Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Altera |
Loadable PLD |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
1200 |
Yes |
2.625 V |
CMOS |
117 |
2.5 |
1.8,1.8/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
4 Dedicated Inputs, 125 I/O |
4 |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
117 |
220 °C (428 °F) |
28 mm |
125 |
||||||||||||||||
Altera |
Flash PLD |
Ball |
100 |
BGA |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
2.5 |
Grid Array |
Macrocell |
2.375 V |
0 Dedicated Inputs, 0 I/O |
0 |
Tin Lead |
Bottom |
S-PBGA-B100 |
No |
It can also operate at 3.3 V |
e0 |
0 |
||||||||||||||||||||||||||||
Altera |
OT PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
55 ns |
Yes |
5.25 V |
192 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 64 I/O |
7 |
0 °C (32 °F) |
Tin/Lead |
Quad |
S-PQCC-J84 |
No |
Labs interconnected by PIA; 12 Labs; 192 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
33.3 MHz |
30 s |
220 °C (428 °F) |
No |
64 |
|||||||||||||
Altera |
OT PLD |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
CMOS |
5 |
Small Outline |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 8 I/O |
7 |
0 °C (32 °F) |
Dual |
R-PDSO-G20 |
2.65 mm |
7.5 mm |
No |
16 Macrocells; Shared Input/Clock; Shared Product Terms |
100 MHz |
12.8 mm |
8 |
||||||||||||||||||||
Altera |
Loadable PLD |
Commercial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
2.5 |
Grid Array |
Registered |
2.375 V |
1 mm |
70 °C (158 °F) |
6 Dedicated Inputs, 186 I/O |
6 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
2.1 mm |
17 mm |
No |
e1 |
17 mm |
186 |
||||||||||||||||||||||
Altera |
Loadable PLD |
Other |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
2.29 ns |
11520 |
Yes |
1.89 V |
CMOS |
144 |
1.8 |
1.8,1.8/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 152 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e0 |
160 MHz |
20 s |
144 |
220 °C (428 °F) |
32 mm |
152 |
||||||||||
Altera |
OT PLD |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
17 ns |
No |
5.25 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
160 |
2.54 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
4.32 mm |
7.62 mm |
No |
Macrocells Interconnected By Global Bus; 16 Macrocells; 2 External Clocks |
e0 |
71.4 MHz |
16 |
220 °C (428 °F) |
31.68 mm |
16 |
||||||||||
Altera |
Loadable PLD |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
2560 |
Yes |
2.625 V |
CMOS |
143 |
2.5 |
1.8,1.8/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
4 Dedicated Inputs, 151 I/O |
4 |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
143 |
220 °C (428 °F) |
32 mm |
151 |
|||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
356 |
LBGA |
Square |
Plastic/Epoxy |
9 ns |
6656 |
Yes |
2.7 V |
CMOS |
274 |
2.5 |
2.5,2.5/3.3 V |
Grid Array, Low Profile |
BGA356,26X26,50 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
1.27 mm |
85 °C (185 °F) |
274 I/O |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B356 |
1.63 mm |
35 mm |
No |
e0 |
274 |
220 °C (428 °F) |
35 mm |
274 |
||||||||||||||
Altera |
OT PLD |
Military |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
25 ns |
Yes |
5.5 V |
CMOS |
24 |
PAL-TYPE |
5 |
5 V |
Small Outline |
SOP28,.5 |
Programmable Logic Devices |
Macrocell |
4.5 V |
320 |
1.27 mm |
125 °C (257 °F) |
7 Dedicated Inputs, 16 I/O |
7 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-PDSO-G28 |
2.65 mm |
7.5 mm |
No |
Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
50 MHz |
16 |
220 °C (428 °F) |
17.9 mm |
16 |
||||||||||
Altera |
EE PLD |
Commercial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Flatpack, Low Profile, Fine Pitch |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
1.27 mm |
14 mm |
No |
e3 |
100 MHz |
14 mm |
84 |
|||||||||||||||||||
Altera |
EE PLD |
Commercial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
e0 |
100 MHz |
220 °C (428 °F) |
14 mm |
Yes |
84 |
|||||||||||
|
Altera |
Flash PLD |
Other |
Ball |
68 |
TFBGA |
Square |
Plastic/Epoxy |
7.9 ns |
Yes |
1.89 V |
64 |
CMOS |
1.8 |
1.8,1.2/3.3 V |
Grid Array, Thin Profile, Fine Pitch |
BGA68,9X9,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
52 I/O |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B68 |
1.2 mm |
5 mm |
No |
e1 |
184.1 MHz |
5 mm |
Yes |
52 |
|||||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
128 Macrocells |
e0 |
116.3 MHz |
220 °C (428 °F) |
14 mm |
Yes |
84 |
||||||||||
Altera |
Loadable PLD |
Other |
Ball |
356 |
LBGA |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
2.5 |
Grid Array, Low Profile |
Macrocell |
2.375 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 279 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B356 |
1.63 mm |
35 mm |
No |
e1 |
220 °C (428 °F) |
35 mm |
279 |
|||||||||||||||||||||
Altera |
EE PLD |
Commercial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
64 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
64 Macrocells; 4 Labs; Configurable I/O operation with 3.3 V or 5 V |
e0 |
125 MHz |
20 s |
235 °C (455 °F) |
14 mm |
Yes |
68 |
|||||||||
Altera |
Loadable PLD |
Other |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
1.8 |
Flatpack, Fine Pitch |
