Infineon Technologies Programmable Logic Devices (PLD) 178

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length	JTAG Boundary Scan Test	No. of I/O Lines
5962-01-385-4552	Infineon Technologies		Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	35 ns	No			CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		132	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T24			No			18.1 MHz	10
PALC22V10-30HMR	Infineon Technologies
PALC22V10-30PMT	Infineon Technologies
CY37384P256-66BGC	Infineon Technologies	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	20 ns	Yes	5.25 V	384	CMOS					3.3/5,5 V	Grid Array	BGA256,20X20,50	Programmable Logic Devices	Yes		4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O		0 °C (32 °F)	Tin/Lead	Bottom	S-PBGA-B256		27 mm	No		e0	47.6 MHz		27 mm	Yes
PALC22V10-20HCT	Infineon Technologies
5962-88713082X	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	30 ns	Yes	5.5 V		CMOS				5		Chip Carrier				Mixed	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)		Quad	S-CQCC-N20	1.905 mm	8.89 mm	No			22 MHz		8.89 mm		4
PALC22V10-20PIR	Infineon Technologies
5962-8946805XA	Infineon Technologies	UV PLD	Military	Pin/Peg	68	WPGA	Square	Ceramic, Metal-Sealed Cofired	33 ns	No	5.5 V		CMOS				5		Grid Array, Window				Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	7 Dedicated Inputs, 52 I/O	7	-55 °C (-67 °F)	Tin Lead	Perpendicular	S-CPGA-P68	5.08 mm	27.9527 mm	No	Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock	e0	50 MHz		27.9527 mm		52
PALC22V10-25WCR	Infineon Technologies
PALC22V10-25HMR	Infineon Technologies
PALC22V10-20LCT	Infineon Technologies
PALC22V10-40PMT	Infineon Technologies
CY7C377-15GMB	Infineon Technologies
PALC22V10-20LIT	Infineon Technologies
PALC22V10-40JMB	Infineon Technologies
PALC22V10-20WIT	Infineon Technologies
5962-01-349-2199	Infineon Technologies		Military	Through-Hole	24	DIP	Rectangular	Ceramic	40 ns	No			CMOS	38535Q/M;38534H;883B	22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		132	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24			No			18.1 MHz	10
5962-01-385-4477	Infineon Technologies		Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	35 ns	No			CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		132	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T24			No			18.1 MHz	10
CY39165Z208-83NTI	Infineon Technologies
CY39165Z208-125NTC	Infineon Technologies
CY37064P44-100YMB	Infineon Technologies	EE PLD	Military	J Bend	44	QCCJ	Square	Ceramic	12 ns	Yes		64	CMOS	38535Q/M;38534H;883B				3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes				1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Lead	Quad	S-XQCC-J44			No		e0				Yes
PALC22V10-25LIR	Infineon Technologies
M38510/50801BLA	Infineon Technologies	OT PLD	Military	Through-Hole	24	DIP	Rectangular		30 ns	No	5.5 V		CMOS	MIL-M-38510 Class B			5		In-Line				Combinatorial	4.5 V			125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	25 MHz				10
PALC22V10-30HMT	Infineon Technologies
5962-8946805XX	Infineon Technologies	UV PLD	Military	Pin/Peg	68	WPGA	Square	Ceramic, Metal-Sealed Cofired	33 ns	No	5.5 V		CMOS				5		Grid Array, Window				Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	7 Dedicated Inputs, 52 I/O	7	-55 °C (-67 °F)		Perpendicular	S-CPGA-P68	5.08 mm	27.9527 mm	No	Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock		50 MHz		27.9527 mm		52
PALC22V10-20WCT	Infineon Technologies
PALC22V10-30WMR	Infineon Technologies
CY37064VP100-83AI	Infineon Technologies	EE PLD	Industrial	Gull Wing	100	QFP	Square	Plastic/Epoxy	15 ns	Yes		64	CMOS				3.3	3.3 V	Flatpack	QFP100,.63SQ,20	Programmable Logic Devices	Yes				.5 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin/Lead	Quad	S-PQFP-G100			No		e0				Yes
PALC22V10-25PIR	Infineon Technologies
5962-9233803M2A	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	10 ns	Yes	5.5 V		BICMOS	MIL-STD-883			5		Chip Carrier				Mixed	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 2 I/O	8	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N20	1.905 mm	8.89 mm	No	Power-Up Reset	e0	87 MHz		8.89 mm		2
CY7C376-15GMB	Infineon Technologies
PALC22V10-35PCT	Infineon Technologies
PALC22V10-35LIB	Infineon Technologies
PALC22V10-40JMR	Infineon Technologies
5962-9233805M2A	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	7 ns	Yes	5.5 V		BICMOS	MIL-STD-883			5		Chip Carrier				Combinatorial	4.5 V		1.27 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N20	1.905 mm	8.89 mm	No		e0			8.89 mm		6
5962-9233808M2X	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	7 ns	Yes	5.5 V		BICMOS	MIL-STD-883			5		Chip Carrier				Mixed	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)		Quad	S-CQCC-N20	1.905 mm	8.89 mm	No	Power-Up Reset		105.3 MHz		8.89 mm		4
CY37064P44-100JI	Infineon Technologies	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	12 ns	Yes		64	CMOS					3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes				1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin/Lead	Quad	S-PQCC-J44			No		e0				Yes
PALC22V10-30LMR	Infineon Technologies
5962-9233801M2X	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	10 ns	Yes	5.5 V		BICMOS	MIL-STD-883			5		Chip Carrier				Combinatorial	4.5 V		1.27 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)		Quad	S-CQCC-N20	1.905 mm	8.89 mm	No					8.89 mm		6
CY3125R62	Infineon Technologies
CY39165Z208-83NTC	Infineon Technologies
CY39165Z208-125NTI	Infineon Technologies
5962-9233803M2X	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	10 ns	Yes	5.5 V		BICMOS	MIL-STD-883			5		Chip Carrier				Mixed	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 2 I/O	8	-55 °C (-67 °F)		Quad	S-CQCC-N20	1.905 mm	8.89 mm	No	Power-Up Reset		87 MHz		8.89 mm		2
PALC22V10-30LMT	Infineon Technologies
5962-88713082A	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	30 ns	Yes	5.5 V		CMOS				5		Chip Carrier				Mixed	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N20	1.905 mm	8.89 mm	No		e0	22 MHz		8.89 mm		4
PALC22V10-20HIT	Infineon Technologies
CY37384P256-66BGI	Infineon Technologies	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	20 ns	Yes	5.5 V	384	CMOS					3.3/5,5 V	Grid Array	BGA256,20X20,50	Programmable Logic Devices	Yes		4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 192 I/O		-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B256		27 mm	No		e0	47.6 MHz		27 mm	Yes
5962-01-382-8760	Infineon Technologies	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic	40 ns	No			CMOS	38535Q/M;38534H;883B	16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Combinatorial		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T20			No				8

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.