Programmable Logic Devices (PLD)

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
EP20K100EBC356-2X	Intel	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	2.02 ns	4160	Yes	1.89 V		CMOS	238		1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Macrocell	1.71 V		1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0			238		35 mm		246
EP20K100EBC356-3	Intel	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	2.2 ns	4160	Yes	1.89 V		CMOS	238		1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Macrocell	1.71 V		1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0			238		35 mm		246
EP20K100EBC356-3N	Intel	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	2.2 ns	4160	Yes	1.89 V		CMOS	238		1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Macrocell	1.71 V		1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e1			238		35 mm		246
EP20K100EQC240-2X	Intel	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	2.02 ns	4160	Yes	1.89 V		CMOS	175		1.8	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays		Macrocell	1.71 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 183 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0			175		32 mm		183
EP20K200EQI240-2X	Intel	Loadable PLD		Gull Wing	240	FQFP	Square	Plastic/Epoxy	1.97 ns	8320	Yes	1.89 V		CMOS	160		1.8	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays		Macrocell	1.71 V		.5 mm		4 Dedicated Inputs, 168 I/O	4		Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3			160	220 °C (428 °F)	32 mm		168
EP610PC-25	Texas Instruments	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	27 ns		No	5.25 V		CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	160	2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 16 I/O	4	0 °C (32 °F)		Dual	R-PDIP-T24				No	Zero Standby Function; 16 Macrocells With Configurable I/O		40 MHz		16				16
EP900JC	Altera	UV PLD	Commercial	J Bend	44	WQCCJ	Square	Ceramic, Glass-Sealed	60 ns		Yes	5.25 V		CMOS	36	PAL-TYPE	5	5 V	Chip Carrier, Window	LDCC44,.7SQ	Programmable Logic Devices		Macrocell	4.75 V	240	1.27 mm	70 °C (158 °F)	12 Dedicated Inputs, 24 I/O	12	0 °C (32 °F)	Tin Lead	Quad	S-GQCC-J44		4.57 mm	16.51 mm	No	24 Macrocells	e0	20 MHz		24	220 °C (428 °F)	16.51 mm		24
EPF10K100EQC240-1N	Intel	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	0.4 ns	4992	Yes	2.625 V		CMOS	189		2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays		Mixed	2.375 V		.5 mm	70 °C (158 °F)	189 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3			189		32 mm		189
EPF10K100EQI208-2	Intel	Loadable PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	0.5 ns	4992	Yes	2.625 V		CMOS	147		2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Mixed	2.375 V		.5 mm	85 °C (185 °F)	147 I/O		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0			147		28 mm		147
EPF10K10ATI144-3	Intel	Loadable PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	0.8 ns	576	Yes	3.6 V		CMOS	102		3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.63SQ,20	Field Programmable Gate Arrays		Registered	3 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 102 I/O	4	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	576 Logic Elements; 72 Labs	e0	80 MHz		102		20 mm		102
EPF10K20RC208-4N	Intel	Loadable PLD	Commercial	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	0.6 ns	1152	Yes	5.25 V		CMOS	147		5	3.3/5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays		Registered	4.75 V		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 147 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	1152 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3	67.11 MHz		147		28 mm		147
EPF10K40RC208-3	Intel	Loadable PLD	Commercial	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	0.6 ns	2304	Yes	5.25 V		CMOS	147		5	3.3/5,5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays		Registered	4.75 V		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 147 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	2304 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	66.67 MHz		147		28 mm		147
EPF10K50RC240-3	Intel	Loadable PLD	Commercial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	0.6 ns	2880	Yes	5.25 V		CMOS	189		5	3.3/5,5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Registered	4.75 V		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	2880 Logic Elements	e0	66.67 MHz		189		32 mm		189
EPF8452ALC84-3	Intel	Loadable PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		336	Yes	5.25 V		CMOS	68		5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		Registered	4.75 V		1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 68 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	336 Logic Elements	e0	385 MHz		64		29.3116 mm		68
EPF8636AQC160-3N	Intel	Loadable PLD	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy		504	Yes	5.25 V		CMOS	118		5	3.3/5,5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays		Registered	4.75 V		.65 mm	70 °C (158 °F)	4 Dedicated Inputs, 118 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G160	3	4.07 mm	28 mm	No	504 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3	385 MHz		118		28 mm		118