Macrocell |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 132 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e3 |
220 °C (428 °F) |
32 mm |
132 |
||||||||||||||||||||||
Altera |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic |
37 ns |
No |
CMOS |
38535Q/M;38534H;883B |
20 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
160 |
2.54 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-XDIP-T24 |
No |
e0 |
28.6 MHz |
16 |
220 °C (428 °F) |
|||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
1.8 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Flatpack, Fine Pitch |
Registered |
3 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 136 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
Can also operate at 5 V supply |
e3 |
28 mm |
136 |
|||||||||||||||||||
|
Altera |
EE PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
6 ns |
Yes |
32 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
1.27 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Quad |
S-PQCC-J44 |
No |
Yes |
||||||||||||||||||||||||
Altera |
220 °C (428 °F) |
||||||||||||||||||||||||||||||||||||||||||||||||
Altera |
UV PLD |
Military |
Through-Hole |
24 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
37 ns |
No |
5.5 V |
CMOS |
5 |
In-Line, Window |
Macrocell |
4.5 V |
2.54 mm |
125 °C (257 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
5.08 mm |
7.62 mm |
No |
Macrocells Interconnected By Global Bus; 16 Macrocells; 2 External Clocks |
e0 |
28.5 MHz |
32 mm |
16 |
||||||||||||||||||
Altera |
UV PLD |
Military |
Pin/Peg |
100 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
59 ns |
No |
5.5 V |
CMOS |
MIL-STD-883 Class B |
5 |
Grid Array |
Macrocell |
4.5 V |
125 °C (257 °F) |
19 Dedicated Inputs, 64 I/O |
19 |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P100 |
No |
27.7 MHz |
64 |
||||||||||||||||||||||||
Altera |
Loadable PLD |
Commercial |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
0.5 ns |
2880 |
Yes |
2.625 V |
CMOS |
254 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
1 mm |
70 °C (158 °F) |
254 I/O |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B484 |
3 |
2.1 mm |
23 mm |
No |
e0 |
20 s |
254 |
220 °C (428 °F) |
23 mm |
254 |
||||||||||||
Altera |
Loadable PLD |
Commercial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
CMOS |
2.5 |
Flatpack, Fine Pitch |
Mixed |
.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 189 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
32 mm |
189 |
||||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Pin/Peg |
232 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
1008 |
No |
5.5 V |
CMOS |
184 |
5 |
3.3/5,5 V |
Grid Array |
PGA232M,17X17 |
Field Programmable Gate Arrays |
Registered |
4.5 V |
2.54 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 184 I/O |
4 |
-40 °C (-40 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P232 |
1 |
5.207 mm |
44.7 mm |
No |
1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e0 |
385 MHz |
180 |
220 °C (428 °F) |
44.7 mm |
184 |
|||||||||||
|
Altera |
EE PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
160 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 64 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e3 |
125 MHz |
29.3116 mm |
Yes |
64 |
|||||||||||
|
Altera |
EE PLD |
Industrial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
3.5 ns |
Yes |
2.625 V |
64 |
CMOS |
2.5 |
1.8/3.3,2.5 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
e3 |
303 MHz |
14 mm |
Yes |
68 |
|||||||||||
|
Altera |
Loadable PLD |
Commercial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
0.7 ns |
576 |
Yes |
2.625 V |
CMOS |
136 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
1 mm |
70 °C (158 °F) |
136 I/O |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
3 |
2.1 mm |
17 mm |
No |
e1 |
30 s |
136 |
260 °C (500 °F) |
17 mm |
136 |
|||||||||||
Altera |
Loadable PLD |
Commercial |
Pin/Peg |
192 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
504 |
No |
5.25 V |
CMOS |
136 |
5 |
3.3/5,5 V |
Grid Array |
PGA192M,17X17 |
Field Programmable Gate Arrays |
Registered |
4.75 V |
2.54 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 136 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P192 |
1 |
5.43 mm |
45.15 mm |
No |
504 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e0 |
357 MHz |
132 |
220 °C (428 °F) |
45.15 mm |
136 |
|||||||||||
Altera |
EE PLD |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
R-PQFP-G100 |
3.65 mm |
14 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e3 |
100 MHz |
20 mm |
80 |
||||||||||||||||||
Altera |
Loadable PLD |
Other |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
CMOS |
1.8 |
Grid Array |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 303 I/O |
0 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B484 |
2.1 mm |
23 mm |
No |
e1 |
23 mm |
303 |
|||||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
3 ns |
Yes |
2.625 V |
CMOS |
2.5 |
Flatpack, Fine Pitch |
Macrocell |
2.375 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 159 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
28 mm |
159 |
||||||||||||||||||
Altera |
EE PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.63SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 100 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
