| Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Altera |
Loadable PLD |
Commercial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
12.5 ns |
Yes |
2.625 V |
CMOS |
2.5 |
Flatpack, Fine Pitch |
Mixed |
2.375 V |
.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 189 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
32 mm |
189 |
||||||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
1008 |
Yes |
5.5 V |
CMOS |
148 |
5 |
3.3/5,5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 148 I/O |
4 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
1008 Logic elements; 126 Labs; Configurable I/O operation with 3.3 V or 5 V |
e0 |
144 |
220 °C (428 °F) |
28 mm |
148 |
||||||||||||
|
|
Altera |
Flash PLD |
Automotive |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
7 ns |
Yes |
1.89 V |
1700 |
CMOS |
1.8 |
1.5/3.3,1.8 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
1 mm |
125 °C (257 °F) |
0 Dedicated Inputs, 204 I/O |
0 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
2.2 mm |
17 mm |
No |
It can also operate at 3.3 V |
e1 |
17 mm |
Yes |
204 |
||||||||||||
|
Altera |
UV PLD |
Commercial |
Gull Wing |
100 |
WQFP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
55 ns |
Yes |
5.25 V |
192 |
CMOS |
5 |
5 V |
Flatpack, Window |
QFP100,.7X.9 |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 64 I/O |
7 |
0 °C (32 °F) |
Tin Lead |
Quad |
R-CQFP-G100 |
3.35 mm |
13.2 mm |
No |
Labs interconnected by PIA; 12 Labs; 192 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
33.3 MHz |
220 °C (428 °F) |
19.2 mm |
No |
64 |
|||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
324 |
BGA |
Square |
Plastic/Epoxy |
1.72 ns |
2560 |
Yes |
1.89 V |
CMOS |
188 |
1.8 |
1.8,1.8/3.3 V |
Grid Array |
BGA324,18X18,40 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 196 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B324 |
3 |
3.5 mm |
19 mm |
No |
e0 |
160 MHz |
20 s |
188 |
220 °C (428 °F) |
19 mm |
196 |
||||||||||
|
Altera |
Loadable PLD |
Ball |
324 |
BGA |
Square |
Plastic/Epoxy |
2.41 ns |
2560 |
Yes |
1.89 V |
CMOS |
188 |
1.8 |
1.8,1.8/3.3 V |
Grid Array |
BGA324,18X18,40 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
1 mm |
4 Dedicated Inputs, 196 I/O |
4 |
Tin Silver Copper |
Bottom |
S-PBGA-B324 |
3 |
3.5 mm |
19 mm |
No |
e1 |
188 |
220 °C (428 °F) |
19 mm |
196 |
|||||||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
16.4 ns |
Yes |
5.25 V |
480 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Fine Pitch |
HQFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 146 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
676 Flip Flops; Configurable I/O operation with 3.3 V or 5 V |
e0 |
117.6 MHz |
220 °C (428 °F) |
28 mm |
Yes |
146 |
||||||||||
|
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
17.2 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack, Fine Pitch |
Registered |
4.75 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 189 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
32 mm |
189 |
||||||||||||||||||||
|
Altera |
Loadable PLD |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
CMOS |
2.5 |
Flatpack, Fine Pitch |
Macrocell |
2.375 V |
.5 mm |
4 Dedicated Inputs, 152 I/O |
4 |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
220 °C (428 °F) |
32 mm |
152 |
|||||||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
652 |
LBGA |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
1.8 |
Grid Array, Low Profile |
Macrocell |
1.71 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 488 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B652 |
1.63 mm |
45 mm |
No |
e1 |
160 MHz |
45 mm |
488 |
|||||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
1960 |
Yes |
3.6 V |
CMOS |
171 |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 171 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Can Also Be Used 24000 Logic Gates |
e0 |
153 MHz |
20 s |
171 |
220 °C (428 °F) |
28 mm |
171 |
||||||||||
|
Altera |
Loadable PLD |
Commercial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack, Fine Pitch |
Registered |
4.75 V |
.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 189 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
