SQUARE ATM/SONET/SDH Circuits 998

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Applications Surface Mount No. of Functions No. of Channels Technology Nominal Negative Supply Voltage Maximum Supply Current Nominal Supply Voltage Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Terminal Position Data Rate JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length

OQ2541BU

NXP Semiconductors

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

OTHER

NO LEAD

48

DIE

SQUARE

UNSPECIFIED

YES

1

-3.35 V

UNCASED CHIP

85 Cel

-10 Cel

UPPER

S-XUUC-N48

Not Qualified

OQ2541HP

NXP Semiconductors

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

SDH; SONET

YES

1

BIPOLAR

-3.3 V

155 mA

-4.5

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G48

1.6 mm

7 mm

Not Qualified

7 mm

TZA3017HW

NXP Semiconductors

ATM/SONET/SDH TRANSMITTER

INDUSTRIAL

GULL WING

100

HTFQFP

SQUARE

PLASTIC/EPOXY

SDH; SONET

YES

1

410 mA

3.3 V

3.3

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

HQFP100,.63SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

TIN

QUAD

S-PQFP-G100

1.2 mm

14 mm

Not Qualified

e3

14 mm

TZA3000HL

NXP Semiconductors

ATM/SONET/SDH RECEIVER

GULL WING

32

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

QUAD

S-PQFP-G32

1.6 mm

5 mm

Not Qualified

5 mm

TZA3019BV

NXP Semiconductors

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

BUTT

32

HVBCC

SQUARE

PLASTIC/EPOXY

YES

1

-3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

BOTTOM

S-PBCC-B32

.8 mm

5 mm

Not Qualified

5 mm

TZA3004HL/C3

NXP Semiconductors

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

-3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G48

1.6 mm

7 mm

Not Qualified

7 mm

PXB4360F

Infineon Technologies

ATM/SONET/SDH SUPPORT CIRCUIT

COMMERCIAL

GULL WING

144

LFQFP

SQUARE

PLASTIC/EPOXY

ATM

YES

1

CMOS

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

S-PQFP-G144

1.6 mm

20 mm

Not Qualified

e0

20 mm

PXB4220EV34

Infineon Technologies

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY

1.27 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B256

2.13 mm

27 mm

27 mm

CDR3300-00

Infineon Technologies

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

BIPOLAR

-5 V

.35 mA

-5

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

ATM/SONET/SDH ICs

.5 mm

TIN LEAD

QUAD

S-PQFP-G100

1.6 mm

14 mm

Not Qualified

e0

14 mm

PXB4221

Infineon Technologies

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

ATM

YES

1

CMOS

.47 mA

3.3 V

3.3

GRID ARRAY

QFP256,1.2SQ,16

ATM/SONET/SDH ICs

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B256

27 mm

Not Qualified

e0

27 mm

PXB4240

Infineon Technologies

ATM/SONET/SDH TRANSCEIVER

COMMERCIAL

GULL WING

160

QFP

SQUARE

PLASTIC/EPOXY

YES

CMOS

3.3 V

3.3

FLATPACK

QFP160,1.2SQ

ATM/SONET/SDH ICs

.635 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

S-PQFP-G160

Not Qualified

e0

PXB4219

Infineon Technologies

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

ATM

YES

1

CMOS

.7 mA

3.3 V

3.3

GRID ARRAY

BGA256,20X20,50

ATM/SONET/SDH ICs

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B256

2.13 mm

27 mm

Not Qualified

e0

27 mm

PXB4225

Infineon Technologies

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

BALL

388

HBGA

SQUARE

PLASTIC/EPOXY

ATM

YES

1

CMOS

1000 mA

1.8 V

1.8,3.3

GRID ARRAY, HEAT SINK/SLUG

BGA388,26X26,50

ATM/SONET/SDH ICs

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B388