EPM1270F256C3N	Intel	Flash PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy	6.2 ns		Yes	2.625 V	980	CMOS	212		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1		30 s	212	260 °C (500 °F)	17 mm	Yes	212
EPM3064ATC100-4	Intel	EE PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	4.5 ns		Yes	3.6 V	64	CMOS			3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 66 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No		e0	222.2 MHz				14 mm	Yes	66
EPM3128ATC100-7	Intel	EE PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	128	CMOS			3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No		e0	129.9 MHz				14 mm	Yes	80
EPM570GF256I5N	Intel	Flash PLD		Ball	256	BGA	Square	Plastic/Epoxy	8.7 ns		Yes	1.89 V	440	CMOS	160		1.8	1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	100 °C (212 °F)	0 Dedicated Inputs, 160 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1			160		17 mm	Yes	160
EPM570T100I4N	Intel	Flash PLD		Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7 ns		Yes	2.625 V	440	CMOS	76		2.5	1.5/3.3,2.5/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	100 °C (212 °F)	0 Dedicated Inputs, 76 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100		1.2 mm	14 mm	No	It can also operate at 3.3 V	e3			76		14 mm	Yes	76
EPM7032LC44-15T	Altera	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns		Yes	5.25 V	32	CMOS			5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	1	4.572 mm	16.5862 mm	No	Labs interconnected by PIA; 2 Labs; 32 Macrocells; 1 External Clock; Shared Input/Clock	e0	83.3 MHz	20 s		220 °C (428 °F)	16.5862 mm	No	36
EPM7032STC44-7	Altera	EE PLD	Commercial	Gull Wing	44	LQFP	Square	Plastic/Epoxy	7.5 ns		Yes	5.25 V	32	CMOS			5	5 V	Flatpack, Low Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.75 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.27 mm	10 mm	No		e0	166.7 MHz			220 °C (428 °F)	10 mm	Yes	36
EPM7064LC44-15	Intel	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns		Yes	5.25 V	64	CMOS			5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	1	4.572 mm	16.5862 mm	No	Labs interconnected by PIA; 4 Labs; 64 Macrocells; 1 External Clock; Shared Input/Clock	e0	100 MHz				16.5862 mm	No	36
EPM7064LC84-15	Intel	EE PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	15 ns		Yes	5.25 V	64	CMOS			5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 68 I/O	0	0 °C (32 °F)	Tin/Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Configurable I/O operation with 3.3 V or 5 V	e0	100 MHz	30 s		220 °C (428 °F)	29.3116 mm	No	68
EPM7128AETC100-10	Intel	EE PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	128	CMOS			3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 84 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No		e0	98 MHz	30 s		235 °C (455 °F)	14 mm	Yes	84
EPM7128AETC144-7N	Intel	EE PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	128	CMOS			3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 100 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	129.9 MHz				20 mm	Yes	100
EPM7128AETI144-7N	Intel	EE PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	128	CMOS			3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 100 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	129.9 MHz				20 mm	Yes	100
EPM7128SLC84-7	Intel	EE PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	7.5 ns		Yes	5.25 V	128	CMOS			5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 68 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Configurable I/O operation with 3.3 V or 5 V	e0	166.7 MHz				29.3116 mm	Yes	68
EPM7160STC100-6	Intel	EE PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	6 ns		Yes	5.25 V	160	CMOS			5	3.3/5,5 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 84 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No	160 Macrocells; 10 Labs; Configurable I/O operation with 3.3 V or 5 V	e0	166.7 MHz				14 mm	Yes	84
EPM7192EGI160-20	Intel	EE PLD	Industrial	Pin/Peg	160	PGA	Square	Ceramic, Metal-Sealed Cofired	20 ns		No	5.5 V	192	CMOS			5	3.3/5,5 V	Grid Array	PGA160M,15X15	Programmable Logic Devices	No	Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	0 Dedicated Inputs, 124 I/O	0	-40 °C (-40 °F)	Tin Lead	Perpendicular	S-CPGA-P160	1	5.34 mm	39.624 mm	No	Configurable I/O operation with 3.3 V or 5 V	e0	83.3 MHz				39.624 mm	No	124
EPM7256AEFI100-7	Intel	EE PLD	Industrial	Ball	100	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	256	CMOS			3.3	2.5/3.3,3.3 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 84 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No		e0	126.6 MHz				11 mm	Yes	84
EPM7256EGI192-15	Intel	EE PLD	Industrial	Pin/Peg	192	PGA	Square	Ceramic, Metal-Sealed Cofired	15 ns		No	5.5 V	256	CMOS			5	3.3/5,5 V	Grid Array	PGA192M,17X17	Programmable Logic Devices	No	Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	0 Dedicated Inputs, 160 I/O	0	-40 °C (-40 °F)	Tin Lead	Perpendicular	S-CPGA-P192	1	5.43 mm	45.15 mm	No	Configurable I/O operation with 3.3 V or 5 V	e0	76.9 MHz			220 °C (428 °F)	45.15 mm	No	160
