Programmable Logic Devices (PLD)

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
CY37128P160-100AI	Cypress Semiconductor	EE PLD	Industrial	Gull Wing	160	LFQFP	Square	Plastic/Epoxy	12 ns		Yes	5.5 V	128	CMOS				5		3.3/5 V	Flatpack, Low Profile, Fine Pitch	QFP160,1.0SQ,20	Programmable Logic Devices	Yes	Macrocell	4.5 V		.5 mm	85 °C (185 °F)	1 Dedicated Inputs, 133 I/O	1	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G160		1.6 mm	24 mm	No	128 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e0	80 MHz				24 mm	Yes	133
EP1K100FI256-2N	Intel	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	0.5 ns	4992	Yes	2.625 V		CMOS		186		2.5		2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Mixed	2.375 V		1 mm	85 °C (185 °F)	186 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	37.5 MHz		186		17 mm		186
EP1K50QI208-2N	Intel	Loadable PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	0.4 ns	2880	Yes	2.625 V		CMOS		147		2.5		2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Mixed	2.375 V		.5 mm	85 °C (185 °F)	147 I/O		-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	37.5 MHz		147		28 mm		147
EP1K50TI144-3	Altera	Loadable PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	12.5 ns	2880	Yes	2.625 V		CMOS		102		2.5		2.5,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays		Registered	2.375 V		.5 mm	85 °C (185 °F)	6 Dedicated Inputs, 102 I/O	6	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0			102	220 °C (428 °F)	20 mm		102
EP20K30EFC324-3	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	3.98 ns	1200	Yes	1.89 V		CMOS		120		1.8		1.8,1.8/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		Macrocell	1.71 V		1 mm	85 °C (185 °F)	4 Dedicated Inputs, 128 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	2.1 mm	19 mm	No		e1	160 MHz		120	220 °C (428 °F)	19 mm		128
EPF10K20RC208-3N	Intel	Loadable PLD	Commercial	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	0.5 ns	1152	Yes	5.25 V		CMOS		147		5		3.3/5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays		Registered	4.75 V		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 147 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	1152 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3	71.43 MHz		147		28 mm		147
EPF6010ATC144-3N	Intel	Loadable PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy			Yes	3.6 V						3.3			Flatpack, Low Profile, Fine Pitch				Macrocell	3 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 102 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Can Also Be Used 10000 Logic Gates	e3	133 MHz				20 mm		102
EPM1270GM256I5N	Intel	Flash PLD		Ball	256	BGA	Rectangular	Plastic/Epoxy	10 ns		Yes	1.89 V	980	CMOS		212		1.8		1.5/3.3,1.8 V	Grid Array	BGA256,20X20,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	100 °C (212 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3		11 mm	No	It can also operate at 3.3 V	e1			212		11 mm	Yes	212
EPM1270T144C3	Intel	Flash PLD	Commercial Extended	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	6.2 ns		Yes	2.625 V	980	CMOS		116		2.5		1.5/3.3,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 116 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	It can also operate at 3.3 V	e0			116		20 mm	Yes	116
EPM1270T144C4	Intel	Flash PLD	Commercial Extended	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	8.1 ns		Yes	2.625 V	980	CMOS		116		2.5		1.5/3.3,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 116 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	It can also operate at 3.3 V	e0			116		20 mm	Yes	116
EPM2210F256A5N	Intel	Flash PLD	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	11.2 ns		Yes	2.625 V	1700	CMOS		204		2.5		1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	125 °C (257 °F)	0 Dedicated Inputs, 204 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1			204		17 mm	Yes	204
