Programmable Logic Devices (PLD)

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

XC95144XL-7TQG144I

Xilinx

Flash PLD

Industrial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

144

CMOS

117

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 117 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

138.88 MHz

30 s

117

260 °C (500 °F)

20 mm

Yes

117

XC95288XL-10FGG256C

Xilinx

Flash PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

288

CMOS

192

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 192 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2 mm

17 mm

No

e1

100 MHz

30 s

192

260 °C (500 °F)

17 mm

Yes

192

XC95288XL-10PQ208I

Xilinx

Flash PLD

Industrial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

288

CMOS

168

3.3

2.5/3.3,3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 168 I/O

0

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e4

100 MHz

168

28 mm

Yes

168

XC95288XL-10PQG208I

Xilinx

Flash PLD

Industrial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

288

CMOS

168

3.3

2.5/3.3,3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 168 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

100 MHz

30 s

168

245 °C (473 °F)

28 mm

Yes

168

XC9536XL-10CSG48I

Xilinx

Flash PLD

Industrial

Ball

48

FBGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

36

CMOS

36

3.3

2.5/3.3,3.3 V

Grid Array, Fine Pitch

BGA48,7X7,32

Programmable Logic Devices

Yes

Macrocell

3 V

.8 mm

85 °C (185 °F)

0 Dedicated Inputs, 36 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B48

3

1.8 mm

7 mm

No

e1

138.88 MHz

30 s

36

260 °C (500 °F)

7 mm

Yes

36

XCR3512XL-10PQG208C

Xilinx

EE PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

512

CMOS

3.3

3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 180 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

97 MHz

30 s

245 °C (473 °F)

28 mm

Yes

180

5962-89839142A

Defense Logistics Agency

EE PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

15 ns

Yes

5.5 V

CMOS

MIL-STD-883

5

Chip Carrier

Macrocell

4.5 V

125 °C (257 °F)

8 Dedicated Inputs, 8 I/O

8

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

No

e0

8

5962-8984101LA

NXP Semiconductors

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

5.5 V

CMOS

5

In-Line

Macrocell

4.5 V

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

No

e0

22 MHz

10

5962-89841113A

Defense Logistics Agency

EE PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

15 ns

Yes

5.5 V

CMOS

MIL-STD-883

5

Chip Carrier

Macrocell

4.5 V

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

No

e0

50 MHz

10

ATF1502AS-10AC44

Atmel

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

32

CMOS

5

3.3,5 V

Flatpack, Thin Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

4.75 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 32 I/O

0

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

32 Macrocells; Configurable I/O operation with 3.3 V or 5 V

e0

125 MHz

10 mm

Yes

32

ATF1502AS-15AC44

Atmel

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

32

CMOS

5

3.3,5 V

Flatpack, Thin Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

4.75 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 32 I/O

0

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

e0

100 MHz

10 mm

Yes

32

ATF1502AS-15AI44

Atmel

EE PLD

Industrial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

15 ns

Yes

5.5 V

32

CMOS

5

3.3,5 V

Flatpack, Thin Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

4.5 V

.8 mm

85 °C (185 °F)

0 Dedicated Inputs, 32 I/O

0

-40 °C (-40 °F)

Tin/Lead

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

e0

100 MHz

30 s

240 °C (464 °F)

10 mm

Yes

32

ATF1508AS-15AC100

Atmel

EE PLD

Commercial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

128

5

3.3/5,5 V

Flatpack, Thin Profile, Fine Pitch

TQFP100,.63SQ

Programmable Logic Devices

Yes

Macrocell

4.75 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 80 I/O

0

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G100

3

1.2 mm

14 mm

No

128 Macrocells; Configurable I/O operation with 3.3 V or 5 V

e0

100 MHz

240 °C (464 °F)

14 mm

Yes

80

CY37512P208-125NXC

Cypress Semiconductor

EE PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

512

CMOS

165

PLA-TYPE

5

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Yes

Macrocell

4.75 V

.5 mm

70 °C (158 °F)

1 Dedicated Inputs, 160 I/O

1

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3.7 mm

28 mm

No

512 Macrocells; Configurable I/O Operation with 3.3 V or 5 V

e3

83 MHz

20 s

160

260 °C (500 °F)