EPM7512AEFC256-10	Intel	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	512	CMOS			3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No	512 Macrocells; 32 Labs; Configurable I/O operation with 2.5 V or 3.3 V	e0	87 MHz	20 s		220 °C (428 °F)	17 mm	Yes	212
EPM9320LI84-15	Altera	EE PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	16 ns		Yes	5.5 V	320	CMOS			5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 60 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	320 Macrocells	e0	117.6 MHz			220 °C (428 °F)	29.3116 mm	Yes	60
EPM9560GC280-15	Altera	EE PLD	Commercial	Pin/Peg	280	PGA	Square	Ceramic, Metal-Sealed Cofired	16.6 ns		No	5.25 V	560	CMOS			5	3.3/5,5 V	Grid Array	PGA280,19X19	Programmable Logic Devices	Yes	Macrocell	4.75 V		2.54 mm	70 °C (158 °F)	0 Dedicated Inputs, 216 I/O	0	0 °C (32 °F)	Tin Lead	Perpendicular	S-CPGA-P280	1	5.081 mm	49.78 mm	No	772 Flip Flops; Configurable I/O operation with 3.3 V or 5 V	e0	117.6 MHz			220 °C (428 °F)	49.78 mm	Yes	216
GAL16V8B-25LP	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns		No	5.25 V		CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20		4.57 mm	7.62 mm	No	Register Preload; Power-Up Reset	e0	37 MHz		8		26.125 mm		8
GAL20V8B-15LJN	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns		Yes	5.25 V		CMOS	20	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	75 °C (167 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No	Register Preload; Power-Up Reset	e3	45.5 MHz	40 s	8	245 °C (473 °F)	11.5062 mm		8
GAL20V8B-25LJ	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	25 ns		Yes	5.25 V		CMOS	20	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	75 °C (167 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No	Register Preload; Power-Up Reset	e0	37 MHz	30 s	8	225 °C (437 °F)	11.5062 mm		8
GAL20V8B-25LJN	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	25 ns		Yes	5.25 V		CMOS	20	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	75 °C (167 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No	Register Preload; Power-Up Reset	e3	37 MHz	40 s	8	245 °C (473 °F)	11.5062 mm		8
GAL20V8C-5LJ	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	5 ns		Yes	5.25 V		CMOS	20	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	75 °C (167 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No	Register Preload; Power-Up Reset	e0	142.8 MHz	30 s	8	225 °C (437 °F)	11.5062 mm		8
GAL22V10B-25QP	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns		No	5.25 V		CMOS	22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24		4.953 mm	7.62 mm	No	Register Preload; Power-Up Reset	e0	33.3 MHz		10		31.877 mm		10
GAL22V10D-10LPI	Lattice Semiconductor	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns		No	5.5 V		CMOS	22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No	10 Macrocells; Shared Input/Clock	e0	83.3 MHz		10		31.75 mm		10
ISPLSI1016E-80LT44	Lattice Semiconductor	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	18.5 ns		Yes	5.25 V	64	CMOS	35	PLA-TYPE	5	5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.75 V		.8 mm	70 °C (158 °F)	3 Dedicated Inputs, 32 I/O	3	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e0	57 MHz	30 s	32	240 °C (464 °F)	10 mm	No	32
ISPLSI1016EA-100LT44	Lattice Semiconductor	EE PLD	Commercial	Gull Wing	44	QFP	Square	Plastic/Epoxy	12.5 ns		Yes	5.25 V	64	CMOS			5	5 V	Flatpack	QFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.75 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 32 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G44	3		10 mm	No		e0	77 MHz			240 °C (464 °F)	10 mm	No	32
ISPLSI2032A-110LJN44	Lattice Semiconductor	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	13 ns		Yes	5.25 V	32	CMOS			5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 32 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e3	77 MHz	40 s		245 °C (473 °F)	16.5862 mm	No	32
ISPLSI2032A-80LJ44	Lattice Semiconductor	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	18.5 ns		Yes	5.25 V	32	CMOS			5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 32 I/O	0	0 °C (32 °F)	Tin/Lead	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e0	57 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	32
ISPLSI2064E-100LT100	Lattice Semiconductor	EE PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	13 ns		Yes	5.25 V	64	CMOS			5	5 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	4.75 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 64 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e0	77 MHz	30 s		240 °C (464 °F)	14 mm	No	64
ISPLSI2064VE-135LTN44I	Lattice Semiconductor	EE PLD	Industrial	Gull Wing	44	LQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	64	CMOS			3.3	3.3 V	Flatpack, Low Profile	QFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.6 mm	10 mm	No		e3	100 MHz	30 s		260 °C (500 °F)	10 mm	No	32

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.