SQUARE ATM/SONET/SDH Circuits 998

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TMXA846221BL-21	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	909	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.5 V	1.5,3.3	GRID ARRAY	BGA909,34X34,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B909	2.51 mm	35 mm	Not Qualified	e0	30	225	35 mm
BCM8220	Broadcom	ATM/SONET/SDH TRANSCEIVER		BALL	100	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.8 V		GRID ARRAY							BOTTOM	S-PBGA-B100
T-8207---BAL-DT	Broadcom	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B272	2.54 mm	27 mm	Not Qualified	e0	30	225	27 mm
L-TMXA846221BL-3	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	909	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B909	2.51 mm	35 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	35 mm
TSWC03622	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	208	BGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B208	2.12 mm	17 mm	Not Qualified	e0	30	225	17 mm
L-TMXF846221BL-3	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	700	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B700	2.51 mm	35 mm	Not Qualified	e1	40	245	35 mm
T-8207---BAL-DB	Broadcom	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B272	2.54 mm	27 mm	Not Qualified	e0	30	225	27 mm
TDAT042G5-3BLL1	Broadcom	ATM/SONET/SDH TERMINATOR	INDUSTRIAL	BALL	600	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B600	3.05 mm	45 mm	Not Qualified	e0	30	225	45 mm
TMXL281553BAL-1-DB	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	456	BGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B456	2.54 mm	35 mm	Not Qualified	e0	30	225	35 mm
TMPRFE2G51BL-1	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	1605	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B1605	3.42 mm	42.5 mm	Not Qualified	e0	30	225	42.5 mm
LG1600KXH1250	Broadcom	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	COMMERCIAL	GULL WING	68	QFP	SQUARE	PLASTIC/EPOXY	YES	1				5 V		FLATPACK			1.27 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G68	4.3942 mm	29.972 mm	Not Qualified	e0	30	225	29.972 mm
TMXL336251BL-3	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.5 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B1152	2.51 mm	45 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	45 mm
TMOD0110G5XE3	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT		GULL WING	32	QFP	SQUARE	UNSPECIFIED	YES	1		-5.2 V				FLATPACK			.65 mm			TIN LEAD	QUAD	S-XQFP-G32			Not Qualified	e0	30	240
TRCV0111G2	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	BALL	177	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1				3.3 V		GRID ARRAY			1 mm	85 Cel	0 Cel	TIN LEAD	BOTTOM	S-CBGA-B177	1.961 mm	14 mm	Not Qualified	e0	30	240	14 mm
TDAT042G51A-3BLL1	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	600	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B600	3.05 mm	45 mm	Not Qualified	e0	30	225	45 mm
ORT8850L-1BA352I	Broadcom	ATM/SONET/SDH TRANSCEIVER	INDUSTRIAL	BALL	352	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B352	2.51 mm	35 mm	Not Qualified	e0	30	225	35 mm
TFEC0410G-3PBGA2	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	792	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B792	2.49 mm	40 mm	Not Qualified	e0	30	225	40 mm
TSWC01622	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	208	BGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B208	2.12 mm	17 mm	Not Qualified	e0	30	225	17 mm
MARS2G5P-PRO(TDAT162G52)	Broadcom		INDUSTRIAL	BALL	792	BGA	SQUARE	PLASTIC/EPOXY	YES		CMOS				1.6/3.3	GRID ARRAY	BGA792,39X39,40	ATM/SONET/SDH ICs	1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B792			Not Qualified
L644360A3WV3E41FAA	Broadcom	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE	COMMERCIAL	GULL WING	208	QFP	SQUARE	METAL	YES		CMOS			5 V	5	FLATPACK	QFP208,1.2SQ,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-MQFP-G208			Not Qualified	e0
TMPR28051-3-SL2	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G208	4.1 mm	28 mm	Not Qualified	e0	30	225	28 mm
TMPR28051-SL	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1				5 V		FLATPACK, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G208	4.1 mm	28 mm	Not Qualified	e0	30	225	28 mm
L644360A4WV3E41FAA	Broadcom	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE	COMMERCIAL	GULL WING	208	QFP	SQUARE	METAL	YES		CMOS			5 V	5	FLATPACK	QFP208,1.2SQ,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-MQFP-G208			Not Qualified	e0
TRCV0111G	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	BALL	177	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1				3.3 V		GRID ARRAY			1 mm	85 Cel	0 Cel	TIN LEAD	BOTTOM	S-CBGA-B177	1.885 mm	14 mm	Not Qualified	e0	30	225	14 mm
TDAT162G52-BA23	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	792	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.6 V	1.6/3.3	GRID ARRAY	BGA792,39X39,40	ATM/SONET/SDH ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B792	2.49 mm	40 mm	Not Qualified	e0	30	225	40 mm
L644360A1WV3E41FAA	Broadcom	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE	COMMERCIAL	GULL WING	208	QFP	SQUARE	METAL	YES		CMOS			5 V	5	FLATPACK	QFP208,1.2SQ,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-MQFP-G208			Not Qualified	e0
TRCV0111G2-3-XE-DB	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	BALL	177	BGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY			1 mm	85 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B177	1.74 mm	14 mm	Not Qualified	e0	30	240	14 mm
TRCV0110G-3-XE	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	BALL	177	BGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY			1 mm	85 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B177	1.74 mm	14 mm	Not Qualified	e0	30	240	14 mm