2.54 mm

35 mm

Not Qualified

e0

35 mm

PXB4330E

Infineon Technologies

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

BALL

352

HLBGA

SQUARE

PLASTIC/EPOXY

ATM

YES

1

CMOS

3.3 V

3.3

GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE

BGA352,26X26,50

ATM/SONET/SDH ICs

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B352

1.58 mm

35 mm

Not Qualified

e0

35 mm

PXB4310

Infineon Technologies

ATM/SONET/SDH SWITCHING CIRCUIT

COMMERCIAL

BALL

352

BGA

SQUARE

PLASTIC/EPOXY

ATM

YES

1

CMOS

3.3 V

3.3

GRID ARRAY

BGA352,26X26,50

ATM/SONET/SDH ICs

1.27 mm

70 Cel

0 Cel

BOTTOM

S-PBGA-B352

Not Qualified

PXB43201

Infineon Technologies

ATM/SONET/SDH SUPPORT CIRCUIT

BALL

342

BGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY

BOTTOM

S-PBGA-B342

Not Qualified

PXB4219E

Infineon Technologies

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

ATM; SDH

YES

1

CMOS

.7 mA

3.3 V

3.3

GRID ARRAY

BGA256,20X20,50

ATM/SONET/SDH ICs

1.27 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B256

2.13 mm

27 mm

Not Qualified

27 mm

PEF3460E

Infineon Technologies

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

BALL

272

BGA

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

CMOS

1.8 V

1.8,3.3

GRID ARRAY

BGA272,20X20,50

Digital Transmission Interfaces

1.27 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B272

2.54 mm

27 mm

Not Qualified

27 mm

PXB4260

Infineon Technologies

ATM/SONET/SDH SUPPORT CIRCUIT

COMMERCIAL

BALL

272

BGA

SQUARE

PLASTIC/EPOXY

ATM

YES

1

CMOS

2.5 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B272

27 mm

Not Qualified

e0

27 mm

FOA3251B1

Infineon Technologies

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

BIPOLAR

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQFP-G48

1.6 mm

7 mm

Not Qualified

e0

7 mm

PXB4220EV33

Infineon Technologies

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY

1.27 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B256

2.13 mm

27 mm

27 mm

PXB4340E

Infineon Technologies

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

BALL

352

BGA

SQUARE

PLASTIC/EPOXY

ATM

YES

1

CMOS

3.3 V

3.3

GRID ARRAY

BGA352,26X26,50

ATM/SONET/SDH ICs

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B352

2.5 mm

35 mm

Not Qualified

e0

35 mm

PXB4350E

Infineon Technologies

ATM/SONET/SDH SWITCHING CIRCUIT

INDUSTRIAL

BALL

456

BGA

SQUARE

PLASTIC/EPOXY

ATM

YES

1

CMOS

3.3 V

3.3

GRID ARRAY

BGA456,26X26,50

ATM/SONET/SDH ICs

1.27 mm

85 Cel

-45 Cel

TIN LEAD

BOTTOM

S-PBGA-B456

2.5 mm

35 mm

Not Qualified

e0

35 mm

PXB4110

Infineon Technologies

ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE

INDUSTRIAL

GULL WING

208

FQFP

SQUARE

PLASTIC/EPOXY

ATM

YES

1

CMOS

3.3 V

3.3,5

FLATPACK, FINE PITCH

QFP208,1.2SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQFP-G208

4.1 mm

28 mm

Not Qualified

e0

28 mm

PXB4221E

Infineon Technologies

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

ATM; SDH

YES

1

CMOS

.7 mA

3.3 V

3.3

GRID ARRAY

BGA256,20X20,50

ATM/SONET/SDH ICs

1.27 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B256

2.13 mm

27 mm

Not Qualified

27 mm

PXB43202

Infineon Technologies

ATM/SONET/SDH SUPPORT CIRCUIT

BALL

342

BGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY

BOTTOM

S-PBGA-B342

Not Qualified

PXB4325E

Infineon Technologies

ATM/SONET/SDH SWITCHING CIRCUIT

COMMERCIAL

BALL

352

BGA

SQUARE

PLASTIC/EPOXY

ATM

YES