1152 Logic elements; Built-in JTAG boundry-scan test circuitry |
e3 |
60.6 MHz |
32 mm |
189 |
||||||||||||||||||
|
Altera |
Commercial |
Through-Hole |
40 |
DIP |
Rectangular |
Plastic/Epoxy |
60 ns |
No |
CMOS |
36 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP40,.6 |
Programmable Logic Devices |
Macrocell |
240 |
2.54 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T40 |
No |
e0 |
16.7 MHz |
24 |
220 °C (428 °F) |
||||||||||||||||||||
|
Altera |
EE PLD |
Industrial |
Gull Wing |
44 |
LQFP |
Square |
Plastic/Epoxy |
6 ns |
Yes |
5.5 V |
64 |
CMOS |
5 |
5 V |
Flatpack, Low Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
1.27 mm |
10 mm |
No |
64 Macrocells |
e0 |
200 MHz |
220 °C (428 °F) |
10 mm |
No |
36 |
||||||||||
|
Altera |
Loadable PLD |
Commercial |
Pin/Peg |
599 |
HIPGA |
Square |
Ceramic, Metal-Sealed Cofired |
12160 |
No |
2.7 V |
CMOS |
470 |
2.5 |
2.5,2.5/3.3 V |
Grid Array, Heat Sink/Slug, Interstitial Pitch |
SPGA599,47X47 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
2.54 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 470 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P599 |
1 |
5.08 mm |
62.484 mm |
No |
e0 |
470 |
220 °C (428 °F) |
62.484 mm |
470 |
|||||||||||||
|
Altera |
Loadable PLD |
Commercial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
2.7 V |
CMOS |
2.5 |
Flatpack, Fine Pitch |
Mixed |
2.3 V |
.5 mm |
70 °C (158 °F) |
182 I/O |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
32 mm |
182 |
|||||||||||||||||||||
|
Altera |
Loadable PLD |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
2.41 ns |
2560 |
Yes |
1.89 V |
CMOS |
140 |
1.8 |
1.8,1.8/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
.5 mm |
4 Dedicated Inputs, 148 I/O |
4 |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
140 |
220 °C (428 °F) |
28 mm |
148 |
|||||||||||||||
|
Altera |
Flash PLD |
Gull Wing |
100 |
QFP |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
2.5 |
Flatpack |
Macrocell |
2.375 V |
0 Dedicated Inputs, 0 I/O |
0 |
Tin Lead |
Quad |
S-PQFP-G100 |
No |
It can also operate at 3.3 V |
e0 |
0 |
||||||||||||||||||||||||||||
|
Altera |
Loadable PLD |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
1.7 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Flatpack, Fine Pitch |
Registered |
3 V |
.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 148 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
Can also operate at 5 V supply |
e3 |
28 mm |
148 |
|||||||||||||||||||
|
Altera |
Loadable PLD |
Military |
Pin/Peg |
160 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
CMOS |
5 |
Grid Array |
Registered |
4.5 V |
2.54 mm |
125 °C (257 °F) |
4 Dedicated Inputs, 116 I/O |
4 |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P160 |
5.34 mm |
39.624 mm |
No |
452 Flip Flops; 336 Logic Elements |
39.624 mm |
116 |
||||||||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Ball |
356 |
HLBGA |
Square |
Plastic/Epoxy |
27 ns |
Yes |
5.5 V |
CMOS |
5 |
Grid Array, Heat Sink/Slug, Low Profile |
Registered |
4.5 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs |
4 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B356 |
1.63 mm |
35 mm |
No |
2304 Logic elements Configurable I/O operation with 3.3 V or 5 V |
e1 |
53.76 MHz |
35 mm |
|||||||||||||||||||
|
Altera |
EE PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.5 V |
64 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
64 Macrocells |
e0 |
166.7 MHz |
220 °C (428 °F) |
29.3116 mm |
No |
68 |
|||||||||||
|
Altera |
EE PLD |
Industrial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Flatpack, Low Profile, Fine Pitch |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
1.27 mm |
14 mm |
No |
e3 |
100 MHz |
14 mm |
84 |
|||||||||||||||||||
|
Altera |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic |
22 ns |
No |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
160 |
2.54 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-XDIP-T24 |
No |
e0 |
55.5 MHz |
16 |
220 °C (428 °F) |
||||||||||||||||||||
|
Altera |
EE PLD |
Industrial |
Gull Wing |
208 |
QFP |
Square |
Ceramic |
23.6 ns |
Yes |
560 |
CMOS |
3.3/5,5 V |
Flatpack |
QFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