100 MHz |
220 °C (428 °F) |
20 mm |
Yes |
100 |
|||||||||||
Altera |
EE PLD |
Commercial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
16.4 ns |
Yes |
5.25 V |
480 |
CMOS |
5 |
3.3/5,5 V |
Flatpack |
QFP160,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 113 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G160 |
3.91 mm |
28 mm |
No |
480 Macrocells; 676 Flip Flops; Configurable I/O operation with 3.3 V or 5 V |
e0 |
117.6 MHz |
220 °C (428 °F) |
28 mm |
Yes |
113 |
|||||||||||
Altera |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
12 ns |
Yes |
5.25 V |
160 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 64 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
2 |
5.08 mm |
29.3116 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
125 MHz |
20 s |
220 °C (428 °F) |
29.3116 mm |
No |
64 |
|||||||||
Altera |
Flash PLD |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
10 ns |
Yes |
980 |
CMOS |
1.5/3.3,2.5/3.3 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
1 mm |
Tin Lead |
Bottom |
S-PBGA-B256 |
1 |
No |
e0 |
Yes |
||||||||||||||||||||||||||
Altera |
EE PLD |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
23.6 ns |
Yes |
5.25 V |
560 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Fine Pitch |
HQFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 153 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
772 Flip Flops; Configurable I/O operation with 3.3 V or 5 V |
e0 |
100 MHz |
220 °C (428 °F) |
28 mm |
Yes |
153 |
|||||||||||
Altera |
EE PLD |
Commercial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
23.4 ns |
Yes |
5.25 V |
480 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Fine Pitch |
HQFP240,1.37SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 175 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
676 Flip Flops; Configurable I/O operation with 3.3 V or 5 V |
e0 |
100 MHz |
220 °C (428 °F) |
32 mm |
Yes |
175 |
|||||||||||
Altera |
UV PLD |
Industrial |
J Bend |
44 |
WQCCJ |
Square |
Ceramic, Glass-Sealed |
50 ns |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier, Window |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
-40 °C (-40 °F) |
Quad |
S-GQCC-J44 |
4.57 mm |
16.51 mm |
No |
28 Macrocells |
28.5 MHz |
16.51 mm |
24 |
||||||||||||||||||||
Altera |
Loadable PLD |
Military |
Pin/Peg |
192 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
0.9 ns |
No |
5.5 V |
CMOS |
MIL-STD-883 |
5 |
Grid Array |
Registered |
4.5 V |
2.54 mm |
125 °C (257 °F) |
4 Dedicated Inputs, 148 I/O |
4 |
-55 °C (-67 °F) |
Gold |
Perpendicular |
S-CPGA-P192 |
5.43 mm |
45.15 mm |
No |
820 Flip Flops; 672 Logic Elements; Configurable I/O Operation |
e4 |
45.15 mm |
148 |
||||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
1.83 ns |
16640 |
Yes |
1.89 V |
CMOS |
480 |
1.8 |
1.8,1.8/3.3 V |
Grid Array |
BGA672,26X26,40 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 488 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B672 |
3 |
3.5 mm |
27 mm |
No |
e1 |
160 MHz |
30 s |
480 |
245 °C (473 °F) |
27 mm |
488 |
|||||||||
Altera |
Loadable PLD |
Commercial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
0.5 ns |
2880 |
Yes |
2.625 V |
CMOS |
189 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
.5 mm |
70 °C (158 °F) |
189 I/O |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e0 |
20 s |
189 |
220 °C (428 °F) |
32 mm |
189 |
||||||||||||
Altera |
Loadable PLD |
Commercial |
Pin/Peg |
192 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
1.9 ns |
No |
3.6 V |
CMOS |
3.3 |
Grid Array |
Registered |
3 V |
2.54 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 152 I/O |
4 |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P192 |
5.43 mm |
45.15 mm |
No |
Can also operate at 5 V supply |
45.15 mm |
152 |
|||||||||||||||||||||
Altera |
Loadable PLD |
Military |
Ball |
356 |
HLBGA |
Square |
Plastic/Epoxy |
27 ns |
Yes |
5.5 V |
CMOS |
5 |
Grid Array, Heat Sink/Slug, Low Profile |
Registered |
4.5 V |
1.27 mm |
125 °C (257 °F) |
4 Dedicated Inputs |
4 |
-55 °C (-67 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B356 |
1.63 mm |
35 mm |
No |
1728 Logic elements Configurable I/O operation with 3.3 V or 5 V |
e1 |
53.76 MHz |
35 mm |
|||||||||||||||||||
Altera |
EE PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
6 ns |
Yes |
5.5 V |
64 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
64 Macrocells |
e0 |
200 MHz |
220 °C (428 °F) |
16.5862 mm |
No |
36 |
|||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
100 |
QFP |
Square |
Plastic/Epoxy |
5 ns |
Yes |
64 |
CMOS |
2.5/3.3,3.3 V |
Flatpack |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
.5 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
No |
e0 |
220 °C (428 °F) |
Yes |
||||||||||||||||||||||
|
Altera |
Loadable PLD |
Commercial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
1.9 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack, Fine Pitch |
Registered |
4.75 V |
.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 181 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
1296 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e3 |
32 mm |
181 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.