1

CMOS

3.3 V

3.3

GRID ARRAY

BGA352,26X26,50

ATM/SONET/SDH ICs

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B352

2.5 mm

35 mm

Not Qualified

e0

35 mm

PXF4225

Infineon Technologies

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

BALL

388

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

1.27 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B388

2.54 mm

35 mm

Not Qualified

35 mm

PXF4336E

Infineon Technologies

INDUSTRIAL

BALL

456

BGA

SQUARE

PLASTIC/EPOXY

YES

1.8,3.3

GRID ARRAY

BGA456,26X26,50

ATM/SONET/SDH ICs

1.27 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B456

Not Qualified

PXB4220

Infineon Technologies

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

ATM

YES

1

CMOS

.47 mA

3.3 V

3.3

GRID ARRAY

BGA256,20X20,50

ATM/SONET/SDH ICs

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B256

27 mm

Not Qualified

e0

27 mm

PXB4220E

Infineon Technologies

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

ATM; SDH

YES

1

CMOS

.7 mA

3.3 V

3.3

GRID ARRAY

BGA256,20X20,50

ATM/SONET/SDH ICs

1.27 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B256

2.13 mm

27 mm

Not Qualified

27 mm

PXB4350

Infineon Technologies

ATM/SONET/SDH SWITCHING CIRCUIT

COMMERCIAL

BALL

456

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

BOTTOM

S-PBGA-B456

2.5 mm

35 mm

Not Qualified

35 mm

PXB4330

Infineon Technologies

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

BALL

456

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

1.27 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B456

2.5 mm

35 mm

Not Qualified

35 mm

PXF4222

Infineon Technologies

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

BALL

388

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

1.27 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B388

2.54 mm

35 mm

Not Qualified

35 mm

CYS25G0101DX-ATXC

Infineon Technologies

ATM/SONET/SDH TRANSCEIVER

COMMERCIAL

GULL WING

120

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

3.3 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

.4 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQFP-G120

3

1.6 mm

14 mm

Not Qualified

e3

30

260

14 mm

CYCB9532-AC

Infineon Technologies

ATM/SONET/SDH TRANSCEIVER

COMMERCIAL

GULL WING

120

QFP

SQUARE

PLASTIC/EPOXY

YES

BICMOS

400 mA

1.5,3.3

FLATPACK

QFP120,.63SQ,16

ATM/SONET/SDH ICs

.4 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

S-PQFP-G120

Not Qualified

e0

CYS25G0101DX-BBI

Infineon Technologies

ATM/SONET/SDH TRANSCEIVER

INDUSTRIAL

BALL

100

BGA

SQUARE

PLASTIC/EPOXY

YES

BICMOS

1.5,3.3

GRID ARRAY

BGA100,10X10,40

ATM/SONET/SDH ICs

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B100

Not Qualified

CYS25G0101DX-BBC

Infineon Technologies

ATM/SONET/SDH TRANSCEIVER

COMMERCIAL

BALL

100

BGA

SQUARE

PLASTIC/EPOXY

YES

BICMOS

1.5,3.3

GRID ARRAY

BGA100,10X10,40

ATM/SONET/SDH ICs

1 mm

70 Cel

0 Cel

BOTTOM

S-PBGA-B100

Not Qualified

P12EQX3232AZDEX

Diodes Incorporated

ATM/SONET/SDH TRANSMITTER

COMMERCIAL

NO LEAD

48

QCCN

SQUARE

PLASTIC/EPOXY

YES

1.8 V

1.8

CHIP CARRIER

LCC48,.27SQ,20

ATM/SONET/SDH ICs

.5 mm

70 Cel

0 Cel

QUAD

S-PQCC-N48

Not Qualified

P12EQX3232BZDE

Diodes Incorporated

ATM/SONET/SDH TRANSMITTER

COMMERCIAL

NO LEAD

48

QCCN

SQUARE

PLASTIC/EPOXY

YES

1.8 V

1.8

CHIP CARRIER

LCC48,.27SQ,20

ATM/SONET/SDH ICs

.5 mm

70 Cel

0 Cel

QUAD

S-PQCC-N48

Not Qualified

P12EQX3232AZDE

Diodes Incorporated

