Programmable Logic Devices (PLD)

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
5M80ZM68C5N	Intel	Flash PLD	Other	Ball	68	TFBGA	Square	Plastic/Epoxy	14 ns		Yes	1.89 V	64	CMOS				1.8		1.8,1.2/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA68,9X9,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	52 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B68		1.2 mm	5 mm	No		e1	118.3 MHz				5 mm	Yes	52
ATF1504ASV-15JC44	Atmel	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns		Yes	3.6 V	64	CMOS				3.3		2.5/3.3,3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	3 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 32 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	2	4.572 mm	16.586 mm	No		e0	100 MHz			225 °C (437 °F)	16.586 mm	Yes	32
ATF1504ASVL-20AC100	Atmel	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	20 ns		Yes	3.6 V	64	CMOS				3.3		2.5/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 64 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0	83.3 MHz			240 °C (464 °F)	14 mm	Yes	64
ATF1508ASL-20AC100	Atmel	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	20 ns		Yes	5.25 V	128					5		3.3/5,5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	128 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e0	41.7 MHz			240 °C (464 °F)	14 mm	Yes	80
ATF16V8C-5JX	Microchip Technology	Flash PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	5 ns		Yes	5.25 V		CMOS		18	PAL-TYPE	5	Tube	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	70 °C (158 °F)	7 Dedicated Inputs, 8 I/O	7	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J20		4.572 mm	8.966 mm	No	8 Macrocells	e3	142 MHz		8		8.966 mm		8
ATF16V8CZ-15XU	Microchip Technology	Flash PLD	Industrial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	15 ns		Yes	5.5 V		CMOS			PAL-TYPE	5	Tube	5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25	Programmable Logic Devices		Macrocell	4.5 V	64	.65 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G20	1	1.2 mm	4.4 mm	No		e3	45 MHz	40 s	8	260 °C (500 °F)	6.5 mm		8
ATF22V10C-10PC	Atmel	Flash PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns		No	5.25 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	70 °C (158 °F)	10 Dedicated Inputs, 10 I/O	10	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No	Shared Input/Clock	e0	90 MHz		10		31.877 mm		10
ATF22V10C-15PC	Atmel	Flash PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns		No	5.25 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	70 °C (158 °F)	10 Dedicated Inputs, 10 I/O	10	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24		5.334 mm	7.62 mm	No		e0	55.5 MHz		10		31.877 mm		10
ATF22V10C-7JU	Microchip Technology	Flash PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	7.5 ns		Yes	5.5 V		CMOS		22	PAL-TYPE	5	Tube	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.5 V	132	1.27 mm	85 °C (185 °F)	10 Dedicated Inputs, 10 I/O	10	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J28		4.572 mm	11.5062 mm	No		e3	125 MHz		10		11.5062 mm		10
ATF22V10CZ-15PC	Microchip Technology	Flash PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns		No	5.25 V		CMOS				5			In-Line				Macrocell	4.75 V		2.54 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDIP-T24		5.334 mm	7.62 mm				55.5 MHz				31.877 mm		10
CY37128P100-100AC	Cypress Semiconductor	EE PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	12 ns		Yes	5.25 V	128	CMOS				5		3.3/5 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	4.75 V		.5 mm	70 °C (158 °F)	1 Dedicated Inputs, 69 I/O	1	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	128 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e0	80 MHz				14 mm	Yes	69
EP1K10TC144-3N	Intel	Loadable PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	0.7 ns	576	Yes	2.625 V		CMOS		92		2.5		2.5,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays		Mixed	2.375 V		.5 mm	70 °C (158 °F)	92 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3			92		20 mm		92
EP1K30QC208-3N	Intel	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	0.6 ns	1728	Yes	2.625 V		CMOS		147		2.5		2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Mixed	2.375 V		.5 mm	70 °C (158 °F)	147 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3			147		28 mm		147
EP1K50TI144-2	Intel	Loadable PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	0.4 ns	2880	Yes	2.625 V		CMOS		102		2.5		2.5,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays		Mixed	2.375 V		.5 mm	85 °C (185 °F)	102 I/O		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	37.5 MHz		102		20 mm		102
EP2A15F672C9	Intel	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	2.23 ns	16640	Yes	1.575 V		CMOS		480		1.5		1.5,1.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Macrocell	1.425 V		1 mm	85 °C (185 °F)	492 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e0			480		27 mm		492
EPF10K100EQC240-3N	Intel	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	0.7 ns	4992	Yes	2.625 V		CMOS		189		2.5		2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays		Mixed	2.375 V		.5 mm	70 °C (158 °F)	189 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	4992 Logic Elements	e3	140 MHz		189		32 mm		189
