SQUARE ATM/SONET/SDH Circuits 998

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Applications	Surface Mount	No. of Functions	Technology	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MARS10G-TD-PRO	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	1724	HBGA	SQUARE	PLASTIC/EPOXY		YES	1				1.5 V		GRID ARRAY, HEAT SINK/SLUG			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B1724	3.22 mm	45 mm	Not Qualified	e0	30	225	45 mm
T-8208---BAL2-DT	Broadcom	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY		YES	1				3.3 V	3.3	GRID ARRAY	BGA272,20X20,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B272	2.54 mm	27 mm	Not Qualified	e0	30	225	27 mm
HDMP-3001	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	GULL WING	160	QFP	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1	CMOS			1.8 V		FLATPACK			.65 mm	85 Cel	0 Cel		QUAD	S-PQFP-G160	4.1 mm	28 mm	Not Qualified				28 mm
TMXE846221BL-3	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	909	BGA	SQUARE	PLASTIC/EPOXY		YES	1	CMOS			1.5 V	1.5,3.3	GRID ARRAY	BGA909,34X34,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B909	2.51 mm	35 mm	Not Qualified	e0	30	225	35 mm
TMXL336251BL-21	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	1152	BGA	SQUARE	PLASTIC/EPOXY		YES	1	CMOS			1.5 V	1.5,3.3	GRID ARRAY	BGA1152,34X34,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B1152	2.51 mm	45 mm	Not Qualified	e0	30	225	45 mm
LG1626DXC	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT		GULL WING	24	QFP	SQUARE	UNSPECIFIED		YES	1		-5.2 V				FLATPACK			.8 mm			TIN LEAD	QUAD	S-XQFP-G24	2.0828 mm	7 mm	Not Qualified	e0	30	240	7 mm
ORT8850L-2BA352I	Broadcom	ATM/SONET/SDH TRANSCEIVER	INDUSTRIAL	BALL	352	BGA	SQUARE	PLASTIC/EPOXY		YES	1				1.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B352	2.51 mm	35 mm	Not Qualified	e0	30	225	35 mm
LUC4AB01	Broadcom	ATM/SONET/SDH SWITCHING CIRCUIT		BALL	352	BGA	SQUARE	PLASTIC/EPOXY		YES	1	CMOS			3.3 V		GRID ARRAY						TIN LEAD	BOTTOM	S-PBGA-B352			Not Qualified	e0	30	225
ORT8850H-1BM680I	Broadcom	ATM/SONET/SDH TRANSCEIVER	INDUSTRIAL	BALL	680	BGA	SQUARE	PLASTIC/EPOXY		YES	1				1.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B680	2.51 mm	35 mm	Not Qualified	e0	30	225	35 mm
BCM8152CIFB	Broadcom	ATM/SONET/SDH TRANSCEIVER		BALL	301		SQUARE	PLASTIC/EPOXY	SONET;SDH	YES	1	CMOS			1.8 V									BOTTOM	S-PBGA-B301
TTSV02622V2-DB	Broadcom	ATM/SONET/SDH TRANSCEIVER	AUTOMOTIVE	BALL	272	BGA	SQUARE	PLASTIC/EPOXY		YES	1				3.3 V		GRID ARRAY			1.27 mm	125 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B272	2.32 mm	27 mm	Not Qualified	e0	30	225	27 mm
AGRBS1G25	Broadcom	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	OTHER	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY		YES	1				3.3 V		FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	80 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G48	1.2 mm	7 mm	Not Qualified	e0	NOT SPECIFIED	NOT SPECIFIED	7 mm
4565B2	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	909	BGA	SQUARE	PLASTIC/EPOXY		YES	1				1.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B909	2.51 mm	35 mm	Not Qualified	e0	30	225	35 mm
L-TMXE846221BL-3	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	909	BGA	SQUARE	PLASTIC/EPOXY		YES	1	CMOS			1.5 V	1.5,3.3	GRID ARRAY	BGA909,34X34,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B909	2.51 mm	35 mm	Not Qualified	e1			35 mm
LUC4AC01	Broadcom	ATM/SONET/SDH SWITCHING CIRCUIT		BALL	352	BGA	SQUARE	PLASTIC/EPOXY		YES	1	CMOS			3.3 V		GRID ARRAY						TIN LEAD	BOTTOM	S-PBGA-B352			Not Qualified	e0	30	225
TSYN03622	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	208	BGA	SQUARE	PLASTIC/EPOXY		YES	1				3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B208	2.12 mm	17 mm	Not Qualified	e0	30	225	17 mm
TMXF281553BAL-C2-DB	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	456	BGA	SQUARE	PLASTIC/EPOXY		YES	1				3.3 V	3.3	GRID ARRAY	BGA456,26X26,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B456	2.54 mm	35 mm	Not Qualified	e0	30	225	35 mm
TSOT1610GP	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	1724	HBGA	SQUARE	PLASTIC/EPOXY		YES	1				1.5 V		GRID ARRAY, HEAT SINK/SLUG			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B1724	3.22 mm	45 mm	Not Qualified	e0	30	225	45 mm
TMXA846221BL-3	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	909	BGA	SQUARE	PLASTIC/EPOXY		YES	1				1.5 V	1.5,3.3	GRID ARRAY	BGA909,34X34,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B909	2.51 mm	35 mm	Not Qualified	e0	30	225	35 mm
TDAT04622-3BLL3-DB	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	600	BGA	SQUARE	PLASTIC/EPOXY		YES	1	CMOS			3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B600	3.05 mm	45 mm	Not Qualified	e0	30	225	45 mm
TSOT1610GPD	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	1724	HBGA	SQUARE	PLASTIC/EPOXY		YES	1				1.5 V		GRID ARRAY, HEAT SINK/SLUG			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B1724	3.22 mm	45 mm	Not Qualified	e0	30	225	45 mm