TDAT161G2-BA23	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	792	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.6 V	1.6/3.3	GRID ARRAY	BGA792,39X39,40	ATM/SONET/SDH ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B792	2.49 mm	40 mm	Not Qualified	e0	30	225	40 mm
BCM8022	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT		BALL		BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS					GRID ARRAY							BOTTOM	S-PBGA-B			Not Qualified
TAAD08JU21BCLUL3A	Broadcom		COMMERCIAL	BALL	520	BGA	SQUARE	PLASTIC/EPOXY	YES		CMOS				1.5,3.3	GRID ARRAY	BGA520,31X31,50	ATM/SONET/SDH ICs	1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B520			Not Qualified
LG1605DXB-TR16	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	COMMERCIAL	GULL WING	16	LQFP	SQUARE	CERAMIC, GLASS-SEALED	YES	1						FLATPACK, LOW PROFILE			.762 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-GQFP-G16	1.3716 mm	5.842 mm	Not Qualified	e0	30	240	5.842 mm
TSOT0410G	Broadcom	ATM/SONET/SDH TERMINATOR	INDUSTRIAL	BALL	600	BGA	SQUARE	PLASTIC/EPOXY	YES	1				2.5 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B600	3.05 mm	45 mm	Not Qualified	e0	30	225	45 mm
TSWC02622	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	208	BGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B208	2.12 mm	17 mm	Not Qualified	e0	30	225	17 mm
TRCV0110G2	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	BALL	177	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1				3.3 V		GRID ARRAY			1 mm	85 Cel	0 Cel	TIN LEAD	BOTTOM	S-CBGA-B177	1.961 mm	14 mm	Not Qualified	e0	30	240	14 mm
ORT8850H-2BM680I	Broadcom	ATM/SONET/SDH TRANSCEIVER	INDUSTRIAL	BALL	680	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B680	2.51 mm	35 mm	Not Qualified	e0	30	225	35 mm
TMXF336251BL-3	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.5 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B1152	2.51 mm	45 mm	Not Qualified	e0	30	225	45 mm
TDAT042G5LT-3BAL3-DB	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	680	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B680	2.51 mm	35 mm	Not Qualified	e0	NOT SPECIFIED	NOT SPECIFIED	35 mm
MARS10G-T-PRO	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	1724	HBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.5 V		GRID ARRAY, HEAT SINK/SLUG			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B1724	3.22 mm	45 mm	Not Qualified	e0	30	225	45 mm
TSOT0410G14	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	600	BGA	SQUARE	PLASTIC/EPOXY	YES	1				2.5 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B600	3.05 mm	45 mm	Not Qualified	e0	30	225	45 mm
L64364NL	Broadcom	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE		GULL WING	240	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS		1040 mA	3.3 V	3.3	FLATPACK	QFP240,1.3SQ,20	ATM/SONET/SDH ICs	.5 mm				QUAD	S-PQFP-G240			Not Qualified
L-TMXF336251BL-3	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.5 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B1152	2.51 mm	45 mm	Not Qualified	e1	40	250	45 mm
TMOD0110G5XE2-FLP	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT		GULL WING	32	QFP	SQUARE	PLASTIC/EPOXY	YES	1		-5.2 V				FLATPACK			.65 mm			TIN LEAD	QUAD	S-PQFP-G32			Not Qualified	e0	30	240
LG1600KXH1244	Broadcom	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	COMMERCIAL	GULL WING	68	QFP	SQUARE	PLASTIC/EPOXY	YES	1				5 V		FLATPACK			1.27 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G68	4.3942 mm	29.972 mm	Not Qualified	e0	30	225	29.972 mm
LG1600KXH2488	Broadcom	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	COMMERCIAL	GULL WING	68	QFP	SQUARE	PLASTIC/EPOXY	YES	1				5 V		FLATPACK			1.27 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G68	4.3942 mm	29.972 mm	Not Qualified	e0	30	225	29.972 mm
BCM8129	Broadcom	ATM/SONET/SDH MUX/DEMUX		BALL	143	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.8 V		GRID ARRAY							BOTTOM	S-PBGA-B143			Not Qualified
LG1600KXH2380	Broadcom	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	COMMERCIAL	GULL WING	68	QFP	SQUARE	PLASTIC/EPOXY	YES	1				5 V		FLATPACK			1.27 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G68	4.3942 mm	29.972 mm	Not Qualified	e0	30	225	29.972 mm
HDMP-0482	Broadcom	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES				400 mA	3.3 V	3.3	FLATPACK	QFP64,.51SQ,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G64			Not Qualified

ATM/SONET/SDH Circuits

ATM (Asynchronous Transfer Mode), SONET (Synchronous Optical Network), and SDH (Synchronous Digital Hierarchy) circuits are high-speed communication technologies used in telecommunications networks.

ATM is a cell-based network technology that enables high-speed data transfer, video and voice communication. It divides data into fixed-size cells and sends them across the network using time-division multiplexing (TDM).

SONET and SDH are both standard protocols for optical telecommunications transport. They use synchronous timing signals to enable high-speed communication over fiber optic networks. SONET is used primarily in North America, while SDH is used primarily in Europe and other regions.

ATM, SONET, and SDH circuits offer several advantages over other communication technologies. They provide high-speed communication with low latency, allowing for efficient data transfer and real-time voice and video communication. They also provide a high level of reliability and fault tolerance, making them ideal for use in mission-critical applications such as banking, healthcare, and defense.

However, these circuits also require specialized hardware and software, and can be more expensive to implement and maintain than other communication technologies. They also require a high level of expertise to configure and manage.