EPF10K200SRC240-3N	Intel	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	0.8 ns	9984	Yes	2.625 V		CMOS		182		2.5		2.5,2.5/3.3 V	Flatpack, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Mixed	2.375 V		.5 mm	70 °C (158 °F)	182 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3			182		32 mm		182
EPF10K20RC240-4	Intel	Loadable PLD	Commercial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	0.6 ns	1152	Yes	5.25 V		CMOS		189		5		3.3/5,5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Registered	4.75 V		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	1152 Logic Elements	e0	67.11 MHz		189		32 mm		189
EPF10K20RC240-4N	Intel	Loadable PLD	Commercial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	0.6 ns	1152	Yes	5.25 V		CMOS		189		5		3.3/5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Registered	4.75 V		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	1152 Logic Elements	e3	67.11 MHz		189		32 mm		189
EPF10K30ATI144-3N	Intel	Loadable PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	0.9 ns	1728	Yes	3.6 V		CMOS		102		3.3		2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.63SQ,20	Field Programmable Gate Arrays		Registered	3 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 102 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	1728 Logic Elements; 216 Labs	e3	80 MHz		102		20 mm		102
EPF6016TC144-3	Intel	Loadable PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		1320	Yes	5.25 V		CMOS		117		5		3.3/5,5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.63SQ,20	Field Programmable Gate Arrays		Macrocell	4.75 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 117 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Can Also Be Used 16000 Logic Gates	e0	133 MHz		117		20 mm		117
EPF6016TC144-3N	Intel	Loadable PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		1320	Yes	5.25 V		CMOS		117		5		3.3/5,5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.63SQ,20	Field Programmable Gate Arrays		Macrocell	4.75 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 117 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Can Also Be Used 16000 Logic Gates	e3	133 MHz		117		20 mm		117
EPM3064ATC44-4NAG	Intel	EE PLD	Commercial	Gull Wing	44	QFP	Square	Plastic/Epoxy	4.5 ns		Yes	3.6 V		CMOS				3.3			Flatpack				Macrocell	3 V			70 °C (158 °F)	0 Dedicated Inputs, 30 I/O	0	0 °C (32 °F)		Quad	S-PQFP-G44							222.2 MHz						30
EPM7032SLC44-6N	Altera	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	6 ns		Yes	5.25 V	32	CMOS				5		5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e3	200 MHz				16.5862 mm	Yes	36
EPM7032SLC44-7	Altera	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	7.5 ns		Yes	5.25 V	32	CMOS				5		5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	1	4.572 mm	16.5862 mm	No		e0	166.7 MHz			220 °C (428 °F)	16.5862 mm	Yes	36
EPM7064STC44-10FN	Intel	EE PLD	Commercial	Gull Wing	44	LQFP	Square	Plastic/Epoxy	10 ns		Yes	5.25 V		CMOS				5			Flatpack, Low Profile				Macrocell	4.75 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.27 mm	10 mm	No		e3	125 MHz				10 mm		36
GAL16V8D-20QJI	Lattice Semiconductor	EE PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	20 ns		Yes	5.5 V		CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.5 V	64	1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J20	1	4.572 mm	8.9662 mm	No		e0	41.6 MHz	30 s	8	225 °C (437 °F)	8.9662 mm		8
GAL16V8D-25LJNI	Lattice Semiconductor	EE PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	25 ns		Yes	5.5 V		CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.5 V	64	1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J20	1	4.572 mm	8.9662 mm	No		e3	37 MHz	40 s	8	250 °C (482 °F)	8.9662 mm		8
GAL16V8D-25LP	Lattice Semiconductor	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns		No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin/Lead	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No		e0	37 MHz	30 s	8	225 °C (437 °F)	26.162 mm		8
GAL16V8D-25LPI	Lattice Semiconductor	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns		No	5.5 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No		e0	37 MHz		8		26.162 mm		8
GAL16V8D-25QJNI	Lattice Semiconductor	EE PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	25 ns		Yes	5.5 V		CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.5 V	64	1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J20	1	4.572 mm	8.9662 mm	No		e3	37 MHz	40 s	8	250 °C (482 °F)	8.9662 mm		8
GAL16V8D-25QP	Lattice Semiconductor	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns		No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No		e0	37 MHz		8		26.162 mm		8
LC4128ZE-7TN144I	Lattice Semiconductor	EE PLD		Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	128	CMOS				1.8		1.8 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm		4 Dedicated Inputs, 96 I/O	4		Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	111 MHz	40 s		260 °C (500 °F)	20 mm	Yes	96
