SQUARE Cellphone ICs 1,150

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
AD9361BBCZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B144	3	1.7 mm	10 mm		e1		260	10 mm
CC1101RGPR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	.5 Mbps	S-PQCC-N20	3	1 mm	4 mm	Not Qualified	e4	NOT SPECIFIED	260	4 mm
AD9361BBCZ-REEL	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B144	3	1.7 mm	10 mm		e1		260	10 mm
AD9361BBCZ-CSL	Analog Devices	RF AND BASEBAND CIRCUIT		BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			150 mA	1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32		.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B144		1.7 mm	10 mm			NOT SPECIFIED	NOT SPECIFIED	10 mm
CC1101RGPT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	.5 Mbps	S-PQCC-N20	3	1 mm	4 mm	Not Qualified	e4	NOT SPECIFIED	260	4 mm
CC1101RGP	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	.5 Mbps	S-PQCC-N20	3	1 mm	4 mm	Not Qualified	e4	NOT SPECIFIED	260	4 mm
ADL5561ACPZ-R7	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N16	3	1 mm	3 mm		e3	30	260	3 mm
ADF4360-4BCPZRL	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	3	1 mm	4 mm	Not Qualified	e3	30	260	4 mm
NRF24L01-REEL	Nordic Semiconductor Asa	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20	2	.95 mm	4 mm		e3		260	4 mm
ADF4360-7BCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	3	1 mm	4 mm	Not Qualified	e3	30	260	4 mm
ADF4360-4BCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	3	1 mm	4 mm	Not Qualified	e3	30	260	4 mm
A7682E	Simcom Wireless Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	85	XMA	SQUARE	UNSPECIFIED	NO	1				3.8 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N85		2.4 mm	19.6 mm					19.6 mm
ADF4360-4BCPZRL7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	3	1 mm	4 mm	Not Qualified	e3	30	260	4 mm
NRF24L01	Nordic Semiconductor Asa	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20	2	.95 mm	4 mm		e3		260	4 mm
LE910C1EU06T060100	Telit Communications Plc	RF AND BASEBAND CIRCUIT		NO LEAD	181	XMA	SQUARE	UNSPECIFIED	NO	1				3.8 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N181		2.2 mm	28.2 mm					28.2 mm
ADL5561ACPZ-WP	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N16	3	1 mm	3 mm		e3	30	260	3 mm
MAX4003EUA-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e0			3 mm
MAX4003EUA+T	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e3	30	260	3 mm
LE910C1EU10T100700	Telit Communications Plc	RF AND BASEBAND CIRCUIT		NO LEAD		XMA	SQUARE	UNSPECIFIED	NO	1				3.8 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N181		2.2 mm	28.2 mm					28.2 mm
CC110LRGPR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	.6 Mbps	S-PQCC-N20	3	1 mm	4 mm	Not Qualified	e4	30	260	4 mm
HMC832LP6GETR	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N40	1	.9 mm	6 mm		e3			6 mm
AT86RF233-ZU	Microchip Technology	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3 V	1.8,3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N32		1 mm	5 mm	Not Qualified	e3			5 mm
SI4713-B30-GM	Silicon Labs	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel		QUAD		S-XQCC-N20		.6 mm	3 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	3 mm
CC1101QRHBRG4Q1	Texas Instruments	RF AND BASEBAND CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.25 Mbps	S-PQCC-N32	2	1 mm	5 mm	Not Qualified	e4	30	260	5 mm
CC115LRGPR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	.6 Mbps	S-PQCC-N20	3	1 mm	4 mm	Not Qualified	e4	NOT SPECIFIED	260	4 mm
HMC830LP6GETR	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N40	1	.9 mm	6 mm		e3		260	6 mm
SX1268IMLTRT	Semtech	RF AND BASEBAND CIRCUIT		NO LEAD	24	HVQCCN	SQUARE		YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	1	1 mm	4 mm		e3		260	4 mm
HMC832LP6GE	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N40	1	.9 mm	6 mm		e3		260	6 mm
SKY65943-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	10		SQUARE	UNSPECIFIED	NO	1				1.8 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		S-XDMA-N10		.7 mm	2.5 mm			NOT SPECIFIED	NOT SPECIFIED	2.5 mm
SI4721-B20-GM	Silicon Labs	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel		QUAD		S-XQCC-N20		.6 mm	3 mm	Not Qualified				3 mm
CC2510F32RHHR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD		S-PQCC-N36	3	1 mm	6 mm	Not Qualified	e4	NOT SPECIFIED	260	6 mm
CC115LRTKT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N20	3	.9 mm	4 mm		e4	30	260	4 mm
TQP3M9036	Qorvo	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		DUAL		S-PDSO-N8	1	.95 mm	2 mm				260	2 mm
ADF7021BCPZ-RL7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N48	3	1 mm	7 mm	Not Qualified	e3		260	7 mm
CC115LRGPT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	.6 Mbps	S-PQCC-N20	3	1 mm	4 mm	Not Qualified	e4	NOT SPECIFIED	260	4 mm
AD6636BBCZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256	3	1.85 mm	17 mm	Not Qualified	e1		260	17 mm
ADF4360-7BCPZRL7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	3	1 mm	4 mm	Not Qualified	e3	30	260	4 mm
SKY13524-639LF	Skyworks Solutions	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	14	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	90 Cel	-30 Cel		QUAD		S-XQCC-N14		.5 mm	1.6 mm			NOT SPECIFIED	NOT SPECIFIED	1.6 mm
LT5526EUF#PBF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N16	1	.8 mm	4 mm	Not Qualified	e3	30	260	4 mm
ADF4360-0BCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	3	1 mm	4 mm	Not Qualified	e3	30	260	4 mm
AT86RF233-ZUR	Microchip Technology	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3 V	1.8,3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N32		1 mm	5 mm	Not Qualified	e3			5 mm
ADF7020-1BCPZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N48	3	1 mm	7 mm	Not Qualified	e3	30	260	7 mm
ADF4360-7BCPZRL	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	3	1 mm	4 mm	Not Qualified	e3	30	260	4 mm
ADF4360-0BCPZRL7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	3	1 mm	4 mm	Not Qualified	e3	30	260	4 mm
CC1020RSSR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.27SQ,25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	.1536 Mbps	S-XQCC-N32	3	1 mm	7 mm	Not Qualified	e4	NOT SPECIFIED	260	7 mm
MAX2620EUA-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e0			3 mm
MAX2620EUA+T	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e3	30	260	3 mm
1185	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N16		.95 mm	4 mm	Not Qualified				4 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.