Programmable Logic Devices (PLD)

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
EPM7064STC44-5N	Intel	EE PLD	Commercial	Gull Wing	44	LQFP	Square	Plastic/Epoxy	5 ns		Yes	5.25 V	64	CMOS				5	5 V	Flatpack, Low Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.75 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.27 mm	10 mm	No	64 Macrocells; 4 Labs; Configurable I/O operation with 3.3 V or 5 V	e3	250 MHz				10 mm	No	36
EPM7064STI100-10	Altera	EE PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	5.5 V	64	CMOS				5	3.3/5,5 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 68 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No	64 Macrocells	e0	125 MHz			220 °C (428 °F)	14 mm	No	68
EPM7128SLI84-10	Intel	EE PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.5 V	128	CMOS				5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 68 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	2	5.08 mm	29.3116 mm	No	Configurable I/O operation with 3.3 V or 5 V	e0	125 MHz				29.3116 mm	Yes	68
EPM7128STI100-10	Intel	EE PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	5.5 V	128	CMOS				5	3.3/5,5 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 84 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No	Configurable I/O operation with 3.3 V or 5 V	e0	125 MHz				14 mm	Yes	84
EPM7192SQC160-15N	Intel	EE PLD	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	15 ns		Yes	5.25 V	192	CMOS				5	3.3/5,5 V	Flatpack	QFP160,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 124 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G160	3	4.07 mm	28 mm	No	Configurable I/O operation with 3.3 V or 5 V	e3	100 MHz				28 mm	Yes	124
EPM7256AETC100-7	Intel	EE PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	256	CMOS				3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 84 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No		e0	126.6 MHz	30 s		235 °C (455 °F)	14 mm	Yes	84
EPM7256SQC208-10	Intel	EE PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	10 ns		Yes	5.25 V	256	CMOS				5	3.3/5,5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	4.75 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 164 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	256 Macrocells; 16 Labs; Configurable I/O operation with 3.3 V or 5 V	e0	125 MHz				28 mm	Yes	164
EPM7512AEFC256-7	Intel	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	512	CMOS				3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No	512 Macrocells; 32 Labs; Configurable I/O operation with 2.5 V or 3.3 V	e0	116.3 MHz	20 s		220 °C (428 °F)	17 mm	Yes	212
EPM9320ALC84-15	Altera	EE PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	16 ns		Yes	5.25 V		CMOS				5		Chip Carrier				Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 56 I/O	4	0 °C (32 °F)		Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	320 Macrocells					220 °C (428 °F)	29.3116 mm		56
EPM9560RC208-15	Altera	EE PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	16.6 ns		Yes	5.25 V	560	CMOS				5	3.3/5,5 V	Flatpack, Fine Pitch	HQFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	4.75 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 153 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	772 Flip Flops; Configurable I/O operation with 3.3 V or 5 V	e0	117.6 MHz			220 °C (428 °F)	28 mm	Yes	153
GAL20VP8B-25LP	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns		No	5.25 V		CMOS		20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	75 °C (167 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24		4.57 mm	7.62 mm	No	Register Preload; Power-Up Reset	e0	40 MHz		8		31.855 mm		8
GAL22V10C-10LJI	Lattice Semiconductor	EE PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.5 V		CMOS		22	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.5 V	132	1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No	Register Preload; Power-Up Reset	e0	71.4 MHz	30 s	10	225 °C (437 °F)	11.5062 mm		10
GAL22V10D-10QJ	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.25 V		CMOS		22	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	132	1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No	10 Macrocells; Shared Input/Clock	e0	83.3 MHz	30 s	10	225 °C (437 °F)	11.5062 mm		10
GAL22V10D-10QJN	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.25 V		CMOS		22	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	132	1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No		e3	83.3 MHz	40 s	10	245 °C (473 °F)	11.5062 mm		10
GAL22V10D-15LP	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns		No	5.25 V		CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No	10 Macrocells; Shared Input/Clock	e0	55.5 MHz		10		31.75 mm		10
ISPLSI1016E-100LTN44	Lattice Semiconductor	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	13 ns		Yes	5.25 V	64	CMOS		35	PLA-TYPE	5	5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.75 V		.8 mm	70 °C (158 °F)	3 Dedicated Inputs, 32 I/O	3	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	77 MHz		32	260 °C (500 °F)	10 mm	No	32
