ATM/SONET/SDH SUPPORT CIRCUIT ATM/SONET/SDH Circuits 957
| Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Applications | Surface Mount | No. of Functions | No. of Channels | Technology | Nominal Negative Supply Voltage | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Infineon Technologies |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
GRID ARRAY |
1.27 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B256 |
2.13 mm |
27 mm |
27 mm |
||||||||||||||||||
|
Infineon Technologies |
ATM/SONET/SDH SUPPORT CIRCUIT |
OTHER |
NO LEAD |
25 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
BIPOLAR |
3.3 V |
UNCASED CHIP |
105 Cel |
-30 Cel |
UPPER |
R-XUUC-N25 |
Not Qualified |
||||||||||||||||||||
|
Infineon Technologies |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
23 |
DIE |
UNSPECIFIED |
UNSPECIFIED |
ATM; SDH; SONET |
YES |
1 |
BIPOLAR |
.057 mA |
5 V |
5 |
UNCASED CHIP |
DIE OR CHIP |
Other Telecom ICs |
85 Cel |
-40 Cel |
UPPER |
X-XUUC-N23 |
Not Qualified |
|||||||||||||||
|
Infineon Technologies |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
ATM |
YES |
1 |
CMOS |
.47 mA |
3.3 V |
3.3 |
GRID ARRAY |
QFP256,1.2SQ,16 |
ATM/SONET/SDH ICs |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B256 |
27 mm |
Not Qualified |
e0 |
27 mm |
||||||||||
|
Infineon Technologies |
ATM/SONET/SDH SUPPORT CIRCUIT |
OTHER |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
ATM; SDH; SONET |
YES |
1 |
BIPOLAR |
41 mA |
3.3 V |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
Other Telecom ICs |
.65 mm |
105 Cel |
-30 Cel |
TIN LEAD |
DUAL |
R-PDSO-G16 |
1.2 mm |
4.4 mm |
Not Qualified |
e0 |
5 mm |
|||||||||
|
Infineon Technologies |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
BIPOLAR |
.054 mA |
5 V |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
Other Telecom ICs |
.65 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G16 |
1.2 mm |
4.4 mm |
Not Qualified |
e0 |
5 mm |
|||||||||
|
Infineon Technologies |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
ATM |
YES |
1 |
CMOS |
.7 mA |
3.3 V |
3.3 |
GRID ARRAY |
BGA256,20X20,50 |
ATM/SONET/SDH ICs |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B256 |
2.13 mm |
27 mm |
Not Qualified |
e0 |
27 mm |
|||||||||
|
Infineon Technologies |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
22 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
BIPOLAR |
5 V |
UNCASED CHIP |
85 Cel |
-40 Cel |
UPPER |
R-XUUC-N22 |
Not Qualified |
||||||||||||||||||||
|
Infineon Technologies |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
388 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
ATM |
YES |
1 |
CMOS |
1000 mA |
1.8 V |
1.8,3.3 |
GRID ARRAY, HEAT SINK/SLUG |
BGA388,26X26,50 |
ATM/SONET/SDH ICs |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B388 |
2.54 mm |
35 mm |
Not Qualified |
e0 |
35 mm |
|||||||||
|
Infineon Technologies |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
352 |
HLBGA |
SQUARE |
PLASTIC/EPOXY |
ATM |
YES |
1 |
CMOS |
3.3 V |
3.3 |
GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE |
BGA352,26X26,50 |
ATM/SONET/SDH ICs |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B352 |
1.58 mm |
35 mm |
Not Qualified |
e0 |
35 mm |
||||||||||
|
Infineon Technologies |
ATM/SONET/SDH SUPPORT CIRCUIT |
BALL |
342 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY |
BOTTOM |
S-PBGA-B342 |
Not Qualified |
|||||||||||||||||||||||||
|
Infineon Technologies |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
ATM; SDH |
YES |
1 |
CMOS |
.7 mA |
3.3 V |
3.3 |
GRID ARRAY |
BGA256,20X20,50 |
ATM/SONET/SDH ICs |
1.27 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B256 |
2.13 mm |
27 mm |
Not Qualified |
27 mm |
|||||||||||
|
Infineon Technologies |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
22 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
BIPOLAR |
5 V |
UNCASED CHIP |
85 Cel |
-40 Cel |
UPPER |
R-XUUC-N22 |
Not Qualified |
||||||||||||||||||||
|
Infineon Technologies |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
272 |
BGA |
SQUARE |
PLASTIC/EPOXY |
ATM; SDH; SONET |
YES |
1 |
CMOS |
1.8 V |
1.8,3.3 |
GRID ARRAY |
BGA272,20X20,50 |
Digital Transmission Interfaces |
1.27 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B272 |
2.54 mm |
27 mm |
Not Qualified |
27 mm |
||||||||||||
|
Infineon Technologies |
ATM/SONET/SDH SUPPORT CIRCUIT |
COMMERCIAL |
BALL |
272 |
BGA |
SQUARE |
PLASTIC/EPOXY |
ATM |
YES |
1 |
CMOS |
2.5 V |
GRID ARRAY |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B272 |
27 mm |
Not Qualified |
e0 |
27 mm |
||||||||||||||
|