EPM2210F256I5	Intel	Flash PLD		Ball	256	BGA	Square	Plastic/Epoxy	11.2 ns		Yes	2.625 V	1700	CMOS		204		2.5		1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	100 °C (212 °F)	0 Dedicated Inputs, 204 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e0			204		17 mm	Yes	204
EPM2210GF256C5N	Intel	Flash PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy	11.2 ns		Yes	1.89 V	1700	CMOS		204		1.8		1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 204 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1			204		17 mm	Yes	204
EPM240ZM68C6N	Intel	Flash PLD	Other	Ball	68	BGA	Rectangular	Plastic/Epoxy	7.9 ns		Yes	1.89 V	192	CMOS		54		1.8		1.5/3.3,1.8 V	Grid Array	BGA68,9X9,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs	0	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B68	3		5 mm	No	It can also operate at 3.3 V	e1			54		5 mm	Yes	54
EPM240ZM68C7N	Intel	Flash PLD	Other	Ball	68	BGA	Rectangular	Plastic/Epoxy	12 ns		Yes	1.89 V	192	CMOS		54		1.8		1.5/3.3,1.8 V	Grid Array	BGA68,9X9,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs	0	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B68	3		5 mm	No	It can also operate at 3.3 V	e1			54		5 mm	Yes	54
EPM3128ATI100-10	Intel	EE PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	128	CMOS				3.3		2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No		e0	98 MHz				14 mm	Yes	80
EPM5032DC-15	Altera	UV PLD	Commercial	Through-Hole	28	DIP	Rectangular	Ceramic, Glass-Sealed	15 ns		No	5.25 V		CMOS		24	PAL-TYPE	5		5 V	In-Line	DIP28,.3	Programmable Logic Devices		Macrocell	4.75 V	320	2.54 mm	70 °C (158 °F)	7 Dedicated Inputs, 16 I/O	7	0 °C (32 °F)	Tin Lead	Dual	R-GDIP-T28				No	Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock	e0	76.9 MHz		16	220 °C (428 °F)			16
EPM5032DC-20	Altera	UV PLD	Commercial	Through-Hole	28	DIP	Rectangular	Ceramic, Glass-Sealed	20 ns		No	5.25 V		CMOS		24	PAL-TYPE	5		5 V	In-Line	DIP28,.3	Programmable Logic Devices		Macrocell	4.75 V	320	2.54 mm	70 °C (158 °F)	7 Dedicated Inputs, 16 I/O	7	0 °C (32 °F)	Tin Lead	Dual	R-GDIP-T28				No	Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock	e0	62.5 MHz		16	220 °C (428 °F)			16
EPM5032JC	Intel	OT PLD	Commercial	J Bend	28		Square	Plastic/Epoxy	25 ns		Yes	5.25 V	32	CMOS		24	PAL-TYPE	5						No	Macrocell	4.75 V	320		70 °C (158 °F)	7 Dedicated Inputs, 16 I/O	7	0 °C (32 °F)		Quad	S-XQCC-J28							50 MHz		16			No	16
EPM5032JC-20	Altera	UV PLD	Commercial	J Bend	28	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	20 ns		Yes	5.25 V		CMOS		24	PAL-TYPE	5		5 V	Chip Carrier, Window	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	320	1.27 mm	70 °C (158 °F)	7 Dedicated Inputs, 16 I/O	7	0 °C (32 °F)	Tin Lead	Quad	S-CQCC-J28		4.57 mm	11.43 mm	No	Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock	e0	62.5 MHz		16	220 °C (428 °F)	11.43 mm		16
EPM5032JM-25	Altera	UV PLD	Military	J Bend	28	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	25 ns		Yes			CMOS		24	PAL-TYPE	5		5 V	Chip Carrier, Window	LDCC28,.5SQ	Programmable Logic Devices		Macrocell		320	1.27 mm	125 °C (257 °F)	7 Dedicated Inputs, 16 I/O	7	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-J28		4.57 mm	11.43 mm	No	Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock	e0	50 MHz		16	220 °C (428 °F)	11.43 mm		16
EPM5032LC-15	Altera	OT PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns		Yes	5.25 V		CMOS		24	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	320	1.27 mm	70 °C (158 °F)	7 Dedicated Inputs, 16 I/O	7	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28				No	Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock	e0	76.9 MHz		16	220 °C (428 °F)			16
EPM5032LC-20	Altera	OT PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	20 ns		Yes	5.25 V		CMOS		24	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	320	1.27 mm	70 °C (158 °F)	7 Dedicated Inputs, 16 I/O	7	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28				No	Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock	e0	62.5 MHz		16	220 °C (428 °F)			16
