Xilinx Programmable Logic Devices (PLD) 1,918

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
XCR3032XL-6PC44C	Xilinx																												Tin Lead			3					e0		30 s		225 °C (437 °F)
XCR3256XL-10CSG280I	Xilinx	EE PLD	Industrial	Ball	280	TFBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	256	CMOS			3.3	3/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA280,19X19,32	Programmable Logic Devices	Yes	Macrocell	2.7 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 164 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No		e1	105 MHz	30 s		260 °C (500 °F)	16 mm	Yes	164
XC95108-7TQ100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	HLFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	5.25 V	108	CMOS			5	3.3/5,5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	4.75 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 81 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e0		30 s		225 °C (437 °F)	14 mm	Yes	81
XC9572XV-5VQG44C	Xilinx	Flash PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	5 ns	Yes	2.62 V	72	CMOS			2.5	1.8/3.3,2.5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	2.37 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	222 MHz	30 s		260 °C (500 °F)	10 mm	Yes	34
XC9572F-15PQG100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.25 V		CMOS			5		Flatpack				Macrocell	4.75 V	.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 72 I/O	0	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e3	56 MHz	30 s		245 °C (473 °F)	20 mm		72
XC9572XL-10CS48C	Xilinx	Flash PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	72	CMOS	38		3.3	2.5/3.3,3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 38 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No	72 Macrocells	e0	100 MHz	30 s	38	240 °C (464 °F)	7 mm	Yes	38
XC7336Q-10WC44C	Xilinx	UV PLD	Commercial	J Bend	44	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	15 ns	Yes	5.25 V	36	CMOS			5	3.3/5,5 V	Chip Carrier, Window	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-CQCC-J44	1	4.826 mm	16.51 mm	No	36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops		100 MHz				16.51 mm	No	32
XC7354-10WC44I	Xilinx	UV PLD	Industrial	J Bend	44	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	22 ns	Yes	5.5 V	54	CMOS			5	3.3/5,5 V	Chip Carrier, Window	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 25 I/O	8	-40 °C (-40 °F)	Tin Lead	Quad	S-CQCC-J44	1	4.826 mm	16.51 mm	No	54 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 108 Flip Flops	e0	76.9 MHz				16.51 mm	No	25
XC7336-15PC44I	Xilinx	OT PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	23 ns	Yes	5.5 V	36	CMOS			5	3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No	36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops	e0	66.7 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	32
XCR5032C-6VQ44C	Xilinx	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	6 ns	Yes	5.25 V	32	CMOS			5	5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.75 V	.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e0	111 MHz	30 s		240 °C (464 °F)	10 mm	Yes	32
XC7354-7PC44C	Xilinx	OT PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	16.5 ns	Yes	5.25 V	54	CMOS			5	3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	8 Dedicated Inputs, 25 I/O	8	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No	54 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 108 Flip Flops	e0	95.2 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	25
XC95108-20TQ100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	HLFQFP	Square	Plastic/Epoxy	20 ns	Yes	5.5 V	108	CMOS			5	3.3/5,5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	4.5 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 81 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e0		30 s		225 °C (437 °F)	14 mm	Yes	81
XC7336-5PC44C	Xilinx	OT PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	8.5 ns	Yes	5.25 V	36	CMOS			5	3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No	36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops	e0	167 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	32
XC7372-7PC68I	Xilinx	OT PLD	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes		72	CMOS				3.3/5,5 V	Chip Carrier	LDCC68,1.0SQ	Programmable Logic Devices	No			1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J68				No		e0						No
XC7336-10WC44C	Xilinx	UV PLD	Commercial	J Bend	44	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	15 ns	Yes	5.25 V	36	CMOS			5	3.3/5,5 V	Chip Carrier, Window	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-CQCC-J44	1	4.826 mm	16.51 mm	No	36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops		100 MHz				16.51 mm	No	32
XC2C64A-5PCG44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	5 ns	Yes	1.9 V	64	CMOS			1.8	1.5/3.3,1.8 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	1.7 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 33 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	Real Digital Design Technology	e3	333 MHz	30 s		245 °C (473 °F)	16.5862 mm	Yes	33