Infineon Technologies |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
GRID ARRAY |
1.27 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B256 |
2.13 mm |
27 mm |
27 mm |
||||||||||||||||||
|
Infineon Technologies |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
352 |
BGA |
SQUARE |
PLASTIC/EPOXY |
ATM |
YES |
1 |
CMOS |
3.3 V |
3.3 |
GRID ARRAY |
BGA352,26X26,50 |
ATM/SONET/SDH ICs |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B352 |
2.5 mm |
35 mm |
Not Qualified |
e0 |
35 mm |
||||||||||
|
Infineon Technologies |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
ATM; SDH |
YES |
1 |
CMOS |
.7 mA |
3.3 V |
3.3 |
GRID ARRAY |
BGA256,20X20,50 |
ATM/SONET/SDH ICs |
1.27 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B256 |
2.13 mm |
27 mm |
Not Qualified |
27 mm |
|||||||||||
|
Infineon Technologies |
ATM/SONET/SDH SUPPORT CIRCUIT |
BALL |
342 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY |
BOTTOM |
S-PBGA-B342 |
Not Qualified |
|||||||||||||||||||||||||
|
Infineon Technologies |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
SONET |
YES |
1 |
BIPOLAR |
.056 mA |
5 V |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
Other Telecom ICs |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G16 |
1.2 mm |
4.4 mm |
Not Qualified |
e0 |
5 mm |
|||||||||
|
Infineon Technologies |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
388 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
GRID ARRAY |
1.27 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B388 |
2.54 mm |
35 mm |
Not Qualified |
35 mm |
|||||||||||||||||
|
Infineon Technologies |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
ATM; SDH; SONET |
YES |
1 |
BIPOLAR |
.057 mA |
5 V |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
Other Telecom ICs |
.65 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G16 |
1.2 mm |
4.4 mm |
Not Qualified |
e0 |
5 mm |
|||||||||
|
Infineon Technologies |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
ATM |
YES |
1 |
CMOS |
.47 mA |
3.3 V |
3.3 |
GRID ARRAY |
BGA256,20X20,50 |
ATM/SONET/SDH ICs |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B256 |
27 mm |
Not Qualified |
e0 |
27 mm |
||||||||||
|
Infineon Technologies |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
ATM; SDH |
YES |
1 |
CMOS |
.7 mA |
3.3 V |
3.3 |
GRID ARRAY |
BGA256,20X20,50 |
ATM/SONET/SDH ICs |
1.27 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B256 |
2.13 mm |
27 mm |
Not Qualified |
27 mm |
|||||||||||
|
Infineon Technologies |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
456 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
GRID ARRAY |
1.27 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B456 |
2.5 mm |
35 mm |
Not Qualified |
35 mm |
|||||||||||||||||
|
Infineon Technologies |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
388 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
GRID ARRAY |
1.27 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B388 |
2.54 mm |
35 mm |
Not Qualified |
35 mm |
|||||||||||||||||
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
81 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
.192 mA |
1.8 V |
1.8,3.3 |
GRID ARRAY, LOW PROFILE |
BGA81,9X9,40 |
Other Telecom ICs |
1 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B81 |
3 |
1.48 mm |
10 mm |
Not Qualified |
10 mm |
|||||||||||
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
.185 mA |
1.8 V |
1.8,3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G64 |
1 |
1.6 mm |
10 mm |
Not Qualified |
10 mm |
|||||||||||
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
95 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
QUAD |
S-XQCC-N36 |
1 |
.95 mm |
6 mm |
30 |
260 |
6 mm |
|||||||||||||
|
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
1.8 V |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B256 |
3 |
1.7 mm |
17 mm |
Not Qualified |
30 |
260 |
17 mm |
||||||||||||
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
81 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
.185 mA |
1.8 V |
1.8,3.3 |
GRID ARRAY, LOW PROFILE |
BGA81,9X9,40 |
Other Telecom ICs |
1 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B81 |
3 |
1.47 mm |
10 mm |
Not Qualified |
e0 |
10 mm |
|||||||||
|
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
95 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
QUAD |
S-XQCC-N36 |
1 |
.95 mm |
6 mm |
30 |
260 |
6 mm |
|||||||||||||
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
.146 mA |
1.8 V |
1.8,3.3 |
GRID ARRAY |
BGA256,16X16,40 |
Other Telecom ICs |
1 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B256 |
1.77 mm |
17 mm |
Not Qualified |
