SQUARE ATM/SONET/SDH Circuits 998

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Applications	Surface Mount	No. of Functions	Technology	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
M2006-01-690.5692	Renesas Electronics	ATM/SONET/SDH SUPPORT CIRCUIT	COMMERCIAL	NO LEAD	36	QCCN	SQUARE	UNSPECIFIED		YES	1				3.3 V		CHIP CARRIER			.635 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-XQCC-N36		2.8 mm	9 mm	Not Qualified	e0			9 mm
M2004-02-627.3296	Renesas Electronics	ATM/SONET/SDH SUPPORT CIRCUIT	COMMERCIAL	NO LEAD	36	QCCN	SQUARE	UNSPECIFIED		YES	1				3.3 V		CHIP CARRIER			.635 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-XQCC-N36		2.8 mm	9 mm	Not Qualified	e0			9 mm
M2004-11I622.0800	Renesas Electronics	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	36	QCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	1				3.3 V		CHIP CARRIER			.64 mm	85 Cel	-40 Cel		QUAD	S-CQCC-N36		3.1 mm	8.99 mm					8.99 mm
77V500S25PF	Renesas Electronics	ATM/SONET/SDH SWITCHING CIRCUIT	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	ATM	YES	1			175 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	Tin/Lead (Sn85Pb15)	QUAD	S-PQFP-G100	3	1.6 mm	14 mm	Not Qualified	e0	20	240	14 mm
M2006-12AI669.3266	Renesas Electronics	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	36	QCCN	SQUARE	UNSPECIFIED	SDH; SONET	YES	1				3.3 V		CHIP CARRIER			.635 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N36		3.1 mm	8.99 mm	Not Qualified	e0			8.99 mm
8T49N281B-DDDNLGI	Renesas Electronics	ATM/SONET/SDH SUPPORT CIRCUIT		NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	SONET;SDH	YES	1			90 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56		1 mm	8 mm					8 mm
M2004-11-625.0000LF	Renesas Electronics	ATM/SONET/SDH SUPPORT CIRCUIT	COMMERCIAL	NO LEAD	36	QCCN	SQUARE	UNSPECIFIED		YES	1				3.3 V		CHIP CARRIER			.635 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-XQCC-N36		2.8 mm	9 mm	Not Qualified	e3			9 mm
82V3280EQG	Renesas Electronics	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT		GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1			528 mA	3.3 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	HQFP100,.63SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G100	3	1.6 mm	14 mm	Not Qualified	e3		260	14 mm
M2006-12AI622.0800	Renesas Electronics	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	36	QCCN	SQUARE	UNSPECIFIED	SDH; SONET	YES	1				3.3 V		CHIP CARRIER			.635 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N36		3.1 mm	8.99 mm	Not Qualified	e0			8.99 mm
M2004-11-669.1281LF	Renesas Electronics	ATM/SONET/SDH SUPPORT CIRCUIT	COMMERCIAL	NO LEAD	36	QCCN	SQUARE	UNSPECIFIED		YES	1				3.3 V		CHIP CARRIER			.635 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-XQCC-N36		2.8 mm	9 mm	Not Qualified	e3			9 mm
M2006-12AI627.3296LF	Renesas Electronics	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	36	QCCN	SQUARE	UNSPECIFIED		YES	1				3.3 V		CHIP CARRIER			.635 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N36		3.1 mm	8.99 mm	Not Qualified	e3			8.99 mm
M2006-12A-644.5313LF	Renesas Electronics	ATM/SONET/SDH SUPPORT CIRCUIT	COMMERCIAL	NO LEAD	36	QCCN	SQUARE	UNSPECIFIED		YES	1				3.3 V		CHIP CARRIER			.635 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-XQCC-N36		3.1 mm	8.99 mm	Not Qualified	e3			8.99 mm
M2006-12AI644.5313	Renesas Electronics	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	36	QCCN	SQUARE	UNSPECIFIED	SDH; SONET	YES	1				3.3 V		CHIP CARRIER			.635 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N36		3.1 mm	8.99 mm	Not Qualified	e0			8.99 mm
M2006-12AI627.3296	Renesas Electronics	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	36	QCCN	SQUARE	UNSPECIFIED	SDH; SONET	YES	1				3.3 V		CHIP CARRIER			.635 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N36		3.1 mm	8.99 mm	Not Qualified	e0			8.99 mm
M2004-11-693.4830LF	Renesas Electronics	ATM/SONET/SDH SUPPORT CIRCUIT	COMMERCIAL	NO LEAD	36	QCCN	SQUARE	UNSPECIFIED		YES	1				3.3 V		CHIP CARRIER			.635 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-XQCC-N36		2.8 mm	9 mm	Not Qualified	e3			9 mm
UPD98410S2-K6	Renesas Electronics	ATM/SONET/SDH SWITCHING CIRCUIT		BALL	580	BGA	SQUARE	PLASTIC/EPOXY		YES	1				3.3 V		GRID ARRAY			1.27 mm				BOTTOM	S-PBGA-B580		2.78 mm	45 mm	Not Qualified				45 mm