28 mm

Yes

160

CY37512P256-100BGI

Cypress Semiconductor

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

12 ns

Yes

5.5 V

512

CMOS

5

3.3/5 V

Grid Array

BGA256,20X20,50

Programmable Logic Devices

Yes

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

1 Dedicated Inputs, 197 I/O

1

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.46 mm

27 mm

No

512 Macrocells; Configurable I/O Operation with 3.3 V or 5 V

e0

80 MHz

27 mm

Yes

197

EP1K100QI208-2

Intel

Loadable PLD

Industrial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

0.5 ns

4992

Yes

2.625 V

CMOS

147

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Mixed

2.375 V

.5 mm

85 °C (185 °F)

147 I/O

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e0

37.5 MHz

147

28 mm

147

EPF8636AQC208-4

Intel

Loadable PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

504

Yes

5.25 V

CMOS

136

5

3.3/5,5 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Registered

4.75 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 136 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

504 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e0

357 MHz

132

28 mm

136

EPM240T100I3

Intel

Flash PLD

Gull Wing

100

QFP

Square

Plastic

4.7 ns

Yes

2.625 V

192

CMOS

80

1.5/3.3,2.5/3.3 V

Flatpack

TQFP100,.63SQ

Programmable Logic Devices

Yes

2.375 V

.5 mm

100 °C (212 °F)

0 Dedicated Inputs, 80 I/O

0

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G100

3

14 mm

No

e0

166.66 MHz

80

14 mm

Yes

80

EPM3032ATC44-10

Intel

EE PLD

Commercial

Gull Wing

44

LQFP

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

32

CMOS

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

3 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 34 I/O

0

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G44

3

1.27 mm

10 mm

No

e0

103.1 MHz

10 mm

Yes

34

EPM3032ATC44-4

Intel

EE PLD

Commercial

Gull Wing

44

LQFP

Square

Plastic/Epoxy

4.5 ns

Yes

3.6 V

32

CMOS

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

3 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 34 I/O

0

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G44

3

1.27 mm

10 mm

No

e0

227.3 MHz

10 mm

Yes

34

EPM3032ATC44-7

Intel

EE PLD

Commercial

Gull Wing

44

LQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

32

CMOS

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

3 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 34 I/O

0

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G44

3

1.27 mm

10 mm

No

e0

138.9 MHz

10 mm

Yes

34

EPM3064ATC44-7N

Intel

EE PLD

Commercial

Gull Wing

44

LQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

64

CMOS

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

3 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 34 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G44

3

1.27 mm

10 mm

No

e3

135.1 MHz

10 mm

Yes

34

EPM570GT144C4N

Intel

Flash PLD

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

7 ns

Yes

1.89 V

440

CMOS

116

1.8

1.5/3.3,1.8 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Programmable Logic Devices

Yes

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 116 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

It can also operate at 3.3 V

e3

116

20 mm

Yes

116

EPM570GT144C5N

Intel

Flash PLD

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

8.7 ns

Yes

1.89 V

440

CMOS

116

1.8

1.5/3.3,1.8 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Programmable Logic Devices

Yes

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 116 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

It can also operate at 3.3 V

e3

116

20 mm

Yes

116

EPM7160ELC84-15

Intel

EE PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

160

CMOS

5

3.3/5,5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

No

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 64 I/O

0

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

2

5.08 mm

29.3116 mm

No

Configurable I/O operation with 3.3 V or 5 V

e0

100 MHz

29.3116 mm

No

64

GAL22V10D-25QJ

Lattice Semiconductor

EE PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

5.25 V

CMOS

22

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.75 V

132

1.27 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J28

1

4.572 mm

11.5062 mm

No

10 Macrocells; Shared Input/Clock

e0

33.3 MHz

30 s

10

225 °C (437 °F)

11.5062 mm

10

ISPLSI1048E-70LQ

Lattice Semiconductor

EE PLD

Commercial

Gull Wing

128

QFP

Square

Plastic/Epoxy

18.5 ns

Yes

5.25 V

192

CMOS

5

5 V

Flatpack

QFP128,1.2SQ,32

Programmable Logic Devices

Yes

Macrocell

4.75 V

.8 mm

70 °C (158 °F)

8 Dedicated Inputs, 96 I/O

8

0 °C (32 °F)