.5 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-XQFP-G208 |
No |
e0 |
220 °C (428 °F) |
Yes |
|||||||||||||||||||||||
|
Altera |
OT PLD |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic |
25 ns |
No |
CMOS |
24 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP28,.3 |
Programmable Logic Devices |
320 |
2.54 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-XDIP-T28 |
No |
e0 |
62.5 MHz |
16 |
220 °C (428 °F) |
||||||||||||||||||||
|
|
Altera |
Loadable PLD |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
1.93 ns |
Yes |
1.89 V |
CMOS |
1.8 |
Grid Array |
Macrocell |
1.71 V |
1 mm |
4 Dedicated Inputs, 316 I/O |
4 |
Tin/Silver/Copper |
Bottom |
S-PBGA-B484 |
3 |
2.1 mm |
23 mm |
No |
e1 |
40 s |
260 °C (500 °F) |
23 mm |
316 |
|||||||||||||||||||
|
Altera |
UV PLD |
Military |
Pin/Peg |
100 |
WPGA |
Square |
Ceramic, Metal-Sealed Cofired |
55 ns |
No |
5.5 V |
CMOS |
5 |
Grid Array, Window |
Macrocell |
4.5 V |
2.54 mm |
125 °C (257 °F) |
19 Dedicated Inputs, 64 I/O |
19 |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P100 |
3.81 mm |
33.528 mm |
No |
Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock |
33.3 MHz |
33.528 mm |
64 |
||||||||||||||||||||
|
Altera |
UV PLD |
Military |
Through-Hole |
24 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
55 ns |
No |
5.5 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
In-Line, Window |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
160 |
2.54 mm |
125 °C (257 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
4.826 mm |
7.62 mm |
No |
16 Macrocells |
e0 |
22.2 MHz |
16 |
220 °C (428 °F) |
31.9405 mm |
16 |
||||||||||
|
Altera |
Loadable PLD |
Commercial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
14.5 ns |
4992 |
Yes |
2.7 V |
CMOS |
189 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
.5 mm |
70 °C (158 °F) |
189 I/O |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
4992 Logic Elements |
e0 |
140 MHz |
189 |
220 °C (428 °F) |
32 mm |
189 |
|||||||||||
|
Altera |
Loadable PLD |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
880 |
Yes |
3.6 V |
CMOS |
102 |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.63SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
3 V |
.5 mm |
4 Dedicated Inputs, 102 I/O |
4 |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Also Configurable with 5 V VCC |
e0 |
153 MHz |
102 |
220 °C (428 °F) |
20 mm |
102 |
||||||||||||||
|
Altera |
Loadable PLD |
Commercial |
Ball |
356 |
LBGA |
Square |
Plastic/Epoxy |
0.7 ns |
1728 |
Yes |
3.6 V |
CMOS |
246 |
3.3 |
2.5/3.3,3.3 V |
Grid Array, Low Profile |
BGA356,26X26,50 |
Field Programmable Gate Arrays |
Registered |
3 V |
1.27 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 246 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B356 |
3 |
1.63 mm |
35 mm |
No |
1728 Logic Elements; 216 Labs |
e0 |
80 MHz |
20 s |
246 |
220 °C (428 °F) |
35 mm |
246 |
|||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
23 ns |
Yes |
5.25 V |
320 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Fine Pitch |
HQFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 132 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
484 Flip Flops; Configurable I/O operation with 3.3 V or 5 V |
e0 |
100 MHz |
220 °C (428 °F) |
28 mm |
Yes |
132 |
|||||||||||
|
|
Altera |
EE PLD |
Industrial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
128 |
CMOS |
5 |
3.3/5,5 V |
Flatpack |
QFP160,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.65 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 100 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
3 |
4.07 mm |
28 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e3 |
125 MHz |
28 mm |
Yes |
100 |
||||||||||
|
Altera |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
3.5 ns |
Yes |
CMOS |
2.5 |
Chip Carrier |
Macrocell |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
0 °C (32 °F) |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
16.5862 mm |
36 |
||||||||||||||||||||||||
|
|
Altera |
Loadable PLD |
Other |
Ball |
652 |
LBGA |
Square |
Plastic/Epoxy |
1.78 ns |
Yes |
1.89 V |
1.8 |
Grid Array, Low Profile |
Macrocell |
1.71 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 488 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B652 |
