Xilinx Programmable Logic Devices (PLD) 1,918

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
XCR3064XL-6CSG48C	Xilinx	EE PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	6 ns	Yes	3.6 V	64	CMOS				3.3	3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 40 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e1	192 MHz	30 s		260 °C (500 °F)	7 mm	Yes	40
XC7336-12PC44C	Xilinx	OT PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	19 ns	Yes	5.25 V	36	CMOS				5	3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No	36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops	e0	80 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	32
XC95288XV-10TQG144C	Xilinx	Flash PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	10 ns	Yes	2.62 V	288	CMOS				2.5	1.8/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	2.37 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 117 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	100 MHz	30 s		260 °C (500 °F)	20 mm	Yes	117
XA2C128-8CPG132Q	Xilinx	Flash PLD	Automotive	Ball	132	TFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	128	CMOS	AEC-Q100			1.8	1.5/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 100 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e1	112 MHz	30 s		260 °C (500 °F)	8 mm	Yes	100
XC9536XL-4VQG44C	Xilinx	Flash PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	4 ns	Yes	3.6 V		CMOS				3.3		Flatpack, Thin Profile				Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3		30 s		260 °C (500 °F)	10 mm		34
XCR3064A-10VQ100C	Xilinx	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	64	CMOS				3.3	3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0	83 MHz	30 s		240 °C (464 °F)	14 mm	Yes	64
XCR3064XL-6PC44C	Xilinx	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	6 ns	Yes	3.6 V	64	CMOS				3.3	3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	2.7 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e0	145 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	36
XC95288XL-6CSG280C	Xilinx	Flash PLD	Commercial	Ball	280	TFBGA	Square	Plastic/Epoxy	6 ns	Yes	3.6 V	288	CMOS		192		3.3	2.5/3.3,3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA280,19X19,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No		e1	208.3 MHz	30 s	192	260 °C (500 °F)	16 mm	Yes	192
XC2C32-6VQG44I	Xilinx	Flash PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	6 ns	Yes	1.9 V	32	CMOS				1.8	1.5/3.3,1.8 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	1.7 V		.8 mm	85 °C (185 °F)	1 Dedicated Inputs, 33 I/O	1	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	Real Digital Design Technology	e3		30 s		260 °C (500 °F)	10 mm	Yes	33
XC2C128-7CP132I	Xilinx	Flash PLD	Industrial	Ball	132	TFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	128	CMOS		100	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 100 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e0	119 MHz	30 s	100	240 °C (464 °F)	8 mm	Yes	100
XC7354-12WC44C	Xilinx	UV PLD	Commercial	J Bend	44	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	27 ns	Yes	5.25 V	54	CMOS				5	3.3/5,5 V	Chip Carrier, Window	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	8 Dedicated Inputs, 25 I/O	8	0 °C (32 °F)		Quad	S-CQCC-J44	1	4.826 mm	16.51 mm	No	54 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 108 Flip Flops		66.7 MHz				16.51 mm	No	25
XC95108-20TQG100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	HLFQFP	Square	Plastic/Epoxy	20 ns	Yes	5.25 V	108	CMOS				5	3.3/5,5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	4.75 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 81 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3		30 s		260 °C (500 °F)	14 mm	Yes	81
XC9536XV-7CS48I	Xilinx	Flash PLD	Industrial	Ball	48	FBGA	Square	Plastic/Epoxy	7.5 ns	Yes	2.62 V	36	CMOS				2.5	1.8/3.3,2.5 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	2.37 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e0		30 s		240 °C (464 °F)	7 mm	Yes	36
XC95288XV-6FGG256C	Xilinx	Flash PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	6 ns	Yes	2.62 V	288	CMOS				2.5	1.8/3.3,2.5 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.37 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	208 MHz	30 s		260 °C (500 °F)	17 mm	Yes	192
XC95288XV-10FGG256C	Xilinx	Flash PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns	Yes	2.62 V	288	CMOS				2.5	1.8/3.3,2.5 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.37 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	100 MHz	30 s		260 °C (500 °F)	17 mm	Yes	192
XC2C512-10FGG324C	Xilinx	Flash PLD	Commercial	Ball	324	BGA	Square	Plastic/Epoxy	10 ns	Yes	1.9 V	512	CMOS		270	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array	BGA324,22X22,40	Programmable Logic Devices	Yes	Macrocell	1.7 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 270 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	2.5 mm	23 mm	No		e1	91 MHz	30 s	270	250 °C (482 °F)	23 mm	Yes	270