XC73144-10PQ160C	Xilinx	OT PLD	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	22 ns	Yes	5.25 V	144	CMOS			5	3.3/5,5 V	Flatpack	QFP160,1.2SQ	Programmable Logic Devices	No	Macrocell	4.75 V	.65 mm	70 °C (158 °F)	12 Dedicated Inputs, 110 I/O	12	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	144 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 276 Flip Flops	e0	62.5 MHz	30 s		225 °C (437 °F)	28 mm	No	110
XC73108-15WC84C	Xilinx	UV PLD	Commercial	J Bend	84	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	36 ns	Yes	5.25 V	108	CMOS			5	3.3/5,5 V	Chip Carrier, Window	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	12 Dedicated Inputs, 37 I/O	12	0 °C (32 °F)		Quad	S-CQCC-J84	1	4.826 mm	29.21 mm	No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops		45.5 MHz				29.21 mm	No	37
XC9536-5PC44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	5 ns	Yes	5.25 V	36	CMOS			5	3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e0	100 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	34
XC95144XV-7TQG144I	Xilinx	Flash PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	2.62 V	144	CMOS			2.5	1.8/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	2.37 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 117 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	125 MHz	30 s		260 °C (500 °F)	20 mm	Yes	117
XC95288XL-10BGG256C	Xilinx	Flash PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	288	CMOS	192		3.3	2.5/3.3,3.3 V	Grid Array	BGA256,20X20,50	Programmable Logic Devices	Yes	Macrocell	3 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e1	100 MHz	30 s	192	250 °C (482 °F)	27 mm	Yes	192
XCR3384XL-12PQ208C	Xilinx	EE PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	384	CMOS			3.3	3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 172 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e4	83 MHz				28 mm	Yes	172
XC9536XV-3CSG48C	Xilinx	Flash PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	3.5 ns	Yes	2.6 V					2.5		Grid Array, Fine Pitch				Registered	2.4 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e1					7 mm		36
XC7372-10WC84I	Xilinx	UV PLD	Industrial	J Bend	84	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	23 ns	Yes	5.5 V	72	CMOS			5	3.3/5,5 V	Chip Carrier, Window	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	12 Dedicated Inputs, 37 I/O	12	-40 °C (-40 °F)		Quad	S-CQCC-J84	1	4.826 mm	29.21 mm	No	72 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 126 Flip Flops		71.4 MHz				29.21 mm	No	37
XC2C512-6PQ208C	Xilinx	Flash PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	6 ns	Yes	1.9 V	512	CMOS			1.8	1.5/3.3,1.8 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 173 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0		30 s		225 °C (437 °F)	28 mm	Yes	173
XC95108-10PQ160I	Xilinx	Flash PLD	Industrial	Gull Wing	160	HQFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.5 V	108	CMOS			5	3.3/5,5 V	Flatpack, Heat Sink/Slug	QFP160,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V	.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 108 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G160	3	4.1 mm	28 mm	No		e0		30 s		225 °C (437 °F)	28 mm	Yes	108
XH95576-7HQG304C	Xilinx	Mask PLD		Gull Wing	304	HFQFP	Square	Plastic/Epoxy		Yes			CMOS			5		Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell		.5 mm		0 Dedicated Inputs, 232 I/O	0		Matte Tin	Quad	S-PQFP-G304		4.5 mm	40 mm	No		e3					40 mm		232
XC7372-12WC68I	Xilinx	UV PLD	Industrial	J Bend	68	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	28 ns	Yes	5.5 V	72	CMOS			5	3.3/5,5 V	Chip Carrier, Window	LDCC68,1.0SQ	Programmable Logic Devices	No	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	10 Dedicated Inputs, 25 I/O	10	-40 °C (-40 °F)		Quad	S-CQCC-J68	1	4.826 mm	24.13 mm	No	72 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 126 Flip Flops		62.5 MHz				24.13 mm	No	25
XC95108F-10PQG100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V		CMOS			5		Flatpack				Macrocell	4.75 V	.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 81 I/O	0	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e3	67 MHz	30 s		245 °C (473 °F)	20 mm		81
XCR5128-15VQ100I	Xilinx	EE PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	17.5 ns	Yes	5.5 V	128	CMOS			5	5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V	.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 80 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0	63 MHz	30 s		240 °C (464 °F)	14 mm	Yes	80
XCR3064XL-7PCG44C	Xilinx	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	64	CMOS			3.3	3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	2.7 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e3	119 MHz	30 s		245 °C (473 °F)	16.5862 mm	Yes	36
XC2C32-6VQG44C	Xilinx	Flash PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	6 ns	Yes	1.9 V	32	CMOS			1.8	1.5/3.3,1.8 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	1.7 V	.8 mm	70 °C (158 °F)	1 Dedicated Inputs, 33 I/O	1	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	Real Digital Design Technology	e3		30 s		260 °C (500 °F)	10 mm	Yes	33