ISPLSI1024-60LJI	Lattice Semiconductor	EE PLD	Industrial	No Lead	68	QCCJ	Square	Plastic/Epoxy	25 ns		Yes	5.5 V	96	CMOS				5	5 V	Chip Carrier	LDCC68,1.0SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 48 I/O	2	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-N68	3	4.57 mm	24.2316 mm	No	In-System Programmable; 4 External Clocks	e0	38 MHz	30 s		225 °C (437 °F)	24.2316 mm	No	48
ISPLSI2032E-110LT44	Lattice Semiconductor	EE PLD	Commercial	Gull Wing	44	LQFP	Square	Plastic/Epoxy	13 ns		Yes	5.25 V	32	CMOS				5	5 V	Flatpack, Low Profile	QFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.75 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 32 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.6 mm	10 mm	No	In-System Programmable	e0	77 MHz				10 mm	No	32
ISPLSI2032VE-180LTN44I	Lattice Semiconductor	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	32	CMOS				3.3	3.3 V	Flatpack, Thin Profile	QFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	118 MHz			260 °C (500 °F)	10 mm	No	32
ISPLSI2096A-100LTN128	Lattice Semiconductor	EE PLD	Commercial	Gull Wing	128	LFQFP	Square	Plastic/Epoxy	13 ns		Yes	5.25 V	96	CMOS				5	5 V	Flatpack, Low Profile, Fine Pitch	QFP128,.64SQ,16	Programmable Logic Devices	Yes	Macrocell	4.75 V		.4 mm	70 °C (158 °F)	3 Dedicated Inputs, 96 I/O	3	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G128	3	1.6 mm	14 mm	No		e3	77 MHz	40 s		260 °C (500 °F)	14 mm	No	96
LA4064V-75TN48E	Lattice Semiconductor	EE PLD	Automotive	Gull Wing	48	TFQFP	Square	Plastic/Epoxy	8 ns		Yes	3.6 V	64	CMOS	AEC-Q100	32		3.3	3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP48,.35SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G48	3	1.2 mm	7 mm	No		e3	168 MHz	40 s	32	260 °C (500 °F)	7 mm	Yes	32
LC4064V-75T44I	Lattice Semiconductor	EE PLD		Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	64			32	PAD-TYPE	3.3	3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V	83	.8 mm	105 °C (221 °F)	2 Dedicated Inputs, 30 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e0	111 MHz	30 s	30	240 °C (464 °F)	10 mm	Yes	30
LC4128V-10TN128I	Lattice Semiconductor	EE PLD		Gull Wing	128	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	128			96	PAD-TYPE	3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP128,.64SQ,16	Programmable Logic Devices	Yes	Macrocell	3 V	83	.4 mm	105 °C (221 °F)	4 Dedicated Inputs, 92 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G128	3	1.6 mm	14 mm	No		e3	86 MHz	40 s	92	260 °C (500 °F)	14 mm	Yes	92
LCMXO640C-3TN144I4W	Lattice Semiconductor	Flash PLD		Gull Wing	144	LFQFP	Square	Plastic/Epoxy	4.9 ns	640	Yes	3.465 V		CMOS		113		1.8	1.8/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.63SQ,20	Field Programmable Gate Arrays		Macrocell	1.71 V		.5 mm		7 Dedicated Inputs, 113 I/O	7		Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	It can also operate at 2.5 V and 3.3 V	e3	388 MHz	40 s	113	260 °C (500 °F)	20 mm		113
PALC16R4-30DMB	Cypress Semiconductor	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns		No	5.5 V		CMOS	38535Q/M;38534H;883B	16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Mixed	4.5 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	No	1 External Clock	e0	22 MHz		4		24.13 mm		4
PALCE16V8H-25PC/4	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns		No	5.25 V		CMOS		18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin/Lead	Dual	R-PDIP-T20		4.953 mm	7.62 mm	No		e0	37 MHz		8		26.1366 mm		8
XC2C512-10FTG256C	Xilinx	Flash PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns		Yes	1.9 V	512	CMOS		212	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	91 MHz	30 s	212	260 °C (500 °F)	17 mm	Yes	212
XC2C512-7FTG256I	Xilinx	Flash PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	512	CMOS		212	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	119 MHz	30 s	212	260 °C (500 °F)	17 mm	Yes	212
XC95288XL-7FG256C	Xilinx	Flash PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	288	CMOS		192		3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	125 MHz	30 s	192	225 °C (437 °F)	17 mm	Yes	192
XCR3512XL-10FT256C	Xilinx	EE PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	512	CMOS				3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	97 MHz	30 s		225 °C (437 °F)	17 mm	Yes	212
5962-8872404LA	Defense Logistics Agency	UV PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	20 ns		No	5.5 V		CMOS	MIL-STD-883			5		In-Line				Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No		e0	31.2 MHz				32 mm		10
5962-8983904RA	Defense Logistics Agency	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	10 ns		No	5.5 V		CMOS	MIL-STD-883			5		In-Line				Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 8 I/O	8	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	Yes	1 External Clock; Register Preload	e0	58.8 MHz				25.27 mm		8
5962-9061102XA	Defense Logistics Agency	UV PLD	Military	Through-Hole	28	DIP	Rectangular	Ceramic, Glass-Sealed			No			CMOS				5		In-Line				Macrocell				125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T28				Yes		e0