20 |
240 |
17 mm |
||||||||||
|
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
192 mA |
1.8 V |
1.8,3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G64 |
3 |
1.6 mm |
10 mm |
Not Qualified |
e3 |
30 |
260 |
10 mm |
||||||
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
1.8 V |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B256 |
1.7 mm |
17 mm |
Not Qualified |
e0 |
17 mm |
||||||||||||||
|
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
81 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
.185 mA |
1.8 V |
1.8,3.3 |
GRID ARRAY, LOW PROFILE |
BGA81,9X9,40 |
Other Telecom ICs |
1 mm |
85 Cel |
-40 Cel |
MATTE TIN |
BOTTOM |
S-PBGA-B81 |
3 |
1.47 mm |
10 mm |
Not Qualified |
e3 |
10 mm |
||||||||
|
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
GRID ARRAY |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B256 |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
.192 mA |
1.8 V |
1.8,3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G64 |
1.6 mm |
10 mm |
Not Qualified |
10 mm |
||||||||||||
|
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
416 mA |
1.8 V |
GRID ARRAY |
BGA256,16X16,40 |
1 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B256 |
1.62 mm |
17 mm |
NOT SPECIFIED |
NOT SPECIFIED |
17 mm |
||||||||||||
|
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
95 Cel |
-40 Cel |
QUAD |
S-XQCC-N36 |
.95 mm |
6 mm |
NOT SPECIFIED |
NOT SPECIFIED |
6 mm |
|||||||||||||||
|
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
.185 mA |
1.8 V |
1.8,3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G64 |
3 |
1.6 mm |
10 mm |
Not Qualified |
e3 |
30 |
260 |
10 mm |
||||||
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
GRID ARRAY |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B256 |
||||||||||||||||||||||
|
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
81 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
.192 mA |
1.8 V |
1.8,3.3 |
GRID ARRAY, LOW PROFILE |
BGA81,9X9,40 |
Other Telecom ICs |
1 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B81 |
3 |
1.48 mm |
10 mm |
Not Qualified |
10 mm |
||||||||||
|
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
.146 mA |
1.8 V |
1.8,3.3 |
GRID ARRAY |
BGA256,16X16,40 |
Other Telecom ICs |
1 mm |
85 Cel |
-40 Cel |
MATTE TIN |
BOTTOM |
S-PBGA-B256 |
3 |
1.77 mm |
17 mm |
Not Qualified |
e3 |
17 mm |
||||||||
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
.12 mA |
1.8 V |
1.8,3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
Other Telecom ICs |
1 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B256 |
1.26 mm |
17 mm |
Not Qualified |
e0 |
17 mm |
||||||||||
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
GRID ARRAY |
1 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B256 |
1.77 mm |
17 mm |
Not Qualified |
17 mm |
|||||||||||||||||
|
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
GRID ARRAY |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B256 |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||
|
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
.12 mA |
1.8 V |
1.8,3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
Other Telecom ICs |
1 mm |
85 Cel |
-40 Cel |
MATTE TIN |
BOTTOM |
S-PBGA-B256 |
3 |
1.26 mm |
17 mm |
Not Qualified |
e3 |
17 mm |
ATM (Asynchronous Transfer Mode), SONET (Synchronous Optical Network), and SDH (Synchronous Digital Hierarchy) circuits are high-speed communication technologies used in telecommunications networks.
ATM is a cell-based network technology that enables high-speed data transfer, video and voice communication. It divides data into fixed-size cells and sends them across the network using time-division multiplexing (TDM).
SONET and SDH are both standard protocols for optical telecommunications transport. They use synchronous timing signals to enable high-speed communication over fiber optic networks. SONET is used primarily in North America, while SDH is used primarily in Europe and other regions.
ATM, SONET, and SDH circuits offer several advantages over other communication technologies. They provide high-speed communication with low latency, allowing for efficient data transfer and real-time voice and video communication. They also provide a high level of reliability and fault tolerance, making them ideal for use in mission-critical applications such as banking, healthcare, and defense.
However, these circuits also require specialized hardware and software, and can be more expensive to implement and maintain than other communication technologies. They also require a high level of expertise to configure and manage.