10 Cellphone ICs 24

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SKY65943-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	10		SQUARE	UNSPECIFIED	NO	1		1.8 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		DUAL	S-XDMA-N10		.7 mm	2.5 mm			NOT SPECIFIED	NOT SPECIFIED	2.5 mm
BGSX22G2A10E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT		BUTT	10	BCC	RECTANGULAR	UNSPECIFIED	YES	1	CMOS		CHIP CARRIER						BOTTOM	R-XBCC-B10	1
SKY65174-21	Skyworks Solutions	RF FRONT END CIRCUIT	OTHER	NO LEAD	10		SQUARE	UNSPECIFIED	NO	1		3.3 V	MICROELECTRONIC ASSEMBLY		.5 mm	85 Cel	-35 Cel		DUAL	S-XDMA-N10		.95 mm	4 mm			NOT SPECIFIED	NOT SPECIFIED	4 mm
SKY77762-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	10		SQUARE	UNSPECIFIED	NO	1		3.4 V	MICROELECTRONIC ASSEMBLY			75 Cel	-30 Cel		DUAL	S-XDMA-N10		1 mm	3 mm			NOT SPECIFIED	NOT SPECIFIED	3 mm
LT5570IDD#PBF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-N10	1	.8 mm	3 mm	Not Qualified	e3	30	260	3 mm
LT5570IDD#TRPBF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-N10	1	.8 mm	3 mm	Not Qualified	e3	30	260	3 mm
MAX2690EUB+T	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		3 V	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G10	1	1.092 mm	2.9465 mm	Not Qualified	e3	30	260	3 mm
MAX2690EUB+	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		3 V	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G10	1	1.092 mm	2.9465 mm	Not Qualified	e3	30	260	3 mm
BGSX22G2A10	Infineon Technologies	RF AND BASEBAND CIRCUIT		BUTT	10	BCC	RECTANGULAR	UNSPECIFIED	YES	1	CMOS		CHIP CARRIER						BOTTOM	R-XBCC-B10	1
CMY191	Infineon Technologies	RF AND BASEBAND CIRCUIT		GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1		3 V	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		.5 mm				DUAL	S-PDSO-G10		1.1 mm	3 mm	Not Qualified				3 mm
BGSX22GN10	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	10	BCC	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	2.6 V	CHIP CARRIER		.4 mm	85 Cel	-40 Cel		BOTTOM	R-XBCC-B10		.4 mm	1.1 mm					1.5 mm
BGSX22G5A10E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT		NO LEAD	10	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1	RFCMOS	2.8 V	CHIP CARRIER, VERY THIN PROFILE	LCC10,.04X.05,16	.4 mm	85 Cel	-40 Cel		QUAD	R-XQCC-N10	1	.65 mm	1.1 mm					1.5 mm
MAX2690EUB-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		3 V	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		.5 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G10	1	1.092 mm	2.9465 mm	Not Qualified	e0			3 mm
MAX2690EUB	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		3 V	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		.5 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G10	1	1.092 mm	2.9465 mm	Not Qualified	e0			3 mm
AJAV-5602-BLK	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	3.8 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.6 mm	90 Cel	-30 Cel	TIN	DUAL	S-PDSO-N10	1	.9 mm	3 mm		e3		260	3 mm
AJAV-5601-TR1	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	3.8 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.6 mm	90 Cel	-30 Cel	TIN	DUAL	S-PDSO-N10	1	.9 mm	3 mm		e3		260	3 mm
AJAV-5501-BLK	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	BUTT	10	HLGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	3.8 V	GRID ARRAY, HEAT SINK/SLUG		.6 mm	90 Cel	-30 Cel		BOTTOM	S-PBGA-B10	3	1.1 mm	3 mm				260	3 mm
ACPM-9005-BLK	Broadcom	RF AND BASEBAND CIRCUIT		NO LEAD	10	DMA	RECTANGULAR	UNSPECIFIED	YES	1			MICROELECTRONIC ASSEMBLY						DUAL	R-XDMA-N10		.92 mm	2 mm					2.5 mm
AJAV-5508-BLK	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	3.8 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.6 mm	90 Cel	-30 Cel	TIN	DUAL	S-PDSO-N10	1	.9 mm	3 mm		e3		260	3 mm
ACPM-9001-BLK	Broadcom	RF AND BASEBAND CIRCUIT		NO LEAD	10	DMA	RECTANGULAR	UNSPECIFIED	YES	1			MICROELECTRONIC ASSEMBLY						DUAL	R-XDMA-N10		.92 mm	2 mm					2.5 mm
AJAV-5501-TR1	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	BUTT	10	HLGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	3.8 V	GRID ARRAY, HEAT SINK/SLUG		.6 mm	90 Cel	-30 Cel		BOTTOM	S-PBGA-B10	3	1.1 mm	3 mm				260	3 mm
AJAV-5602-TR1	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	3.8 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.6 mm	90 Cel	-30 Cel	TIN	DUAL	S-PDSO-N10	1	.9 mm	3 mm		e3		260	3 mm
AJAV-5601-BLK	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	3.8 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.6 mm	90 Cel	-30 Cel	TIN	DUAL	S-PDSO-N10	1	.9 mm	3 mm		e3		260	3 mm
AJAV-5508-TR1	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	3.8 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.6 mm	90 Cel	-30 Cel	TIN	DUAL	S-PDSO-N10	1	.9 mm	3 mm		e3		260	3 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.