LC4256V-5TN100C	Lattice Semiconductor	EE PLD		Gull Wing	100	LFQFP	Square	Plastic/Epoxy	5 ns		Yes	3.6 V	256			74	PAD-TYPE	3.3		3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	83	.5 mm	90 °C (194 °F)	10 Dedicated Inputs, 64 I/O	10	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3	156 MHz	40 s	64	260 °C (500 °F)	14 mm	Yes	64
LC4256V-5TN144I	Lattice Semiconductor	EE PLD		Gull Wing	144	LFQFP	Square	Plastic/Epoxy	5 ns		Yes	3.6 V	256			110	PAD-TYPE	3.3		3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	83	.5 mm	105 °C (221 °F)	14 Dedicated Inputs, 96 I/O	14	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	156 MHz	40 s	96	260 °C (500 °F)	20 mm	Yes	96
LC4512V-10TN176I	Lattice Semiconductor	EE PLD		Gull Wing	176	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	512			132	PAD-TYPE	3.3		3.3 V	Flatpack, Low Profile, Fine Pitch	QFP176,1.0SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	83	.5 mm	105 °C (221 °F)	4 Dedicated Inputs, 128 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G176	3	1.6 mm	21 mm	No		e3	86 MHz	40 s	128	260 °C (500 °F)	21 mm	Yes	128
M4A3-64/32-55VNC	Lattice Semiconductor	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	5.5 ns		Yes	3.6 V	64	CMOS			PAL-TYPE	3.3		3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 32 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	105 MHz	40 s		260 °C (500 °F)	10 mm	Yes	32
M4A5-32/32-7VNI48	Lattice Semiconductor	EE PLD	Industrial	Gull Wing	48	LFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	5.5 V	32	CMOS		34	PAL-TYPE	5		5 V	Flatpack, Low Profile, Fine Pitch	QFP48,.35SQ,20	Programmable Logic Devices	Yes	Macrocell	4.5 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G48	3	1.6 mm	7 mm	No		e3	76.9 MHz	40 s	32	260 °C (500 °F)	7 mm	Yes	32
M4A5-96/48-12VNI	Lattice Semiconductor	EE PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	12 ns		Yes	5.5 V	96	CMOS			PAL-TYPE	5		5 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	4.5 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 48 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3	52.6 MHz	40 s		260 °C (500 °F)	14 mm	Yes	48
M4A5-96/48-55VNC	Lattice Semiconductor	EE PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	5.5 ns		Yes	5.25 V	96	CMOS			PAL-TYPE	5		5 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	4.75 V		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 48 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3	105 MHz	40 s		260 °C (500 °F)	14 mm	Yes	48
M4A5-96/48-7VNC	Lattice Semiconductor	EE PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	5.25 V	96	CMOS			PAL-TYPE	5		5 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	4.75 V		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 48 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3	76.9 MHz	40 s		260 °C (500 °F)	14 mm	Yes	48
M5-192/68-15VC/1	Lattice Semiconductor	EE PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	15 ns		Yes	5.25 V	192	CMOS				5		5 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	4.75 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 68 I/O	0	0 °C (32 °F)	Tin/Lead	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e0	55.6 MHz	30 s		240 °C (464 °F)	14 mm	Yes	68
SLG46538V	Renesas Electronics	OT PLD		No Lead	20	HVQCCN	Rectangular				Yes	1.89 V	17			17	PLA-TYPE	1.8			Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC20,.08X.12,16		No	Macrocell	1.71 V		.4 mm	85 °C (185 °F)	1 Dedicated Inputs, 16 I/O	1	-40 °C (-40 °F)		Quad	R-XQCC-N20		.6 mm	2 mm		Can also operate at 3.3 V or 5 V supply				16		3 mm	No	16
SLG46811V	Renesas Electronics	OT PLD																																		1
SLG46880-AP	Renesas Electronics	OT PLD		No Lead	32	HVQCCN	Square				Yes	5.5 V	12		AEC-Q100	20		2.5			Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20		No	Macrocell	2.3 V		.5 mm	125 °C (257 °F)	8 Dedicated Inputs, 12 I/O	8	-40 °C (-40 °F)		Quad	S-XQCC-N32		.8 mm	5 mm						20		5 mm	No	12
SLG46880V	Renesas Electronics	OT PLD		No Lead	32	HVQCCN	Square				Yes	5.5 V	12			18	PLA-TYPE	2.5			Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.16SQ,16		No	Macrocell	2.3 V		.4 mm	85 °C (185 °F)	2 Dedicated Inputs, 12 I/O	2	-40 °C (-40 °F)		Quad	S-XQCC-N32	1	.6 mm	4 mm						20		4 mm	No	12
SLG46880VTR	Renesas Electronics	OT PLD		No Lead	32	HVQCCN	Square				Yes	5.5 V	12			18	PLA-TYPE	2.5	Box, Tape and Reel, 13 in		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.16SQ,16		No	Macrocell	2.3 V		.4 mm	85 °C (185 °F)	2 Dedicated Inputs, 12 I/O	2	-40 °C (-40 °F)		Quad	S-XQCC-N32	1	.6 mm	4 mm						20		4 mm	No	12
XC2C512-10FGG324I	Xilinx	Flash PLD	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	10 ns		Yes	1.9 V	512	CMOS		270	PLA-TYPE	1.8		1.5/3.3,1.8 V	Grid Array	BGA324,22X22,40	Programmable Logic Devices	Yes	Macrocell	1.7 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 270 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	2.5 mm	23 mm	No		e1	91 MHz	30 s	270	250 °C (482 °F)	23 mm	Yes	270

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.