8T49N281B-014NLGI	Renesas Electronics	ATM/SONET/SDH SUPPORT CIRCUIT		NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	SONET;SDH	YES	1			90 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56		1 mm	8 mm					8 mm
LUC4AU01	Broadcom	ATM/SONET/SDH NETWORK INTERFACE		GULL WING	240	QFP	SQUARE	PLASTIC/EPOXY		YES	1	CMOS			3.3 V		FLATPACK						TIN LEAD	QUAD	S-PQFP-G240				Not Qualified	e0	NOT SPECIFIED	NOT SPECIFIED
TMXF846221BL-3	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	700	BGA	SQUARE	PLASTIC/EPOXY		YES	1				1.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B700	2A	2.51 mm	35 mm	Not Qualified				35 mm
TTRN0110G	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	BALL	198	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	1				3.3 V		GRID ARRAY			1 mm	85 Cel	0 Cel	TIN LEAD	BOTTOM	S-CBGA-B198		1.961 mm	15 mm	Not Qualified	e0	30	240	15 mm
MTMXL846221BL-1	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	700	BGA	SQUARE	PLASTIC/EPOXY		YES	1				1.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B700		2.51 mm	35 mm	Not Qualified	e0	30	225	35 mm
TMOD0110G5XE4	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT		GULL WING	32	QFP	SQUARE	PLASTIC/EPOXY		YES	1		-5.2 V				FLATPACK			.65 mm			TIN LEAD	QUAD	S-PQFP-G32				Not Qualified	e0	30	240
TMXL846221BL-3	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	700	BGA	SQUARE	PLASTIC/EPOXY		YES	1				1.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B700		2.51 mm	35 mm	Not Qualified	e0	30	225	35 mm
TMPR28051-3-SL5	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY		YES	1				3.3 V		FLATPACK, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G208		4.1 mm	28 mm	Not Qualified	e0	30	225	28 mm
TMOD0110G5XE2-SGL	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT		GULL WING	32	QFP	SQUARE	PLASTIC/EPOXY		YES	1		-5.2 V				FLATPACK			.65 mm			TIN LEAD	QUAD	S-PQFP-G32				Not Qualified	e0	30	240
TMOD0110G5YP1	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	1		-5.2 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD	S-PQCC-N28		1 mm	5 mm	Not Qualified	e0	30	240	5 mm
T-8208---BAL2-DB	Broadcom	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY		YES	1				3.3 V	3.3	GRID ARRAY	BGA272,20X20,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B272		2.54 mm	27 mm	Not Qualified	e0	30	225	27 mm
LG1600KXH2666	Broadcom	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	COMMERCIAL	GULL WING	68	QFP	SQUARE	PLASTIC/EPOXY		YES	1				5 V		FLATPACK			1.27 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G68		4.3942 mm	29.972 mm	Not Qualified	e0	30	225	29.972 mm
TMXL33625BL-2	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	1152	BGA	SQUARE	PLASTIC/EPOXY		YES	1				1.5 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B1152		2.51 mm	45 mm	Not Qualified	e0	30	225	45 mm
L-TMXL846221BL-3	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	700	BGA	SQUARE	PLASTIC/EPOXY		YES	1				1.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B700		2.51 mm	35 mm	Not Qualified	e1	40	250	35 mm
L-TMXL336251BL-3	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	1152	BGA	SQUARE	PLASTIC/EPOXY		YES	1				1.5 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B1152		2.51 mm	45 mm	Not Qualified	e1	40	245	45 mm
M-TDAT162G52-3BAL2	Broadcom		INDUSTRIAL	BALL	792	BGA	SQUARE	PLASTIC/EPOXY		YES		CMOS				1.6/3.3	GRID ARRAY	BGA792,39X39,40	ATM/SONET/SDH ICs	1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B792				Not Qualified
L644360A2WV3E41FAA	Broadcom	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE	COMMERCIAL	GULL WING	208	QFP	SQUARE	METAL		YES		CMOS			5 V	5	FLATPACK	QFP208,1.2SQ,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-MQFP-G208				Not Qualified	e0
M-TMXL336251BL-2-DB	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	1152	BGA	SQUARE	PLASTIC/EPOXY		YES	1				1.5 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B1152		2.51 mm	45 mm	Not Qualified	e0	30	225	45 mm
TMUX03155	Broadcom	ATM/SONET/SDH MUX/DEMUX	INDUSTRIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY		YES	1				3.3 V		FLATPACK, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G208		4.1 mm	28 mm	Not Qualified	e0	30	225	28 mm
