SQUARE ATM/SONET/SDH Circuits 998

Reset All
Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Applications Surface Mount No. of Functions No. of Channels Technology Nominal Negative Supply Voltage Maximum Supply Current Nominal Supply Voltage Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Terminal Position Data Rate JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length

DS3182+

Maxim Integrated

ATM/SONET/SDH NETWORK INTERFACE

COMMERCIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B400

3

2.54 mm

27 mm

Not Qualified

e1

27 mm

DS3177N+

Maxim Integrated

ATM/SONET/SDH TRANSCEIVER

INDUSTRIAL

BALL

100

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY, LOW PROFILE

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B100

3

1.5 mm

11 mm

11 mm

DS3181N

Maxim Integrated

ATM/SONET/SDH NETWORK INTERFACE

INDUSTRIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

.28 mA

3.3 V

3.3

GRID ARRAY

BGA400,20X20,50

ATM/SONET/SDH ICs

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B400

2.54 mm

27 mm

Not Qualified

e0

27 mm

DS3184N+

Maxim Integrated

ATM/SONET/SDH NETWORK INTERFACE

INDUSTRIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

.85 mA

3.3 V

3.3

GRID ARRAY

BGA400,20X20,50

ATM/SONET/SDH ICs

1.27 mm

85 Cel

-40 Cel

MATTE TIN

BOTTOM

S-PBGA-B400

3

2.54 mm

27 mm

Not Qualified

e3

27 mm

DS3100GN#

Maxim Integrated

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B256

1.77 mm

17 mm

Not Qualified

17 mm

DS31408GN+

Maxim Integrated

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

85 Cel

-40 Cel

BOTTOM

S-PBGA-B256

NOT SPECIFIED

NOT SPECIFIED

DS3101GN+

Maxim Integrated

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

BALL

256

LBGA

SQUARE

PLASTIC/EPOXY

SDH; SONET

YES

1

.12 mA

1.8 V

1.8,3.3

GRID ARRAY, LOW PROFILE

BGA256,16X16,40

Other Telecom ICs

1 mm

85 Cel

-40 Cel

MATTE TIN

BOTTOM

S-PBGA-B256

3

1.26 mm

17 mm

Not Qualified

e3

17 mm

DS3164

Maxim Integrated

ATM/SONET/SDH NETWORK INTERFACE

COMMERCIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

.468 mA

3.3 V

3.3

GRID ARRAY

BGA400,20X20,50

ATM/SONET/SDH ICs

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B400

2.54 mm

27 mm

Not Qualified

e0

27 mm

MAX3881ECB-TD

Maxim Integrated

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

INDUSTRIAL

GULL WING

64

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

3.3 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQFP-G64

3

1.2 mm

10 mm

Not Qualified

e0

10 mm

MAX3272AEGP

Maxim Integrated

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

ATM; SDH; SONET

YES

1

BIPOLAR

.044 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC20,.16SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N20

1

1 mm

4 mm

Not Qualified

e0

4 mm

MAX3876EHJ-T

Maxim Integrated

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

INDUSTRIAL

GULL WING

32

TFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQFP-G32

1

1.2 mm

5 mm

Not Qualified

e0

5 mm

MAX3872EGJ-T

Maxim Integrated

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

SDH; SONET

YES

1

BIPOLAR

.215 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N32

1

1 mm

5 mm

Not Qualified

e0

5 mm

MAX3886ETN+

Maxim Integrated

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

SONET

YES

1

BICMOS

310 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC56,.31SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N56

3

.8 mm

8 mm

Not Qualified

e3

30

260

8 mm

MAX3691ECJ

Maxim Integrated

ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER

INDUSTRIAL

GULL WING

32

LQFP

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

BIPOLAR

100 mA

3.3 V

3.3

FLATPACK, LOW PROFILE

QFP32,.35SQ,32

ATM/SONET/SDH ICs

.8 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQFP-G32

1

1.6 mm

7 mm

Not Qualified

e0

7 mm

MAX3748HETE#G16

Maxim Integrated

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

ATM; SONET

YES

1

BIPOLAR

.049 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.12SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N16