EPM5032PC-15	Altera	OT PLD	Commercial	Through-Hole	28	DIP	Rectangular	Plastic/Epoxy	15 ns		No	5.25 V		CMOS		24	PAL-TYPE	5		5 V	In-Line	DIP28,.3	Programmable Logic Devices		Macrocell	4.75 V	320	2.54 mm	70 °C (158 °F)	7 Dedicated Inputs, 16 I/O	7	0 °C (32 °F)	Tin/Lead	Dual	R-PDIP-T28				No	Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock	e0	76.9 MHz	30 s	16	220 °C (428 °F)			16
EPM5032PC-20	Altera	OT PLD	Commercial	Through-Hole	28	DIP	Rectangular	Plastic/Epoxy	20 ns		No	5.25 V		CMOS		24	PAL-TYPE	5		5 V	In-Line	DIP28,.3	Programmable Logic Devices		Macrocell	4.75 V	320	2.54 mm	70 °C (158 °F)	7 Dedicated Inputs, 16 I/O	7	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T28				No	Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock	e0	62.5 MHz		16	220 °C (428 °F)			16
EPM570GT100I5N	Intel	Flash PLD		Gull Wing	100	TFQFP	Square	Plastic/Epoxy	8.7 ns		Yes	1.89 V	440	CMOS		76		1.8		1.5/3.3,1.8 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	100 °C (212 °F)	0 Dedicated Inputs, 76 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	It can also operate at 3.3 V	e3			76		14 mm	Yes	76
EPM7032SLC44-10	Altera	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.25 V	32	CMOS				5		5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Tin/Lead	Quad	S-PQCC-J44	1	4.572 mm	16.5862 mm	No		e0	125 MHz	30 s		220 °C (428 °F)	16.5862 mm	Yes	36
EPM7064AETC100-10N	Intel	EE PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	64	CMOS				3.3		2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 68 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No		e3	100 MHz				14 mm	Yes	68
EPM7128AETC100-7N	Intel	EE PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	128	CMOS				3.3		2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 84 I/O	0	0 °C (32 °F)	Matte Tin - annealed	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No		e3	129.9 MHz	30 s		260 °C (500 °F)	14 mm	Yes	84
EPM7128SQC100-10N	Intel	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns		Yes	5.25 V	128	CMOS				5		3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 84 I/O	0	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.65 mm	14 mm	No	Configurable I/O operation with 3.3 V or 5 V	e3	125 MHz				20 mm	Yes	84
EPM7128SQC160-10N	Intel	EE PLD	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	10 ns		Yes	5.25 V	128	CMOS				5		3.3/5,5 V	Flatpack	QFP160,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 100 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G160	3	4.07 mm	28 mm	No	Configurable I/O operation with 3.3 V or 5 V	e3	125 MHz				28 mm	Yes	100
EPM7160ELC84-20	Intel	EE PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	20 ns		Yes	5.25 V	160	CMOS				5		3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 64 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	2	5.08 mm	29.3116 mm	No	Configurable I/O operation with 3.3 V or 5 V	e0	83.3 MHz				29.3116 mm	No	64
EPM7160SQC160-10N	Intel	EE PLD	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	10 ns		Yes	5.25 V	160	CMOS				5		3.3/5,5 V	Flatpack	QFP160,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 104 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G160	3	4.07 mm	28 mm	No	Configurable I/O operation with 3.3 V or 5 V	e3	125 MHz				28 mm	Yes	104
EPM7192SQI160-10	Intel	EE PLD	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy	10 ns		Yes	5.5 V	192	CMOS		124		5		3.3/5,5 V	Flatpack	QFP160,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 124 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G160	3	4.07 mm	28 mm	No	192 Macrocells; 12 Labs; Configurable I/O operation with 3.3 V or 5 V	e0	125 MHz		124		28 mm	Yes	124
EPM7512AEQI208-10	Intel	EE PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	512	CMOS		176	PAL-TYPE	3.3		2.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 176 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0	87 MHz		176		28 mm	Yes	176
EPM7512AEQI208-10N	Intel	EE PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	512	CMOS				3.3		2.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 176 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	512 Macrocells	e3	87 MHz				28 mm	Yes	176