ATM/SONET/SDH TRANSMITTER

COMMERCIAL

NO LEAD

48

QCCN

SQUARE

PLASTIC/EPOXY

YES

1.8 V

1.8

CHIP CARRIER

LCC48,.27SQ,20

ATM/SONET/SDH ICs

.5 mm

70 Cel

0 Cel

QUAD

S-PQCC-N48

Not Qualified

DS3102GN

Maxim Integrated

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

BALL

81

LBGA

SQUARE

PLASTIC/EPOXY

SDH; SONET

YES

1

.192 mA

1.8 V

1.8,3.3

GRID ARRAY, LOW PROFILE

BGA81,9X9,40

Other Telecom ICs

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B81

3

1.48 mm

10 mm

Not Qualified

10 mm

DS3182N

Maxim Integrated

ATM/SONET/SDH NETWORK INTERFACE

INDUSTRIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

.448 mA

3.3 V

3.3

GRID ARRAY

BGA400,20X20,50

ATM/SONET/SDH ICs

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B400

2.54 mm

27 mm

Not Qualified

e0

27 mm

DS3163N

Maxim Integrated

ATM/SONET/SDH NETWORK INTERFACE

INDUSTRIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

.381 mA

3.3 V

3.3

GRID ARRAY

BGA400,20X20,50

ATM/SONET/SDH ICs

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B400

2.54 mm

27 mm

Not Qualified

e0

27 mm

DS3162

Maxim Integrated

ATM/SONET/SDH NETWORK INTERFACE

COMMERCIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

.3 mA

3.3 V

3.3

GRID ARRAY

BGA400,20X20,50

ATM/SONET/SDH ICs

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B400

2.54 mm

27 mm

Not Qualified

e0

27 mm

DS26102

Maxim Integrated

ATM/SONET/SDH NETWORK INTERFACE

INDUSTRIAL

BALL

256

LBGA

SQUARE

PLASTIC/EPOXY

ATM

YES

1

3.3 V

GRID ARRAY, LOW PROFILE

1 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B256

1.5 mm

17 mm

Not Qualified

e0

17 mm

DS3168N

Maxim Integrated

ATM/SONET/SDH TRANSCEIVER

INDUSTRIAL

BALL

676

BGA

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

1.8 V

GRID ARRAY

1 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B676

2.41 mm

27 mm

Not Qualified

e0

27 mm

DS3164N

Maxim Integrated

ATM/SONET/SDH NETWORK INTERFACE

INDUSTRIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

.468 mA

3.3 V

3.3

GRID ARRAY

BGA400,20X20,50

ATM/SONET/SDH ICs

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B400

2.54 mm

27 mm

Not Qualified

e0

27 mm

ATM/SONET/SDH Circuits

ATM (Asynchronous Transfer Mode), SONET (Synchronous Optical Network), and SDH (Synchronous Digital Hierarchy) circuits are high-speed communication technologies used in telecommunications networks.

ATM is a cell-based network technology that enables high-speed data transfer, video and voice communication. It divides data into fixed-size cells and sends them across the network using time-division multiplexing (TDM).

SONET and SDH are both standard protocols for optical telecommunications transport. They use synchronous timing signals to enable high-speed communication over fiber optic networks. SONET is used primarily in North America, while SDH is used primarily in Europe and other regions.

ATM, SONET, and SDH circuits offer several advantages over other communication technologies. They provide high-speed communication with low latency, allowing for efficient data transfer and real-time voice and video communication. They also provide a high level of reliability and fault tolerance, making them ideal for use in mission-critical applications such as banking, healthcare, and defense.

However, these circuits also require specialized hardware and software, and can be more expensive to implement and maintain than other communication technologies. They also require a high level of expertise to configure and manage.