Tin/Lead

Quad

S-PQFP-G128

3

4.1 mm

28 mm

No

Use ISPLSI1048EA for new designs

e0

56 MHz

30 s

225 °C (437 °F)

28 mm

No

96

LC4032V-5TN48C

Lattice Semiconductor

EE PLD

Gull Wing

48

TFQFP

Square

Plastic/Epoxy

5 ns

Yes

3.6 V

32

36

PAD-TYPE

3.3

3.3 V

Flatpack, Thin Profile, Fine Pitch

QFP48,.35SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

83

.5 mm

90 °C (194 °F)

4 Dedicated Inputs, 32 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G48

3

1.2 mm

7 mm

No

e3

156 MHz

40 s

32

260 °C (500 °F)

7 mm

Yes

32

LC4032ZC-75TN48E

Lattice Semiconductor

EE PLD

Gull Wing

48

TFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

1.9 V

32

36

PAD-TYPE

1.8

1.8 V

Flatpack, Thin Profile, Fine Pitch

QFP48,.35SQ,20

Programmable Logic Devices

Yes

Macrocell

1.7 V

83

.5 mm

130 °C (266 °F)

4 Dedicated Inputs, 32 I/O

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G48

3

1.2 mm

7 mm

No

e3

111 MHz

40 s

32

260 °C (500 °F)

7 mm

Yes

32

LC4064V-75TN44E

Lattice Semiconductor

EE PLD

Gull Wing

44

TQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

64

32

PAD-TYPE

3.3

3.3 V

Flatpack, Thin Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

3 V

83

.8 mm

130 °C (266 °F)

2 Dedicated Inputs, 30 I/O

2

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

e3

111 MHz

40 s

30

260 °C (500 °F)

10 mm

Yes

30

LC4128V-27TN100C

Lattice Semiconductor

EE PLD

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

2.7 ns

Yes

3.6 V

128

74

PAD-TYPE

3.3

3.3 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

83

.5 mm

90 °C (194 °F)

10 Dedicated Inputs, 64 I/O

10

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e3

222 MHz

40 s

64

260 °C (500 °F)

14 mm

Yes

64

LC4256V-75TN176I

Lattice Semiconductor

EE PLD

Gull Wing

176

LFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

256

132

PAD-TYPE

3.3

3.3 V

Flatpack, Low Profile, Fine Pitch

QFP176,1.0SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

83

.5 mm

105 °C (221 °F)

4 Dedicated Inputs, 128 I/O

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G176

3

1.6 mm

21 mm

No

e3

111 MHz

40 s

128

260 °C (500 °F)

21 mm

Yes

128

LC4256ZC-45TN100C

Lattice Semiconductor

EE PLD

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

4.5 ns

Yes

1.9 V

256

74

PAD-TYPE

1.8

1.8 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

1.7 V

83

.5 mm

90 °C (194 °F)

10 Dedicated Inputs, 64 I/O

10

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e3

150 MHz

40 s

64

260 °C (500 °F)

14 mm

Yes

64

M4A5-64/32-12VI48

Lattice Semiconductor

EE PLD

Industrial

Gull Wing

48

LFQFP

Square

Plastic/Epoxy

12 ns

Yes

5.5 V

64

CMOS

5

5 V

Flatpack, Low Profile, Fine Pitch

QFP48,.35SQ,20

Programmable Logic Devices

Yes

Macrocell

4.5 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 32 I/O

0

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G48

3

1.6 mm

7 mm

No

e0

52.6 MHz

30 s

240 °C (464 °F)

7 mm

Yes

32

PALCE22V10-10JCR

Cypress Semiconductor

Flash PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Quad

S-PQCC-J28

No

10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms

76.9 MHz

10

PALCE22V10-10JCT

Cypress Semiconductor

Flash PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Quad

S-PQCC-J28

4.572 mm

11.5316 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms

76.9 MHz

11.5316 mm

10

PEEL18CV8P-15L

Diodes Incorporated

EE PLD

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

15 ns

No

5.25 V

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

4.75 V

74

2.54 mm

70 °C (158 °F)

9 Dedicated Inputs, 8 I/O

9

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T20

7.62 mm

No

e3

41.6 MHz

8

260 °C (500 °F)

