Xilinx Programmable Logic Devices (PLD) 1,918

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
XC2C512-10PQG208C	Xilinx	Flash PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	10 ns	Yes	1.9 V	512	CMOS		173	PLA-TYPE	1.8	1.5/3.3,1.8 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 173 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	91 MHz	30 s	173	245 °C (473 °F)	28 mm	Yes	173
XC95288XL-7TQG144C	Xilinx	Flash PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	288	CMOS		117		3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 117 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	125 MHz	30 s	117	260 °C (500 °F)	20 mm	Yes	117
XCR3064XL-10VQG100I	Xilinx	EE PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	64	CMOS				3.3	3/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	2.7 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 68 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3	95 MHz	30 s		260 °C (500 °F)	14 mm	Yes	68
XC95288XL-6FGG256C	Xilinx	Flash PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	6 ns	Yes	3.6 V	288	CMOS		192		3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	208.3 MHz	30 s	192	260 °C (500 °F)	17 mm	Yes	192
XC95288XL-7BGG256I	Xilinx	Flash PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	288	CMOS		192		3.3	2.5/3.3,3.3 V	Grid Array	BGA256,20X20,50	Programmable Logic Devices	Yes	Macrocell	3 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 192 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e1	125 MHz	30 s	192	250 °C (482 °F)	27 mm	Yes	192
XC9536XL-5VQ44C	Xilinx	Flash PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	5 ns	Yes	3.6 V	36	CMOS		34		3.3	2.5/3.3,3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e4	138.88 MHz		34		10 mm	Yes	34
XC9572XL-5VQ44C	Xilinx	Flash PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	5 ns	Yes	3.6 V	72	CMOS		34		3.3	2.5/3.3,3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	72 Macrocells	e4	178.6 MHz		34		10 mm	Yes	34
XC2C384-10FTG256C	Xilinx	Flash PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns	Yes	1.9 V	384	CMOS		212	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	83 MHz	30 s	212	260 °C (500 °F)	17 mm	Yes	212
XC95144XL-7TQ144C	Xilinx	Flash PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	144	CMOS		117		3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 117 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e4	125 MHz		117		20 mm	Yes	117
XC95144XL-7TQG144I	Xilinx	Flash PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	144	CMOS		117		3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 117 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	138.88 MHz	30 s	117	260 °C (500 °F)	20 mm	Yes	117
XC95288XL-10FGG256C	Xilinx	Flash PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	288	CMOS		192		3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	100 MHz	30 s	192	260 °C (500 °F)	17 mm	Yes	192
XC95288XL-10PQ208I	Xilinx	Flash PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	288	CMOS		168		3.3	2.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 168 I/O	0	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e4	100 MHz		168		28 mm	Yes	168
XC95288XL-10PQG208I	Xilinx	Flash PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	288	CMOS		168		3.3	2.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 168 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	100 MHz	30 s	168	245 °C (473 °F)	28 mm	Yes	168
XC9536XL-10CSG48I	Xilinx	Flash PLD	Industrial	Ball	48	FBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	36	CMOS		36		3.3	2.5/3.3,3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e1	138.88 MHz	30 s	36	260 °C (500 °F)	7 mm	Yes	36
XCR3512XL-10PQG208C	Xilinx	EE PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	512	CMOS				3.3	3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 180 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	97 MHz	30 s		245 °C (473 °F)	28 mm	Yes	180
XC2C32A-6CP56C	Xilinx	Flash PLD	Commercial	Ball	56	LFBGA	Square	Plastic/Epoxy	6 ns	Yes	1.9 V	32	CMOS				1.8	1.5/3.3,1.8 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	70 °C (158 °F)	33 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No	Real Digital Design Technology	e0	300 MHz	30 s		240 °C (464 °F)	6 mm	Yes	33
XC95108-10TQG100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	HLFQFP	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	108	CMOS				5	3.3/5,5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	4.75 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 81 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3		30 s		260 °C (500 °F)	14 mm	Yes	81
