Infineon Technologies Programmable Logic Devices (PLD) 178

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

PALC22V10-25HCR

Infineon Technologies

PALC22V10-30JMR

Infineon Technologies

5962-01-360-1553

Infineon Technologies

EE PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic

30 ns

No

CMOS

38535Q/M;38534H;883B

16

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Combinatorial

64

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T20

No

8

PALC22V10-35PIR

Infineon Technologies

PALC22V10-20HCB

Infineon Technologies

5962-8946803XX

Infineon Technologies

UV PLD

Military

Pin/Peg

68

PGA

Square

Ceramic, Metal-Sealed Cofired

51 ns

No

5.5 V

CMOS

MIL-STD-883

5

Grid Array

Macrocell

4.5 V

125 °C (257 °F)

7 Dedicated Inputs, 52 I/O

7

-55 °C (-67 °F)

Perpendicular

S-CPGA-P68

No

52

PALC22V10-35HCB

Infineon Technologies

PALC22V10-30JMT

Infineon Technologies

PALC22V10-20PCT

Infineon Technologies

5962-01-382-8715

Infineon Technologies

EE PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic

40 ns

No

CMOS

38535Q/M;38534H;883B

16

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Combinatorial

64

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T20

No

8

5962-01-277-6831

Infineon Technologies

EE PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic

40 ns

No

CMOS

38535Q/M;38534H;883B

16

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

64

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T20

No

16.5 MHz

4

PALC22V10-25HMT

Infineon Technologies

5962-9233806M2X

Infineon Technologies

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

7 ns

Yes

5.5 V

BICMOS

MIL-STD-883

5

Chip Carrier

Registered

4.5 V

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Quad

S-CQCC-N20

1.905 mm

8.89 mm

No

Power-Up Reset

105.3 MHz

8.89 mm

0

PALC22V10-40HMR

Infineon Technologies

5962-01-360-4028

Infineon Technologies

EE PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic

40 ns

No

CMOS

38535Q/M;38534H;883B

16

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

64

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T20

No

16.5 MHz

6

5962-01-349-7443

Infineon Technologies

Military

Through-Hole

28

DIP

Rectangular

Ceramic

No

CMOS

38535Q/M;38534H;883B

25

PAL-TYPE

5

5 V

In-Line

DIP28,.3

Programmable Logic Devices

192

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T28

No

14.2 MHz

12

PALC22V10-30PMB

Infineon Technologies

PALC22V10-25LIT

Infineon Technologies

5962-01-364-5424

Infineon Technologies

EE PLD

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

25 ns

No

CMOS

16

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Combinatorial

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T20

No

8

5962-01-382-3838

Infineon Technologies

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

5 ns

Yes

CMOS

22

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

132

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

1

No

e0

143 MHz

10

PALC22V10-35LIR

Infineon Technologies

PALC22V10-35LIT

Infineon Technologies

PALC22V10-30WMT

Infineon Technologies

PALC22V10-40WMT

Infineon Technologies

5962-01-354-5490

Infineon Technologies

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

CMOS

38535Q/M;38534H;883B

22

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

90

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T24

1

No

e0

25 MHz

10

CY37064VP44-83AI

Infineon Technologies

EE PLD

Industrial

Gull Wing

44

QFP

Square

Plastic/Epoxy

15 ns

Yes

64

CMOS

3.3

3.3 V

Flatpack

QFP44,.47SQ,32

Programmable Logic Devices

Yes

.8 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead

Quad

S-PQFP-G44

No

e0

Yes

PALC22V10-20PCR

Infineon Technologies

PALC22V10-25JMB

Infineon Technologies

PALC22V10-40WMR

Infineon Technologies

PALC22V10-35LCT

Infineon Technologies

5962-9233802M2A

Infineon Technologies

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

10 ns

Yes

5.5 V

BICMOS

MIL-STD-883

5

Chip Carrier

Registered

4.5 V

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

1.905 mm

8.89 mm

No

Power-Up Reset

e0

87 MHz

8.89 mm

0

CY37064VP100-100AXIT

Infineon Technologies

EE PLD

Industrial

Gull Wing

100

QFP

Square

Plastic/Epoxy

12 ns

Yes

64

CMOS

Tape and Reel

3.3/5 V

Flatpack

QFP100,.63SQ,20

Programmable Logic Devices

Yes

.5 mm

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G100

3

No

e3

40 s

260 °C (500 °F)

Yes

5962-9233807M2X

Infineon Technologies

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

7 ns

Yes

5.5 V

BICMOS

MIL-STD-883

5

Chip Carrier

Mixed

4.5 V

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 2 I/O

8

-55 °C (-67 °F)

Quad

S-CQCC-N20

1.905 mm

8.89 mm

No

Power-Up Reset

105.3 MHz

8.89 mm

2

PLD20G10C-15DC

Infineon Technologies

OT PLD

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic

15 ns

No

BICMOS

22

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

90

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

60 MHz

10

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.