L64360	Broadcom	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE	COMMERCIAL	GULL WING	208	QFP	SQUARE	PLASTIC/EPOXY		YES				750 mA	5 V	5	FLATPACK	QFP208,1.2SQ,20	ATM/SONET/SDH ICs	.5 mm	50 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQFP-G208			Not Qualified	e0
TDAT04622LT-3BAL3-DB	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	680	BGA	SQUARE	PLASTIC/EPOXY		YES	1	CMOS			3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B680	2.51 mm	35 mm	Not Qualified	e0	NOT SPECIFIED	NOT SPECIFIED	35 mm
TMXF281553BAL-2-DB	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	456	BGA	SQUARE	PLASTIC/EPOXY		YES	1				3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B456	2.54 mm	35 mm	Not Qualified	e0	30	225	35 mm
MTMXF846221BL-1	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	700	BGA	SQUARE	PLASTIC/EPOXY		YES	1				1.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B700	2.51 mm	35 mm	Not Qualified	e0	30	225	35 mm
TMXL28155BAL-1	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	456	BGA	SQUARE	PLASTIC/EPOXY		YES	1				3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B456	2.54 mm	35 mm	Not Qualified	e0	30	225	35 mm
TDAT042G51A-3BLL3-DB	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	600	BGA	SQUARE	PLASTIC/EPOXY		YES	1	CMOS			3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B600	3.05 mm	45 mm	Not Qualified	e0	30	225	45 mm
BCM8152	Broadcom	ATM/SONET/SDH TRANSCEIVER		BALL	301	BGA	SQUARE	PLASTIC/EPOXY		YES	1	CMOS			1.8 V		GRID ARRAY							BOTTOM	S-PBGA-B301			Not Qualified
TRCV0110G	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	BALL	177	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	1				3.3 V		GRID ARRAY			1 mm	85 Cel	0 Cel	TIN LEAD	BOTTOM	S-CBGA-B177	1.961 mm	14 mm	Not Qualified	e0	30	240	14 mm
TRCV0111G-3-XE-DB	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	BALL	177	BGA	SQUARE	PLASTIC/EPOXY		YES	1				3.3 V		GRID ARRAY			1 mm	85 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B177	1.74 mm	14 mm	Not Qualified	e0	30	240	14 mm
BCM8128	Broadcom	ATM/SONET/SDH MUX/DEMUX		BALL	127	BGA	SQUARE	PLASTIC/EPOXY		YES	1	CMOS			1.8 V		GRID ARRAY							BOTTOM	S-PBGA-B127			Not Qualified
TMXF336251BL-21	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	1152	BGA	SQUARE	PLASTIC/EPOXY		YES	1	CMOS			1.5 V	1.5,3.3	GRID ARRAY	BGA1152,34X34,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B1152	2.51 mm	45 mm	Not Qualified	e0	30	225	45 mm
TSYN01622	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	208	BGA	SQUARE	PLASTIC/EPOXY		YES	1				3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B208	2.12 mm	17 mm	Not Qualified	e0	30	225	17 mm
TDAT021G21A-3BLL3-DB	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	600	BGA	SQUARE	PLASTIC/EPOXY		YES	1	CMOS			3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B600	3.05 mm	45 mm	Not Qualified	e0	30	225	45 mm
BCM8125	Broadcom	ATM/SONET/SDH MUX/DEMUX		BALL	127	BGA	SQUARE	PLASTIC/EPOXY		YES	1	CMOS			1.8 V		GRID ARRAY							BOTTOM	S-PBGA-B127			Not Qualified
MARS2G5-P-VC-XTRM	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	1605	BGA	SQUARE	PLASTIC/EPOXY		YES	1				1 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B1605	3.42 mm	42.5 mm	Not Qualified	e0	30	225	42.5 mm
TMXF846221BL-21	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	700	BGA	SQUARE	PLASTIC/EPOXY		YES	1				1.5 V	1.5,3.3	GRID ARRAY	BGA700,34X34,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B700	2.51 mm	35 mm	Not Qualified	e0	30	225	35 mm
ORT8850L-1BM680I	Broadcom	ATM/SONET/SDH TRANSCEIVER	INDUSTRIAL	BALL	680	BGA	SQUARE	PLASTIC/EPOXY		YES	1				1.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B680	2.51 mm	35 mm	Not Qualified	e0	30	225	35 mm

ATM/SONET/SDH Circuits

ATM (Asynchronous Transfer Mode), SONET (Synchronous Optical Network), and SDH (Synchronous Digital Hierarchy) circuits are high-speed communication technologies used in telecommunications networks.

ATM is a cell-based network technology that enables high-speed data transfer, video and voice communication. It divides data into fixed-size cells and sends them across the network using time-division multiplexing (TDM).

SONET and SDH are both standard protocols for optical telecommunications transport. They use synchronous timing signals to enable high-speed communication over fiber optic networks. SONET is used primarily in North America, while SDH is used primarily in Europe and other regions.

ATM, SONET, and SDH circuits offer several advantages over other communication technologies. They provide high-speed communication with low latency, allowing for efficient data transfer and real-time voice and video communication. They also provide a high level of reliability and fault tolerance, making them ideal for use in mission-critical applications such as banking, healthcare, and defense.

However, these circuits also require specialized hardware and software, and can be more expensive to implement and maintain than other communication technologies. They also require a high level of expertise to configure and manage.