XC9536-15VQ44I	Xilinx	Flash PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	15 ns	Yes	5.5 V	36	CMOS				5	3.3/5,5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.5 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e0	55.6 MHz	30 s		240 °C (464 °F)	10 mm	Yes	34
XCR3128XL-7VQG100C	Xilinx	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	128	CMOS				3.3	3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 84 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3	119 MHz	30 s		260 °C (500 °F)	14 mm	Yes	84
XC2C512-10FGG324I	Xilinx	Flash PLD	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	10 ns	Yes	1.9 V	512	CMOS		270	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array	BGA324,22X22,40	Programmable Logic Devices	Yes	Macrocell	1.7 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 270 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	2.5 mm	23 mm	No		e1	91 MHz	30 s	270	250 °C (482 °F)	23 mm	Yes	270
XC9536XL-10CS48I	Xilinx	Flash PLD	Industrial	Ball	48	FBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	36	CMOS		36		3.3	2.5/3.3,3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e0	100 MHz	30 s	36	240 °C (464 °F)	7 mm	Yes	36
XCR3032XL-5VQ44C	Xilinx	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	5 ns	Yes	3.6 V	32	CMOS				3.3	3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e4	213 MHz				10 mm	Yes	36
XCR3032XL-7CS48I	Xilinx	EE PLD	Industrial	Ball	48	FBGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	32	CMOS				3.3	3/3.3 V	Grid Array, Fine Pitch	BGA48,6X8,32	Programmable Logic Devices	Yes	Macrocell	2.7 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e0	119 MHz	30 s		240 °C (464 °F)	7 mm	Yes	36
XCR3128XL-7VQ100C	Xilinx	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	128	CMOS				3.3	3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 84 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0	119 MHz	30 s		240 °C (464 °F)	14 mm	Yes	84
XC2C256-6VQ100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	6 ns	Yes	1.9 V	256	CMOS		80	PLA-TYPE	1.8	1.5/3.3,1.8 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Real Digital Design Technology	e4	139 MHz		80		14 mm	Yes	80
XC2C256-7PQG208I	Xilinx	Flash PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	256	CMOS		173	PLA-TYPE	1.8	1.5/3.3,1.8 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 173 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Real Digital Design Technology	e3	108 MHz	30 s	173	245 °C (473 °F)	28 mm	Yes	173
XC2C32A-4CPG56C	Xilinx	Flash PLD	Commercial	Ball	56	LFBGA	Square	Plastic/Epoxy	4 ns	Yes	1.9 V	32	CMOS				1.8	1.5/3.3,1.8 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	70 °C (158 °F)	33 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No	Real Digital Design Technology	e1	450 MHz	30 s		260 °C (500 °F)	6 mm	Yes	33
XC2C64A-7CP56C	Xilinx	Flash PLD	Commercial	Ball	56	LFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	64	CMOS				1.8	1.5/3.3,1.8 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 45 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No	Real Digital Design Technology	e0	200 MHz	30 s		240 °C (464 °F)	6 mm	Yes	45
XC95108-10PQ160C	Xilinx	Flash PLD	Commercial	Gull Wing	160	HQFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V	108	CMOS				5	3.3/5,5 V	Flatpack, Heat Sink/Slug	QFP160,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V	.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 108 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G160	3	4.1 mm	28 mm	No		e0		30 s		225 °C (437 °F)	28 mm	Yes	108
XC95108-15PC84I	Xilinx	Flash PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.5 V	108	CMOS				5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 69 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e0		30 s		225 °C (437 °F)	29.3116 mm	Yes	69
XC95108-7PQ100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	HQFP	Rectangular	Plastic/Epoxy	7.5 ns	Yes	5.25 V	108	CMOS				5	3.3/5,5 V	Flatpack, Heat Sink/Slug	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V	.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 81 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e0		30 s		225 °C (437 °F)	20 mm	Yes	81
XC9536-15PCG44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.25 V	36	CMOS				5	3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e3	55.6 MHz	30 s		245 °C (473 °F)	16.5862 mm	Yes	34