5M160ZM100I5N	Intel	Flash PLD	Industrial	Ball	100	TFBGA	Square	Plastic/Epoxy	14 ns		Yes	1.89 V	128	CMOS				1.8	1.2/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	100 °C (212 °F)	79 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B100		1.2 mm	6 mm	No		e1	118.3 MHz				6 mm	Yes	79
5M570ZM100C4N	Intel	Flash PLD	Other	Ball	100	TFBGA	Square	Plastic/Epoxy	9.5 ns		Yes	1.89 V	440	CMOS				1.8	1.8,1.2/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	74 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100		1.2 mm	6 mm	No		e1	184.1 MHz				6 mm	Yes	74
ATF16V8B-10PC	Atmel	Flash PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	10 ns		No	5.25 V		CMOS		18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20	1	5.334 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock	e0	68 MHz		8		25.908 mm		8
ATF750CL-15JC	Atmel	EE PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns		Yes	5.25 V	10	CMOS				5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28	2	4.572 mm	11.5062 mm	No		e0	44 MHz			225 °C (437 °F)	11.5062 mm	No	10
CY37064P100-125AXI	Cypress Semiconductor	EE PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	5.5 V	64	CMOS				5	3.3/5 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	4.5 V		.5 mm	85 °C (185 °F)	1 Dedicated Inputs, 69 I/O	1	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	64 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e4	83 MHz	40 s		260 °C (500 °F)	14 mm	Yes	69
CY39200V388-125MGC	Cypress Semiconductor	Loadable PLD	Commercial	Ball	388	BGA	Square	Plastic/Epoxy	10 ns		Yes	2.7 V	3072	CMOS				2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA388,26X26,50	Programmable Logic Devices	Yes	Macrocell	2.3 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 294 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B388		2.46 mm	35 mm	No	Also operates at 3.3 V nominal supply	e0					35 mm	Yes	294
CY7C342B-30RI	Cypress Semiconductor	UV PLD	Industrial	Pin/Peg	68	WPGA	Square	Ceramic, Metal-Sealed Cofired	60 ns		No	5.5 V	128	CMOS				5	5 V	Grid Array, Window	PGA68,11X11	Programmable Logic Devices	No	Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	7 Dedicated Inputs, 52 I/O	7	-40 °C (-40 °F)	Tin Lead	Perpendicular	S-CPGA-P68		5.08 mm	27.9527 mm	No	Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock	e0	27.7 MHz				27.9527 mm	No	52
CY7C343-35HI	Cypress Semiconductor	UV PLD	Industrial	J Bend	44	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	35 ns		Yes	5.5 V	64	CMOS				5	5 V	Chip Carrier, Window	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	7 Dedicated Inputs, 28 I/O	7	-40 °C (-40 °F)	Tin Lead	Quad	S-CQCC-J44		4.57 mm	16.51 mm	No	Labs interconnected by PIA; 4 Labs; 64 Macrocells; 1 External Clock; Shared Input/Clock	e0	22.2 MHz				16.51 mm	No	28
CY7C344-25WMB	Cypress Semiconductor	UV PLD	Military	Through-Hole	28	WDIP	Rectangular	Ceramic, Glass-Sealed	25 ns		No	5.5 V		CMOS	38535Q/M;38534H;883B	24	PAL-TYPE	5	5 V	In-Line, Window	DIP28,.3	Programmable Logic Devices		Macrocell	4.5 V	320	2.54 mm	125 °C (257 °F)	7 Dedicated Inputs, 16 I/O	7	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T28		5.08 mm	7.62 mm	No	Macrocells interconnected by PIA; 32 Macrocells; 1 External Clock; Shared Input/Clock	e0	33.3 MHz		16		37.0205 mm		16
CY7C373I-66JC	Cypress Semiconductor	Flash PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	20 ns		Yes	5.25 V	64	CMOS				5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	1 Dedicated Inputs, 64 I/O	1	0 °C (32 °F)	Tin/Lead	Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	In-system re-programmable; 64 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e0	50 MHz				29.3116 mm	No	64
EP1810GM883B	Altera	OT PLD	Military	Pin/Peg	68	PGA	Square	Ceramic	50 ns		No		48	CMOS	38535Q/M;38534H;883B			5	5 V	Grid Array	PGA68,11X11	Programmable Logic Devices	No				2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Perpendicular	S-XPGA-P68				No		e0				220 °C (428 °F)		No
EP1K100FC484-3N	Intel	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.7 ns	4992	Yes	2.625 V		CMOS		333		2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Mixed	2.375 V		1 mm	70 °C (158 °F)	333 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1			333		23 mm		333
EP1K100FI484-2N	Intel	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	0.5 ns	4992	Yes	2.625 V		CMOS		333		2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Mixed	2.375 V		1 mm	85 °C (185 °F)	333 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1	37.5 MHz		333		23 mm		333
EP1K10FC256-3	Intel	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.7 ns	576	Yes	2.625 V		CMOS		136		2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,50	Field Programmable Gate Arrays		Mixed	2.375 V		1 mm	70 °C (158 °F)	136 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0			136		17 mm		136
EP1K10QC208-3N	Intel	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	0.7 ns	576	Yes	2.625 V		CMOS		120		2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Mixed	2.375 V		.5 mm	70 °C (158 °F)	120 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3			120		28 mm		120

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.