Programmable Logic Devices (PLD)

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
LC4064ZC-75TN100C	Lattice Semiconductor	EE PLD		Gull Wing	100	LFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	64			74	PAD-TYPE	1.8		1.8 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	83	.5 mm	90 °C (194 °F)	10 Dedicated Inputs, 64 I/O	10	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3	111 MHz	40 s	64	260 °C (500 °F)	14 mm	Yes	64
LC4256C-5TN100C	Lattice Semiconductor	EE PLD		Gull Wing	100	LFQFP	Square	Plastic/Epoxy	5 ns		Yes	1.95 V	256			74	PAD-TYPE	1.8		1.8 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	1.65 V	83	.5 mm	90 °C (194 °F)	10 Dedicated Inputs, 64 I/O	10	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3	156 MHz	40 s	64	260 °C (500 °F)	14 mm	Yes	64
LC4256V-10TN100I	Lattice Semiconductor	EE PLD		Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	256			74	PAD-TYPE	3.3		3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	83	.5 mm	105 °C (221 °F)	10 Dedicated Inputs, 64 I/O	10	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3	86 MHz	40 s	64	260 °C (500 °F)	14 mm	Yes	64
LC4256V-5T144C	Lattice Semiconductor	EE PLD		Gull Wing	144	LFQFP	Square	Plastic/Epoxy	5 ns		Yes	3.6 V	256			110	PAD-TYPE	3.3		3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	83	.5 mm	90 °C (194 °F)	14 Dedicated Inputs, 96 I/O	14	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	156 MHz	30 s	96	256 °C (492.8 °F)	20 mm	Yes	96
LC4256V-75T144I	Lattice Semiconductor	EE PLD		Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	256			110	PAD-TYPE	3.3		3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	83	.5 mm	105 °C (221 °F)	14 Dedicated Inputs, 96 I/O	14	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	111 MHz	30 s	96	256 °C (492.8 °F)	20 mm	Yes	96
LC4256ZE-7MN144C	Lattice Semiconductor	EE PLD		Ball	144	TFBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	256	CMOS				1.8		1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA144,12X12,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm		4 Dedicated Inputs, 108 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B144	3	1.1 mm	7 mm	No		e1	111 MHz	40 s		260 °C (500 °F)	7 mm	Yes	108
LCMXO2280C-5TN144C4W	Lattice Semiconductor	Flash PLD		Gull Wing	144	LFQFP	Square	Plastic/Epoxy	3.6 ns	2280	Yes	3.465 V		CMOS		113		1.8		1.8/2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays		Macrocell	1.71 V		.5 mm		7 Dedicated Inputs, 113 I/O	7		Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	It can also operate at 2.5 V and 3.3 V	e3	388 MHz	40 s	113	260 °C (500 °F)	20 mm		113
M38510/50504BLA	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed			No	5.25 V		Bipolar	MIL-M-38510 Class B	16	PAL-TYPE	5	Tube	5 V	In-Line	DIP24,.3	Programmable Logic Devices	No	Mixed	4.75 V	64	2.54 mm	125 °C (257 °F)	12 Dedicated Inputs, 4 I/O	12	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	6.92 mm	Yes		e0	40 MHz		8		32 mm	No	4
M4A3-128/64-10VNC	Lattice Semiconductor	EE PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	128	CMOS			PAL-TYPE	3.3		3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3	62.5 MHz	40 s		260 °C (500 °F)	14 mm	Yes	64
M4A3-64/32-12VNI48	Lattice Semiconductor	EE PLD	Industrial	Gull Wing	48	LFQFP	Square	Plastic/Epoxy	12 ns		Yes	3.6 V	64	CMOS			PAL-TYPE	3.3		3.3 V	Flatpack, Low Profile, Fine Pitch	QFP48,.35SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G48	3	1.6 mm	7 mm	No		e3	52.6 MHz	40 s		260 °C (500 °F)	7 mm	Yes	32
M4A5-256/128-10YNC	Lattice Semiconductor	EE PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	10 ns		Yes	5.25 V	256	CMOS				5		5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	4.75 V		.5 mm	70 °C (158 °F)	14 Dedicated Inputs, 128 I/O	14	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	62.5 MHz	40 s		245 °C (473 °F)	28 mm	Yes	128
M4A5-32/32-10JC	Lattice Semiconductor	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.25 V	32	CMOS				5		5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 32 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e0	62.5 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	32
M4A5-32/32-10JNC	Lattice Semiconductor	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.25 V	32	CMOS				5		5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 32 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e3	62.5 MHz	40 s		245 °C (473 °F)	16.5862 mm	Yes	32
M4A5-32/32-10VNI	Lattice Semiconductor	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	10 ns		Yes	5.5 V	32	CMOS		34	PAL-TYPE	5		5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.5 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	62.5 MHz	40 s	32	260 °C (500 °F)	10 mm	Yes	32
SLG46108V	Renesas Electronics	OT PLD		No Lead	8	VQCCN	Rectangular				Yes	1.89 V	7			6	PLA-TYPE	1.8			Chip Carrier, Very Thin Profile	LCC8,.039X.047,16		No	Macrocell	1.71 V		.4 mm	85 °C (185 °F)	1 Dedicated Inputs, 5 I/O	1	-40 °C (-40 °F)		Quad	R-XQCC-N8	1	.6 mm	1 mm		Can also operate at 3.3 V or 5 V supply				5		1.2 mm	No	5