XH95180-10HQ208I	Xilinx	Mask PLD		Gull Wing	208	HFQFP	Square	Plastic/Epoxy		Yes			CMOS			5		Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell		.5 mm		0 Dedicated Inputs, 168 I/O	0		Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0					28 mm		168
XC95288XV-5PQ208C	Xilinx	Flash PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	5 ns	Yes	2.62 V	288	CMOS			2.5	1.8/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	2.37 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 168 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0	222 MHz	30 s		225 °C (437 °F)	28 mm	Yes	168
XC95108-20PC84C	Xilinx	Flash PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	20 ns	Yes	5.25 V	108	CMOS			5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 69 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e0		30 s		225 °C (437 °F)	29.3116 mm	Yes	69
XC9572XL-7CS48C	Xilinx	Flash PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	72	CMOS	38		3.3	2.5/3.3,3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 38 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No	72 Macrocells	e0	125 MHz	30 s	38	240 °C (464 °F)	7 mm	Yes	38
XCR3032-12PC44C	Xilinx	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	3.6 V		CMOS			3.3		Chip Carrier				Macrocell	3 V	1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 33 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J44		4.57 mm	16.5862 mm	No			47 MHz				16.5862 mm		33
XC95288XV-6PQ208C	Xilinx	Flash PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	6 ns	Yes	2.62 V	288	CMOS			2.5	1.8/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	2.37 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 168 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0	208 MHz	30 s		225 °C (437 °F)	28 mm	Yes	168
XC7372-12PG84C	Xilinx	OT PLD	Commercial	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	28 ns	No	5.25 V	72	CMOS			5	3.3/5,5 V	Grid Array	PGA84M,11X11	Programmable Logic Devices	No	Macrocell	4.75 V	2.54 mm	70 °C (158 °F)	12 Dedicated Inputs, 37 I/O	12	0 °C (32 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	72 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 126 Flip Flops		62.5 MHz				27.94 mm	No	37
XC95180-10PQ160	Xilinx	Flash PLD		Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes			CMOS			3.3		Flatpack				Macrocell		.65 mm		0 Dedicated Inputs, 133 I/O	0		Tin Lead	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Configurable I/O operation with 3.3 V or 5 V; Insystem Programmable	e0					28 mm		133
XC95180-10PQ160C	Xilinx	Flash PLD	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	10 ns	Yes			CMOS			5		Flatpack				Macrocell		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 133 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No		e0					28 mm		133
XC7372-10PC68C	Xilinx	OT PLD	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy	23 ns	Yes	5.25 V	72	CMOS			5	3.3/5,5 V	Chip Carrier	LDCC68,1.0SQ	Programmable Logic Devices	No	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	10 Dedicated Inputs, 25 I/O	10	0 °C (32 °F)		Quad	S-PQCC-J68	1	5.08 mm	24.2316 mm	No	72 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 126 Flip Flops		71.4 MHz				24.2316 mm	No	25
XC9536XV-5CS48C	Xilinx	Flash PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	5 ns	Yes	2.62 V	36	CMOS			2.5	1.8/3.3,2.5 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	2.37 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e0		30 s		240 °C (464 °F)	7 mm	Yes	36
XC9536XV-7CS48C	Xilinx	Flash PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	7.5 ns	Yes	2.62 V	36	CMOS			2.5	1.8/3.3,2.5 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	2.37 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e0		30 s		240 °C (464 °F)	7 mm	Yes	36
XC95576-12HQ304	Xilinx	Flash PLD		Gull Wing	304	HFQFP	Square	Plastic/Epoxy		Yes			CMOS			5		Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell		.5 mm		232 I/O			Tin Lead	Quad	S-PQFP-G304	3	4.5 mm	40 mm	No	3.3 or 5 V I/O Capability	e0	100 MHz				40 mm		232
XC2C384-7FGG324C	Xilinx	Flash PLD	Commercial	Ball	324	BGA	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	384	CMOS	240	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array	BGA324,22X22,40	Programmable Logic Devices	Yes	Macrocell	1.7 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 240 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	2.5 mm	23 mm	No		e1	112 MHz	30 s	240	250 °C (482 °F)	23 mm	Yes	240
XC2C64-4CPG56C	Xilinx	Flash PLD	Commercial	Ball	56	LFBGA	Square	Plastic/Epoxy	4 ns	Yes	1.9 V	64	CMOS	45	PLA-TYPE	1.8		Grid Array, Low Profile, Fine Pitch				Macrocell	1.7 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 45 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No	Fast Zero Power Design Technology	e1	213 MHz	30 s	45	260 °C (500 °F)	6 mm		45
XC2C256-7PQ208C	Xilinx	Flash PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	256	CMOS	173	PLA-TYPE	1.8	1.5/3.3,1.8 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 173 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Real Digital Design Technology	e4	108 MHz		173		28 mm	Yes	173

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.