Infineon Technologies Programmable Logic Devices (PLD) 178

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

5962-8946803XA

Infineon Technologies

UV PLD

Military

Pin/Peg

68

WPGA

Square

Ceramic, Metal-Sealed Cofired

51 ns

No

5.5 V

CMOS

5

Grid Array, Window

Macrocell

4.5 V

2.54 mm

125 °C (257 °F)

7 Dedicated Inputs, 52 I/O

7

-55 °C (-67 °F)

Tin Lead

Perpendicular

S-CPGA-P68

5.08 mm

27.9527 mm

No

Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock

e0

33.3 MHz

27.9527 mm

52

PALC22V10-25PIT

Infineon Technologies

5962-01-382-7255

Infineon Technologies

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

5 ns

Yes

CMOS

22

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

132

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

1

No

e0

143 MHz

10

5962-9233804M2X

Infineon Technologies

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

10 ns

Yes

5.5 V

BICMOS

MIL-STD-883

5

Chip Carrier

Mixed

4.5 V

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Quad

S-CQCC-N20

1.905 mm

8.89 mm

No

Power-Up Reset

87 MHz

8.89 mm

4

PALC22V10-25HIR

Infineon Technologies

5962-01-302-9836

Infineon Technologies

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

CMOS

38535Q/M;38534H;883B

22

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

90

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T24

1

No

e0

25 MHz

10

PALC22V10-25LIB

Infineon Technologies

PALC22V10-25JMT

Infineon Technologies

5962-01-394-3671

Infineon Technologies

EE PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic

30 ns

No

CMOS

38535Q/M;38534H;883B

16

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Combinatorial

64

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T20

No

8

5962-01-350-4918

Infineon Technologies

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

35 ns

No

CMOS

22

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

132

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T24

No

18.1 MHz

10

PALC22V10-20LIB

Infineon Technologies

PALC22V10-40PMB

Infineon Technologies

PALC22V10-20JIB

Infineon Technologies

PALC22V10-35WIT

Infineon Technologies

5962-01-382-3824

Infineon Technologies

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

5 ns

Yes

CMOS

22

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

132

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

1

No

e0

143 MHz

10

PALC22V10-25LCT

Infineon Technologies

PALC22V10-20HCR

Infineon Technologies

PALC22V10-35WCR

Infineon Technologies

5962-8946804XX

Infineon Technologies

UV PLD

Military

Pin/Peg

68

WPGA

Square

Ceramic, Metal-Sealed Cofired

42 ns

No

5.5 V

CMOS

5

Grid Array, Window

Macrocell

4.5 V

2.54 mm

125 °C (257 °F)

7 Dedicated Inputs, 52 I/O

7

-55 °C (-67 °F)

Tin Lead

Perpendicular

S-CPGA-P68

5.08 mm

27.9527 mm

No

Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock

e0

40 MHz

27.9527 mm

52

PALC22V10-20PIB

Infineon Technologies

5962-9233801M2A

Infineon Technologies

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

10 ns

Yes

5.5 V

BICMOS

MIL-STD-883

5

Chip Carrier

Combinatorial

4.5 V

1.27 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

1.905 mm

8.89 mm

No

e0

8.89 mm

6

PALC22V10-20WCB

Infineon Technologies

PALC22V10-20LCB

Infineon Technologies

PALC22V10-35PIT

Infineon Technologies

5962-01-382-3822

Infineon Technologies

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

5 ns

Yes

CMOS

22

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

132

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

1

No

e0

143 MHz

10

PALC22V10-35HCT

Infineon Technologies

CY37064VP84-83JI

Infineon Technologies

EE PLD

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

64

CMOS

3.3

3.3 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

Yes

1.27 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead

Quad

S-PQCC-J84

No

e0

Yes

PALC22V10-35HIT

Infineon Technologies

5962-01-359-8984

Infineon Technologies

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic

No

CMOS

25

PAL-TYPE

5

5 V

In-Line

DIP28,.3

Programmable Logic Devices

192

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-XDIP-T28

No

23.8 MHz

12

5962-01-382-3312

Infineon Technologies

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

35 ns

No

CMOS

22

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

132

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T24

No

18.1 MHz

10

PALC22V10-20WCR

Infineon Technologies

5962-9233806M2A

Infineon Technologies

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

7 ns

Yes

5.5 V

BICMOS

MIL-STD-883

5

Chip Carrier

Registered

4.5 V

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

1.905 mm

8.89 mm

No

Power-Up Reset

e0

105.3 MHz

8.89 mm

0

PALC22V10-35WIR

Infineon Technologies

PALC22V10-25LMT

Infineon Technologies

PALC22V10-20JCB

Infineon Technologies

PALC22V10-25JMR

Infineon Technologies

PALC22V10-25PCR

Infineon Technologies

5962-01-421-4812

Infineon Technologies

EE PLD

Military

No Lead

20

QCCN

Square

Ceramic

20 ns

Yes

CMOS

38535Q/M;38534H;883B

16

PAL-TYPE

5

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

Registered

64

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N20

No

28.5 MHz

6

PALC22V10-40JMT

Infineon Technologies

PALC22V10-25HCT

Infineon Technologies

5962-01-305-5393

Infineon Technologies

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

CMOS

38535Q/M;38534H;883B

22

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

90

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T24

1

No

e0

25 MHz

10

PALC22V10-20LIR

Infineon Technologies

CY37064P100-100AI

Infineon Technologies

EE PLD

Industrial

Gull Wing

100

QFP

Square

Plastic/Epoxy

12 ns

Yes

64

CMOS

3.3/5,5 V

Flatpack

QFP100,.63SQ,20

Programmable Logic Devices

Yes

.5 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G100

No

e0

Yes

PALC22V10-40LMR

Infineon Technologies

5962-9233808M2A

Infineon Technologies

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

7 ns

Yes

5.5 V

BICMOS

MIL-STD-883

5

Chip Carrier

Mixed

4.5 V

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

1.905 mm

8.89 mm

No

Power-Up Reset

e0

105.3 MHz

8.89 mm

4

5962-01-382-7170

Infineon Technologies

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

5 ns

Yes

CMOS

22

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

132

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

1

No

e0

143 MHz

10

PALC22V10-25PMT

Infineon Technologies

PALC22V10-35HIR

Infineon Technologies

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.