1

.8 mm

3 mm

Not Qualified

e3

3 mm

MAX3664EUA

Maxim Integrated

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

SDH; SONET

YES

1

.035 mA

3.3 V

3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e0

3 mm

MAX3874AEGJ

Maxim Integrated

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

SDH; SONET

YES

1

BIPOLAR

.215 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N32

1

1 mm

5 mm

Not Qualified

e0

245

5 mm

MAX3861E/D

Maxim Integrated

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

32

DIE

SQUARE

UNSPECIFIED

YES

1

BIPOLAR

3.3 V

UNCASED CHIP

85 Cel

-40 Cel

TIN LEAD

UPPER

S-XUUC-N32

Not Qualified

e0

MAX3890ECB+D

Maxim Integrated

ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER

INDUSTRIAL

GULL WING

64

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN

QUAD

S-PQFP-G64

3

1.2 mm

10 mm

Not Qualified

e3

10 mm

MAX3260C/D

Maxim Integrated

ATM/SONET/SDH SUPPORT CIRCUIT

OTHER

NO LEAD

14

DIE

SQUARE

UNSPECIFIED

SDH; SONET

YES

1

BIPOLAR

.07 mA

5 V

5

UNCASED CHIP

DIE OR CHIP

Other Telecom ICs

100 Cel

0 Cel

TIN LEAD

UPPER

S-XUUC-N14

1

Not Qualified

e0

MAX3885ECB-TD

Maxim Integrated

ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

SDH; SONET

YES

1

.28 mA

3.3 V

3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQFP-G64

3

1.6 mm

10 mm

Not Qualified

e0

10 mm

MAX3873EGP-T

Maxim Integrated

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

INDUSTRIAL

NO LEAD

20

VQCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

1

BICMOS

3.3 V

CHIP CARRIER, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-CQCC-N20

1

1 mm

4 mm

Not Qualified

e0

4 mm

MAX3892EGH-D

Maxim Integrated

ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER

INDUSTRIAL

NO LEAD

44

HVQCCN

SQUARE

UNSPECIFIED

SDH; SONET

YES

1

BIPOLAR

.19 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC44,.28SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N44

1

.9 mm

7 mm

Not Qualified

e0

7 mm

MAX3885ECB

Maxim Integrated

ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER

INDUSTRIAL

GULL WING

64

TFQFP

SQUARE

PLASTIC/EPOXY

SDH; SONET

YES

1

BIPOLAR

.28 mA

3.3 V

3.3

FLATPACK, THIN PROFILE, FINE PITCH

QFP64,.47SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQFP-G64

1

1.2 mm

10 mm

Not Qualified

e0

10 mm

MAX3861ETG+

Maxim Integrated

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

ATM; SONET

YES

1

BIPOLAR

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N24

1

.8 mm

4 mm

Not Qualified

e3

30

260

4 mm

MAX3831UCB-D

Maxim Integrated

ATM/SONET/SDH MUX/DEMUX

OTHER

GULL WING

64

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

0 Cel

TIN LEAD

QUAD

S-PQFP-G64

3

1.2 mm

10 mm

Not Qualified

e0

10 mm

MAX3746HETE

Maxim Integrated

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

ATM; SONET

YES

1

BIPOLAR

.0415 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.12SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N16

1

.8 mm

3 mm

Not Qualified

e0

3 mm

MAX3882AETX+T

Maxim Integrated

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

INDUSTRIAL

NO LEAD

36

HVQCCN

SQUARE

UNSPECIFIED

SDH; SONET

YES

1

.23 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC36,.25SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N36

1

.8 mm

6 mm

Not Qualified

e3

30

260

6 mm

MAX3747EUB

Maxim Integrated

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

10

SON

SQUARE

PLASTIC/EPOXY

SONET

YES

1

BIPOLAR

.035 mA

3.3 V

3.3

SMALL OUTLINE

TSSOP10,.19,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

S-PDSO-N10

1

.8 mm

3 mm

Not Qualified

e0

245

3 mm

MAX3950EGK-D

Maxim Integrated

ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

SDH; SONET

YES

1

BIPOLAR

.35 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC68,.4SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N68

3

.9 mm

10 mm

Not Qualified

e0

10 mm

MAX3877EHJ

Maxim Integrated

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

INDUSTRIAL

GULL WING

32

TFQFP

SQUARE

PLASTIC/EPOXY

SDH; SONET

YES

1

BIPOLAR

3.3 V

FLATPACK, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQFP-G32

1

1.2 mm

5 mm

Not Qualified

e0

5 mm

MAX3831UCB

Maxim Integrated

ATM/SONET/SDH MUX/DEMUX

OTHER

GULL WING

64

HTFQFP

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

3.3 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

0 Cel

TIN LEAD

QUAD

S-PQFP-G64

1

1.2 mm

10 mm

Not Qualified

e0

10 mm

MAX3891ECB-TD

Maxim Integrated

ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER

INDUSTRIAL

GULL WING

64

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

3.3 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQFP-G64

3

1.2 mm

10 mm

Not Qualified

e0

10 mm

MAX3964AETP-T

Maxim Integrated

INDUSTRIAL

NO LEAD

20

QCCN

SQUARE

PLASTIC/EPOXY

YES

1

.045 mA

3.3/5

CHIP CARRIER

LCC20,.16SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

QUAD

S-PQCC-N20

Not Qualified

e0

MAX3861EGG-T

Maxim Integrated

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

ATM; SONET

YES

1

BIPOLAR

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N24

1

1 mm

4 mm

Not Qualified

e0

4 mm

MAX3748ETE-T

Maxim Integrated

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

ATM; SONET

YES

1

BIPOLAR

.049 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.12SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N16