EPXA1F484C2	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes	1.89 V						1.8			Grid Array				Macrocell	1.71 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 186 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0				220 °C (428 °F)	23 mm		186
GAL16V8-20HB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	20 ns		No			CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20				No		e0	33.3 MHz		8
GAL16V8D-25QJI	Lattice Semiconductor	EE PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	25 ns		Yes	5.5 V		CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.5 V	64	1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J20	1	4.572 mm	8.9662 mm	No		e0	37 MHz	30 s	8	225 °C (437 °F)	8.9662 mm		8
GAL20V8C-10LJI	Lattice Semiconductor	EE PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.5 V		CMOS		20	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.5 V	64	1.27 mm	85 °C (185 °F)	12 Dedicated Inputs, 8 I/O	12	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No	Register Preload; Power-Up Reset	e0	58.8 MHz	30 s	8	225 °C (437 °F)	11.5062 mm		8
GAL20V8C-10LJN	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.25 V		CMOS		20	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	75 °C (167 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No	Register Preload; Power-Up Reset	e3	58.8 MHz	40 s	8	245 °C (473 °F)	11.5062 mm		8
GAL20V8C-10LJNI	Lattice Semiconductor	EE PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.5 V		CMOS		20	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.5 V	64	1.27 mm	85 °C (185 °F)	12 Dedicated Inputs, 8 I/O	12	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No	Register Preload; Power-Up Reset	e3	58.8 MHz	40 s	8	245 °C (473 °F)	11.5062 mm		8
GAL22V10D-25LPNI	Lattice Semiconductor	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns		No	5.5 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No	10 Macrocells; Shared Input/Clock	e3	33.3 MHz		10		31.75 mm		10
JM38510/50604BRA	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	20 ns		No	5.25 V		TTL	MIL-M-38510 Class B	12	PAL-TYPE	5	Tube		In-Line			No	Mixed	4.75 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20		5.08 mm	6.92 mm	No		e0	40 MHz		8		24.2 mm	No	4
LC4032ZC-35MN56C	Lattice Semiconductor	EE PLD		Ball	56	LFBGA	Square	Plastic/Epoxy	3.5 ns		Yes	1.9 V	32			36	PAD-TYPE	1.8		1.8 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	83	.5 mm	90 °C (194 °F)	4 Dedicated Inputs, 32 I/O	4	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No		e1	212 MHz	40 s	32	260 °C (500 °F)	6 mm	Yes	32
LC4064V-10T48I	Lattice Semiconductor	EE PLD		Gull Wing	48	TFQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	64			36	PAD-TYPE	3.3		3.3 V	Flatpack, Thin Profile, Fine Pitch	QFP48,.35SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	83	.5 mm	105 °C (221 °F)	4 Dedicated Inputs, 32 I/O	4	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G48	3	1.2 mm	7 mm	No		e0	86 MHz	30 s	32	240 °C (464 °F)	7 mm	Yes	32
LC4064V-75T48C	Lattice Semiconductor	EE PLD		Gull Wing	48	TFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	64			36	PAD-TYPE	3.3		3.3 V	Flatpack, Thin Profile, Fine Pitch	QFP48,.35SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	83	.5 mm	90 °C (194 °F)	4 Dedicated Inputs, 32 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G48	3	1.2 mm	7 mm	No		e0	111 MHz	30 s	32	240 °C (464 °F)	7 mm	Yes	32
LC4064V-75T48I	Lattice Semiconductor	EE PLD		Gull Wing	48	TFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	64			36	PAD-TYPE	3.3		3.3 V	Flatpack, Thin Profile, Fine Pitch	QFP48,.35SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	83	.5 mm	105 °C (221 °F)	4 Dedicated Inputs, 32 I/O	4	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G48	3	1.2 mm	7 mm	No		e0	111 MHz	30 s	32	240 °C (464 °F)	7 mm	Yes	32

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.