XC9572-10TQ100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	72	CMOS				5	3.3/5,5 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	4.75 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 72 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e0	66.7 MHz	30 s		225 °C (437 °F)	14 mm	Yes	72
XC9572-15PC84C	Xilinx	Flash PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.25 V	72	CMOS				5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 69 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e0	55.6 MHz	30 s		225 °C (437 °F)	29.3116 mm	Yes	69
XC9572-15PCG84C	Xilinx	Flash PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.25 V	72	CMOS				5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 69 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e3	55.6 MHz	30 s		245 °C (473 °F)	29.3116 mm	Yes	69
XC9572XL-10VQ64C	Xilinx	Flash PLD	Commercial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	72	CMOS		36		3.3	2.5/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 52 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	72 Macrocells	e4	100 MHz		36		10 mm	Yes	52
XCR3032XL-10VQ44C	Xilinx	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	32	CMOS				3.3	3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e4	95 MHz				10 mm	Yes	36
XCR3032XL-7VQ44I	Xilinx	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	32	CMOS				3.3	3/3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	2.7 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e4	119 MHz				10 mm	Yes	36
XA2C64A-7VQG100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	64	CMOS	AEC-Q100			1.8	1.5/3.3,1.8 V	Flatpack, Thin Profile, Fine Pitch	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 64 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Real Digital Design Technology	e3		30 s		260 °C (500 °F)	14 mm	Yes	64
XC2C128-6TQG144C	Xilinx	Flash PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	6 ns	Yes	1.9 V	128	CMOS		100	PLA-TYPE	1.8	1.5/3.3,1.8 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 100 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	152 MHz	30 s	100	260 °C (500 °F)	20 mm	Yes	100
XC2C256-6FTG256C	Xilinx	Flash PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	6 ns	Yes	1.9 V	256	CMOS		184	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 184 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Real Digital Design Technology	e1	139 MHz	30 s	184	260 °C (500 °F)	17 mm	Yes	184
XC2C256-6VQG100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	6 ns	Yes	1.9 V	256	CMOS		80	PLA-TYPE	1.8	1.5/3.3,1.8 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Real Digital Design Technology	e3	139 MHz	30 s	80	260 °C (500 °F)	14 mm	Yes	80
XC2C256-7PQG208C	Xilinx	Flash PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	256	CMOS		173	PLA-TYPE	1.8	1.5/3.3,1.8 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 173 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Real Digital Design Technology	e3	108 MHz	30 s	173	245 °C (473 °F)	28 mm	Yes	173
XC95144XL-10CS144I	Xilinx	Flash PLD	Industrial	Ball	144	TFBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	144	CMOS		117		3.3	2.5/3.3,3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 117 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e0	138.88 MHz	30 s	117	240 °C (464 °F)	12 mm	Yes	117
XC95144XL-7CSG144I	Xilinx	Flash PLD	Industrial	Ball	144	TFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	144	CMOS		117		3.3	2.5/3.3,3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 117 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e1	138.88 MHz	30 s	117	260 °C (500 °F)	12 mm	Yes	117
XC95288XL-7PQG208I	Xilinx	Flash PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	288	CMOS		168		3.3	2.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 168 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	125 MHz	30 s	168	245 °C (473 °F)	28 mm	Yes	168
XC9536-7VQG44C	Xilinx	Flash PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns	Yes	5.25 V	36	CMOS				5	3.3/5,5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.75 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	83.3 MHz	30 s		260 °C (500 °F)	10 mm	Yes	34
XC9572-15PCG44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.25 V	72	CMOS				5	3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	72 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e3	55.6 MHz	30 s		245 °C (473 °F)	16.5862 mm	Yes	34

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.