3 |
1.63 mm |
45 mm |
No |
e1 |
45 mm |
488 |
|||||||||||||||||||
|
|
Altera |
EE PLD |
Commercial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 98 I/O |
0 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
3 |
3.5 mm |
17 mm |
No |
e1 |
30 s |
260 °C (500 °F) |
17 mm |
Yes |
98 |
||||||||||
|
Altera |
Loadable PLD |
Commercial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
336 |
Yes |
5.25 V |
CMOS |
68 |
5 |
3.3/5,5 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
Registered |
4.75 V |
.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 78 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
336 Logic Elements |
e0 |
417 MHz |
64 |
220 °C (428 °F) |
14 mm |
78 |
|||||||||||
|
|
Altera |
Loadable PLD |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
3.3 |
Flatpack, Low Profile, Fine Pitch |
Macrocell |
3 V |
.5 mm |
4 Dedicated Inputs, 117 I/O |
4 |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Can Also Be Used 16000 Logic Gates |
e3 |
133 MHz |
20 mm |
117 |
|||||||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
2.5 |
Flatpack, Low Profile, Fine Pitch |
Registered |
2.375 V |
.5 mm |
85 °C (185 °F) |
6 Dedicated Inputs, 102 I/O |
6 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
e3 |
20 mm |
102 |
||||||||||||||||||||||
|
Altera |
OT PLD |
Industrial |
Gull Wing |
100 |
QFP |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack |
Macrocell |
4.5 V |
85 °C (185 °F) |
20 Dedicated Inputs, 64 I/O |
20 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
No |
e3 |
62.5 MHz |
64 |
|||||||||||||||||||||||
|
Altera |
Loadable PLD |
Military |
Gull Wing |
240 |
HFQFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Registered |
4.5 V |
.5 mm |
125 °C (257 °F) |
4 Dedicated Inputs, 180 I/O |
4 |
-55 °C (-67 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e3 |
32 mm |
180 |
||||||||||||||||||||
|
|
Altera |
Flash PLD |
Ball |
100 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
1.8 |
Grid Array |
Macrocell |
1.71 V |
0 Dedicated Inputs, 0 I/O |
0 |
Tin Silver Copper |
Bottom |
S-PBGA-B100 |
No |
e1 |
0 |
||||||||||||||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Pin/Peg |
503 |
IPGA |
Square |
Ceramic, Metal-Sealed Cofired |
24.2 ns |
3744 |
No |
5.25 V |
CMOS |
358 |
5 |
3.3/5,5 V |
Grid Array, Interstitial Pitch |
SPGA503,43X43 |
Field Programmable Gate Arrays |
Registered |
4.75 V |
2.54 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 358 I/O |
4 |
-40 °C (-40 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P503 |
1 |
5.077 mm |
57.4 mm |
No |
3744 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e0 |
49 MHz |
354 |
220 °C (428 °F) |
57.4 mm |
358 |
||||||||||
|
|
Altera |
Flash PLD |
Automotive |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
7 ns |
Yes |
2.625 V |
440 |
CMOS |
2.5 |
1.5/3.3,2.5/3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
.5 mm |
125 °C (257 °F) |
0 Dedicated Inputs, 76 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
1.2 mm |
14 mm |
No |
It can also operate at 3.3 V |
e3 |
14 mm |
Yes |
76 |
||||||||||||
|
Altera |
EE PLD |
Industrial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
6 ns |
Yes |
5.5 V |
128 |
CMOS |
5 |
3.3/5,5 V |
Flatpack |
QFP100,.7X.9 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.65 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
R-PQFP-G100 |
3 |
3.65 mm |
14 mm |
No |
128 Macrocells |
e0 |
200 MHz |
220 °C (428 °F) |
20 mm |
Yes |
84 |
||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 72 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
R-PQFP-G100 |
3.65 mm |
14 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e3 |
100 MHz |
20 mm |
72 |
||||||||||||||||||
|
Altera |
Loadable PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
504 |
Yes |
5.25 V |
CMOS |
68 |
5 |
5 V |
Chip Carrier |
LDCC84,1.2SQ |
Field Programmable Gate Arrays |
Registered |
4.75 V |
1.27 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 68 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
No |
504 Logic Elements |
e0 |
385 MHz |
20 s |
64 |
220 °C (428 °F) |
29.3116 mm |
68 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.