1

.8 mm

3 mm

Not Qualified

e0

245

3 mm

MAX3861ETG+T

Maxim Integrated

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

ATM; SONET

YES

1

BIPOLAR

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N24

1

.8 mm

4 mm

Not Qualified

e3

30

260

4 mm

MAX3880ECB+TD

Maxim Integrated

ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER

INDUSTRIAL

GULL WING

64

HTFQFP

SQUARE

PLASTIC/EPOXY

SDH; SONET

YES

1

.38 mA

3.3 V

3.3

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP64,.47SQ

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G64

3

1.2 mm

10 mm

Not Qualified

e3

10 mm

MAX3875AEHJ

Maxim Integrated

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

INDUSTRIAL

GULL WING

32

QFP

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

167 mA

3.3 V

3.3/5

FLATPACK

TQFP32,.28SQ

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQFP-G32

1

Not Qualified

e0

MAX3746ETE

Maxim Integrated

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

ATM; SONET

YES

1

BIPOLAR

.0415 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.12SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N16

1

.8 mm

3 mm

Not Qualified

e0

245

3 mm

MAX3941ETG

Maxim Integrated

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

24

QCCN

SQUARE

UNSPECIFIED

SDH; SONET

YES

1

BIPOLAR

-5.2 V

CHIP CARRIER

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N24

1

Not Qualified

e0

MAX3832UCB-T

Maxim Integrated

ATM/SONET/SDH MUX/DEMUX

OTHER

GULL WING

64

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

0 Cel

TIN LEAD

QUAD

S-PQFP-G64

3

1.2 mm

10 mm

Not Qualified

e0

10 mm

MAX3748HETE-T

Maxim Integrated

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

ATM; SONET

YES

1

BIPOLAR

.049 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.12SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N16

.8 mm

3 mm

Not Qualified

e0

3 mm

MAX3822UCM+T

Maxim Integrated

ATM/SONET/SDH SUPPORT CIRCUIT

OTHER

GULL WING

48

HTFQFP

SQUARE

PLASTIC/EPOXY

ATM

YES

1

BIPOLAR

3.3 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

0 Cel

MATTE TIN

QUAD

S-PQFP-G48

1

1.2 mm

7 mm

Not Qualified

e3

7 mm

MAX3880ECB-TD

Maxim Integrated

ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER

INDUSTRIAL

GULL WING

64

HTFQFP

SQUARE

PLASTIC/EPOXY

SDH; SONET

YES

1

.38 mA

3.3 V

3.3

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP64,.47SQ

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQFP-G64

3

1.2 mm

10 mm

Not Qualified

e0

10 mm

MAX3872AETJ+T

Maxim Integrated

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BIPOLAR

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

1

1 mm

5 mm

e3

30

260

5 mm

MAX3693ECJ+

Maxim Integrated

ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER

INDUSTRIAL

GULL WING

32

LQFP

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

BIPOLAR

.1 mA

3.3 V

3.3

FLATPACK, LOW PROFILE

QFP32,.35SQ,32

ATM/SONET/SDH ICs

.8 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G32

1

1.6 mm

7 mm

Not Qualified

e3

30

260

7 mm

MAX3992UTG+T

Maxim Integrated

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

OTHER

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

SDH; SONET

YES

1

BIPOLAR

.145 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

0 Cel

MATTE TIN

QUAD

S-XQCC-N24

1

.8 mm

4 mm

Not Qualified

e3

4 mm

ATM/SONET/SDH Circuits

ATM (Asynchronous Transfer Mode), SONET (Synchronous Optical Network), and SDH (Synchronous Digital Hierarchy) circuits are high-speed communication technologies used in telecommunications networks.

ATM is a cell-based network technology that enables high-speed data transfer, video and voice communication. It divides data into fixed-size cells and sends them across the network using time-division multiplexing (TDM).

SONET and SDH are both standard protocols for optical telecommunications transport. They use synchronous timing signals to enable high-speed communication over fiber optic networks. SONET is used primarily in North America, while SDH is used primarily in Europe and other regions.

ATM, SONET, and SDH circuits offer several advantages over other communication technologies. They provide high-speed communication with low latency, allowing for efficient data transfer and real-time voice and video communication. They also provide a high level of reliability and fault tolerance, making them ideal for use in mission-critical applications such as banking, healthcare, and defense.

However, these circuits also require specialized hardware and software, and can be more expensive to implement and maintain than other communication technologies. They also require a high level of expertise to configure and manage.