
e0 |
220 °C (428 °F) |
No |
||||||||||||||||||||||
Altera |
Loadable PLD |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
672 |
Yes |
5.25 V |
CMOS |
152 |
5 |
3.3/5,5 V |
Flatpack, Fine Pitch |
HQFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Registered |
4.75 V |
.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 152 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
672 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e0 |
385 MHz |
148 |
220 °C (428 °F) |
28 mm |
152 |
|||||||||||
|
Altera |
Flash PLD |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
6.2 ns |
Yes |
2.625 V |
980 |
CMOS |
2.5 |
1.5/3.3,2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
.5 mm |
0 Dedicated Inputs, 116 I/O |
0 |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
It can also operate at 3.3 V |
e3 |
245 °C (473 °F) |
20 mm |
Yes |
116 |
|||||||||||||
|
Altera |
Flash PLD |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
7 ns |
Yes |
2.625 V |
1700 |
CMOS |
2.5 |
1.5/3.3,2.5/3.3 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
1 mm |
0 Dedicated Inputs, 204 I/O |
0 |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
3 |
2.2 mm |
17 mm |
No |
It can also operate at 3.3 V |
e1 |
245 °C (473 °F) |
17 mm |
Yes |
204 |
|||||||||||||
Altera |
EE PLD |
Industrial |
Ball |
100 |
LBGA |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Grid Array, Low Profile |
BGA100,10X10,40 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B100 |
3 |
1.7 mm |
11 mm |
No |
e0 |
98 MHz |
220 °C (428 °F) |
11 mm |
Yes |
84 |
|||||||||||
Altera |
EE PLD |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
3.6 V |
256 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 164 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e0 |
78.1 MHz |
220 °C (428 °F) |
28 mm |
Yes |
164 |
|||||||||||
Altera |
EE PLD |
Commercial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.25 V |
192 |
CMOS |
5 |
5 V |
Flatpack |
QFP160,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 120 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G160 |
3 |
4.07 mm |
28 mm |
No |
192 Macrocells; Shared Input/Clock |
e0 |
62.5 MHz |
220 °C (428 °F) |
28 mm |
No |
120 |
||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
HFQFP |
Square |
Plastic/Epoxy |
13 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Registered |
3 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 189 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
32 mm |
189 |
||||||||||||||||||||
Altera |
OT PLD |
Commercial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
48 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC68,1.0SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
12 Dedicated Inputs, 48 I/O |
12 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J68 |
24.2316 mm |
No |
48 Macrocells |
e0 |
18.5 MHz |
220 °C (428 °F) |
24.2316 mm |
No |
48 |
|||||||||||||
Altera |
EE PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
5 ns |
Yes |
3.6 V |
32 |
CMOS |
3.3 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
Can also operate with 3.3 V supply |
e0 |
250 MHz |
220 °C (428 °F) |
16.5862 mm |
Yes |
32 |
|||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
7.5 ns |
Yes |
5.5 V |
96 |
CMOS |
5 |
3.3/5,5 V |
Flatpack |
QFP100,.7X.9 |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
.65 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 76 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
R-PQFP-G100 |
3 |
3.65 mm |
14 mm |
No |
96 Macrocells |
e0 |
166.7 MHz |
220 °C (428 °F) |
20 mm |
No |
76 |
||||||||||
Altera |
UV PLD |
Military |
J Bend |
68 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
45 ns |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier, Window |
Macrocell |
4.5 V |
1.27 mm |
125 °C (257 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
-55 °C (-67 °F) |
Quad |
S-CQCC-J68 |
5.08 mm |
24.13 mm |
No |
Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock |
40 MHz |
24.13 mm |
52 |
||||||||||||||||||||
Altera |
Loadable PLD |
Other |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
2.5 |
Grid Array |
Macrocell |
2.375 V |
85 °C (185 °F) |
4 Dedicated Inputs, 252 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B672 |
No |
e1 |
252 |
||||||||||||||||||||||||||
Altera |
Loadable PLD |
Other |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
1.6 ns |
Yes |
1.89 V |
1.8 |
Grid Array |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 376 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B672 |
3 |
2.1 mm |
27 mm |
No |
e1 |
220 °C (428 °F) |
27 mm |
376 |