SLG46140V	Renesas Electronics	OT PLD		No Lead	14	VQCCN	Rectangular				Yes	1.89 V	8			12	PLA-TYPE	1.8			Chip Carrier, Very Thin Profile	LCC14,.06X.08,16		No	Macrocell	1.71 V		.4 mm	85 °C (185 °F)	1 Dedicated Inputs, 11 I/O	1	-40 °C (-40 °F)		Quad	R-XQCC-N14	1	.6 mm	1.6 mm		Can also operate at 3.3 V or 5 V supply				11		2 mm	No	11
SLG46140VTR	Renesas Electronics	OT PLD		No Lead	14	VQCCN	Rectangular				Yes	1.89 V	8			12	PLA-TYPE	1.8	Box, Tape and Reel, 7 in		Chip Carrier, Very Thin Profile	LCC14,.06X.08,16		No	Macrocell	1.71 V		.4 mm	85 °C (185 °F)	1 Dedicated Inputs, 11 I/O	1	-40 °C (-40 °F)		Quad	R-XQCC-N14	1	.6 mm	1.6 mm		Can also operate at 3.3 V or 5 V supply				11		2 mm	No	11
SLG46538MTR	Renesas Electronics	OT PLD		No Lead	22	HVQCCN	Rectangular				Yes	1.89 V	17			17	PLA-TYPE	1.8	Tape and Reel, 7 in		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC22,.08X.09,16		No	Macrocell	1.71 V		.4 mm	85 °C (185 °F)	1 Dedicated Inputs, 16 I/O	1	-40 °C (-40 °F)		Quad	R-XQCC-N22		.6 mm	2 mm		Can also operate at 3.3 V or 5 V supply				16		2.2 mm	No	16
SLG46721V	Renesas Electronics	OT PLD																																		1
SLG47105V	Renesas Electronics	OT PLD																																		1
TIBPAL16L8-25CFN	Texas Instruments	OT PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	25 ns		Yes	5.25 V		TTL	MIL-STD-883	16	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Combinatorial	4.75 V	64	1.27 mm	75 °C (167 °F)	10 Dedicated Inputs, 6 I/O	10	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQCC-J20	3	4.57 mm	8.965 mm	No		e4	30 MHz	30 s	8	245 °C (473 °F)	8.965 mm		6
XA2C64A-7VQG100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	64	CMOS	AEC-Q100			1.8		1.5/3.3,1.8 V	Flatpack, Thin Profile, Fine Pitch	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 64 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Real Digital Design Technology	e3		30 s		260 °C (500 °F)	14 mm	Yes	64
XC2C128-6TQG144C	Xilinx	Flash PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	6 ns		Yes	1.9 V	128	CMOS		100	PLA-TYPE	1.8		1.5/3.3,1.8 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 100 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	152 MHz	30 s	100	260 °C (500 °F)	20 mm	Yes	100
XC2C256-6FTG256C	Xilinx	Flash PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	6 ns		Yes	1.9 V	256	CMOS		184	PLA-TYPE	1.8		1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 184 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Real Digital Design Technology	e1	139 MHz	30 s	184	260 °C (500 °F)	17 mm	Yes	184
XC2C256-6VQG100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	6 ns		Yes	1.9 V	256	CMOS		80	PLA-TYPE	1.8		1.5/3.3,1.8 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Real Digital Design Technology	e3	139 MHz	30 s	80	260 °C (500 °F)	14 mm	Yes	80
XC2C256-7PQG208C	Xilinx	Flash PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	256	CMOS		173	PLA-TYPE	1.8		1.5/3.3,1.8 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 173 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Real Digital Design Technology	e3	108 MHz	30 s	173	245 °C (473 °F)	28 mm	Yes	173
XC95144XL-10CS144I	Xilinx	Flash PLD	Industrial	Ball	144	TFBGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	144	CMOS		117		3.3		2.5/3.3,3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 117 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e0	138.88 MHz	30 s	117	240 °C (464 °F)	12 mm	Yes	117
XC95144XL-7CSG144I	Xilinx	Flash PLD	Industrial	Ball	144	TFBGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	144	CMOS		117		3.3		2.5/3.3,3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 117 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e1	138.88 MHz	30 s	117	260 °C (500 °F)	12 mm	Yes	117
XC95288XL-7PQG208I	Xilinx	Flash PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	288	CMOS		168		3.3		2.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 168 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	125 MHz	30 s	168	245 °C (473 °F)	28 mm	Yes	168
XC9536-7VQG44C	Xilinx	Flash PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns		Yes	5.25 V	36	CMOS				5		3.3/5,5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.75 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	83.3 MHz	30 s		260 °C (500 °F)	10 mm	Yes	34
XC9572-15PCG44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns		Yes	5.25 V	72	CMOS				5		3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	72 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e3	55.6 MHz	30 s		245 °C (473 °F)	16.5862 mm	Yes	34
XC9572XL-5VQ64C	Xilinx	Flash PLD	Commercial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	5 ns		Yes	3.6 V	72	CMOS		36		3.3		2.5/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 52 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	72 Macrocells	e4	178.6 MHz		36		10 mm	Yes	52