26.162 mm

8

TIBPAL16L8-25CN

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

25 ns

No

5.25 V

TTL

MIL-STD-883

16

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Combinatorial

4.75 V

64

2.54 mm

75 °C (167 °F)

10 Dedicated Inputs, 6 I/O

10

0 °C (32 °F)

Nickel Palladium Gold

Dual

R-PDIP-T20

5.08 mm

7.62 mm

No

e4

30 MHz

8

25.4 mm

6

XC2C32A-6CP56C

Xilinx

Flash PLD

Commercial

Ball

56

LFBGA

Square

Plastic/Epoxy

6 ns

Yes

1.9 V

32

CMOS

1.8

1.5/3.3,1.8 V

Grid Array, Low Profile, Fine Pitch

BGA56,10X10,20

Programmable Logic Devices

Yes

Macrocell

1.7 V

.5 mm

70 °C (158 °F)

33 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B56

3

1.35 mm

6 mm

No

Real Digital Design Technology

e0

300 MHz

30 s

240 °C (464 °F)

6 mm

Yes

33

XC95108-10TQG100C

Xilinx

Flash PLD

Commercial

Gull Wing

100

HLFQFP

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

108

CMOS

5

3.3/5,5 V

Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch

QFP100,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

4.75 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 81 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e3

30 s

260 °C (500 °F)

14 mm

Yes

81

XC9536-15VQ44I

Xilinx

Flash PLD

Industrial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

15 ns

Yes

5.5 V

36

CMOS

5

3.3/5,5 V

Flatpack, Thin Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

4.5 V

.8 mm

85 °C (185 °F)

0 Dedicated Inputs, 34 I/O

0

-40 °C (-40 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

e0

55.6 MHz

30 s

240 °C (464 °F)

10 mm

Yes

34

XCR3128XL-7VQG100C

Xilinx

EE PLD

Commercial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

128

CMOS

3.3

3.3 V

Flatpack, Thin Profile, Fine Pitch

TQFP100,.63SQ

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 84 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.2 mm

14 mm

No

e3

119 MHz

30 s

260 °C (500 °F)

14 mm

Yes

84

5M1270ZF256C4N

Intel

Flash PLD

Other

Ball

256

LBGA

Square

Plastic/Epoxy

8.1 ns

Yes

1.89 V

980

CMOS

1.8

1.8,1.2/3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

85 °C (185 °F)

211 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

1.55 mm

17 mm

No

e1

247.5 MHz

17 mm

Yes

211

5M1270ZF324C5N

Intel

Flash PLD

Other

Ball

324

LBGA

Square

Plastic/Epoxy

11.2 ns

Yes

1.89 V

980

CMOS

1.8

1.8,1.2/3.3 V

Grid Array, Low Profile

BGA324,18X18,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

85 °C (185 °F)

271 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

1.55 mm

19 mm

No

e1

201.1 MHz

19 mm

Yes

271

5M1270ZT144C5

Intel

Flash PLD

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

10 ns

Yes

1.89 V

1.8

Flatpack, Low Profile, Fine Pitch

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

114 I/O

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G144

1.6 mm

20 mm

No

e0

201.1 MHz

20 mm

114

5M2210ZF256I5

Intel

Flash PLD

Industrial

Ball

256

LBGA

Square

Plastic/Epoxy

11.2 ns

Yes

1.89 V

1700

CMOS

203

1.8

1.8,1.2/3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

100 °C (212 °F)

203 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

1.55 mm

17 mm

No

e0

201.1 MHz

203

17 mm

Yes

203

5M40ZE64C4

Intel

Flash PLD

Other

Gull Wing

64

HTFQFP

Square

Plastic/Epoxy

7.9 ns

Yes

1.89 V

1.8

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

Macrocell

1.71 V

.4 mm

85 °C (185 °F)

54 I/O

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G64

1.2 mm

7 mm

No

e0

184.1 MHz

7 mm

54

5M570ZT100I5

Intel

Flash PLD

Industrial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

17.7 ns

Yes

1.89 V

1.8

Flatpack, Thin Profile, Fine Pitch

Macrocell

1.71 V

.5 mm

100 °C (212 °F)

74 I/O

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G100

1.2 mm

14 mm

No

e0

118.3 MHz

14 mm

74

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.