XC9572XV-7VQ44C	Xilinx	Flash PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns	Yes	2.62 V	72	CMOS				2.5	1.8/3.3,2.5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	2.37 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e0	125 MHz	30 s		240 °C (464 °F)	10 mm	Yes	34
XC95288XV-5PQG208C	Xilinx	Flash PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	5 ns	Yes	2.62 V						2.5		Flatpack, Fine Pitch				Macrocell	2.37 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 168 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	222 MHz	30 s		245 °C (473 °F)	28 mm		168
XCR3064-10PC44C	Xilinx	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	64	CMOS				3.3	3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	2.97 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e0	80 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	32
XC7272-25WC68I	Xilinx	UV PLD	Industrial	J Bend	68	QCCJ	Square	Ceramic	40 ns	Yes		72	CMOS				5	5 V	Chip Carrier	LDCC68,1.0SQ	Programmable Logic Devices	No				1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)		Quad	S-XQCC-J68				No								No
XCR3512XL-10FTG256C	Xilinx	EE PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	512	CMOS				3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	97 MHz	30 s		260 °C (500 °F)	17 mm	Yes	212
XC95144XV-4TQ100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	4 ns	Yes	2.6 V						2.5		Flatpack, Low Profile, Fine Pitch				Registered	2.4 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 81 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e0					14 mm		81
XC7272A-25WC84M	Xilinx	UV PLD	Military	J Bend	84	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	40 ns	Yes	5.5 V	72	CMOS				5	5 V	Chip Carrier, Window	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	125 °C (257 °F)	12 Dedicated Inputs, 42 I/O	12	-55 °C (-67 °F)		Quad	S-CQCC-J84	1	4.826 mm	29.21 mm	No	PAL Blocks interconnected by PIA; 72 Macrocells		40 MHz				29.21 mm	No	42
XA9536XL-10VQG44I	Xilinx	Flash PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	36	CMOS	AEC-Q100			3.3	2.5/3.3,3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3		30 s		260 °C (500 °F)	10 mm	Yes	34
XH95180-7HQG208C	Xilinx	Mask PLD		Gull Wing	208	HFQFP	Square	Plastic/Epoxy		Yes			CMOS				5		Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell			.5 mm		0 Dedicated Inputs, 168 I/O	0		Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3					28 mm		168
XH95576-7HQG304I	Xilinx	Mask PLD		Gull Wing	304	HFQFP	Square	Plastic/Epoxy		Yes			CMOS				5		Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell			.5 mm		0 Dedicated Inputs, 232 I/O	0		Matte Tin	Quad	S-PQFP-G304		4.5 mm	40 mm	No		e3					40 mm		232
XC2C32-4PCG44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	4 ns	Yes	1.9 V	32	CMOS				1.8	1.5/3.3,1.8 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	1.7 V		1.27 mm	70 °C (158 °F)	1 Dedicated Inputs, 33 I/O	1	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	Real Digital Design Technology	e3		30 s		245 °C (473 °F)	16.5862 mm	Yes	33
XCR3128-12TQ128C	Xilinx	EE PLD	Commercial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	12 ns	Yes	3.63 V	128	CMOS				3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP128,.63X.87,20	Programmable Logic Devices	Yes	Macrocell	2.97 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 96 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G128		1.6 mm	14 mm	No			66 MHz				20 mm	Yes	96
XC73108-15PC84I	Xilinx	OT PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	36 ns	Yes	5.5 V	108	CMOS				5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	12 Dedicated Inputs, 37 I/O	12	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops	e0	45.5 MHz	30 s		225 °C (437 °F)	29.3116 mm	No	37
XC9536-5PCG44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	5 ns	Yes	5.25 V	36	CMOS				5	3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e3	100 MHz	30 s		245 °C (473 °F)	16.5862 mm	Yes	34
XCR3128XL-6VQG100C	Xilinx	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	6 ns	Yes	3.6 V	128	CMOS				3.3	3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 84 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3	175 MHz	30 s		260 °C (500 °F)	14 mm	Yes	84
XC95108-20PQ100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	HQFP	Rectangular	Plastic/Epoxy	20 ns	Yes	5.5 V	108	CMOS				5	3.3/5,5 V	Flatpack, Heat Sink/Slug	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 81 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e0		30 s		225 °C (437 °F)	20 mm	Yes	81
XCR3512XL-12PQ208C	Xilinx	EE PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	512	CMOS				3.3	3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 180 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e4	77 MHz				28 mm	Yes	180
XC2C32A-3CPG56C	Xilinx	Flash PLD	Commercial	Ball	56	LFBGA	Square	Plastic/Epoxy	3 ns	Yes	1.9 V		CMOS				1.8		Grid Array, Low Profile, Fine Pitch				Macrocell	1.7 V		.5 mm	70 °C (158 °F)	33 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No		e1	500 MHz				6 mm		33