|||||||||||||||||||
Altera |
Loadable PLD |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
2.02 ns |
4160 |
Yes |
1.89 V |
CMOS |
143 |
1.8 |
1.8,1.8/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 151 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e0 |
20 s |
143 |
220 °C (428 °F) |
28 mm |
151 |
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Altera |
EE PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
12 ns |
Yes |
3.6 V |
512 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Grid Array |
BGA256,20X20,50 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 212 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
2.3 mm |
27 mm |
No |
512 Macrocells |
e0 |
71.9 MHz |
220 °C (428 °F) |
27 mm |
Yes |
212 |
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Altera |
UV PLD |
Military |
J Bend |
28 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
37 ns |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier, Window |
Macrocell |
4.5 V |
1.27 mm |
125 °C (257 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
-55 °C (-67 °F) |
Quad |
S-CQCC-J28 |
4.826 mm |
11.43 mm |
No |
Macrocells Interconnected By Global Bus; 16 Macrocells; 2 External Clocks |
28.6 MHz |
11.43 mm |
16 |
||||||||||||||||||||
Altera |
Loadable PLD |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
Yes |
1.8 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Macrocell |
.5 mm |
4 Dedicated Inputs, 100 I/O |
4 |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
e3 |
220 °C (428 °F) |
28 mm |
100 |
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Altera |
OT PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
200 |
1.27 mm |
70 °C (158 °F) |
8 Dedicated Inputs, 12 I/O |
8 |
0 °C (32 °F) |
Tin/Lead |
Quad |
S-PQCC-J28 |
4.572 mm |
11.5062 mm |
No |
12 Macrocells |
e0 |
66 MHz |
30 s |
12 |
220 °C (428 °F) |
11.5062 mm |
12 |
|||||||||
Altera |
Loadable PLD |
Military |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Registered |
4.5 V |
.5 mm |
125 °C (257 °F) |
4 Dedicated Inputs, 132 I/O |
4 |
-55 °C (-67 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
636 Flip Flops; 504 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e3 |
28 mm |
132 |
||||||||||||||||||||
Altera |
UV PLD |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
22 ns |
No |
5.25 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
160 |
2.54 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
No |
e0 |
55.6 MHz |
16 |
220 °C (428 °F) |
16 |
||||||||||||||
Altera |
Loadable PLD |
Ball |
356 |
LBGA |
Square |
Plastic/Epoxy |
6400 |
Yes |
2.625 V |
CMOS |
263 |
2.5 |
1.8,1.8/3.3 V |
Grid Array, Low Profile |
BGA356,26X26,50 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
1.27 mm |
4 Dedicated Inputs, 271 I/O |
4 |
Tin Silver Copper |
Bottom |
S-PBGA-B356 |
1.63 mm |
35 mm |
No |
e1 |
263 |
220 °C (428 °F) |
35 mm |
271 |
|||||||||||||||||
Altera |
EE PLD |
Commercial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
6 ns |
Yes |
5.25 V |
160 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
160 Macrocells; 10 Labs; Configurable I/O operation with 3.3 V or 5 V |
e0 |
166.7 MHz |
220 °C (428 °F) |
14 mm |
Yes |
84 |
||||||||||
|
Altera |
EE PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
5.5 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Grid Array |
Macrocell |
3 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 212 I/O |
0 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
2.3 mm |
27 mm |
No |
512 Macrocells |
e1 |
163.9 MHz |
27 mm |
212 |
|||||||||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
44 |
QFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
32 |
CMOS |
5 |
5 V |
Flatpack |
QFP44,.5SQ,32 |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
2.45 mm |
10 mm |
No |
e0 |
76.9 MHz |
220 °C (428 °F) |
10 mm |
No |
32 |
|||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
23 ns |
Yes |
5.5 V |
320 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Fine Pitch |
HQFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 132 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
484 Flip Flops; Configurable I/O operation with 3.3 V or 5 V |
e0 |
100 MHz |
220 °C (428 °F) |
28 mm |
Yes |
132 |
|||||||||||
Altera |
OT PLD |
Industrial |
Through-Hole |
40 |
DIP |
Rectangular |
Plastic/Epoxy |
50 ns |
No |
5.5 V |
CMOS |
5 |
In-Line |
Macrocell |
4.5 V |
2.54 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
-40 °C (-40 °F) |
Dual |
R-PDIP-T40 |
4.83 mm |
15.24 mm |
No |
24 Macrocells |
23.8 MHz |
52.324 mm |
24 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.