LG1600KXH0622	Broadcom	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	COMMERCIAL	GULL WING	68	QFP	SQUARE	PLASTIC/EPOXY		YES	1				5 V		FLATPACK			1.27 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G68		4.3942 mm	29.972 mm	Not Qualified	e0	30	225	29.972 mm
TAAD08JU21BCL-L3A	Broadcom		COMMERCIAL	BALL	520	BGA	SQUARE	PLASTIC/EPOXY		YES		CMOS				1.5,3.3	GRID ARRAY	BGA520,31X31,50	ATM/SONET/SDH ICs	1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B520				Not Qualified
TDCS6440G	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	792	BGA	SQUARE	PLASTIC/EPOXY		YES	1				1.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B792		2.85 mm	40 mm	Not Qualified	e0	30	225	40 mm
LG1605DXB-FLP	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	COMMERCIAL	GULL WING	16	LQFP	SQUARE	CERAMIC, GLASS-SEALED		YES	1						FLATPACK, LOW PROFILE			.762 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-GQFP-G16		1.3716 mm	5.842 mm	Not Qualified	e0	30	240	5.842 mm
LG1628AXA	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	NO LEAD	21	DIE	SQUARE	UNSPECIFIED		YES	1		-5.2 V				UNCASED CHIP				85 Cel	0 Cel	TIN LEAD	UPPER	S-XUUC-N21				Not Qualified	e0	30	240
TMXL846221BL-21	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	700	BGA	SQUARE	PLASTIC/EPOXY		YES	1				1.5 V	1.5,3.3	GRID ARRAY	BGA700,34X34,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B700		2.51 mm	35 mm	Not Qualified	e0	30	225	35 mm
TAAD08JU2	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	520	LBGA	SQUARE	PLASTIC/EPOXY		YES	1	CMOS			1.5 V	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA520,31X31,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B520		1.67 mm	40 mm	Not Qualified	e0	30	225	40 mm
ORT8850L-2BM680I	Broadcom	ATM/SONET/SDH TRANSCEIVER	INDUSTRIAL	BALL	680	BGA	SQUARE	PLASTIC/EPOXY		YES	1				1.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B680		2.51 mm	35 mm	Not Qualified	e0	30	225	35 mm
LG1600KXH1298	Broadcom	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	COMMERCIAL	GULL WING	68	QFP	SQUARE	PLASTIC/EPOXY		YES	1				5 V		FLATPACK			1.27 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G68		4.3942 mm	29.972 mm	Not Qualified	e0	30	225	29.972 mm
TDAT12622-BA23	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	792	BGA	SQUARE	PLASTIC/EPOXY		YES	1	CMOS			1.6 V	1.6/3.3	GRID ARRAY	BGA792,39X39,40	ATM/SONET/SDH ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B792		2.49 mm	40 mm	Not Qualified	e0	30	225	40 mm
TDAT162G52-3BAL	Broadcom		INDUSTRIAL	BALL	792	BGA	SQUARE	PLASTIC/EPOXY		YES		CMOS				1.6/3.3	GRID ARRAY	BGA792,39X39,40	ATM/SONET/SDH ICs	1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B792				Not Qualified
LUC4AS01	Broadcom	ATM/SONET/SDH SWITCHING CIRCUIT		BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	1	CMOS			3.3 V		GRID ARRAY						TIN LEAD	BOTTOM	S-PBGA-B388				Not Qualified	e0	30	225
BCM8228	Broadcom	ATM/SONET/SDH TRANSCEIVER		BALL	196	BGA	SQUARE	PLASTIC/EPOXY		YES	1	CMOS			1.8 V		GRID ARRAY							BOTTOM	S-PBGA-B196				Not Qualified

ATM/SONET/SDH Circuits

ATM (Asynchronous Transfer Mode), SONET (Synchronous Optical Network), and SDH (Synchronous Digital Hierarchy) circuits are high-speed communication technologies used in telecommunications networks.

ATM is a cell-based network technology that enables high-speed data transfer, video and voice communication. It divides data into fixed-size cells and sends them across the network using time-division multiplexing (TDM).

SONET and SDH are both standard protocols for optical telecommunications transport. They use synchronous timing signals to enable high-speed communication over fiber optic networks. SONET is used primarily in North America, while SDH is used primarily in Europe and other regions.

ATM, SONET, and SDH circuits offer several advantages over other communication technologies. They provide high-speed communication with low latency, allowing for efficient data transfer and real-time voice and video communication. They also provide a high level of reliability and fault tolerance, making them ideal for use in mission-critical applications such as banking, healthcare, and defense.

However, these circuits also require specialized hardware and software, and can be more expensive to implement and maintain than other communication technologies. They also require a high level of expertise to configure and manage.