XC7354-12PC68I	Xilinx	OT PLD	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	27 ns	Yes	5.5 V	54	CMOS				5	3.3/5,5 V	Chip Carrier	LDCC68,1.0SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 42 I/O	8	-40 °C (-40 °F)		Quad	S-PQCC-J68	1	5.08 mm	24.2316 mm	No	54 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 108 Flip Flops		66.7 MHz				24.2316 mm	No	42
XC7236A-20WC44C	Xilinx	UV PLD	Commercial	J Bend	44	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	32 ns	Yes	5.25 V	36	CMOS				5	3/5 V	Chip Carrier, Window	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 30 I/O	2	0 °C (32 °F)		Quad	S-CQCC-J44	1	4.826 mm	16.51 mm	No	PAL Blocks interconnected by PIA; 36 Macrocells; Configurable I/O operation with 3.3 V or 5 V		40 MHz				16.51 mm	No	30
XC7336-10PQ44C	Xilinx	OT PLD	Commercial	Gull Wing	44	QFP	Square	Plastic/Epoxy	15 ns	Yes	5.25 V	36	CMOS				5	3.3/5,5 V	Flatpack	QFP44,.5SQ,20	Programmable Logic Devices	No	Macrocell	4.75 V		.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G44	3	2.35 mm	10 mm	No	36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops	e0	100 MHz	30 s		225 °C (437 °F)	10 mm	No	32
XH95576-7HQ304I	Xilinx	Mask PLD		Gull Wing	304	HFQFP	Square	Plastic/Epoxy		Yes			CMOS				5		Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell			.5 mm		0 Dedicated Inputs, 232 I/O	0		Tin Lead	Quad	S-PQFP-G304	3	4.5 mm	40 mm	No		e0					40 mm		232
XH95180-7PQG160I	Xilinx	Mask PLD		Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes			CMOS				5		Flatpack				Macrocell			.65 mm		0 Dedicated Inputs, 133 I/O	0		Matte Tin	Quad	S-PQFP-G160	3	3.94 mm	28 mm	No		e3					28 mm		133
XC95216-15PQ160C	Xilinx	Flash PLD	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	15 ns	Yes	5.25 V	216	CMOS		133		5	3.3/5,5 V	Flatpack	QFP160,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V	90	.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 133 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No		e0	55.6 MHz	30 s	133	225 °C (437 °F)	28 mm	Yes	133
XC95108-20PQ100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	HQFP	Rectangular	Plastic/Epoxy	20 ns	Yes	5.25 V	108	CMOS				5	3.3/5,5 V	Flatpack, Heat Sink/Slug	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 81 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e0		30 s		225 °C (437 °F)	20 mm	Yes	81
XC95108-7PQ160C	Xilinx	Flash PLD	Commercial	Gull Wing	160	HQFP	Rectangular	Plastic/Epoxy	7.5 ns	Yes	5.25 V	108	CMOS				5	3.3/5,5 V	Flatpack, Heat Sink/Slug	QFP160,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 108 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G160	3	4.1 mm	28 mm	No		e0		30 s		225 °C (437 °F)	28 mm	Yes	108
XC2C512-10FG324I	Xilinx	Flash PLD	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	10 ns	Yes	1.9 V	512	CMOS		270	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array	BGA324,22X22,40	Programmable Logic Devices	Yes	Macrocell	1.7 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 270 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B324	3	2.5 mm	23 mm	No		e0	91 MHz	30 s	270	225 °C (437 °F)	23 mm	Yes	270
XCR3064XL-7VQ100I	Xilinx	EE PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	64	CMOS				3.3	3/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	2.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 68 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0	119 MHz	30 s		240 °C (464 °F)	14 mm	Yes	68
XC73144-10BG225C	Xilinx	OT PLD	Commercial	Ball	225	BGA	Square	Plastic/Epoxy	22 ns	Yes	5.25 V	144	CMOS				5	3.3/5,5 V	Grid Array	BGA225,15X15	Programmable Logic Devices	No	Macrocell	4.75 V		1.5 mm	70 °C (158 °F)	12 Dedicated Inputs, 120 I/O	12	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B225	3	3.5 mm	27 mm	No	144 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 276 Flip Flops	e0	62.5 MHz	30 s		225 °C (437 °F)	27 mm	No	120
XC73108-20PQ100I	Xilinx	OT PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	45 ns	Yes	5.5 V	108	CMOS				5	3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	No	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	12 Dedicated Inputs, 47 I/O	12	-40 °C (-40 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops	e0	35.7 MHz	30 s		225 °C (437 °F)	20 mm	No	47
XC73144-12PG184M	Xilinx	UV PLD	Military	Pin/Peg	184	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V		CMOS				5		Grid Array				Macrocell	4.5 V			125 °C (257 °F)	0 Dedicated Inputs, 120 I/O	0	-55 °C (-67 °F)		Perpendicular	S-CPGA-P184				No	144 Macrocells With Programmable I/O Architecture								120
XC95108-7TQG100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	HLFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	5.5 V	108	CMOS				5	3.3/5,5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	4.5 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 81 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e3		30 s		260 °C (500 °F)	14 mm	Yes	81

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.