XCR3064XL-10PC44C	Xilinx	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	64	CMOS				3.3		3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	2.7 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e0	95 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	36
XCR3064XL-10VQ100C	Xilinx	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	64	CMOS				3.3		3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 68 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e4	95 MHz				14 mm	Yes	68
XCR3064XL-10VQ44C	Xilinx	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	64	CMOS				3.3		3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e4	95 MHz				10 mm	Yes	36
XCR3128XL-10CS144I	Xilinx	EE PLD	Industrial	Ball	144	TFBGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	128	CMOS				3.3		3/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Programmable Logic Devices	Yes	Macrocell	2.7 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 108 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e0	95 MHz	30 s		240 °C (464 °F)	12 mm	Yes	108
5M160ZM68I5N	Intel	Flash PLD	Industrial	Ball	68	TFBGA	Square	Plastic/Epoxy	14 ns		Yes	1.89 V	128	CMOS				1.8		1.2/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA68,9X9,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	100 °C (212 °F)	52 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B68		1.2 mm	5 mm	No		e1	118.3 MHz				5 mm	Yes	52
5M2210ZF256C5	Intel	Flash PLD	Other	Ball	256	LBGA	Square	Plastic/Epoxy	11.2 ns		Yes	1.89 V	1700	CMOS		203		1.8		1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	85 °C (185 °F)	203 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256		1.55 mm	17 mm	No		e0	201.1 MHz		203		17 mm	Yes	203
5M80ZE64C5	Intel	Flash PLD	Other	Gull Wing	64	HTFQFP	Square	Plastic/Epoxy	14 ns		Yes	1.89 V						1.8			Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch				Macrocell	1.71 V		.4 mm	85 °C (185 °F)	54 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G64		1.2 mm	7 mm	No		e0	118.3 MHz				7 mm		54
82S100/BXA	NXP Semiconductors	OT PLD	Military	Through-Hole	28	DIP	Rectangular	Ceramic, Glass-Sealed	80 ns		No	5.5 V		TTL				5			In-Line				Combinatorial	4.5 V			125 °C (257 °F)	16 Dedicated Inputs, 0 I/O	16	-55 °C (-67 °F)		Dual	R-GDIP-T28				No									0
82S100BXA	Qp Semiconductor	OT PLD	Military	Through-Hole	28		Rectangular	Ceramic, Metal-Sealed Cofired	80 ns		No	5.5 V		Bipolar				5			In-Line				Combinatorial	4.5 V			125 °C (257 °F)	16 Dedicated Inputs, 0 I/O	16	-55 °C (-67 °F)		Dual	R-CDIP-T28				No									0
ATF1504ASVL-20JI84	Atmel	EE PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	20 ns		Yes	3.6 V	64	CMOS				3.3		2.5/3.3,3.3 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	3 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 64 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	2	4.572 mm	29.3115 mm	No		e0	83.3 MHz			225 °C (437 °F)	29.3115 mm	Yes	64
ATF22LV10CQZ-30PU	Microchip Technology	Flash PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	30 ns		No	5.5 V		CMOS		22	PAL-TYPE	3.3	Tube	3.3/5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	3 V	132	2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No		e3	25 MHz		10		31.887 mm		10
ATF750CL-15PC	Atmel	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns		No	5.25 V	10	CMOS				5		5 V	In-Line	DIP24,.3	Programmable Logic Devices	No	Macrocell	4.75 V		2.54 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No		e0	44 MHz				31.877 mm	No	10
CY37128P100-100AI	Cypress Semiconductor	EE PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	12 ns		Yes	5.5 V	128	CMOS				5		3.3/5 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	4.5 V		.5 mm	85 °C (185 °F)	1 Dedicated Inputs, 69 I/O	1	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	128 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e0	80 MHz				14 mm	Yes	69
CY37128P100-125AC	Cypress Semiconductor	EE PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	5.25 V	128	CMOS				5		3.3/5 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	4.75 V		.5 mm	70 °C (158 °F)	1 Dedicated Inputs, 69 I/O	1	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	128 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e0	83 MHz				14 mm	Yes	69
CY37128P100-125AI	Cypress Semiconductor	EE PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	5.5 V	128	CMOS				5		3.3/5 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	4.5 V		.5 mm	85 °C (185 °F)	1 Dedicated Inputs, 69 I/O	1	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	128 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e0	83 MHz				14 mm	Yes	69
CY37128P100-125AXC	Cypress Semiconductor	EE PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	5.25 V	128	CMOS				5		3.3/5 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	4.75 V		.5 mm	70 °C (158 °F)	1 Dedicated Inputs, 69 I/O	1	0 °C (32 °F)	Nickel/Palladium/Gold	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	128 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e4	83 MHz	40 s		260 °C (500 °F)	14 mm	Yes	69

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.